JP4991774B2 - 粘着剤及び粘着シート - Google Patents

粘着剤及び粘着シート Download PDF

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Publication number
JP4991774B2
JP4991774B2 JP2009033181A JP2009033181A JP4991774B2 JP 4991774 B2 JP4991774 B2 JP 4991774B2 JP 2009033181 A JP2009033181 A JP 2009033181A JP 2009033181 A JP2009033181 A JP 2009033181A JP 4991774 B2 JP4991774 B2 JP 4991774B2
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JP
Japan
Prior art keywords
sensitive adhesive
pressure
meth
acrylate
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009033181A
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English (en)
Japanese (ja)
Other versions
JP2010189489A (ja
Inventor
仁 又野
真盛 小林
隆行 荒井
敦史 黒川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2009033181A priority Critical patent/JP4991774B2/ja
Priority to KR1020090129997A priority patent/KR101201102B1/ko
Priority to TW098144647A priority patent/TWI394808B/zh
Priority to CN2009102495402A priority patent/CN101818032B/zh
Publication of JP2010189489A publication Critical patent/JP2010189489A/ja
Application granted granted Critical
Publication of JP4991774B2 publication Critical patent/JP4991774B2/ja
Active legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/092—Polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2009033181A 2009-02-16 2009-02-16 粘着剤及び粘着シート Active JP4991774B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009033181A JP4991774B2 (ja) 2009-02-16 2009-02-16 粘着剤及び粘着シート
KR1020090129997A KR101201102B1 (ko) 2009-02-16 2009-12-23 점착제 조성물 및 점착 시트
TW098144647A TWI394808B (zh) 2009-02-16 2009-12-24 黏著劑及黏著片
CN2009102495402A CN101818032B (zh) 2009-02-16 2009-12-25 粘着剂组合物及粘着片

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009033181A JP4991774B2 (ja) 2009-02-16 2009-02-16 粘着剤及び粘着シート

Publications (2)

Publication Number Publication Date
JP2010189489A JP2010189489A (ja) 2010-09-02
JP4991774B2 true JP4991774B2 (ja) 2012-08-01

Family

ID=42653312

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009033181A Active JP4991774B2 (ja) 2009-02-16 2009-02-16 粘着剤及び粘着シート

Country Status (4)

Country Link
JP (1) JP4991774B2 (ko)
KR (1) KR101201102B1 (ko)
CN (1) CN101818032B (ko)
TW (1) TWI394808B (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6324651B2 (ja) * 2011-03-29 2018-05-16 住友化学株式会社 液晶表示装置
KR102375987B1 (ko) 2011-05-26 2022-03-17 닛토덴코 가부시키가이샤 점착제층이 부착된 편광 필름 및 화상 표시 장치
JP2012247574A (ja) 2011-05-26 2012-12-13 Nitto Denko Corp 粘着型偏光板および画像表示装置
JP6050660B2 (ja) * 2011-11-22 2016-12-21 リンテック株式会社 粘着剤、及び粘着シート
WO2013140472A1 (ja) * 2012-03-21 2013-09-26 日本化薬株式会社 光学部材及びその製造に用いる紫外線硬化型接着剤
JP5977582B2 (ja) * 2012-05-25 2016-08-24 藤森工業株式会社 表面保護フィルム、及びそれが貼合された光学部品
JP6647767B2 (ja) * 2012-11-05 2020-02-14 ソマール株式会社 帯電防止性樹脂組成物及び成形品
JP2014189778A (ja) * 2013-03-28 2014-10-06 Lintec Corp 両面粘着シートおよび捲回体
US9891368B2 (en) * 2013-04-11 2018-02-13 Nippon Carbide Industries Co., Inc. Multilayer sheet
JP6274206B2 (ja) * 2013-04-24 2018-02-07 王子ホールディングス株式会社 粘着シート及び積層体とその製造方法
WO2015194531A1 (ja) * 2014-06-18 2015-12-23 王子ホールディングス株式会社 偏光子用粘着剤組成物及び偏光子用粘着シート
WO2015194523A1 (ja) * 2014-06-18 2015-12-23 住友化学株式会社 偏光子、粘着剤付き偏光板及び画像表示装置
KR101958680B1 (ko) * 2014-06-18 2019-03-15 오지 홀딩스 가부시키가이샤 편광자용 점착제 조성물 및 편광자용 점착 시트
JP5997355B1 (ja) * 2015-11-26 2016-09-28 住友化学株式会社 粘着剤層付き偏光板、及び画像表示装置
JP6847929B2 (ja) * 2016-04-28 2021-03-24 リンテック株式会社 保護膜形成用フィルムおよび保護膜形成用複合シート
KR102108563B1 (ko) * 2017-04-27 2020-05-08 주식회사 엘지화학 액정셀 제조용 적층체 및 액정셀의 제조 방법
JP6876544B2 (ja) * 2017-06-29 2021-05-26 日東電工株式会社 粘着型偏光板および画像表示装置
JP6920502B2 (ja) * 2017-06-29 2021-08-18 日東電工株式会社 粘着型偏光板および画像表示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5019552B2 (ja) * 2004-05-26 2012-09-05 日東電工株式会社 粘着型光学部材
TWI387629B (zh) * 2004-07-26 2013-03-01 Nitto Denko Corp 壓感黏合劑組成物、壓感黏合片及表面保護膜
JP4800018B2 (ja) * 2004-12-03 2011-10-26 日東電工株式会社 粘着剤組成物、粘着シート類および表面保護フィルム
JP4814000B2 (ja) * 2006-07-26 2011-11-09 リンテック株式会社 光学機能性フィルム貼合用粘着剤、光学機能性フィルム及びその製造方法
JP5649274B2 (ja) * 2007-11-07 2015-01-07 日本合成化学工業株式会社 偏光板用粘着剤及び粘着剤層付き偏光板
JP2010065217A (ja) * 2008-08-12 2010-03-25 Nippon Synthetic Chem Ind Co Ltd:The 光学部材用粘着剤組成物および光学部材用粘着剤ならびにそれを用いて得られる粘着剤層付き光学部材

Also Published As

Publication number Publication date
KR101201102B1 (ko) 2012-11-13
JP2010189489A (ja) 2010-09-02
TWI394808B (zh) 2013-05-01
TW201033311A (en) 2010-09-16
CN101818032A (zh) 2010-09-01
KR20100093470A (ko) 2010-08-25
CN101818032B (zh) 2013-06-26

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