ATE418764T1 - Anschliessbares gehäuse für ein tragbares objekt - Google Patents

Anschliessbares gehäuse für ein tragbares objekt

Info

Publication number
ATE418764T1
ATE418764T1 AT06727689T AT06727689T ATE418764T1 AT E418764 T1 ATE418764 T1 AT E418764T1 AT 06727689 T AT06727689 T AT 06727689T AT 06727689 T AT06727689 T AT 06727689T AT E418764 T1 ATE418764 T1 AT E418764T1
Authority
AT
Austria
Prior art keywords
portable object
package
semiconductor die
connector body
connectable
Prior art date
Application number
AT06727689T
Other languages
English (en)
Inventor
Stephan M Koch
Heinz-Peter Wirtz
Alexander M Jooss
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE418764T1 publication Critical patent/ATE418764T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Packages (AREA)
  • Purses, Travelling Bags, Baskets, Or Suitcases (AREA)
  • Switches With Compound Operations (AREA)
AT06727689T 2005-03-30 2006-03-21 Anschliessbares gehäuse für ein tragbares objekt ATE418764T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05300228 2005-03-30

Publications (1)

Publication Number Publication Date
ATE418764T1 true ATE418764T1 (de) 2009-01-15

Family

ID=37053755

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06727689T ATE418764T1 (de) 2005-03-30 2006-03-21 Anschliessbares gehäuse für ein tragbares objekt

Country Status (7)

Country Link
US (1) US7692280B2 (de)
EP (1) EP1866830B1 (de)
JP (1) JP4977828B2 (de)
CN (1) CN100583121C (de)
AT (1) ATE418764T1 (de)
DE (1) DE602006004437D1 (de)
WO (1) WO2006103592A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8544755B2 (en) * 2010-06-28 2013-10-01 United Test And Assembly Center Ltd. Subscriber identity module (SIM) card
TWI514506B (zh) * 2013-08-30 2015-12-21 Arktek Co Ltd 電子元件的定位裝置

Family Cites Families (32)

* Cited by examiner, † Cited by third party
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US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US6330164B1 (en) * 1985-10-18 2001-12-11 Formfactor, Inc. Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device
US5360946A (en) * 1991-09-17 1994-11-01 International Business Machines Corporation Flex tape protective coating
US6690186B2 (en) * 1994-07-07 2004-02-10 Tessera, Inc. Methods and structures for electronic probing arrays
US5490072A (en) 1994-07-18 1996-02-06 Kelsey-Hayes Company Method and system for detecting the proper functioning of an ABS control unit utilizing dual programmed microprocessors
FR2730328B1 (fr) * 1995-02-03 1997-04-04 Connectors Pontarlier Connecteur pour appareil lecteur de carte a microcircuit et appareil lecteur de carte a microcircuit le comprenant
DE19530264A1 (de) * 1995-08-17 1997-02-20 Abb Management Ag Leistungshalbleitermodul
RU2119276C1 (ru) * 1997-11-03 1998-09-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный гибкий электронный модуль
US6468830B1 (en) * 1998-01-26 2002-10-22 Tessera, Inc. Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor
US6078500A (en) * 1998-05-12 2000-06-20 International Business Machines Inc. Pluggable chip scale package
JPH11330283A (ja) * 1998-05-15 1999-11-30 Toshiba Corp 半導体モジュール及び大型半導体モジュール
US6586845B1 (en) * 1998-10-28 2003-07-01 Shinko Electric Industries Co., Ltd. Semiconductor device module and a part thereof
EP1085453A1 (de) * 1999-09-20 2001-03-21 TELEFONAKTIEBOLAGET LM ERICSSON (publ) SIM-Kartenhalter
US6461892B2 (en) * 2000-01-26 2002-10-08 Tessera, Inc. Methods of making a connection component using a removable layer
FR2805671B1 (fr) 2000-02-25 2002-07-26 Sagem Connecteur pour cartes a puce
US6572781B2 (en) * 2000-05-16 2003-06-03 Tessera, Inc. Microelectronic packaging methods and components
JP3280954B2 (ja) * 2000-06-02 2002-05-13 株式会社東芝 回路モジュール及び回路モジュールを搭載した電子機器
JP2002057767A (ja) * 2000-08-08 2002-02-22 Denso Corp 電話器
US6589819B2 (en) * 2000-09-29 2003-07-08 Tessera, Inc. Microelectronic packages having an array of resilient leads and methods therefor
FR2816451B1 (fr) * 2000-11-07 2005-04-01 Framatome Connectors Int Connecteur pour carte a circuit imprime pour etablir le contact depuis des cartes ic, en particulier des cartes sim, dans des telephones mobiles
JP2002151550A (ja) * 2000-11-15 2002-05-24 Nec Corp 半導体装置、その製造方法並びに製造に使用するコイルスプリング切断治具及びコイルスプリング供給治具
JP3923258B2 (ja) * 2001-01-17 2007-05-30 松下電器産業株式会社 電力制御系電子回路装置及びその製造方法
US6825552B2 (en) * 2001-05-09 2004-11-30 Tessera, Inc. Connection components with anisotropic conductive material interconnection
US6695623B2 (en) * 2001-05-31 2004-02-24 International Business Machines Corporation Enhanced electrical/mechanical connection for electronic devices
US20030048624A1 (en) * 2001-08-22 2003-03-13 Tessera, Inc. Low-height multi-component assemblies
TW565019U (en) * 2002-01-29 2003-12-01 Molex Inc Electrical connector
KR20050054959A (ko) 2002-09-25 2005-06-10 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 커넥터, 칩 카드 판독기, 이동 전화기 및 ｐｄａ
US6977434B2 (en) * 2003-10-20 2005-12-20 Hewlett-Packard Development Company, L.P. Semiconductor assembly and spring member therefor
US7057295B2 (en) * 2004-04-22 2006-06-06 Ted Ju IC module assembly
US7335979B2 (en) * 2004-06-28 2008-02-26 Intel Corporation Device and method for tilted land grid array interconnects on a coreless substrate package
US7184202B2 (en) * 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
US7427809B2 (en) * 2004-12-16 2008-09-23 Salmon Technologies, Llc Repairable three-dimensional semiconductor subsystem

Also Published As

Publication number Publication date
EP1866830A2 (de) 2007-12-19
JP4977828B2 (ja) 2012-07-18
CN100583121C (zh) 2010-01-20
US20080224288A1 (en) 2008-09-18
CN101180632A (zh) 2008-05-14
WO2006103592A2 (en) 2006-10-05
DE602006004437D1 (de) 2009-02-05
WO2006103592A3 (en) 2007-02-22
US7692280B2 (en) 2010-04-06
JP2008535076A (ja) 2008-08-28
EP1866830B1 (de) 2008-12-24

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties