JP4977828B2 - 携帯型物体接続可能パッケージ - Google Patents
携帯型物体接続可能パッケージ Download PDFInfo
- Publication number
- JP4977828B2 JP4977828B2 JP2008503640A JP2008503640A JP4977828B2 JP 4977828 B2 JP4977828 B2 JP 4977828B2 JP 2008503640 A JP2008503640 A JP 2008503640A JP 2008503640 A JP2008503640 A JP 2008503640A JP 4977828 B2 JP4977828 B2 JP 4977828B2
- Authority
- JP
- Japan
- Prior art keywords
- portable object
- package
- semiconductor die
- lead
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Packages (AREA)
- Purses, Travelling Bags, Baskets, Or Suitcases (AREA)
- Switches With Compound Operations (AREA)
Description
Claims (16)
- 電子装置用の携帯型物体接続可能パッケージであって、
上面と反対側の底面とを備える半導体ダイ・パッケージを備え、前記底面がプリント回路板に接続するための複数の接続要素を備え、前記半導体ダイ・パッケージが少なくとも1つの半導体ダイを備え、
前記携帯型物体接続可能パッケージは前記半導体ダイ・パッケージによって機械的に支持されるコネクタ体をさらに備え、該コネクタ体が、携帯型物体と接触するために前記上面上に延びる複数の弾性電気接続用要素を備え、
前記携帯型物体接続可能パッケージが携帯型物体ポジショナに結合されるように構成され、前記携帯型物体が前記携帯型物体ポジショナ内にあるときに、前記携帯型物体ポジショナは前記携帯型物体の接触用領域を前記複数の弾性電気接続用要素に接触させて取外し可能に位置決めする、携帯型物体接続可能パッケージ。 - 前記コネクタ体が前記半導体ダイから電気的に分離される、請求項1に記載の携帯型物体接続可能パッケージ。
- 前記半導体ダイの前記プリント回路板に接続するための前記複数の接続要素を介して、前記複数の弾性電気接続用要素が前記プリント回路板に電気的に接続される、請求項1又は2に記載の携帯型物体接続可能パッケージ。
- 前記上面を前記底面に結合する前記半導体ダイの複数の貫通ビアを介して、前記半導体ダイ・パッケージの前記底面に前記複数の弾性電気接続用要素が電気的に接続される、請求項1又は2に記載の携帯型物体接続可能パッケージ。
- 前記複数の弾性電気接続用要素が、前記プリント回路板に直接接続するための複数の追加のコネクタを備える、請求項1又は2に記載の携帯型物体接続可能パッケージ。
- 前記複数の弾性電気接続用要素の各接続用要素が接続用リードを備え、前記上面によって機械的に支持される支持用部分と前記上面上に突き出る接触用部分とを前記接続用リードが備える、請求項1乃至5のいずれか一項に記載の携帯型物体接続可能パッケージ。
- 前記半導体ダイ・パッケージが、前記上面と前記反対側の底面との間にほぼ垂直に広がる複数の側面をさらに備え、
前記複数の弾性電気接続用要素の各接続用要素が接続用リードを備え、前記側面によって機械的に支持される支持用部分と前記上面上に突き出る接触用部分とを前記接続用リードが備える請求項1乃至5のいずれか一項に記載の携帯型物体接続可能パッケージ。 - 前記複数の弾性電気接続用要素が少なくとも第1のリード及び第2のリードを備え、前記第1のリードが前記第2のリードに面し、そして、前記半導体ダイ・パッケージのほぼ半分の長さ上に延びる、請求項1乃至7のいずれか一項に記載の携帯型物体接続可能パッケージ。
- 前記複数の弾性電気接続用要素が少なくとも第1のリード及び第2のリードを備え、前記第1のリードが前記第2のリードからずらされ、各リードが前記半導体ダイ・パッケージのほぼ全体の長さ上に延びる、請求項1乃至7のいずれか一項に記載の携帯型物体接続可能パッケージ。
- 前記接続用リードが前記支持用部分と前記接触用部分の間に中間部分をさらに備え、前記中間部分が前記上面によって機械的に支持される、請求項6又は7に記載の携帯型物体接続可能パッケージ。
- 前記接触用部分が前記支持用部分から前記上面上にほぼ斜めに突き出る、請求項6又は7に記載の携帯型物体接続可能パッケージ。
- 前記接続用リードが前記支持用部分と前記接触用部分の間に中間部分をさらに備え、前記接触用部分が前記中間部分から前記上面上にほぼ斜めに突き出る、請求項6又は7に記載の携帯型物体接続可能パッケージ。
- 前記接触用部分が、前記上面の方に向けられたほぼかぎ形の末端部をさらに備える、請求項6又は7に記載の携帯型物体接続可能パッケージ。
- 前記接触用部分が横方向に突き出る塊状部を備え、前記塊状部が複数のフィンを備える、請求項6、7及び10乃至13のいずれか一項に記載の携帯型物体接続可能パッケージ。
- 前記弾性電気接続用要素が、前記半導体ダイ・パッケージの一部分の周囲に巻き付けられた少なくとも1つの薄い積層体を備え、前記薄い積層体が可撓性接点のアレイを備える、請求項1乃至5のいずれか一項に記載の携帯型物体接続可能パッケージ。
- 前記携帯型物体が前記コネクタ体に対して相対的に移動するのを制限するために、前記携帯型物体ポジショナが、前記半導体ダイ・パッケージに固定された枠と少なくとも1つの受面とを備える、請求項1乃至15のいずれか一項に記載の携帯型物体接続可能パッケージ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05300228.3 | 2005-03-30 | ||
EP05300228 | 2005-03-30 | ||
PCT/IB2006/050857 WO2006103592A2 (en) | 2005-03-30 | 2006-03-21 | A portable object connectable package. |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008535076A JP2008535076A (ja) | 2008-08-28 |
JP4977828B2 true JP4977828B2 (ja) | 2012-07-18 |
Family
ID=37053755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008503640A Expired - Fee Related JP4977828B2 (ja) | 2005-03-30 | 2006-03-21 | 携帯型物体接続可能パッケージ |
Country Status (7)
Country | Link |
---|---|
US (1) | US7692280B2 (ja) |
EP (1) | EP1866830B1 (ja) |
JP (1) | JP4977828B2 (ja) |
CN (1) | CN100583121C (ja) |
AT (1) | ATE418764T1 (ja) |
DE (1) | DE602006004437D1 (ja) |
WO (1) | WO2006103592A2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8544755B2 (en) * | 2010-06-28 | 2013-10-01 | United Test And Assembly Center Ltd. | Subscriber identity module (SIM) card |
TWI514506B (zh) * | 2013-08-30 | 2015-12-21 | Arktek Co Ltd | 電子元件的定位裝置 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6330164B1 (en) * | 1985-10-18 | 2001-12-11 | Formfactor, Inc. | Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device |
US5917707A (en) * | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US5360946A (en) * | 1991-09-17 | 1994-11-01 | International Business Machines Corporation | Flex tape protective coating |
US6690186B2 (en) * | 1994-07-07 | 2004-02-10 | Tessera, Inc. | Methods and structures for electronic probing arrays |
US5490072A (en) | 1994-07-18 | 1996-02-06 | Kelsey-Hayes Company | Method and system for detecting the proper functioning of an ABS control unit utilizing dual programmed microprocessors |
FR2730328B1 (fr) * | 1995-02-03 | 1997-04-04 | Connectors Pontarlier | Connecteur pour appareil lecteur de carte a microcircuit et appareil lecteur de carte a microcircuit le comprenant |
DE19530264A1 (de) * | 1995-08-17 | 1997-02-20 | Abb Management Ag | Leistungshalbleitermodul |
RU2119276C1 (ru) * | 1997-11-03 | 1998-09-20 | Закрытое акционерное общество "Техно-ТМ" | Трехмерный гибкий электронный модуль |
US6468830B1 (en) * | 1998-01-26 | 2002-10-22 | Tessera, Inc. | Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor |
US6078500A (en) * | 1998-05-12 | 2000-06-20 | International Business Machines Inc. | Pluggable chip scale package |
JPH11330283A (ja) * | 1998-05-15 | 1999-11-30 | Toshiba Corp | 半導体モジュール及び大型半導体モジュール |
US6586845B1 (en) * | 1998-10-28 | 2003-07-01 | Shinko Electric Industries Co., Ltd. | Semiconductor device module and a part thereof |
EP1085453A1 (en) * | 1999-09-20 | 2001-03-21 | TELEFONAKTIEBOLAGET LM ERICSSON (publ) | SIM card holder |
US6461892B2 (en) * | 2000-01-26 | 2002-10-08 | Tessera, Inc. | Methods of making a connection component using a removable layer |
FR2805671B1 (fr) * | 2000-02-25 | 2002-07-26 | Sagem | Connecteur pour cartes a puce |
US6572781B2 (en) * | 2000-05-16 | 2003-06-03 | Tessera, Inc. | Microelectronic packaging methods and components |
JP3280954B2 (ja) * | 2000-06-02 | 2002-05-13 | 株式会社東芝 | 回路モジュール及び回路モジュールを搭載した電子機器 |
JP2002057767A (ja) * | 2000-08-08 | 2002-02-22 | Denso Corp | 電話器 |
US6589819B2 (en) * | 2000-09-29 | 2003-07-08 | Tessera, Inc. | Microelectronic packages having an array of resilient leads and methods therefor |
FR2816451B1 (fr) * | 2000-11-07 | 2005-04-01 | Framatome Connectors Int | Connecteur pour carte a circuit imprime pour etablir le contact depuis des cartes ic, en particulier des cartes sim, dans des telephones mobiles |
JP2002151550A (ja) * | 2000-11-15 | 2002-05-24 | Nec Corp | 半導体装置、その製造方法並びに製造に使用するコイルスプリング切断治具及びコイルスプリング供給治具 |
JP3923258B2 (ja) * | 2001-01-17 | 2007-05-30 | 松下電器産業株式会社 | 電力制御系電子回路装置及びその製造方法 |
US6825552B2 (en) * | 2001-05-09 | 2004-11-30 | Tessera, Inc. | Connection components with anisotropic conductive material interconnection |
US6695623B2 (en) * | 2001-05-31 | 2004-02-24 | International Business Machines Corporation | Enhanced electrical/mechanical connection for electronic devices |
US20030048624A1 (en) * | 2001-08-22 | 2003-03-13 | Tessera, Inc. | Low-height multi-component assemblies |
TW565019U (en) * | 2002-01-29 | 2003-12-01 | Molex Inc | Electrical connector |
EP1546988B1 (en) * | 2002-09-25 | 2007-02-14 | Koninklijke Philips Electronics N.V. | Connector for chip-card |
US6977434B2 (en) * | 2003-10-20 | 2005-12-20 | Hewlett-Packard Development Company, L.P. | Semiconductor assembly and spring member therefor |
US7057295B2 (en) * | 2004-04-22 | 2006-06-06 | Ted Ju | IC module assembly |
US7335979B2 (en) * | 2004-06-28 | 2008-02-26 | Intel Corporation | Device and method for tilted land grid array interconnects on a coreless substrate package |
US7184202B2 (en) * | 2004-09-27 | 2007-02-27 | Idc, Llc | Method and system for packaging a MEMS device |
US7427809B2 (en) * | 2004-12-16 | 2008-09-23 | Salmon Technologies, Llc | Repairable three-dimensional semiconductor subsystem |
-
2006
- 2006-03-21 EP EP06727689A patent/EP1866830B1/en active Active
- 2006-03-21 DE DE602006004437T patent/DE602006004437D1/de active Active
- 2006-03-21 CN CN200680010754.9A patent/CN100583121C/zh not_active Expired - Fee Related
- 2006-03-21 US US11/910,449 patent/US7692280B2/en active Active
- 2006-03-21 JP JP2008503640A patent/JP4977828B2/ja not_active Expired - Fee Related
- 2006-03-21 WO PCT/IB2006/050857 patent/WO2006103592A2/en active Application Filing
- 2006-03-21 AT AT06727689T patent/ATE418764T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN100583121C (zh) | 2010-01-20 |
JP2008535076A (ja) | 2008-08-28 |
WO2006103592A3 (en) | 2007-02-22 |
WO2006103592A2 (en) | 2006-10-05 |
US7692280B2 (en) | 2010-04-06 |
CN101180632A (zh) | 2008-05-14 |
ATE418764T1 (de) | 2009-01-15 |
EP1866830A2 (en) | 2007-12-19 |
EP1866830B1 (en) | 2008-12-24 |
DE602006004437D1 (de) | 2009-02-05 |
US20080224288A1 (en) | 2008-09-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20100165589A1 (en) | Sim card, sim card holder and electronic device with same | |
JP2006318217A (ja) | メモリカード用アダプタ | |
US9787111B2 (en) | Battery protection module package | |
CN113169491B (zh) | 数据存储设备及其连接器 | |
JP2006323803A (ja) | Sd/mmcカード | |
CN103795827B (zh) | 移动终端电路板组件及移动终端 | |
KR20040028635A (ko) | 접점 어레이를 포함하는 데이터 캐리어 | |
KR101772490B1 (ko) | 인쇄회로기판 어셈블리 | |
JP4977828B2 (ja) | 携帯型物体接続可能パッケージ | |
US7573724B2 (en) | Memory module and connection interface between the memory module and circuit board | |
CN100573572C (zh) | 射频识别芯片封装模块 | |
JP2005183925A (ja) | 半導体装置及びその製造方法 | |
KR101118236B1 (ko) | 초고속 유에스비 프로토콜에 적합한 씨오비 타입 휴대용 메모리 장치 | |
CN105280603A (zh) | 电子封装组件 | |
CN207995231U (zh) | 摄像头封装结构、电路板封装结构及电子设备 | |
JP2007012348A (ja) | メモリカード用コネクタ及びこれを用いた携帯電話機 | |
KR200444404Y1 (ko) | 정전기 방지 기능이 있는 유에스비 메모리 장치 | |
EP2159884A1 (en) | Laminated low profile connector for chip cards | |
CN205319148U (zh) | 半导体封装体 | |
CN102290400B (zh) | 半导体封装模块及具有该模块的电子电路组件 | |
CN104883817B (zh) | 模块器件和具有模块器件的电子设备 | |
JP3145045U (ja) | 電子記憶装置パッケージ | |
US20020063163A1 (en) | Microminiature card | |
JP3145758U (ja) | 電子装置パッケージ | |
KR20190066442A (ko) | 카드 커넥터 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090217 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110930 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111014 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120110 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120217 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20120301 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120301 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150427 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4977828 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |