JP4978493B2 - 回路接続材料、接続構造体及びその製造方法 - Google Patents

回路接続材料、接続構造体及びその製造方法 Download PDF

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Publication number
JP4978493B2
JP4978493B2 JP2008026731A JP2008026731A JP4978493B2 JP 4978493 B2 JP4978493 B2 JP 4978493B2 JP 2008026731 A JP2008026731 A JP 2008026731A JP 2008026731 A JP2008026731 A JP 2008026731A JP 4978493 B2 JP4978493 B2 JP 4978493B2
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JP
Japan
Prior art keywords
circuit
adhesive layer
connection
circuit member
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008026731A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009105361A5 (enExample
JP2009105361A (ja
Inventor
幸寿 廣澤
優 久保田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2008026731A priority Critical patent/JP4978493B2/ja
Priority to KR1020087029026A priority patent/KR20090052303A/ko
Priority to CN2008801101981A priority patent/CN101816221B/zh
Priority to PCT/JP2008/067491 priority patent/WO2009044678A1/ja
Priority to CN2011102225114A priority patent/CN102382594A/zh
Publication of JP2009105361A publication Critical patent/JP2009105361A/ja
Publication of JP2009105361A5 publication Critical patent/JP2009105361A5/ja
Application granted granted Critical
Publication of JP4978493B2 publication Critical patent/JP4978493B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
JP2008026731A 2007-10-05 2008-02-06 回路接続材料、接続構造体及びその製造方法 Expired - Fee Related JP4978493B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008026731A JP4978493B2 (ja) 2007-10-05 2008-02-06 回路接続材料、接続構造体及びその製造方法
KR1020087029026A KR20090052303A (ko) 2007-10-05 2008-09-26 회로 접속 재료, 접속 구조체 및 그의 제조 방법
CN2008801101981A CN101816221B (zh) 2007-10-05 2008-09-26 电路连接材料、连接结构体及其制造方法
PCT/JP2008/067491 WO2009044678A1 (ja) 2007-10-05 2008-09-26 回路接続材料、接続構造体及びその製造方法
CN2011102225114A CN102382594A (zh) 2007-10-05 2008-09-26 粘结剂组合物的应用

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007261994 2007-10-05
JP2007261994 2007-10-05
JP2008026731A JP4978493B2 (ja) 2007-10-05 2008-02-06 回路接続材料、接続構造体及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009105361A JP2009105361A (ja) 2009-05-14
JP2009105361A5 JP2009105361A5 (enExample) 2010-11-04
JP4978493B2 true JP4978493B2 (ja) 2012-07-18

Family

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JP2008026731A Expired - Fee Related JP4978493B2 (ja) 2007-10-05 2008-02-06 回路接続材料、接続構造体及びその製造方法

Country Status (3)

Country Link
JP (1) JP4978493B2 (enExample)
KR (1) KR20090052303A (enExample)
CN (2) CN102382594A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011062963A (ja) * 2009-09-18 2011-03-31 Canon Inc 液体吐出ヘッドの製造方法
CN102905473B (zh) * 2011-07-29 2017-06-06 富泰华工业（深圳）有限公司 电路板及电路板的制作方法
JP5614440B2 (ja) * 2011-10-26 2014-10-29 日立化成株式会社 回路部品及びその製造方法
WO2014156904A1 (ja) 2013-03-25 2014-10-02 大日本印刷株式会社 電池用包装材料
JP6425899B2 (ja) * 2014-03-11 2018-11-21 デクセリアルズ株式会社 異方性導電接着剤、接続体の製造方法及び電子部品の接続方法
KR102031530B1 (ko) * 2014-11-12 2019-10-14 데쿠세리아루즈 가부시키가이샤 광 경화계 이방성 도전 접착제, 접속체의 제조 방법 및 전자 부품의 접속 방법
JP2017179128A (ja) * 2016-03-30 2017-10-05 Jnc株式会社 熱硬化性樹脂組成物の硬化物、硬化物を備えた基板および電子部品の製造方法
JP2017185086A (ja) * 2016-04-07 2017-10-12 オリンパス株式会社 医療機器および医療機器用熱硬化型接着剤
JP6428841B2 (ja) * 2017-04-26 2018-11-28 大日本印刷株式会社 電池用包装材料
WO2019050005A1 (ja) * 2017-09-11 2019-03-14 日立化成株式会社 接着剤フィルム収容セット及びその製造方法
CN109082262B (zh) * 2018-08-13 2020-11-03 广东泰强化工实业有限公司 一种基于CuS光热转换机理的红外快固化水性过机胶以及涂布方法
JPWO2024070436A1 (enExample) * 2022-09-28 2024-04-04

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4788038B2 (ja) * 2000-12-28 2011-10-05 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP4867069B2 (ja) * 2000-12-28 2012-02-01 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP2004160676A (ja) * 2002-11-08 2004-06-10 Hitachi Chem Co Ltd 近赤外線遮蔽性を有する電磁波シールド積層物及びその製造法
JP4389471B2 (ja) * 2003-05-19 2009-12-24 パナソニック株式会社 電子回路の接続構造とその接続方法
JP2005320491A (ja) * 2004-05-11 2005-11-17 Hitachi Chem Co Ltd 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法
JP2006199778A (ja) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
WO2006121174A1 (en) * 2005-05-10 2006-11-16 Nippon Shokubai Co., Ltd. Pressure-sensitive adhesive composition comprising near infrared ray absorption agent
JPWO2007023834A1 (ja) * 2005-08-23 2009-02-26 株式会社ブリヂストン 接着剤組成物

Also Published As

Publication number Publication date
CN102382594A (zh) 2012-03-21
KR20090052303A (ko) 2009-05-25
CN101816221B (zh) 2011-09-21
CN101816221A (zh) 2010-08-25
JP2009105361A (ja) 2009-05-14

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