JP4973893B2 - 基板処理装置及び基板処理装置での整備方法 - Google Patents
基板処理装置及び基板処理装置での整備方法 Download PDFInfo
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- 238000012545 processing Methods 0.000 title claims description 174
- 239000000758 substrate Substances 0.000 title claims description 96
- 238000000034 method Methods 0.000 title claims description 43
- 238000012423 maintenance Methods 0.000 title claims description 26
- 238000007789 sealing Methods 0.000 claims description 25
- 239000012530 fluid Substances 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 16
- 238000000576 coating method Methods 0.000 description 12
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 238000000206 photolithography Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
(実施例)
本実施形態では基板処理装置1が処理する基板として半導体基板を一例として図示して説明するが、本発明はこれに限定されず、ガラス基板のような多様な種類の基板にも適用可能である。
100 処理容器
200 基板支持部材
300 ノズル部材
400 排気部材
Claims (14)
- 内部空間を有するチャンバと、
前記チャンバの内部空間に設置され、前記チャンバの一面を通じて引き出すことができ、排気ラインを有する処理ユニットと、
前記チャンバに設置される排気部材とを含み、
前記排気部材は、
スリット形態の開口を有する排気ダクトと、
前記排気ラインと連結され、前記処理ユニットの移動によって前記開口に沿って動く移動排気ポートと、
前記移動排気ポートと共に移動し、前記開口を密閉するシーリングベルトと、を含むことを特徴とする基板処理装置。 - 前記排気部材は、
前記開口の一側と前記開口の他側に隣接して配置され、前記シーリングベルトの移動をガイドするガイドローラをさらに含むことを特徴とする請求項1に記載の基板処理装置。 - 前記排気ダクトは、
該長さ方向が前記処理ユニットの移動方向と平行になるように前記チャンバの一側面に設置されることを特徴とする請求項1に記載の基板処理装置。 - 前記処理ユニットは、
基板が置かれるスピンヘッドを含む基板支持部材と、
前記スピンヘッドの周りを囲むように設置され、基板上で飛散する処理流体を回収する処理容器とを含むことを特徴とする請求項1に記載の基板処理装置。 - 前記チャンバは、
前記処理ユニットの引き出し方向に沿って設置されるガイドレールと、
前記ガイドレールに沿って移動し、前記処理ユニットが設置された移動ベースをさらに含むことを特徴とする請求項1に記載の基板処理装置。 - 前記チャンバは、
基板出入口を有する第1面と、前記第1面と向き合う第2面と、第1面と第2面とを連結する第3側面と第4側面とを含み、
前記第2面はドアによって開放され、前記処理ユニットが引き出される開放面を提供することを特徴とする請求項1に記載の基板処理装置。 - 内部空間を有するチャンバと、
前記チャンバの内部空間に設置され、前記チャンバに対する相対位置が第1状態と第2状態に位置変更可能な処理ユニットと、
前記第1状態に位置する前記処理ユニットと連結される第1位置と、前記第2状態に位置する前記処理ユニットと連結される第2位置への移動が可能な移動排気ポートと、
外部のメイン排気ラインと連結され、前記移動排気ポートの第1位置と前記第2位置に移動可能になるように移動通路を提供する開口を有する排気ダクトと、
前記移動排気ポートと共に移動し、前記開口を密閉するシーリングベルトと、を有することを特徴とする基板処理装置。 - 前記第1状態は、前記処理ユニットが前記チャンバの内部空間に収納された状態であり、前記第2状態は、前記処理ユニットの整備のために前記チャンバから引き出された状態であることを特徴とする請求項7に記載の基板処理装置。
- 前記排気ダクトは、
前記開口の一側と前記開口の他側に隣接して配置され、前記シーリングベルトの移動をガイドするガイドローラをさらに含むことを特徴とする請求項7に記載の基板処理装置。 - 前記処理ユニットの位置変更方向に沿って前記チャンバに設置されるガイドレールと、
前記ガイドレールに沿って移動し、前記処理ユニットが設置される移動ベースとをさらに含むことを特徴とする請求項7に記載の基板処理装置。 - 内部空間を有し、ドアによって開放される開放面を有するチャンバと、
前記チャンバの内部空間に設置され、前記チャンバの開放面を通じて引き出すことができる移動ベースと、
前記移動ベースに設置され、基板が置かれるスピンヘッドを囲むように設置され、基板上で飛散する処理流体を回収する処理容器と、
前記処理容器に連結される排気ラインと、
前記排気ラインと連結され、前記移動ベースの移動方向と同一方向に移動可能な移動排気ポートが設置された排気ダクトとを含み、
前記排気ダクトは、
前記移動排気ポートが移動可能に位置するスリット形態の開口と、
前記移動排気ポートと共に移動し、前記開口を密閉するシーリングベルトとを含むことを特徴とする基板処理装置。 - 前記チャンバは、
前記移動ベースにより上部空間と下部空間に区画され、
前記排気ダクトは、前記下部空間に固定設置されることを特徴とする請求項11に記載の基板処理装置。 - 前記排気ダクトは、
前記開口の一側と前記開口の他側に隣接して配置され、前記シーリングベルトの移動をガイドするガイドローラをさらに含むことを特徴とする請求項11に記載の基板処理装置。 - チャンバに対する相対位置が第1状態と第2状態に位置変更可能な処理ユニットと、前記処理ユニットとは排気ラインを通じて連結され、前記処理ユニットの位置変更によって排気ダクト上で移動される移動排気ポートを有する基板処理装置での整備方法において、
前記処理ユニットを第1状態から第2状態に位置変更する段階と、
前記処理ユニットの位置変更によって、前記移動排気ポートが前記排気ダクトの第1位置から第2位置に位置変更する段階とを含み、
前記移動排気ポートの位置変更は、
前記排気ダクトに形成された開口の一側端の第1位置から他側端の第2位置に移動するものであり、
前記移動排気ポートの位置変更時、前記排気ダクトの開口は、シーリングベルトによって密閉され、前記シーリングベルトは、前記移動排気ポートと共に移動することを特徴とする基板処理装置での整備方法。
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KR1020080114532A KR101052818B1 (ko) | 2008-11-18 | 2008-11-18 | 기판 처리 장치 및 기판 처리 장치에서의 정비 방법 |
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JP2005087944A (ja) | 2003-09-19 | 2005-04-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
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KR100666352B1 (ko) * | 2005-05-26 | 2007-01-11 | 세메스 주식회사 | 기판 세정 건조 장치 및 방법 |
KR20080000876A (ko) | 2006-06-28 | 2008-01-03 | 삼성전자주식회사 | 플리커 측정 장치, 액정 표시 장치의 테스트 시스템 및액정 표시 장치의 플리커 튜닝 방법 |
KR20080045803A (ko) * | 2006-11-21 | 2008-05-26 | 삼성전자주식회사 | 반도체 디바이스 제조설비의 배기라인 구조 |
KR100916005B1 (ko) * | 2007-07-09 | 2009-09-10 | 한서에이치케이(주) | 플라즈마 에칭 장치 |
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2008
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2009
- 2009-11-11 TW TW098138236A patent/TWI424462B/zh active
- 2009-11-16 CN CN2009101801913A patent/CN101740347B/zh active Active
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20130056752A (ko) * | 2011-11-22 | 2013-05-30 | 세메스 주식회사 | 반송로봇 |
KR101895403B1 (ko) | 2011-11-22 | 2018-09-06 | 세메스 주식회사 | 반송로봇 및 이를 가지는 기판처리장치 |
KR20180005848A (ko) * | 2016-07-07 | 2018-01-17 | 세메스 주식회사 | 기판 반송 모듈 및 이를 포함하는 기판 처리 장치 |
KR101885571B1 (ko) | 2016-07-07 | 2018-08-07 | 세메스 주식회사 | 기판 반송 모듈 및 이를 포함하는 기판 처리 장치 |
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CN101740347A (zh) | 2010-06-16 |
JP2010123964A (ja) | 2010-06-03 |
US20100122773A1 (en) | 2010-05-20 |
TWI424462B (zh) | 2014-01-21 |
KR101052818B1 (ko) | 2011-07-29 |
TW201021089A (en) | 2010-06-01 |
KR20100055688A (ko) | 2010-05-27 |
CN101740347B (zh) | 2012-01-04 |
US8631756B2 (en) | 2014-01-21 |
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