TW200738840A - Polyimide resin composition and metal polyimide laminate - Google Patents

Polyimide resin composition and metal polyimide laminate

Info

Publication number
TW200738840A
TW200738840A TW096101787A TW96101787A TW200738840A TW 200738840 A TW200738840 A TW 200738840A TW 096101787 A TW096101787 A TW 096101787A TW 96101787 A TW96101787 A TW 96101787A TW 200738840 A TW200738840 A TW 200738840A
Authority
TW
Taiwan
Prior art keywords
polyimide
laminate
metal
polyimide resin
resin adhesive
Prior art date
Application number
TW096101787A
Other languages
English (en)
Other versions
TWI356085B (zh
Inventor
Koya Matsuura
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of TW200738840A publication Critical patent/TW200738840A/zh
Application granted granted Critical
Publication of TWI356085B publication Critical patent/TWI356085B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/16—Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C08L61/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW096101787A 2006-01-17 2007-01-17 Polyimide resin composition and metal polyimide laminate TW200738840A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006009078 2006-01-17

Publications (2)

Publication Number Publication Date
TW200738840A true TW200738840A (en) 2007-10-16
TWI356085B TWI356085B (zh) 2012-01-11

Family

ID=38287576

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101787A TW200738840A (en) 2006-01-17 2007-01-17 Polyimide resin composition and metal polyimide laminate

Country Status (5)

Country Link
JP (1) JP4987733B2 (zh)
KR (1) KR101037018B1 (zh)
CN (1) CN101370892B (zh)
TW (1) TW200738840A (zh)
WO (1) WO2007083623A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI615419B (zh) * 2011-10-05 2018-02-21 日立化成杜邦微系統股份有限公司 聚醯亞胺前驅物、樹脂組成物、聚醯亞胺、聚醯亞胺成形體及其製造方法、透明基板、保護膜、電子零件、顯示裝置以及太陽電池模組

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008065997A1 (fr) * 2006-12-01 2008-06-05 Hitachi Chemical Company, Ltd. Adhésif et structure de liaison utilisant celui-ci
JP5524475B2 (ja) * 2008-11-28 2014-06-18 株式会社有沢製作所 ２層両面フレキシブル金属積層板及びその製造方法
JP5979516B2 (ja) * 2015-02-18 2016-08-24 パナソニックＩｐマネジメント株式会社 プリント配線板及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1042168A (zh) * 1988-09-26 1990-05-16 M&T化学有限公司 聚酰亚胺薄膜模片固定粘合剂
JPH05125345A (ja) * 1991-11-08 1993-05-21 Ube Ind Ltd 接着性組成物
JP2000141541A (ja) * 1998-11-10 2000-05-23 Mitsui Chemicals Inc 高いピール強度を発現する金属積層板
JP3715454B2 (ja) * 1999-01-28 2005-11-09 東京応化工業株式会社 リソグラフィー用下地材
JP2003298227A (ja) * 2002-03-28 2003-10-17 Tokai Rubber Ind Ltd フレキシブルプリント配線板用基材の製法およびそれにより得られたフレキシブルプリント配線板用基材
JP2005072454A (ja) * 2003-08-27 2005-03-17 Kyocera Corp 配線基板及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI615419B (zh) * 2011-10-05 2018-02-21 日立化成杜邦微系統股份有限公司 聚醯亞胺前驅物、樹脂組成物、聚醯亞胺、聚醯亞胺成形體及其製造方法、透明基板、保護膜、電子零件、顯示裝置以及太陽電池模組

Also Published As

Publication number Publication date
CN101370892B (zh) 2012-06-13
TWI356085B (zh) 2012-01-11
KR101037018B1 (ko) 2011-05-25
JPWO2007083623A1 (ja) 2009-06-11
JP4987733B2 (ja) 2012-07-25
KR20080087036A (ko) 2008-09-29
WO2007083623A1 (ja) 2007-07-26
CN101370892A (zh) 2009-02-18

Similar Documents

Publication Publication Date Title
EP2113524A4 (en) EPOXY RESIN COMPOSITION, PREPREG, LAMINATES AND PCB
MY143997A (en) Resin composition, prepreg and their uses
TW200631977A (en) Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
TW200735730A (en) Resin composite copper foil, printed wiring board, and production process thereof
TWI350716B (en) High thermal conductivity, halogen-free flame-retardent resin composition and its pre-impregnated and coating materials for printed circuit boards
TW200742520A (en) Resin composition, resin film, coverlay film, interlayer adhesive, metal clad laminate, and multilayer printer circuit board
WO2008111489A1 (ja) 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム
WO2009001850A1 (ja) 樹脂組成物及びその樹脂組成物を用いて得られる樹脂付銅箔
WO2008102113A3 (en) Printed circuit boards
MX2011012226A (es) Retardantes de flama derivados de 10-oxido de 9,10-dihidro-9-oxa-10-fosfafenantreno (dopo) y composicion de resinas epoxi.
SG179001A1 (en) Adhesive film, multilayer circuit board, electronic component and semiconductor device
EP2070963A4 (en) EPOXY RESIN COMPOSITION FOR CONDUCTOR PLATE, RESIN COMPOSITION PAINT, PREPREG, METALLUM COATED LAMINATE, PCB AND MULTILAYER CONDUCTOR PLATE
TWI346127B (en) Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board
WO2008157143A3 (en) Edge connection structure for printed circuit boards
TW200610775A (en) Curable resin composition and its use
WO2007100724A3 (en) A halogen-free phosphorous epoxy resin composition
TW200733824A (en) Wiring circuit board
MY145098A (en) Phenol resin composition, cured article thereof, resin composition for copper-clad laminate, copper-clad laminate, and novel phenol resin
WO2012091320A3 (en) Epoxy resin compound and radiant heat circuit board using the same
TW200738840A (en) Polyimide resin composition and metal polyimide laminate
TW200736292A (en) Epoxy resin composition
TW200641035A (en) Resin composition for embedded capacitors having excellent adhesive strength, heat resistance and flame retardancy
SG11201900452QA (en) Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar
TW200641526A (en) Photosetting/thermosetting one-liquid type solder resist composite and printed wiring board using the same
TW200602405A (en) Thermosetting resin composition and its cured film

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees