JP4980610B2 - 基板及びマスクの整列装置及び整列方法 - Google Patents
基板及びマスクの整列装置及び整列方法 Download PDFInfo
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- JP4980610B2 JP4980610B2 JP2005356677A JP2005356677A JP4980610B2 JP 4980610 B2 JP4980610 B2 JP 4980610B2 JP 2005356677 A JP2005356677 A JP 2005356677A JP 2005356677 A JP2005356677 A JP 2005356677A JP 4980610 B2 JP4980610 B2 JP 4980610B2
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- 239000000758 substrate Substances 0.000 title claims description 122
- 238000000034 method Methods 0.000 title claims description 24
- 238000001514 detection method Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 239000003550 marker Substances 0.000 description 9
- 239000011368 organic material Substances 0.000 description 8
- 238000007740 vapor deposition Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7038—Alignment for proximity or contact printer
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/02—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from ac mains by converters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0047—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with monitoring or indicating devices or circuits
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
112 整列点
114 基準点
130 感知部
132 撮影機
140 制御部
142 読み取り機
144 制御機
Claims (5)
- 基板とマスクが鉛直(vertical)の状態で整列されるように構成される垂直配列システムにおいて、
基板余剰部とマスク余剰部の、一方側の左右各側部に、それぞれ一対ずつ設けられ、かつこれら基板余剰部とマスク余剰部の、反対側に位置する他方側の左右各側部に、それぞれ一対ずつ設けられる標識部と;
前記基板とマスクが駆動装置及びステージによって動作されて整列されつつ、重畳された標識を、前記基板余剰部とマスク余剰部の、左右の各側部にて感知するように構成される感知部と;
連続的に進入される後続基板とマスクの前記感知部のデータが収集・判断されて、
基板とマスクの整列が適合であると判定されれば、以後の蒸着のための連続された後続工程の進行、
及び不適合と判定されれば、マスクと基板の重畳された際の整列誤差が検知される段階S1と;
基板とマスクが隔離されつつ補正される段階S2と;
前記検知段階S1に回帰する段階S3と;
前記検知段階S1で適合判定されればマスクと基板の整列が完了する段階S4と;が含まれて再整列のための全工程が繰り返されるように制御する制御部と;が具備され、
前記制御部は、
感知部の撮影機から受信された画像データが読取られて基板及びマスクの整列適合及び不適合を判定する読取り機と;
前記読取り機の結果データによって、基板の前後方向の移動を提供する駆動装置と上下左右の整列のための微細調整を提供するステージが動作されるように制御する制御機とが含まれて構成され、
前記制御機は、読取り機で整列の不適合が判定されれば、基板とマスクが離隔されつつ整列の誤差が補正されるように基板の位置が可変され、マスクと再固着されるように前記基板を動作させる駆動装置とステージが制御されるように構成されることを特徴とする基板及びマスクの整列装置。 - 前記標識部は、
基板とマスクの剰余部である枠部位にそれぞれ表示された標識が含まれ、
前記標識は同一中心を持つように重畳されるときに基板及びマスクの整列のための整合位置になるように表示されることを特徴とする請求項1に記載の基板及びマスクの整列装置。 - 前記感知部は、
基板とマスクに表示された標識が重畳された状態を画像処理する撮影機が含まれて構成されることを特徴とする請求項2に記載の基板及びマスクの整列装置。 - 前記感知部の撮影機は、
トレイとマスクの標識が画像範囲に存在するように固定されたことを特徴とする請求項3に記載の基板及びマスクの整列装置。 - 請求項1に記載の整列装置が利用されてマスクと基板が整列されるように構成される発光素子用基板及びマスクの整列方法において、
基板余剰部とマスク余剰部の、一方側の左右各側部にそれぞれ一対ずつ設けられ、かつこれら基板余剰部とマスク余剰部の、反対側に位置する他方側の左右各側部にそれぞれ一対ずつ設けられた標識により、マスクと基板の重畳された際の整列誤差が検知される段階S1と;
前記検知段階で不適合判定されれば基板とマスクが隔離されつつ補正される段階S2と;
前記検知段階S1に回帰する段階S3と;
前記検知段階S1で適合判定されればマスクと基板の整列が完了する段階S4と;
が含まれて構成されることを特徴とする基板及びマスクの整列方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2005-0000947 | 2005-01-05 | ||
KR1020050000947A KR100636492B1 (ko) | 2005-01-05 | 2005-01-05 | 기판과 마스크의 정렬장치 및 정렬방법 |
Publications (2)
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JP2006188759A JP2006188759A (ja) | 2006-07-20 |
JP4980610B2 true JP4980610B2 (ja) | 2012-07-18 |
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JP2005356677A Active JP4980610B2 (ja) | 2005-01-05 | 2005-12-09 | 基板及びマスクの整列装置及び整列方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7486397B2 (ja) |
JP (1) | JP4980610B2 (ja) |
