KR101037018B1 - 폴리이미드 수지 조성물 및 금속 폴리이미드 적층체 - Google Patents

폴리이미드 수지 조성물 및 금속 폴리이미드 적층체 Download PDF

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Publication number
KR101037018B1
KR101037018B1 KR1020087019951A KR20087019951A KR101037018B1 KR 101037018 B1 KR101037018 B1 KR 101037018B1 KR 1020087019951 A KR1020087019951 A KR 1020087019951A KR 20087019951 A KR20087019951 A KR 20087019951A KR 101037018 B1 KR101037018 B1 KR 101037018B1
Authority
KR
South Korea
Prior art keywords
polyimide
metal
solvent
polyimide resin
bis
Prior art date
Application number
KR1020087019951A
Other languages
English (en)
Korean (ko)
Other versions
KR20080087036A (ko
Inventor
고야 마쯔우라
Original Assignee
아사히 가세이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사히 가세이 가부시키가이샤 filed Critical 아사히 가세이 가부시키가이샤
Publication of KR20080087036A publication Critical patent/KR20080087036A/ko
Application granted granted Critical
Publication of KR101037018B1 publication Critical patent/KR101037018B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/16—Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C08L61/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020087019951A 2006-01-17 2007-01-16 폴리이미드 수지 조성물 및 금속 폴리이미드 적층체 KR101037018B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006009078 2006-01-17
JPJP-P-2006-00009078 2006-01-17

Publications (2)

Publication Number Publication Date
KR20080087036A KR20080087036A (ko) 2008-09-29
KR101037018B1 true KR101037018B1 (ko) 2011-05-25

Family

ID=38287576

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087019951A KR101037018B1 (ko) 2006-01-17 2007-01-16 폴리이미드 수지 조성물 및 금속 폴리이미드 적층체

Country Status (5)

Country Link
JP (1) JP4987733B2 (zh)
KR (1) KR101037018B1 (zh)
CN (1) CN101370892B (zh)
TW (1) TW200738840A (zh)
WO (1) WO2007083623A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5223679B2 (ja) * 2006-12-01 2013-06-26 日立化成株式会社 接着剤及びこれを用いた接続構造体
JP5524475B2 (ja) * 2008-11-28 2014-06-18 株式会社有沢製作所 ２層両面フレキシブル金属積層板及びその製造方法
JP6261981B2 (ja) * 2011-10-05 2018-01-17 日立化成デュポンマイクロシステムズ株式会社 高透明ポリイミド
JP5979516B2 (ja) * 2015-02-18 2016-08-24 パナソニックＩｐマネジメント株式会社 プリント配線板及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0361728A2 (en) * 1988-09-26 1990-04-04 National Starch And Chemical Investment Holding Corporation Adhesive polyimide compositions
JPH05125345A (ja) * 1991-11-08 1993-05-21 Ube Ind Ltd 接着性組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000141541A (ja) * 1998-11-10 2000-05-23 Mitsui Chemicals Inc 高いピール強度を発現する金属積層板
JP3715454B2 (ja) * 1999-01-28 2005-11-09 東京応化工業株式会社 リソグラフィー用下地材
JP2003298227A (ja) * 2002-03-28 2003-10-17 Tokai Rubber Ind Ltd フレキシブルプリント配線板用基材の製法およびそれにより得られたフレキシブルプリント配線板用基材
JP2005072454A (ja) * 2003-08-27 2005-03-17 Kyocera Corp 配線基板及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0361728A2 (en) * 1988-09-26 1990-04-04 National Starch And Chemical Investment Holding Corporation Adhesive polyimide compositions
JPH05125345A (ja) * 1991-11-08 1993-05-21 Ube Ind Ltd 接着性組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Surface & Coating Technology Voi.193 pp 101-106

Also Published As

Publication number Publication date
WO2007083623A1 (ja) 2007-07-26
CN101370892B (zh) 2012-06-13
JP4987733B2 (ja) 2012-07-25
TWI356085B (zh) 2012-01-11
JPWO2007083623A1 (ja) 2009-06-11
KR20080087036A (ko) 2008-09-29
TW200738840A (en) 2007-10-16
CN101370892A (zh) 2009-02-18

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