JP4964042B2 - Electronic equipment and duct plug type lighting equipment - Google Patents

Description

The present invention is, for example, relates electronic instrument and the duct plug illuminator again and again has a heat radiation structure of the lighting device.

An incandescent lamp lighting device such as a low-volt halogen lamp performs full-wave rectification of a commercial power source with a diode bridge or the like, and a DC voltage pulsated by full-wave rectification is switched at 20 kHz to 50 kHz using a switching element such as a transistor. In general, a rectangular wave voltage output by switching is stepped down to approximately 12 V by a step-down transformer, and a circuit that applies the stepped down voltage to the lamp is generally used.
Electronic appliances on which this lighting device is mounted are roughly classified into two types: appliances called duct plug type (built-in type) and appliances called separate type.

FIG. 7 is a view showing the structure of the duct plug type lighting fixture 400, and FIG. 8 is a view showing the structure of the separate type lighting fixture 401.
As shown in FIG. 7, a duct plug type lighting fixture 400 includes a lighting device 199 composed of an electronic transformer substrate 100 and an electronic component 198 disposed on the electronic transformer substrate 100, housed in a metal or resin case 200, and a ceiling. A structure that is attached to the duct rail 510 installed at 520 with one touch is common. And since the whole is installed on the ceiling surface, it is required to make the case 200 in which the lighting device 199 is housed in the duct plug type lighting fixture 400 as small as possible so as not to impair the beauty. However, if the case 200 is made smaller, the heat generated by the electronic component 198 tends to stay in the case 200.
Further, as shown in FIG. 8, the stand-alone lighting fixture 401 is attached to a ceiling hole 521 in which a lamp 440 and a reflection plate 420 are formed in a ceiling 520, and a lighting device 199 is housed in a metal case 200 and the lamp 440 or A structure that is fixed to the construction material 530 or the like on the back of the ceiling separately from the reflection plate 420 is generally used. In the separate lighting fixture 401, since the lighting device 199 is located away from the lamp 440 and the reflector 420, the heat generated by the electronic component 198 is easily radiated as compared with the duct plug type lighting fixture 400.
In addition, a low volt halogen or the like is generally used for the lamp 440 attached to the socket 430 of the duct plug type luminaire 400 and the separate type luminaire 401, and the lamp 440 using the low volt halogen or the like generates a large amount of heat.

The electronic components attached to the substrate shown in FIGS. 7 and 8 include a discrete component and a surface mount component.
Patent Document 1 shows an apparatus for dissipating heat from surface-mounted components.
Japanese Patent Laid-Open No. 11-214559

  Here, the duct plug type lighting fixture 400 which is required to make the outer shape of the case 200 as small as possible while the lamp 440 is close to the case 200 in which the lighting device 199 is housed is electronic compared to the separate type lighting fixture 401. The heat generated by the component 198 is difficult to dissipate and tends to stay in the case 200. For this reason, suppressing the heat generation of the electronic component 198 used in the lighting device 199 is one of the major design issues for the duct plug type lighting fixture 400. In addition, for the stand-alone lighting fixture 401, it is one of the major design issues to suppress the heat generation of the electronic component 198 used in the lighting device 199. In general, when an appliance (electronic appliance) using an electronic component is stored in a case, it is a big design problem for the electronic appliance to suppress the heat generation of the electronic component.

  In general, there are three methods for heat treatment of electronic parts 198: a method of dissipating heat by using a heat radiation fin, a method of dissipating heat by filling a case with a filler such as silicon or urethane, and a method of reducing the rated lamp output. is there.

FIG. 9 is a diagram showing a heat countermeasure method using the radiation fins 110, and FIG. 10 is a diagram showing a heat countermeasure method using the filler 120.
FIG. 9 shows that the large heat radiation fins 110 are attached to the electronic transformer substrate 100 from the front (lower view) and the upper side (upper view).
FIG. 10 shows that the filler 120 filled in the case 200 covers each electronic component (electronic component 101 to electronic component 108) of the lighting device 199.

The heat countermeasure method using the radiating fin 110 shown in FIG. 9 is a method of radiating heat by increasing the radiating area by attaching the radiating fin 110 to an electronic component (the electronic component 102, the electronic component 104, and the electronic component 105 in FIG. 9). In order to obtain a heat dissipation effect, a large heat dissipation fin 110 is required. For this reason, this heat countermeasure method has a problem that both the material cost and the processing cost of the radiating fin 110 become expensive, and the problem that the area of the electronic transformer substrate 100 on which each electronic component is arranged increases.
Further, the heat countermeasure method for filling the filler 120 shown in FIG. 10 has a high heat dissipation effect because each electronic component is covered with the filler 120 such as silicon or urethane. However, this heat countermeasure method has a problem that the degree of difficulty in processing is high, and it is necessary to introduce a dedicated facility for forming the filler 120, and the filling material is expensive, and thus there is a problem that a manufacturing cost is required.
Further, a heat countermeasure method for reducing the rated lamp output is a method of lighting with an output different from the rated power displayed on the lamp. Therefore, this heat countermeasure method has a problem that, for example, it is necessary to inform the user that “lights with an output different from the rated power”.

  The present invention, for example, suppresses the manufacturing cost of electronic equipment such as material costs and processing costs after obtaining a desired heat dissipation effect for the electronic components of the lighting device at the lamp output at the rated power. An object of the present invention is to reduce the size of the electronic apparatus by reducing the area of the base on which the electronic apparatus is disposed, and further facilitate the processing to increase the manufacturing efficiency of the electronic apparatus.

  The electronic apparatus of the present invention is an electronic component, a case in which the electronic component is built in, a heat radiation fin attached to the electronic component, a contact portion in contact with the electronic component, a connection portion connected to the contact portion, A heat dissipating fin that is attached to the surface of the connecting part and has an elastic part that contacts the inner surface of the case and transmits heat generated by the electronic component to the case; and the surface of the connecting part of the heat dissipating fin and the The distance L1 from the inner surface of the case and the thickness L2 of the elastic part of the radiating fin have a relationship of L2 = L1 + 1 (unit: millimeter).

  According to the present invention, for example, since the elastic portion of the radiating fin comes into contact with the case with an appropriate stress, a desired heat radiating effect can be obtained. Further, for example, according to the present invention, a large heat dissipating fin is not required and a filler is not required. Therefore, it is possible to suppress the manufacturing cost of an electronic instrument such as a material cost and a processing cost. Further, for example, according to the present invention, since a large heat dissipating fin is not required, the area of the base on which the electronic component is arranged can be suppressed and the electronic apparatus can be downsized. Further, for example, according to the present invention, it is not necessary to fill the filler so as to cover each electronic component, so that the processing can be facilitated and the manufacturing efficiency of the electronic apparatus can be increased.

Embodiment 1 FIG.
FIG. 1 is a diagram showing a lighting device 199 to which heat dissipating fins 300 are attached in the first embodiment.
FIG. 1 shows that the lighting device 199 is composed of an electronic transformer substrate 100 (printed circuit board) and discrete components (electronic components 101 to 108) arranged on the electronic transformer substrate 100. It is shown from the bottom (upper) and the upper (upper). The electronic component 101 to the electronic component 108 are connected to the electronic transformer substrate 100 by, for example, solder.
As a heat dissipation structure in the first embodiment, the lighting device 199 is made of a metal (for example, aluminum) heat dissipation fin that is a feature of the first embodiment in a semiconductor electronic component such as a diode bridge or a switching transistor that generates a relatively high temperature. 300 is attached. However, the electronic component to which the heat radiating fin 300 is attached is not limited to the diode bridge or the switching transistor, and the heat radiating fin 300 may be attached to the electronic component to be radiated. Moreover, although the radiation fin 300 is not restricted to metal, it is desirable that it is a material having high thermal conductivity. By attaching the radiating fin 300 to the electronic component, heat generated by the electronic component is transmitted to the radiating fin 300. In FIG. 1, the electronic component 102 is a diode bridge, and the pair of the electronic component 104 and the electronic component 105 is a switching transistor.

In the heat dissipation structure in the first embodiment, as shown in FIG. 1, the cross section of the heat dissipation fin 300 is substantially L-shaped, and the heat dissipation fin 300 forms one surface (hereinafter referred to as the heat dissipation surface 320 and the heat dissipation surface 320). And a pad 330 having elasticity such as silicon, urethane, rubber or the like. Further, in the heat dissipation structure in the first embodiment, the discrete component (electronic component) is perpendicular to one surface (hereinafter referred to as contact surface 310) where the pad 330 in which the heat dissipation fin 300 forms a substantially L-shaped cross section is not disposed. It is attached to a surface.
That is, the heat dissipation structure in the first embodiment includes the contact surface 310 where the heat dissipation fin 300 contacts the discrete component, the heat dissipation surface 320 connected to the contact surface 310, and the pad 330 attached to the surface of the heat dissipation surface 320. Features.

FIG. 2 is a diagram showing the electronic component 102 to which the radiation fin 300 is attached in the first embodiment.
FIG. 3 is a diagram illustrating the electronic component 104 and the electronic component 105 to which the radiation fins 300 are attached in the first embodiment.
2 and 3 show the electronic component 102, the electronic component 104, and the electronic component 105 to which the radiation fins 300 are attached from the front (lower right diagram), the upper (upper right diagram), and the left side (left diagram).
As shown in FIGS. 2 and 3, the heat radiation fin 300 is attached to the electronic component 102, the electronic component 104, and the electronic component 105 by screwing with screws 301. However, the method of attaching the heat dissipating fins 300 may be a method other than screwing such as adhesion or engagement as long as it is a method of closely attaching to the electronic component. By bringing the radiating fin 300 into close contact with the electronic component, heat generated by the electronic component is transmitted to the radiating fin 300.

4, FIG. 5, and FIG. 6 are diagrams showing lighting device 199 housed in case 200 in the first embodiment.
4 and 5 show the inside of the case 200 containing the lighting device 199 from the front.
FIG. 6 shows the inside of the case 200 containing the lighting device 199 from below.
As shown in FIGS. 4 to 6, the lighting device 199 according to the first embodiment is characterized in that, when the lighting device 199 is housed in the case 200, the pads 330 attached to the radiation fins 300 are in contact with the case 200.
In FIG. 4, the lighting device 199 is configured so that discrete components (electronic components) extend downward, that is, the electronic components on which the electronic transformer substrate 100 is attached and the electronic components to which the radiation fins 300 are attached are located downward. It is stored in the case 200 facing downward. In FIG. 4, the pad 330 of the radiating fin 300 is in contact with the bottom surface 201 of the case 200.
In FIG. 5, the lighting device 199 is such that discrete components (electronic components) extend upward, that is, the electronic components with the heat radiation fins 300 attached on the bottom of the electronic transformer substrate 100. It is stored in the case 200 facing upward. In FIG. 5, the pad 330 of the radiating fin 300 is in contact with the top surface 202 of the case 200.
In FIG. 6, the lighting device 199 is housed in the case 200 sideways so that the discrete component (electronic component) extends in the lateral direction, that is, the electronic transformer substrate 100 and the electronic component are positioned on the left and right. It has been. In FIG. 6, the pad 330 of the radiating fin 300 is in contact with the side surface 203 of the case 200.

In the heat dissipation structure in the first embodiment, a high heat dissipation effect can be obtained when the pad 330 of the heat dissipation fin 300 attached to the electronic component is in contact with the case 200 with an appropriate stress. Therefore, when the inner diameter of the case 200 is too large with respect to the size of the lighting device 199, the lighting device 199 is fixed so that the lighting device 199 is fixed with the pad 330 in contact with the case 200 with an appropriate stress. A fixing mechanism such as an engaging rail or protrusion may be provided on the shape / inner surface of the case 200.
In the heat dissipation structure in the first embodiment, the lighting device 199 is placed vertically as shown in FIG. 4 and FIG. 5 in response to requests for “reducing the height” and “reducing the width (depth)” of the outer shape of the case 200. This can be accommodated by housing in the case 200 or by placing the lighting device 199 horizontally in the case 200 as shown in FIG.

  As shown in FIGS. 4 to 6, the heat dissipation structure in the first embodiment is an electronic apparatus (for example, a duct plug type lighting apparatus 400) in which a lighting device 199 for lighting a halogen lamp or an incandescent lamp is built in a case 200. A metal radiating fin 300 having a substantially L-shaped cross section is attached to an electronic component mounted on the electronic transformer board 100 (printed board) of the lighting device 199. At this time, the radiating fin 300 is attached to the radiating fin 300 such that the radiating surface 320 is disposed on the top surface 202, bottom surface 201, or side surface 203 side of the case 200. A heat transfer pad 330 having elasticity is attached to the heat radiation surface 320 of the heat radiation fin 300.

In the heat dissipation structure in the first embodiment, the heat dissipating fin 300 having a substantially L-shaped cross section is in surface contact with the discrete component (electronic component) at the contact surface 310 where the pad 330 is not disposed, and elastically attached to the heat dissipation surface 320. The pad 330 having a surface is in surface contact with the case 200.
Further, in the heat dissipation method (heat countermeasure method) using the heat dissipation structure in the first embodiment, the heat generated by the electronic component is transmitted from the heat dissipation fin 300 to the case 200 via the pad 330 so that the case 200 and the case 200 It is characterized by radiating heat to the outside.
In the heat dissipation structure / heat dissipation method in the first embodiment, since the pad 330 having elasticity is in contact with the case 200 with an appropriate stress, the heat conduction efficiency between the heat dissipation fin 300 and the case 200 is high. A high heat dissipation effect for the heat generated by the parts can be obtained.
Further, in the heat dissipation structure and heat dissipation method in the first embodiment, the case 200, which is a heat dissipation destination of the heat generated by the electronic component, has a larger surface area than the electronic component or the heat dissipation fin 300. On the other hand, a high heat dissipation effect can be obtained.

That is, in the heat dissipation structure / heat dissipation method in the first embodiment, an appropriate stress is obtained between the heat dissipation fin 300 and the case 200 by using an appropriate pad 330, so that the heat generated by the electronic component is desired. A heat dissipation effect is obtained.
In the heat dissipation structure and heat dissipation method in the first embodiment, the heat generated by the heat dissipation fin 300 by the electronic component is dissipated by the case 200, thereby eliminating the need for a large heat dissipation fin that dissipates heat by itself. Furthermore, in the heat dissipation structure and heat dissipation method in the first embodiment, the pad 330 of the heat dissipation fin 300 is in contact with the case 200 with an appropriate stress to obtain a high heat dissipation effect, thereby eliminating the need for a filler having a high heat dissipation effect. For this reason, in the heat dissipation structure / heat dissipation method of Embodiment 1, the material cost and processing of the lighting device 199 and the duct plug type lighting fixture 400 (or the separate type lighting fixture 401) are compared with the heat dissipation method using a large heat dissipation fin or filler. Costs can be reduced. In addition, in the heat dissipation structure / heat dissipation method of the first embodiment, the electronic transformer substrate 100, the lighting device 199, and the duct plug type lighting fixture 400 (or the separate type lighting fixture 401) are downsized compared to the heat dissipation method using a large heat dissipation fin. be able to. In addition, in the heat dissipation structure / heat dissipation method of the first embodiment, the manufacturing efficiency of the lighting device 199 and the duct plug type lighting fixture 400 (or the separate type lighting fixture 401) is higher than that of the heat dissipation method using a filler that is difficult to process. Can be increased.

  The characteristics of the pad 330 for obtaining a desired heat dissipation effect with respect to the heat generated by the electronic component in the heat dissipation structure of the first embodiment will be described in an eighth embodiment to be described later. The characteristics of the pad 330 are, for example, thickness, hardness, and area. In the heat dissipation method in the first embodiment, by using the pad 330 having appropriate characteristics, an appropriate stress is obtained between the heat dissipation fin 300 and the case 200, and a desired heat dissipation is performed with respect to the heat generated by the electronic component. An effect is obtained.

Embodiment 2. FIG.
In the first embodiment, the heat radiating fins 300 are positioned such that the heat radiating surfaces 320 and the pads 330 of the heat radiating fins 300 are positioned ahead of the discrete components in the extending direction, that is, the heat radiating surfaces 320 and the pads 330 of the heat radiating fins 300 are positioned above the electronic components. The form which attaches 300 to an electronic component was demonstrated.
In the second embodiment, a mode in which the heat radiation fin 300 is attached to the electronic component so that the pad 330 is positioned on the side of the electronic component will be described.
Hereinafter, the mounting direction of the radiating fin 300 with respect to the electronic component will be described, and other matters such as the radiating structure, the radiating method, the characteristics of the pad 330, the mounting method, the operation, and the effect of the radiating fin 300 are the same as those in the first embodiment. Will not be described.

FIG. 11 is a diagram showing a lighting device 199 to which the radiation fins 300 are attached in the second embodiment.
FIG. 11 is a diagram corresponding to FIG. 1 of the first embodiment, in which the radiating fins 300 are attached so that the heat radiating surface 320 and the pads 330 are located on the sides of the electronic component 102, the electronic component 104, and the electronic component 105. 1 is different from FIG. 1 of the first embodiment.

12, 13 and 14 are diagrams showing lighting device 199 housed in case 200 in the second embodiment.
FIGS. 12 to 14 are diagrams corresponding to FIGS. 4, 5, and 6 of the first embodiment, respectively, and show a method of housing the lighting device 199 in the second embodiment shown in FIG. 11 in the case 200. Yes.
The pads 330 of the heat dissipation fins 300 attached to the electronic component 102, the electronic component 104, and the electronic component 105 are in contact with the bottom surface 201 of the case 200 in FIG. 12, in contact with the top surface 202 of the case 200 in FIG. It is in contact with the side surface 203 of 200.

Since the heat dissipating structure in the second embodiment differs only in the mounting direction of the heat dissipating fins 300 with respect to the electronic component, the same effect as the heat dissipating structure in the first embodiment can be obtained.
In the heat dissipation structure in the second embodiment, since the heat dissipation fin 300 does not cover the electronic component or the electronic transformer substrate 100 from above, the lighting device 199 can be easily inspected.

Embodiment 3 FIG.
In the first embodiment and the second embodiment, a description has been given of a configuration in which each heat dissipating fin 300 is attached to an electronic component so that the heat dissipating surface 320 and the pad 330 face the same direction.
In the third embodiment, a mode in which each heat radiation fin 300 is attached to an electronic component such that the heat radiation surfaces 320 and the pads 330 face in different directions will be described.
Hereinafter, the mounting direction of the radiating fin 300 with respect to the electronic component will be described, and other matters such as the radiating structure, the radiating method, the characteristics of the pad 330, the mounting method, the operation, and the effect of the radiating fin 300 are the same as those in the first embodiment. Will not be described.

FIG. 15 is a diagram illustrating a lighting device 199 to which the radiation fins 300 are attached in the third embodiment.
FIG. 15 is a diagram corresponding to FIG. 11 of the third embodiment, and the heat radiating surface 320 of the radiating fin 300 attached to the electronic component 102 and the heat radiating surface of the radiating fin 300 attached to the electronic component 104 and the electronic component 105. 320 differs from FIG. 11 of the third embodiment in that it is directed in a different direction.

FIGS. 16 and 17 are diagrams showing a lighting device 199 housed in a case 200 according to the third embodiment.
FIGS. 16 and 17 are diagrams corresponding to FIGS. 12 (or 13) and 14 of the second embodiment, respectively, and a method of housing the lighting device 199 in the third embodiment shown in FIG. Show.
In FIG. 16, the pad 330 of the radiating fin 300 attached to the electronic component 102 and the pad 330 of the radiating fin 300 attached to the electronic component 104 and the electronic component 105 are in contact with the bottom surface 201 and the top surface 202 of the case 200 in FIG. In FIG. 17, the case 200 is in contact with the left and right side surfaces 203.

In FIGS. 15 to 17, the heat radiating fins 300 are attached to the electronic component such that the heat radiating surface 320 and the pad 330 face the left or right side of the electronic component, but the heat radiating surface 320 and the pad 330 are located above the electronic component. The heat radiating fins 300 may be attached to the electronic component so as to face.
For example, when three radiating fins 300 are attached to different electronic components, the two radiating fins 300 are attached to the electronic components so that the respective radiating surfaces 320 and pads 330 face the left and right sides as shown in FIG. The remaining one radiating fin 300 may be attached to the electronic component such that the radiating surface 320 and the pad 330 face upward as shown in FIG.

Since the heat dissipating structure in the third embodiment differs only in the mounting direction of the heat dissipating fins 300 with respect to the electronic component, the same effect as the heat dissipating structure in the first embodiment can be obtained.
Further, in the heat dissipation structure in the third embodiment, heat generated in the electronic component can be dissipated on different surfaces of the case 200 via the heat dissipation fins 300 and the pads 330, so that a higher heat dissipation effect than in the first embodiment is achieved. Obtainable.

Embodiment 4 FIG.
Although Embodiment 1 to Embodiment 3 have described the form in which the cross section of the radiating fin 300 is substantially L-shaped, the radiating fin 300 may have other shapes.
In the fourth embodiment, an example of a heat radiating structure using a heat radiating fin 300 having a shape other than a substantially L-shaped cross section is shown.
The fourth embodiment is the same as the first to third embodiments except for the shape of the radiating fin 300.

18 and 19 are diagrams showing a lighting device 199 to which the radiation fin 300 according to the fourth embodiment is attached.
FIG. 18 and FIG. 19 are views corresponding to FIG. 1 of the first embodiment, and show that heat dissipating fins 300 having a substantially U-shaped cross section and a substantially π-shaped cross section are attached to the electronic component. In addition to the shape of the radiating fin 300, FIGS. 18 and 19 are attached to one radiating fin 300 (electronic component 102) or a plurality of electronic components (electronic component 104 and electronic component 105) arranged in series (lateral). 1 is characterized by being attached to electronic components (electronic component 102 and electronic component 105, electronic component 102 and electronic component 104) arranged in parallel (facing each other) with respect to FIG. .

  In addition, the shape of the radiating fin 300 may be a shape other than a substantially L shape, a substantially U shape, or a substantially π shape in cross section, and may have a substantially T shape, a substantially F shape, or the like in cross section.

Embodiment 5 FIG.
FIG. 20 is a diagram illustrating a lighting device 199 to which the radiation fin 300 according to the fifth embodiment is attached.
FIG. 20 shows the lighting device 199 in which the heat radiation fin 300 is attached to the surface-mounted electronic component 109 from the front (lower left diagram), the upper (upper left diagram), and the side (right diagram).
In the first to fourth embodiments, the form in which the radiating fins 300 are attached to the discrete parts has been described. However, as shown in FIG. 20, heat is radiated to the electronic parts 109 (surface-mounted parts) that are surface-mounted on the electronic transformer substrate 100. The fin 300 may be attached.
The fifth embodiment is the same as the first to fourth embodiments except for the form of the electronic component.

Embodiment 6 FIG.
In the sixth embodiment, a heat radiating structure that increases the surface area of the pad 330 without changing the external size will be described in order to enhance the heat radiating effect.
In the sixth embodiment, matters other than those described below are the same as those in the first to fifth embodiments.

FIGS. 21 and 22 are diagrams showing lighting device 199 housed in case 200 in the sixth embodiment.
FIGS. 21 and 22 are views corresponding to FIG. 4 of the first embodiment, and are views (upper view) showing the inside of the case 200 containing the lighting device 199 from the front, and the contact between the pad 330 and the case 200. The enlarged view (lower figure) of the part is shown.
The heat dissipation structure according to the sixth embodiment shown in FIG. 21 is characterized in that the contact portion of the case 200 with the heat transfer pad 330 is uneven. Accordingly, the elastic pad 330 is deformed so as to follow the unevenness and is in close contact with the case 200, so that the heat conduction area between the case 200 and the pad 330 is widened, and the heat conduction from the pad 330 to the case 200 is performed. Efficiency increases and the heat dissipation effect can be enhanced.
The heat dissipating structure in the sixth embodiment shown in FIG. 22 is characterized in that a concavity and convexity are formed on the joint portion of the pad 330 on the heat dissipating surface 320 of the metal heat dissipating fin 300. As a result, the elastic pad 330 is deformed so as to follow the unevenness and is coupled to the heat radiating surface 320, so that the heat conduction area between the heat radiating surface 320 and the pad 330 is widened, and the heat radiating fin 300 to the pad 330. The heat conduction efficiency increases, and the heat dissipation effect can be enhanced.

  Concavities and convexities may be provided on both the case 200 and the heat radiation surface 320 of the heat radiation fin 300.

Embodiment 7 FIG.
In the first to sixth embodiments, the form in which the pad 330 is coupled to the heat radiating fin 300 has been described. However, the pad 330 may be coupled to the case 200.
In this case, when the lighting device 199 is housed in the case 200, the heat radiation surface 320 of the heat radiation fin 300 attached to the electronic component and the pad 330 attached to the case 200 come into contact with each other with an appropriate stress. And the high heat dissipation effect with respect to the heat which generate | occur | produced with the electronic component similarly to Embodiment 1- Embodiment 6 can be acquired.

Embodiment 8 FIG.
In the eighth embodiment, the characteristics of the pad 330 for obtaining the desired heat radiation effect described in the first embodiment will be described.
As described in the first embodiment, the characteristics of the pad 330 include, for example, thickness, hardness, area, and the like.

FIG. 23 is a diagram illustrating a contact portion between the radiating fin 300 and the case 200 in the eighth embodiment.
The new code | symbol shown in FIG. 23 is demonstrated below.

“L1” indicates the distance between the heat radiation surface 320 of the heat radiation fin 300 and the case 200.
“L2” indicates the thickness of the pad 330.
“P” indicates the compression amount of the pad 330 and is represented by “L2−L1”.
“C” indicates the hardness of the pad 330.
“A” indicates the area of the pad 330.
“S” indicates a stress generated between the pad 330 and the case 200.

The heat conduction efficiency can be increased by applying an appropriate stress to the heat conduction surface. That is, in each embodiment, by applying an appropriate stress S between the pad 330 and the case 200, it is possible to enhance the heat dissipation effect for the heat generated by the electronic component.
In addition, the stress S between the pad 330 and the case 200 is influenced by the compression amount P (size that crushes the pad 330) of the pad 330, the hardness C of the pad 330, the area A where the pad 330 and the case 200 are in contact, and the like. The
Therefore, in consideration of the heat dissipation effect and cost, the essential characteristics (thickness L2, hardness C, area A) of the pad 330 suitable for the heat dissipation structure / heat dissipation method described in each embodiment and other Specific examples of incidental characteristics (interval L1, compression amount P) that are influenced by the characteristics of the object are given below. Here, the essential characteristics of the pad 330 and the incidental characteristics of the pad 330 are combined to form the characteristics of the pad 330.

<Example 1>
(1) The distance L1 between the heat radiation surface 320 of the heat radiation fin 300 and the case 200 is 1 mm (millimeters) or more and 3 mm or less.
(2) The thickness L2 of the pad 330 is 2 mm or more and 4 mm or less.
(3) The compression amount P of the pad 330 is 1 mm.
(4) The pad 330 has a hardness C equivalent to 25 or less in terms of Asker C hardness.

In the first embodiment, the characteristics of the pad 330 have the following relationship.
(A) L2 = L1 + 1 (mm)
(B) 1.3 ≦ L2 / L1 ≦ 2.0

  Note that the description “Xmm (1 mm to 4 mm)” in the characteristics of the pad 330 means “substantially Xmm” and indicates an approximate value such as a rounded value or a value obtained by rounding up or down after the decimal point.

The following three points can be cited as reasons for setting the characteristics of the pad 330 as described above in the first embodiment.
The first reason is that if the thickness L2 of the pad 330 is too thin, sufficient elasticity of the pad 330 cannot be obtained. Therefore, when the lighting device 199 is housed in the case 200, stress is applied to the solder portion of the electronic component, which is the worst. This is because cracks may occur in the solder.
The second reason is that if the pad 330 is too thick, the thermal resistance of the pad 330 is increased, and the heat transfer from the radiating fin 300 to the case 200 is deteriorated.
The third reason is that the thickness 330 of the pad 330 is 1 to 4 mm in general-purpose size, and the pad 330 having a thickness L2 that is greater than or equal to this size is a custom-made product and increases in price.

Embodiment 9 FIG.
In the present embodiment, in order to improve the adhesion between the heat radiation fin 300 (heat radiation plate) and the case 200 of the first to eighth embodiments, the surface of the heat radiation fin 300 that contacts the case 200 (the heat radiation surface 320, This relates to a structure that regulates the pad 330) so as to be substantially parallel to the case 200.

FIG. 24 is a diagram illustrating a lighting device 199 to which the radiation fin 300 according to the ninth embodiment is attached. FIG. 24 corresponds to the first embodiment, and shows the lighting device 199 from the front (lower view) and the upper side (upper view).
FIG. 25 is a cross-sectional view showing lighting device 199 housed in case 200 of duct plug-type lighting fixture 400 in the ninth embodiment.
FIG. 26 is a diagram illustrating attachment of the heat radiation fin 300 to the electronic component 102 according to the ninth embodiment.
FIG. 27 is a diagram illustrating the electronic component 102 to which the radiation fin 300 according to the ninth embodiment is attached. FIG. 27 shows the electronic component 102 to which the radiation fins 300 are attached from the front (lower view) and the upper side (upper view).
FIG. 28 is a diagram illustrating attachment of heat radiation fins 300 to electronic component 104 and electronic component 105 in the ninth embodiment.
FIG. 29 is a diagram illustrating the electronic component 104 and the electronic component 105 to which the radiation fins 300 are attached according to the ninth embodiment. FIG. 29 shows the electronic component 104 and the electronic component 105 to which the radiation fins 300 are attached from the front (lower view) and the upper side (upper view).
FIG. 30 is a diagram illustrating an arrangement relationship of the electronic component 102, the electronic component 104, and the electronic component 105 to which the heat radiation fins 300 are attached according to the ninth embodiment. FIG. 30 shows the electronic component 102, the electronic component 104, and the electronic component 105, to which the heat radiating fins 300 are attached, from above (upper diagram).
The configuration of lighting device 199 according to Embodiment 9 will be described below with reference to FIGS.

As shown in FIGS. 24 and 25, the heat radiation fin 300 is formed by being bent so that the cross section is substantially L-shaped, and comes into contact with an electronic component (for example, the electronic component 102, the electronic component 104, and the electronic component 105). It has a contact surface 310 and a heat dissipation surface 320 that contacts the case 200. The heat dissipating surface 320 of the heat dissipating fin 300 has a pad 330, contacts the case 200 via the pad 330, and transmits heat of the electronic component to the case 200 to dissipate heat.
The radiating fin 300 is the same as that in each of the embodiments.

Further, as shown in FIGS. 26 and 28, the contact surface 310 of the radiating fin 300 is provided with three threaded screw holes 340 into which the screws 301 and the inclination regulating screws 620 are inserted in substantially a straight line.
As shown in FIG. 26 and FIG. 27, a heat radiation fin 300 is attached to the electronic component 102 (diode bridge) to be radiated with screws 301. The screw 301 passes through the electronic component 102 and the contact surface 310 of the radiating fin 300 that are in contact with each other, and fixes the radiating fin 300 to the electronic component 102.

  As shown in FIG. 24 and FIG. 25, the screw head 302 of the screw 301 attached to the electronic component 102 protrudes from the electronic component 102, and another electronic component in which the screw head 302 is disposed on the electronic transformer substrate 100. The electronic component 101 and the electronic component 102 are arranged so as to come into contact with 101 (line filter). That is, the other electronic component 101 that is the target of heat dissipation and is disposed next to the electronic component 102 to which the heat dissipation fin 300 is attached is the height (thickness) of the screw head 302 of the screw 301 that fixes the heat dissipation fin 300 to the electronic component 102. It is arranged at a position separated by a). In other words, the radiating fin 300 is fixed to the electronic component 102 by the screw 301 having the screw head 302 having a height corresponding to the arrangement interval between the electronic component 102 and the electronic component 101. The screw 301 is inserted into the screw hole 131 of the electronic component 102 and the screw hole 340 of the heat radiation fin 300 from the side where the electronic component 101 is arranged so that the screw head 302 is positioned on the electronic component 101 side. The radiation fin 300 is fixed. When the contact surface 310 of the radiating fin 300 is disposed between the electronic component 102 and the electronic component 101 and the radiating fin 300 is fixed to the electronic component 102, the screw head 302 of the screw 301 is connected to the electronic component 102 and the electronic component 101. Therefore, the height of the contact surface 310 is subtracted from the interval width. Hereinafter, the contact surface 310 of the heat radiating fin 300 is disposed not between the electronic component 102 and the electronic component 101 but between the electronic component 102 and the electronic component 104 disposed opposite to the electronic component 102. It will be described as a thing.

  At this time, if the heat dissipation fin 300 is attached to the electronic component 102 so that the heat dissipation surface 320 that contacts the case 200 via the pad 330 protrudes toward the electronic component 101, the electronic component 102 is attached to the electronic component 101 by the weight of the heat dissipation fin 300. The electronic component 102 is stable and almost upright. That is, the radiating fin 300 is attached to the electronic component 102 such that the radiating surface 320 protruding in a direction perpendicular to the contact surface 310 is disposed on the electronic component 101 side. For this reason, the load of the heat radiation fin 300 is applied to the electronic component 102 to which the heat radiation fin 300 is attached in the protruding direction of the heat radiation surface 320, that is, the electronic component 101 side. However, in the ninth embodiment, the screw head 302 of the screw 301 that attaches the radiating fin 300 to the electronic component 102 abuts against the electronic component 101, so that the electronic component 102 remains on the electronic component 101 side even when a load is applied from the radiating fin 300. Does not tilt. In addition, since a load is applied to the electronic component 102 on the electronic component 101 side, the electronic component 102 does not tilt to the opposite side (the electronic component 104 and the electronic component 105 side) where the electronic component 101 is not disposed. That is, the electronic component 102 can be kept upright. Here, it is assumed that the electronic component 101 forms a rectangular parallelepiped and is attached to the electronic transformer substrate 100 by four wiring legs 132 protruding from the four corners of the lower surface of the rectangular parallelepiped. The electronic component 101 that is stably attached by the four wiring legs 132 arranged at the four corners of the lower surface of the quadrangle is the side where the heat radiation surface 320 of the heat radiation fin 300 attached to the electronic component 102 extends from the contact surface 310. In FIG. 26, the heat dissipating fin 300 is disposed at a position separated by the height of the screw head 302 of the screw 301 for attaching the electronic component 102, and is attached by four wiring legs 132 (see FIG. 26) arranged in series. A stable electronic component 102 is supported via a screw head 302.

  Since the electronic component 102 can be kept upright, the heat radiation surface 320 of the L-shaped heat radiation fin 300 attached to the electronic component 102 is maintained parallel to the electronic transformer substrate 100 and the bottom surface 201 (or the rectangular parallelepiped case 200) (or The pad 330 can be brought into surface contact with the case 200 with a uniform stress. As a result, heat conduction from the pad 330 to the case 200 is facilitated, and the heat dissipation effect for the electronic component 102 is improved.

In the present embodiment, the case where the screw head 302 of the screw 301 attached to the electronic component 102 is in contact with the electronic component 101 has been described. However, the screw head 302 is not limited to the electronic component 101 and is not limited to the electronic transformer. Other electronic components that are stably mounted on the substrate 100 may be used.
Further, the screw 301 does not have to be screwed in completely until the screw head 302 contacts the electronic component 102, and may be screwed to such an extent that the screw head 302 contacts the electronic component 101.

  Next, the screws (screw 301, tilt restriction screw 620) for fixing the heat radiation fin 300 to the electronic component 104 and the electronic component 105 will be described.

As shown in FIG. 28 and FIG. 29, the same radiating fin 300 is attached to the electronic component 105 and the electronic component 104 (MOS-FET), which are switching elements, by screws 301 and inclination regulating screws 620, respectively. The screw 301 passes through the electronic component 105 and the contact surface 310 of the radiating fin 300 that are in contact with each other to fix the radiating fin 300 to the electronic component 105, and the tilt restriction screw 620 is the contact surface 310 of the electronic component 104 and the radiating fin 300 that are in contact with each other. And radiating fins 300 are fixed to the electronic component 104.
The inclination regulating screw 620 for attaching the heat radiating fin 300 to the electronic component 104 is longer than the screw 301 (for example, the total length is 20 mm), and penetrates the heat radiating fin 300 so that the tip 621 protrudes from the heat radiating fin 300 longer than the screw 301. However, the tilt restricting screw 620 may fix the radiating fin 300 to the electronic component 105, and the screw 301 may fix the radiating fin 300 to the electronic component 104.
The protruding length of the tilt regulating screw 620 is such that the tip 621 of the tilt regulating screw 620 is attached to the electronic component 102 when the electronic component 102, the electronic component 104, and the electronic component 105 are mounted on the electronic transformer board 100 substantially upright. The length that contacts the contact surface 310 of the attached radiating fin 300 or the length that the tip portion 621 of the inclination regulating screw 620 is inserted into the screw hole 340 of the radiating fin 300 attached to the electronic component 102. is there.

As shown in FIG. 30, an electron is placed on the electronic transformer substrate 100 so that the tip 621 of the inclination regulating screw 620 protruding from the electronic component 104 and the heat radiating fin 300 contacts the heat radiating fin 300 attached to the electronic component 102. The component 102, the electronic component 104, and the electronic component 105 are mounted. Alternatively, the tip part 621 of the tilt regulating screw 620 is screwed into the screw hole 340 of the heat radiation fin 300 attached to the electronic component 102, and the electronic component 102, the electronic component 104, and the electronic component 105 are mounted on the electronic transformer substrate 100.
That is, in the radiating fin 300 attached to the electronic component 102, the electronic component 102 is fixed to the surface of the contact surface 310, and the tip portion 621 of the tilt regulating screw 620 contacts or is inserted into the back surface of the contact surface 310.
As a result, the electronic component 104 and the electronic component 105 are coupled to the electronic component 102 by the inclination regulating screw 620 via the heat radiation fin 300.
In this way, the electronic component 102, the electronic component 104, and the electronic component 105 are arranged in series formed by the four wiring legs 132 (see FIG. 26) arranged in series with the electronic component 102 and the electronic component 104 and electronic component 105. The eight wiring legs 132 facing the four wiring legs 132 (see FIG. 28) are stably attached to the electronic transformer substrate 100.
The electronic component 104 and the electronic component 105 are kept upright by being stably attached to the electronic transformer substrate 100.
Then, by maintaining the electronic component 104 and the electronic component 105 upright, the heat radiating surface 320 of the L-shaped radiating fin 300 attached to the electronic component 104 and the electronic component 105 is parallel to the electronic transformer substrate 100. It is substantially parallel to the bottom surface 201 (or top surface 202, side surface 203) of the rectangular parallelepiped case 200, and the pad 330 can be brought into surface contact with the case 200 with uniform stress. As a result, heat conduction from the pad 330 to the case 200 is facilitated, and the heat dissipation effect for the electronic component 104 and the electronic component 105 is improved.

FIG. 31 is a diagram illustrating a process of soldering electronic components of the lighting device 199 according to the ninth embodiment to the electronic transformer substrate 100.
When performing flow type soldering, as shown in FIG. 31, the electronic transformer substrate 100 climbs the slope to the solder tank 700 by the conveyance path 701 on the production line.
At this time, since each electronic component arranged on the electronic transformer substrate 100 is not soldered, the electronic component may be inclined when climbing the slope on the line.
However, since the electronic component 102 contacts the electronic component 101 stably disposed on the electronic transformer substrate 100, the electronic component 102 can be kept almost upright.
In addition, the electronic component 104 and the electronic component 105 are substantially upright like the electronic component 102 because the tip portion 621 of the inclination regulating screw 620 protruding from the radiating fin 300 contacts the radiating fin 300 attached to the electronic component 102. Can keep the state.
After climbing the transport path 701, the electronic transformer substrate 100 passes through the solder tank 700 while maintaining a substantially horizontal level, and the solder is ejected from the lower side, and the lead portions (wiring legs 132) of the respective electronic components become the electronic transformer substrate 100. Soldered to the pattern.
As described above, the electronic component 102, the electronic component 104, and the electronic component 105 to which the heat dissipating fins 300 are attached are soldered in a substantially upright state, and thus remain substantially upright after soldering. That is, after the soldering, the heat dissipating fin 300 attached to the electronic component 102 and the heat dissipating fin 300 attached to the electronic component 104 and the electronic component 105 have the heat dissipating surface 320 parallel to the bottom surface 201 of the case 200. The surface of the pad 330 can be in contact with the case 200 evenly. As a result, the pads 330 of the radiating fins 300 and the case 200 come into contact with each other with an appropriate stress, and a high heat radiating effect is obtained with respect to the heat generated in the electronic component 102, the electronic component 104, and the electronic component 105.
In this embodiment, the case of soldering by the flow method has been described as a method of soldering the electronic component. However, the electronic component is soldered by another method (for example, reflow method, manual soldering). You may solder.

FIG. 32 is an exploded perspective view showing a duct plug type lighting apparatus 400 according to the ninth embodiment.
FIG. 33 is a diagram showing a duct plug type lighting apparatus 400 according to the ninth embodiment.
FIG. 34 is an exploded perspective view showing a duct plug type lighting apparatus 400 according to the ninth embodiment.
As shown in FIGS. 32 and 33, the case 200 of the duct plug-type lighting device 400 has a cross-section of a case body 220, a top surface 202, and a side surface 203 that forms a U-shaped cross section with a bottom surface 201 and a side surface 203. And a case lid 210 forming a letter shape. One surface of the case main body 220 is opened, and the lighting device 199 is incorporated so that the heat radiating surface 320 of the heat radiating fin 300 contacts the bottom surface 201 of the case main body 220 from the surface of the case main body 220 opened. The case main body 220 in which the lighting device 199 is incorporated is covered with a case lid 210 that closes the opening surface of the case main body 220, and the duct plug type lighting apparatus 400 is assembled. Inside the assembled duct plug type lighting fixture 400, the top surface 202 of the case lid 210 and the bottom surface 201 of the case body 220 sandwich the lighting device 199, and the lighting device 199 is fixed in the case 200.
At this time, as shown in FIG. 25, the solder surface of the lighting device 199 (the back surface of the electronic transformer substrate 100 from which the leading end of the lead part of the electronic component protrudes) comes to the surface side where the case 200 is opened. For this reason, when the case lid 210 is made of a material that conducts electricity (for example, metal), as shown in FIG. 34, an insulating sheet 230 that electrically insulates the electronic transformer substrate 100 and the case lid 210. Put between. For example, as shown in FIG. 34, a plastic sheet having a U-shaped cross section that is refracted in the longitudinal direction is used as the insulating sheet 230, and the solder surface and sides of the electronic transformer substrate 100 are covered with the insulating sheet 230.

  In the present embodiment, the case where the tip portion 621 of the tilt regulating screw 620 is brought into contact with another heat radiation fin 300 has been described. However, the tip portion 621 of the tilt regulating screw 620 is connected to another electronic component (for example, the electronic component 102). ) May be contacted. It is preferable that the electronic component that contacts the tip 621 of the tilt regulating screw 620 is stably disposed on the electronic transformer substrate 100.

FIG. 35 and FIG. 36 are diagrams showing a lighting device 199 to which the radiation fin 300 according to the ninth embodiment is attached. 35 and 36 correspond to FIG.
In addition, as shown in FIG. 35, the heat radiation fin 300 may be fixed to the electronic component 102 with an inclination regulating screw 620. The tilt regulating screw 620 for fixing the heat radiation fin 300 to the electronic component 102 has a screw head 622 that contacts the electronic component 101 and a tip 621 in the screw hole 340 of the heat radiation fin 300 attached to the electronic component 104 and the electronic component 105. Screwed.
Further, as shown in FIG. 36, the heat radiation fin 300 attached to the electronic component 104 and the electronic component 105 has the heat radiation surface 320 extending to the side where the electronic component 104 and the electronic component 105 are not located, that is, the electronic component 102 side. It may be attached to.

  In the ninth embodiment, the following lighting device 199 has been described.

The lighting device 199 includes the following.
(A) Electronic component (electronic component 102)
(B) Substrate on which electronic components are mounted (electronic transformer substrate 100)
(C) Case 200 containing a substrate
(D) A heat dissipating member (heat dissipating fin 300) formed by being bent into a substantially L shape and having a heat dissipating surface 320 that contacts the case 200 and a contact surface 310 that contacts the electronic component.
(E) The electronic component is fixed to the heat dissipating member, and the mounting head (screw head 302) protruding from the electronic component is arranged so that the heat dissipating surface 320 contacting the case 200 of the heat dissipating member is substantially parallel to the case 200. Fixing member (screw 301) in contact with another electronic component (electronic component 101)

The lighting device 199 includes the following.
(A) Electronic component (electronic component 104, electronic component 105)
(B) Substrate on which electronic components are mounted (c) Case 200 containing a substrate
(D) A heat radiating member formed by being bent into a substantially L shape and having a heat radiating surface 320 that contacts the case 200 and a contact surface 310 that contacts the electronic component. (E) The electronic component is fixed to the heat radiating member, and the heat radiating member. The other end of the electronic component 102 (the electronic component 102 or the electronic component 102 is attached) so that the heat dissipation surface 320 of the heat dissipation member contacting the case 200 of the heat dissipation member is substantially parallel to the case 200. Fixing member (tilt regulating screw 620) in contact with heat radiation fin 300)

The lighting device 199 includes the following.
(A) Electronic component (electronic component 102, electronic component 104, and electronic component 105)
(B) Substrate on which electronic components are mounted (c) Case 200 containing a substrate
(D) Two heat radiating members (e) an electronic component (electronic component 102) are formed by bending one of the heat dissipating surfaces 320 in contact with the case 200 and the contact surface 310 in contact with the electronic component. While fixing to the heat radiating member, the tip portion protruding from the heat radiating member contacts another electronic component (electronic component 101) so that the heat radiating surface 320 contacting the case 200 of the heat radiating member is substantially parallel to the case 200. A first fixing member (f) a second fixing member that fixes another electronic component (the electronic component 104 and the electronic component 105) different from the electronic component to the other heat radiating member, and the lighting device 199 includes a heat radiating member The contact surface 310 that contacts the other electronic component (electronic component 102) contacts another electronic component (electronic component 101) on the side where the heat radiating surface 320 that contacts the case 200 is disposed. The tip of the second fixing member is brought into contact with the back surface of the contact surface 310 that comes into contact with the other electronic component.
Further, in this lighting device 199, the contact surfaces 310 that contact the electronic components of the respective heat radiating members are arranged so as to face each other, and any one of the heat radiating members and the fixing member that fixes the electronic components are disposed on the other side. Nearly contacts the member.
Moreover, this lighting device 199 may project the heat radiating surface 320 in contact with the case 200 of each heat radiating member in the same direction with respect to the contact surface 310 in contact with the electronic component, or contact the case 200 of each heat radiating member. The heat dissipating surface 320 may be protruded in a direction opposite to the contact surface 310 that contacts the electronic component.
In addition, the lighting device 199 includes at least two fixing holes (screw holes 340) in the contact surface 310 that contacts the electronic component of the heat dissipation member, and the tip of the fixing member that fixes one heat dissipation member is the other heat dissipation member. Touch the fixing hole.
Further, the lighting device 199 includes a heat conducting member (pad 330) between the case 200 and the heat radiating surface 320 that contacts the case 200 of the heat radiating member.

Embodiment 10 FIG.
FIG. 37 is a diagram showing electronic component 104 and electronic component 105 to which heat dissipating fins 300 are attached in the tenth embodiment.
FIG. 38 is a diagram illustrating electronic component 104 and electronic component 105 to which heat dissipating fins 300 are attached in the tenth embodiment.
FIGS. 37 and 38 show the electronic component 104 and the electronic component 105 to which the radiation fins 300 are attached from the front (lower view) and the lower side (upper view).
FIG. 37 and FIG. 38 show a structure in which the surface (heat radiation surface 320, pad 330) that contacts the case 200 of the radiating fin 300 is regulated to be substantially parallel to the case 200 by a method different from the ninth embodiment. This will be described below. 37 and 38 correspond to FIG. 30 of the ninth embodiment.

  As shown in FIG. 37, the lighting device 199 according to the tenth embodiment has an electronic component 197 (for example, a thermal protector) orthogonal to the electronic component 104 and the electronic component 105 between the electronic component 104 and the electronic component 105 that are serially connected. And arranged so as to form a T-shaped cross section. Further, the electronic component 197 is in contact with the contact surface 310 of the radiating fin 300 in a direction orthogonal to the contact surface 310 (a direction forming a right angle), and forms a T-shaped section with the contact surface 310 of the radiating fin 300. Thereby, the load of the heat radiation fin 300 applied to the side where the heat radiation surface 320 extends can be received by the electronic component 197, and the heat radiation fin 300 can be prevented from being inclined in the direction in which the heat radiation surface 320 extends. In addition, the tip 621 of the inclination regulating screw 620 contacts the heat radiating fin 300 attached to the electronic component 102, so that the heat radiating fin 300 attached to the electronic component 104 and the electronic component 105 is also on the side where the heat radiating surface 320 is not located. Does not tilt. As a result, the heat radiation surface 320 of the heat radiation fin 300 attached to the electronic component 104 and the electronic component 105 is substantially parallel to the surface of the case 200, and the pad 330 is brought into surface contact with the case 200 with uniform stress, A high heat dissipation effect for the electronic component 104 and the electronic component 105 is obtained.

  Further, as shown in FIG. 38, the electronic component 197 may be arranged so as to form an L-shaped cross section at right angles to the electronic component 104 on the end side of the electronic component 104 (or the electronic component 105). In other words, the electronic component 197 and the contact surface 310 of the radiating fin 300 may form an L-shaped cross section.

In the tenth embodiment, the lighting device 199 including the following has been described.
(A) Electronic component (electronic component 104, electronic component 105)
(B) Substrate on which electronic components are mounted (electronic transformer substrate 100)
(C) Case 200 containing a substrate
(D) A heat dissipating member (heat dissipating fin 300) formed by being bent into a substantially L shape and having a heat dissipating surface 320 that contacts the case 200 and a contact surface 310 that contacts the electronic component.
(E) Fixing member (screw 301) for fixing the electronic component to the heat dissipation member
In the lighting device 199, the contact surface 310 that contacts the electronic component of the heat dissipation member contacts another electronic component (electronic component 197) on the side where the heat dissipation surface 320 that contacts the case 200 is disposed.

FIG. 5 shows a lighting device 199 to which heat radiating fins 300 are attached in the first embodiment. FIG. 3 shows an electronic component 102 to which heat radiating fins 300 are attached in the first embodiment. FIG. 5 shows electronic component 104 and electronic component 105 to which heat radiating fins 300 are attached in the first embodiment. FIG. 5 shows a lighting device 199 housed in a case 200 in Embodiment 1. FIG. 5 shows a lighting device 199 housed in a case 200 in Embodiment 1. FIG. 5 shows a lighting device 199 housed in a case 200 in Embodiment 1. The figure which shows the structure of the duct plug type lighting fixture 400. FIG. The figure which shows the structure of the stand-alone type lighting fixture 401. FIG. The figure which shows the heat countermeasure method using the radiation fin 110. FIG. The figure which shows the heat countermeasure method using the filler. The figure which shows the lighting device 199 to which the radiation fin 300 in Embodiment 2 was attached. FIG. 10 shows a lighting device 199 housed in a case 200 in Embodiment 2. FIG. 10 shows a lighting device 199 housed in a case 200 in Embodiment 2. FIG. 10 shows a lighting device 199 housed in a case 200 in Embodiment 2. FIG. 10 shows a lighting device 199 to which a radiation fin 300 according to Embodiment 3 is attached. FIG. 10 shows a lighting device 199 housed in a case 200 in Embodiment 3. FIG. 10 shows a lighting device 199 housed in a case 200 in Embodiment 3. The figure which shows the lighting device 199 to which the radiation fin 300 in Embodiment 4 was attached. The figure which shows the lighting device 199 to which the radiation fin 300 in Embodiment 4 was attached. The figure which shows the lighting device 199 to which the radiation fin 300 in Embodiment 5 was attached. FIG. 20 shows a lighting device 199 housed in a case 200 in Embodiment 6. FIG. 20 shows a lighting device 199 housed in a case 200 in Embodiment 6. The figure which shows the contact part of the radiation fin 300 and case 200 in Embodiment 8. FIG. FIG. 20 shows a lighting device 199 to which heat dissipating fins 300 according to Embodiment 9 are attached. Sectional drawing which shows the lighting device 199 accommodated in case 200 of the duct plug type lighting fixture 400 in Embodiment 9. FIG. FIG. 10 shows attachment of heat radiation fins 300 to electronic component 102 in the ninth embodiment. FIG. 10 shows an electronic component 102 to which heat dissipating fins 300 are attached in the ninth embodiment. FIG. 18 shows attachment of heat radiation fins 300 to electronic component 104 and electronic component 105 in the ninth embodiment. The figure which shows the electronic component 104 and the electronic component 105 to which the radiation fin 300 in Embodiment 9 was attached. The figure which shows the arrangement | positioning relationship of the electronic component 102, the electronic component 104, and the electronic component 105 to which the radiation fin 300 in Embodiment 9 was attached. FIG. 20 is a diagram illustrating a process of soldering electronic components of a lighting device 199 according to Embodiment 9 to an electronic transformer substrate 100. FIG. 20 is an exploded perspective view showing a duct plug type lighting apparatus 400 according to Embodiment 9. FIG. 20 shows a duct plug-type lighting fixture 400 in the ninth embodiment. FIG. 20 is an exploded perspective view showing a duct plug type lighting apparatus 400 according to Embodiment 9. FIG. 20 shows a lighting device 199 to which heat dissipating fins 300 according to Embodiment 9 are attached. FIG. 20 shows a lighting device 199 to which heat dissipating fins 300 according to Embodiment 9 are attached. Electronic component 104 and electronic component 105 to which heat dissipating fins 300 are attached in the tenth embodiment. The figure which shows the electronic component 104 and the electronic component 105 to which the radiation fin 300 in Embodiment 10 was attached.

Explanation of symbols

  100 Electronic transformer substrate, 101, 102, 103, 104, 105, 106, 107, 108, 109, 197, 198 Electronic component, 110 Radiation fin, 111 Screw hole, 112 Wiring leg, 120 Filling material, 131 Screw hole, 132 Wiring leg, 199 lighting device, 200 case, 201 bottom surface, 202 top surface, 203 side surface, 210 case lid, 220 case main body, 230 insulating sheet, 300 heat radiation fin, 301 screw, 302 screw head, 303 screw main body, 310 contact surface 320 heat dissipation surface, 330 pad, 340 screw hole, 400 duct plug type lighting fixture, 401 separate type lighting fixture, 410 lighting mounting shaft, 420 reflector, 430 socket, 440 lamp, 450 cord, 510 duct rail, 520 ceiling, 521 Ceiling hole, 530 Construction material, 620 tilt regulating screw, 621 tip, 622 screw head, 623 screw body, 700 solder tank, 701 conveyance path.

Claims (9)

Electronic components,
A case in which the electronic component is incorporated;
A radiating fin to be attached to the electronic component, and is attached to the surface of the connection portion, a contact portion that contacts the electronic component, a connection portion that is connected to the contact portion, and is in contact with the inner surface of the case. Ru and a heat dissipating fin having a resilient portion for transmitting the heat to the case an electronic device,
The contact portion of the heat radiating fin and the connecting portion are formed to be orthogonal to each other,
Wherein a surface of the connection portion of the heat radiating fins and spacing L1 between the inner surface of the case and the thickness of the elastic portion L2 of the heat radiation fins have a relationship of L2> L1,
The distance L1 between the surface of the connecting portion of the heat radiating fin and the inner surface of the case is 1 mm or more and 3 mm or less,
The thickness L2 of the elastic part of the heat radiating fin is 2 mm or more and 4 mm or less,
The electronic apparatus according to claim 1 , wherein the elastic part of the heat dissipating fin has an Asker C hardness of 25 or less . Electronic components,
A case in which the electronic component is incorporated;
A radiating fin to be attached to the electronic component, and is attached to the surface of the connection portion, a contact portion that contacts the electronic component, a connection portion that is connected to the contact portion, and is in contact with the inner surface of the case. Ru and a heat dissipating fin having a resilient portion for transmitting the heat to the case an electronic device,
The contact portion of the heat radiating fin and the connecting portion are formed to be orthogonal to each other,
The electronic apparatus according to claim 1, wherein a distance L1 between the surface of the connecting portion of the radiating fin and the inner surface of the case and a thickness L2 of the elastic portion of the radiating fin have a relationship of L2> L1 . Electronic components,
A case in which the electronic component is incorporated;
A radiating fin to be attached to the electronic component, and is attached to the surface of the connection portion, a contact portion that contacts the electronic component, a connection portion that is connected to the contact portion, and is in contact with the inner surface of the case. Ru and a heat dissipating fin having a resilient portion for transmitting the heat to the case an electronic device,
The contact portion of the heat radiating fin and the connecting portion are formed to be orthogonal to each other,
Wherein a surface of the connection portion of the heat radiating fins and spacing L1 between the inner surface of the case and the thickness of the elastic portion L2 of the heat radiation fins have a relationship of L2> L1,
The distance L1 between the surface of the connecting portion of the heat radiating fin and the inner surface of the case is 1 mm or more and 3 mm or less,
The electronic apparatus according to claim 1 , wherein a thickness L2 of the elastic portion of the radiating fin is 2 mm or more and 4 mm or less . Electronic components,
A case in which the electronic component is incorporated;
A radiating fin to be attached to the electronic component, and is attached to the surface of the connection portion, a contact portion that contacts the electronic component, a connection portion that is connected to the contact portion, and is in contact with the inner surface of the case. Ru and a heat dissipating fin having a resilient portion for transmitting the heat to the case an electronic device,
The contact portion of the heat radiating fin and the connecting portion are formed to be orthogonal to each other,
Wherein a surface of the connection portion of the heat radiating fins and spacing L1 between the inner surface of the case and the thickness of the elastic portion L2 of the heat radiation fins have a relationship of L2> L1,
The electronic apparatus according to claim 1 , wherein the elastic part of the heat dissipating fin has an Asker C hardness of 25 or less . In the heat radiating fin, the connecting portion has an uneven shape at an attachment portion of the elastic portion, and the elastic portion is deformed along the uneven shape of the connecting portion and is in close contact with the connecting portion. electronic instrument according to any one of claims 1 to 4,. The case has a concavo-convex shape at a portion where the elastic portion of the radiating fin contacts, and the elastic portion of the radiating fin is deformed along the concavo-convex shape of the case and is in close contact with the case. The electronic instrument according to any one of claims 1 to 5 . Claims, wherein the pre-Symbol thickness L2 of the elastic portion of the heat radiating fins is less than 2.0 times 1.3 times or more the distance L1 between the inner surface of the connecting portion of the surface and the case of the heat radiating fins The electronic apparatus in any one of Claims 1-6 . Electronic device according to any claims 1 to 7, wherein the electronic component is a discrete component. The electronic apparatus according to any one of claims 1 to 8, wherein the electronic component constitutes a lighting device that turns on a light source.
A duct plug type lighting apparatus comprising a socket for mounting a light source.

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