KR (1) | KR100636492B1 (ja) |
CN (1) | CN100487155C (ja) |
TW (1) | TWI300168B (ja) |
Families Citing this family (14)
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US20080123096A1 (en) * | 2006-11-08 | 2008-05-29 | Tien-Sung Liu | Optical system for alignment assembly of field emission display panel |
WO2008069259A1 (en) * | 2006-12-05 | 2008-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Film formation apparatus, film formation method, manufacturing apparatus, and method for manufacturing light-emitting device |
KR101427983B1 (ko) * | 2007-05-25 | 2014-09-23 | 구완회 | 얼라인먼트 방법 및 장치 |
TW201336140A (zh) * | 2008-12-15 | 2013-09-01 | Hitachi High Tech Corp | 有機電激發光製造裝置及成膜裝置 |
KR101116322B1 (ko) * | 2009-08-17 | 2012-03-09 | 에이피시스템 주식회사 | 기판 정렬 방법 |
JP5232112B2 (ja) * | 2009-09-17 | 2013-07-10 | 株式会社日立ハイテクノロジーズ | 成膜装置 |
KR101107179B1 (ko) | 2009-09-25 | 2012-01-25 | 삼성모바일디스플레이주식회사 | 마스크 정렬 장치 및 마스크 정렬 방법 |
CN103160775B (zh) * | 2011-12-14 | 2016-03-16 | 昆山工研院新型平板显示技术中心有限公司 | 蒸镀掩膜板对位系统 |
KR101479937B1 (ko) * | 2013-05-24 | 2015-01-12 | 주식회사 에스에프에이 | 글라스와 마스크의 정렬장치 |
CN103743342B (zh) * | 2013-12-31 | 2017-04-05 | 温康纳(常州)机械制造有限公司 | 同步浮雕视觉识别系统 |
KR102365900B1 (ko) * | 2015-07-17 | 2022-02-22 | 삼성디스플레이 주식회사 | 증착 장치 |
KR101979149B1 (ko) * | 2018-04-27 | 2019-05-15 | 캐논 톡키 가부시키가이샤 | 얼라인먼트 방법, 이를 사용한 증착방법 및 전자디바이스 제조방법 |
CN109136836A (zh) * | 2018-10-12 | 2019-01-04 | 京东方科技集团股份有限公司 | 掩膜板、晶圆、蒸镀装置及蒸镀方法 |
EP3611567A3 (en) * | 2019-07-23 | 2020-05-13 | ASML Netherlands B.V. | Improvements in metrology targets |
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US4037969A (en) * | 1976-04-02 | 1977-07-26 | Bell Telephone Laboratories, Incorporated | Zone plate alignment marks |
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JP3532742B2 (ja) * | 1997-08-29 | 2004-05-31 | 株式会社東芝 | X線リソグラフィ装置およびx線露光方法 |
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TWI228636B (en) * | 2002-01-11 | 2005-03-01 | Pentax Corp | Projection aligner |
JP3789857B2 (ja) | 2002-06-25 | 2006-06-28 | トッキ株式会社 | 蒸着装置 |
JP2004282017A (ja) | 2002-09-20 | 2004-10-07 | Asml Netherlands Bv | リソグラフィ装置の位置決めシステムおよび方法 |
TWI230837B (en) | 2002-12-16 | 2005-04-11 | Asml Netherlands Bv | Lithographic apparatus with alignment subsystem, device manufacturing method using alignment, and alignment structure |
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2005
- 2005-01-05 KR KR1020050000947A patent/KR100636492B1/ko active IP Right Grant
- 2005-12-09 JP JP2005356677A patent/JP4980610B2/ja active Active
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2006
- 2006-01-04 TW TW095100266A patent/TWI300168B/zh active
- 2006-01-04 US US11/324,247 patent/US7486397B2/en active Active
- 2006-01-05 CN CNB2006100004309A patent/CN100487155C/zh active Active
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Publication number | Publication date |
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CN1800435A (zh) | 2006-07-12 |
JP2006188759A (ja) | 2006-07-20 |
KR100636492B1 (ko) | 2006-10-18 |
TW200643659A (en) | 2006-12-16 |
US20060146329A1 (en) | 2006-07-06 |
TWI300168B (en) | 2008-08-21 |
KR20060080467A (ko) | 2006-07-10 |
CN100487155C (zh) | 2009-05-13 |
US7486397B2 (en) | 2009-02-03 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |