JP4987733B2 - ポリイミド樹脂組成物及び金属ポリイミド積層体 - Google Patents

ポリイミド樹脂組成物及び金属ポリイミド積層体 Download PDF

Info

Publication number
JP4987733B2
JP4987733B2 JP2007554893A JP2007554893A JP4987733B2 JP 4987733 B2 JP4987733 B2 JP 4987733B2 JP 2007554893 A JP2007554893 A JP 2007554893A JP 2007554893 A JP2007554893 A JP 2007554893A JP 4987733 B2 JP4987733 B2 JP 4987733B2
Authority
JP
Japan
Prior art keywords
polyimide
resin
adhesive
metal
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007554893A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2007083623A1 (ja
Inventor
航也 松浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei E Materials Corp
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Priority to JP2007554893A priority Critical patent/JP4987733B2/ja
Publication of JPWO2007083623A1 publication Critical patent/JPWO2007083623A1/ja
Application granted granted Critical
Publication of JP4987733B2 publication Critical patent/JP4987733B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/16—Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C08L61/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2007554893A 2006-01-17 2007-01-16 ポリイミド樹脂組成物及び金属ポリイミド積層体 Expired - Fee Related JP4987733B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007554893A JP4987733B2 (ja) 2006-01-17 2007-01-16 ポリイミド樹脂組成物及び金属ポリイミド積層体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006009078 2006-01-17
JP2006009078 2006-01-17
JP2007554893A JP4987733B2 (ja) 2006-01-17 2007-01-16 ポリイミド樹脂組成物及び金属ポリイミド積層体
PCT/JP2007/050489 WO2007083623A1 (ja) 2006-01-17 2007-01-16 ポリイミド樹脂組成物及び金属ポリイミド積層体

Publications (2)

Publication Number Publication Date
JPWO2007083623A1 JPWO2007083623A1 (ja) 2009-06-11
JP4987733B2 true JP4987733B2 (ja) 2012-07-25

Family

ID=38287576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007554893A Expired - Fee Related JP4987733B2 (ja) 2006-01-17 2007-01-16 ポリイミド樹脂組成物及び金属ポリイミド積層体

Country Status (5)

Country Link
JP (1) JP4987733B2 (ko)
KR (1) KR101037018B1 (ko)
CN (1) CN101370892B (ko)
TW (1) TW200738840A (ko)
WO (1) WO2007083623A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008065997A1 (fr) * 2006-12-01 2008-06-05 Hitachi Chemical Company, Ltd. Adhésif et structure de liaison utilisant celui-ci
JP5524475B2 (ja) * 2008-11-28 2014-06-18 株式会社有沢製作所 ２層両面フレキシブル金属積層板及びその製造方法
JP6261981B2 (ja) * 2011-10-05 2018-01-17 日立化成デュポンマイクロシステムズ株式会社 高透明ポリイミド
JP5979516B2 (ja) * 2015-02-18 2016-08-24 パナソニックＩｐマネジメント株式会社 プリント配線板及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02120383A (ja) * 1988-09-26 1990-05-08 M & T Chem Inc 接着剤組成物
JPH05125345A (ja) * 1991-11-08 1993-05-21 Ube Ind Ltd 接着性組成物
JP2003298227A (ja) * 2002-03-28 2003-10-17 Tokai Rubber Ind Ltd フレキシブルプリント配線板用基材の製法およびそれにより得られたフレキシブルプリント配線板用基材
JP2005072454A (ja) * 2003-08-27 2005-03-17 Kyocera Corp 配線基板及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141541A (ja) * 1998-11-10 2000-05-23 Mitsui Chemicals Inc 高いピール強度を発現する金属積層板
JP3715454B2 (ja) * 1999-01-28 2005-11-09 東京応化工業株式会社 リソグラフィー用下地材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02120383A (ja) * 1988-09-26 1990-05-08 M & T Chem Inc 接着剤組成物
JPH05125345A (ja) * 1991-11-08 1993-05-21 Ube Ind Ltd 接着性組成物
JP2003298227A (ja) * 2002-03-28 2003-10-17 Tokai Rubber Ind Ltd フレキシブルプリント配線板用基材の製法およびそれにより得られたフレキシブルプリント配線板用基材
JP2005072454A (ja) * 2003-08-27 2005-03-17 Kyocera Corp 配線基板及びその製造方法

Also Published As

Publication number Publication date
CN101370892B (zh) 2012-06-13
TWI356085B (ko) 2012-01-11
KR101037018B1 (ko) 2011-05-25
JPWO2007083623A1 (ja) 2009-06-11
KR20080087036A (ko) 2008-09-29
TW200738840A (en) 2007-10-16
WO2007083623A1 (ja) 2007-07-26
CN101370892A (zh) 2009-02-18

Similar Documents

Publication Publication Date Title
TWI716524B (zh) 覆銅積層體及印刷線路板
US7285321B2 (en) Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto
JP4540964B2 (ja) 低温ポリイミド接着剤組成物
TW201825295A (zh) 聚醯亞胺膜、銅張積層板及電路基板
JP4734837B2 (ja) 接着性の改良されたポリイミドフィルム、その製造方法および積層体
US20090117374A1 (en) Polyimide film for metallizing, and metal-laminated polyimide film
JP5251508B2 (ja) 耐熱性フィルム金属箔積層体、およびその製造方法
JP5168009B2 (ja) ポリイミドおよびその製造法
TW200409569A (en) Copper-clad laminate
JP2006224644A (ja) 絶縁シートおよび金属層／絶縁シート積層体とそれを用いたプリント配線板
TW200810649A (en) Copper clad laminate for chip on film
KR100262417B1 (ko) 필름접착제 및 그의 제조 방법
JP4987733B2 (ja) ポリイミド樹脂組成物及び金属ポリイミド積層体
US6541122B2 (en) Roll of metal film/aromatic polyimide film composite web
JP5693422B2 (ja) 耐熱両面金属積層板、これを用いた耐熱透明フィルム、及び耐熱透明回路基板
JP4205993B2 (ja) 金属積層体
JP2007281361A (ja) ポリイミド系プリント基板及びポリイミド系プリント配線板
JP2012006200A (ja) ポリイミド金属積層体、及びそれを用いたプリント配線板
JP5167712B2 (ja) ポリイミド積層体の製造方法、ポリイミド積層体
TW200930563A (en) Metal laminate
KR100517233B1 (ko) 금속적층체
JP2009154538A (ja) 積層体及びその製造方法
KR20170132801A (ko) 폴리이미드 적층 필름, 폴리이미드 적층 필름의 제조 방법, 열가소성 폴리이미드의 제조 방법 및 플렉시블 금속 피복 적층체의 제조 방법
JP2008279698A (ja) 積層体及びその製造法
JP2011062842A (ja) 金属箔ポリイミド積層体

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20090401

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090422

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110621

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110811

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120424

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120425

R150 Certificate of patent or registration of utility model

Ref document number: 4987733

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150511

Year of fee payment: 3

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees