JP4967739B2 - セラミックス電子部品（以下電子部品）焼成用道具材 - Google Patents
セラミックス電子部品（以下電子部品）焼成用道具材 Download PDFInfo
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- JP4967739B2 JP4967739B2 JP2007075540A JP2007075540A JP4967739B2 JP 4967739 B2 JP4967739 B2 JP 4967739B2 JP 2007075540 A JP2007075540 A JP 2007075540A JP 2007075540 A JP2007075540 A JP 2007075540A JP 4967739 B2 JP4967739 B2 JP 4967739B2
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- electronic parts
- alumina
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- 239000000463 material Substances 0.000 title claims description 22
- 238000010304 firing Methods 0.000 title claims description 13
- 239000000919 ceramic Substances 0.000 title description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052863 mullite Inorganic materials 0.000 claims description 10
- 239000002994 raw material Substances 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000011787 zinc oxide Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 description 8
- 239000000654 additive Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229920001353 Dextrin Polymers 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000010835 comparative analysis Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Images
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Furnace Charging Or Discharging (AREA)
Description
電融アルミナ、焼結アルミナ、シリカ粉、電融ムライトそれぞれの原料をアルミナ：シリカ比が（７０〜９９）：（３０〜１）に成るように調合し、混合する。混合時に外配で０．０１〜１０重量％の酸化亜鉛を添加し、バインダーとしてデキストリンを使用して混練した後、坏土を２６０×１７３ｍｍの金型に入れ、２．２ｔ／ｃｍ２の圧力を加えて乾式プレス成形した。これにより縦２６０ｍｍ、幅１７３ｍｍ、厚み７ｍｍの成形体を得た。この成形体をトンネル炉にて最高温度１７３０℃にて合計１０２時間の条件で焼成し、試料を作製した。
実施例１と同一の方法で添加物を使用しないものを比較例として作製した。
実施例１〜７及び比較例１の試料について、各試料をそれぞれ６ｍｍの厚さに研磨し、所定荷重を掛けて、電気炉にて１６００℃の温度で５時間保持し試料の反り量を試験した。その結果を表１に示す。
２ 試料（サイズ：２６０×１７３×６ｍｍ）
３ 支点
Claims (2)
- 化学成分がアルミナ７０〜９９重量％、シリカ３０〜１重量％からなる、アルミナ−ムライト質電子部品焼成用道具材において、製造時に外配で０．５〜３重量％の酸化亜鉛原料を添加して得られる道具材。
- 化学成分がアルミナ７０〜９９重量％、シリカ３０〜１重量％からなる、アルミナ−ムライト質電子部品焼成用道具材において、製造時に外配で０．５〜３重量％の酸化亜鉛原料を添加して得られる道具材の製造方法。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007075540A JP4967739B2 (ja) | 2007-02-21 | 2007-02-21 | セラミックス電子部品（以下電子部品）焼成用道具材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007075540A JP4967739B2 (ja) | 2007-02-21 | 2007-02-21 | セラミックス電子部品（以下電子部品）焼成用道具材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008201658A JP2008201658A (ja) | 2008-09-04 |
| JP4967739B2 true JP4967739B2 (ja) | 2012-07-04 |
Family
ID=39779546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007075540A Active JP4967739B2 (ja) | 2007-02-21 | 2007-02-21 | セラミックス電子部品（以下電子部品）焼成用道具材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4967739B2 (ja) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09142942A (ja) * | 1995-11-15 | 1997-06-03 | Mitsubishi Materials Corp | 亜鉛アルミナスピネル含有基材を用いた焼成用治具 |
| JP3320027B2 (ja) * | 1999-01-26 | 2002-09-03 | ニチアス株式会社 | 低熱膨張性セラミックスセッター及びその製造方法 |
| JP2005289723A (ja) * | 2004-03-31 | 2005-10-20 | Toshiba Ceramics Co Ltd | アルミナ・ムライト質焼成用治具 |
| CA2577998A1 (en) * | 2004-09-14 | 2006-03-23 | Carbo Ceramics Inc. | Sintered spherical pellets |
-
2007
- 2007-02-21 JP JP2007075540A patent/JP4967739B2/ja active Active
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| Publication number | Publication date |
|---|---|
| JP2008201658A (ja) | 2008-09-04 |
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