JP6592893B2

JP6592893B2 - Power supply

Info

Publication number: JP6592893B2
Application number: JP2014265865A
Authority: JP
Inventors: 啓一郎沼倉; 賢太郎秦; 明範大久保; 林　　哲也
Original assignee: Nissan Motor Co Ltd
Current assignee: Nissan Motor Co Ltd
Priority date: 2014-12-26
Filing date: 2014-12-26
Publication date: 2019-10-23
Anticipated expiration: 2034-12-26
Also published as: JP2016127685A

Description

本発明は、電源装置に関するものである。 The present invention relates to a power supply device.

従来より、スイッチング素子を配置する第１基板と、トランスと、交流成分を低減するフィルタ機構と、第１基板、トランス、及びフィルタ機構を収容するケースとを有する電源装置が知られている。この電源装置では、トランスとフィルタ機構が近接に配置し、トランス１３の漏れ磁束を含んだノイズを遮蔽する第１遮蔽部がトランスとフィルタとの間に設けられ、冷却フィンがケース本体に一体形成されている（特許文献１）。 2. Description of the Related Art Conventionally, there is known a power supply device that includes a first substrate on which a switching element is disposed, a transformer, a filter mechanism that reduces an AC component, and a case that houses the first substrate, the transformer, and the filter mechanism. In this power supply device, the transformer and the filter mechanism are arranged close to each other, the first shielding part that shields the noise including the leakage magnetic flux of the transformer 13 is provided between the transformer and the filter, and the cooling fin is formed integrally with the case body. (Patent Document 1).

特開２０１３−９０５３３号公報JP 2013-90533 A

しかしながら、上記の電源装置では、ケースと冷却器が一体に形成されているため、コイル等、ケース内の発熱する部品からノイズが発生した場合に、当該ノイズがケースから外部に漏れやすいという問題があった。 However, in the above power supply device, since the case and the cooler are integrally formed, when noise is generated from a heat generating component in the case such as a coil, there is a problem that the noise is likely to leak from the case to the outside. there were.

本発明が解決しようとする課題は、筐体から漏洩するノイズを低減できる電源装置を提供することである。 The problem to be solved by the present invention is to provide a power supply device that can reduce noise leaking from a casing.

本発明は、コイル、当該コイルを冷却する冷却器、及び、冷却器に接続された導電性部材を、導電性を持つ筐体で収容し、冷却器を筐体と直流的に絶縁した状態で配置し、冷却器又は導電性部材のうち少なくともいずれか一方の部材とコイルと近接させることによって上記課題を解決する。 In the present invention, a coil, a cooler for cooling the coil, and a conductive member connected to the cooler are accommodated in a casing having conductivity, and the cooler is DC-insulated from the casing. It arrange | positions and the said subject is solved by making it close to a coil and at least any one member among a cooler or an electroconductive member.

本発明によれば、コイルから筐体までの浮遊容量が低減されるため、コイルで発生したノイズは筐体に伝搬しにくくなり、筐体から漏洩するノイズを低減できるという効果を奏する。 According to the present invention, since the stray capacitance from the coil to the housing is reduced, noise generated in the coil is difficult to propagate to the housing, and the effect of reducing noise leaking from the housing can be achieved.

図１は、本発明の実施形態に係る電源装置（電力変換装置）の回路図である。FIG. 1 is a circuit diagram of a power supply device (power conversion device) according to an embodiment of the present invention. 図２は、本発明の実施形態に係る電源装置の断面図である。FIG. 2 is a cross-sectional view of the power supply device according to the embodiment of the present invention. 図３は、本実施形態の変形例に係る電源装置の断面図である。FIG. 3 is a cross-sectional view of a power supply device according to a modification of the present embodiment. 図４は、本発明の他の実施形態に係る電源装置の断面図である。FIG. 4 is a cross-sectional view of a power supply device according to another embodiment of the present invention. 図５は、他の実施形態の変形例に係る電源装置の断面図である。FIG. 5 is a cross-sectional view of a power supply device according to a modification of the other embodiment. 図６は、本発明の他の実施形態に係る電源装置の断面図である。FIG. 6 is a cross-sectional view of a power supply device according to another embodiment of the present invention. 図７は、他の実施形態の変形例に係る電源装置の断面図である。FIG. 7 is a cross-sectional view of a power supply device according to a modification of the other embodiment. 図８は、本発明の他の実施形態に係る電源装置の断面図である。FIG. 8 is a cross-sectional view of a power supply device according to another embodiment of the present invention. 図９は、本発明の他の実施形態に係る電源装置の断面図である。FIG. 9 is a cross-sectional view of a power supply device according to another embodiment of the present invention. 図１０は、本発明の他の実施形態に係る電源装置の断面図である。FIG. 10 is a cross-sectional view of a power supply device according to another embodiment of the present invention. 図１１は、本発明の他の実施形態に係る電源装置の断面図である。FIG. 11 is a cross-sectional view of a power supply device according to another embodiment of the present invention. 図１２は、本発明の他の実施形態に係る電源装置の断面図である。FIG. 12 is a cross-sectional view of a power supply device according to another embodiment of the present invention. 図１３は、本発明の他の実施形態に係る電源装置の断面図である。FIG. 13 is a cross-sectional view of a power supply device according to another embodiment of the present invention.

以下、本発明の実施形態を図面に基づいて説明する。
《第１実施形態》 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
<< First Embodiment >>

本実施形態に係る電源装置は、入力側をバッテリ等の電力源に接続されて、負荷等に対して電力を出力する装置である。電源装置は、例えば充電器の構成の一部、又は、モータを駆動させる駆動システムの構成の一部として用いることができる。 The power supply device according to the present embodiment is a device that has an input side connected to a power source such as a battery and outputs power to a load or the like. The power supply device can be used as, for example, a part of a configuration of a charger or a part of a configuration of a drive system that drives a motor.

電源装置の一例として、電力変換装置を説明する。図１は、電力変換装置の回路図である。なお、以下の説明では、電力変換装置について説明するが、電源装置１００は電力変換装置に限らず、例えばスイッチング素子を備えた装置など他の装置であってもよい。 A power conversion device will be described as an example of a power supply device. FIG. 1 is a circuit diagram of the power converter. In the following description, the power conversion device will be described. However, the power supply device 100 is not limited to the power conversion device, and may be another device such as a device including a switching element.

図１に示すように、電源装置１００は、ＡＣ入力部１と、トランス２、４、８、１１と、コンデンサ３、５、１０と、チョークコイル６と、電力変換回路７、９と、ＤＣ出力部１２とを備えている。電源装置１００は、ＡＣ入力部１から入力された交流電力を直流電力に変換し、直流電力をＤＣ出力部１２から出力する。ＡＣ入力部１は、Ｐ母線及びＮ母線の端部に接続されたコネクタである。ＡＣ入力部１及び電力変換回路７との間には、ＡＣ入力部１から入力された交流電力を整流するためのフィルタとして、トランス２、４、６及びコンデンサ３、５が接続されている。トランス２、４はフィルタ用のトランスである。チョークコイル６は、電力変換用のチョークコイルである。 As shown in FIG. 1, the power supply device 100 includes an AC input unit 1, transformers 2, 4, 8, 11, capacitors 3, 5, 10, choke coil 6, power conversion circuits 7, 9, and DC And an output unit 12. The power supply apparatus 100 converts AC power input from the AC input unit 1 into DC power, and outputs DC power from the DC output unit 12. The AC input unit 1 is a connector connected to the ends of the P bus and the N bus. Between the AC input unit 1 and the power conversion circuit 7, transformers 2, 4, 6 and capacitors 3, 5 are connected as a filter for rectifying the AC power input from the AC input unit 1. Transformers 2 and 4 are filter transformers. The choke coil 6 is a choke coil for power conversion.

電力変換回路７は、電力変換用チョークコイル６からの入力電力を変換し、トランス８の１次側のコイルに出力する回路である。トランス８は、絶縁型電力変換用のトランスであって、電力変換回路７と電力変換回路９との間に接続されている。電力変換回路９は、トランス８の２次側コイルからの入力電力を変換し、コンデンサ１０に出力する回路である。 The power conversion circuit 7 is a circuit that converts input power from the power conversion choke coil 6 and outputs it to the primary coil of the transformer 8. The transformer 8 is an insulated power conversion transformer, and is connected between the power conversion circuit 7 and the power conversion circuit 9. The power conversion circuit 9 is a circuit that converts input power from the secondary coil of the transformer 8 and outputs the converted power to the capacitor 10.

電力変換回路９の出力とＤＣ出力部１２との間には、コンデンサ１０及びトランス１１が接続されている。コンデンサ１０及びトランス１１は、ＬＣフィルタである。トランス１１はフィルタ用のトランスである。ＡＣ出力部１２は、Ｐ母線及びＮ母線の端部に接続されたコネクタである。 A capacitor 10 and a transformer 11 are connected between the output of the power conversion circuit 9 and the DC output unit 12. The capacitor 10 and the transformer 11 are LC filters. The transformer 11 is a filter transformer. The AC output unit 12 is a connector connected to the ends of the P bus and the N bus.

なお、電力変換回路９は、図１に示すようなＡＣ−ＤＣコンバータに限らず、ＤＣ−ＤＣコンバータやインバータ等でもよい。また、トランス２等で構成されるフィルタの回路、及び、電力変換回路７、９の回路は、図１に示す回路に限らず、他の回路でもよい。 The power conversion circuit 9 is not limited to the AC-DC converter as shown in FIG. 1, but may be a DC-DC converter, an inverter, or the like. Further, the circuit of the filter constituted by the transformer 2 and the like and the circuits of the power conversion circuits 7 and 9 are not limited to the circuit shown in FIG.

次に、図２を用いて、電源装置１００の構造を説明する。図２は電源装置１００の断面図である。なお、図２において、浮遊容量は回路記号で表されている。他の図でも同様に、浮遊容量は回路記号で表されている。電源装置１００は、コイル２０と、冷却器３０と、導電性部材４０と、筐体５０とを備えている。なお、図２は、電源装置１００を構成する部品の一部を示しており、電源装置１００は、図２に示す構成以外に、例えば電力変換回路７に含まれるスイッチング素子等を備えている。 Next, the structure of the power supply apparatus 100 will be described with reference to FIG. FIG. 2 is a cross-sectional view of the power supply device 100. In FIG. 2, the stray capacitance is represented by a circuit symbol. Similarly in other drawings, the stray capacitance is represented by a circuit symbol. The power supply device 100 includes a coil 20, a cooler 30, a conductive member 40, and a housing 50. FIG. 2 shows some of the components constituting the power supply apparatus 100. The power supply apparatus 100 includes, for example, a switching element included in the power conversion circuit 7 in addition to the configuration shown in FIG.

コイル２０は、トランス２、トランス４、チョークコイル６、トランス８、トランス１１のうち少なくとも１つのコイルに相当する。コイル２０は、電源装置１００に含まれる各部品のうち、発熱する部品の１つである。コイル２０は、筐体５０と直流的に絶縁した状態で、筐体５０内に設けられている。コイル２０は、筐体５０の側壁に対して、一定の距離を空けて配置されている。筐体５０の側壁は、コイル２０の周囲に位置する、筐体５０の内壁である。 The coil 20 corresponds to at least one of the transformer 2, the transformer 4, the choke coil 6, the transformer 8, and the transformer 11. The coil 20 is one of the components that generate heat among the components included in the power supply device 100. The coil 20 is provided in the housing 50 in a state of being insulated from the housing 50 in a direct current manner. The coil 20 is arranged with a certain distance from the side wall of the housing 50. The side wall of the housing 50 is an inner wall of the housing 50 that is located around the coil 20.

コイル２０は、モジュール化されており、コイル２０の側面（図２に示すｙｚ面）が、筐体５０の側面（ｙｚ面）と対向するように配置されている。また、筐体５０は、導電性をもっている。そのため、コイル２０の側面と筐体５０の側面との間で、浮遊容量Ｃ_ｈが生じる。 The coil 20 is modularized and is disposed such that the side surface (yz surface shown in FIG. 2) of the coil 20 faces the side surface (yz surface) of the housing 50. Moreover, the housing | casing 50 has electroconductivity. Therefore, stray capacitance _Ch is generated between the side surface of the coil 20 and the side surface of the housing 50.

冷却器３０は、コイル２０を冷却するための放熱機構である。冷却器３０は、空冷式又は水冷式の冷却機構である。空冷式の場合には、冷却器３０は、放熱フィンを有しており、放熱フィンは冷却面３０ａの裏面に設けられている。冷却面３０ａは、冷却器３０の表面のうち、コイル２０に向けられた面である。水冷式の場合には、冷却器３０は流路が設けられている。そして、水又はＬＬＣが流路を流れることで、冷却面３０ａが冷えるように、冷却器３０は構成されている。冷却器３０は、金属などの導電性をもつ材料で形成されており、冷却器３０は導電性を有している。また、冷却器３０は、筐体５０と直流的に絶縁した状態で、筐体５０内に設けられている。 The cooler 30 is a heat dissipation mechanism for cooling the coil 20. The cooler 30 is an air-cooled or water-cooled cooling mechanism. In the case of the air cooling type, the cooler 30 has a heat radiating fin, and the heat radiating fin is provided on the back surface of the cooling surface 30a. The cooling surface 30 a is a surface directed to the coil 20 among the surfaces of the cooler 30. In the case of the water cooling type, the cooler 30 is provided with a flow path. And the cooler 30 is comprised so that the cooling surface 30a may cool because water or LLC flows through a flow path. The cooler 30 is made of a conductive material such as metal, and the cooler 30 has conductivity. Further, the cooler 30 is provided in the housing 50 in a state where it is galvanically insulated from the housing 50.

導電性部材４０は、金属などの導電性の材料によって、板状に形成された部材である。導電性部材４０は、コイル２０で発生するノイズを遮蔽するための遮蔽板としての機能を有する。導電性部材４０は、冷却器３０に接続されている。冷却器３０及び導電性部材４０は、共に導電性を有しているため、冷却器３０と導電性部材４０は電気的に接続されている。導電性部材４０は、冷却面３０ａの法線方向に沿って、冷却器３０から延在するように構成されている。そのため、導電性部材４０は、冷却器３０から突出した形状になっている。 The conductive member 40 is a member formed in a plate shape by a conductive material such as metal. The conductive member 40 has a function as a shielding plate for shielding noise generated in the coil 20. The conductive member 40 is connected to the cooler 30. Since the cooler 30 and the conductive member 40 are both conductive, the cooler 30 and the conductive member 40 are electrically connected. The conductive member 40 is configured to extend from the cooler 30 along the normal direction of the cooling surface 30a. Therefore, the conductive member 40 has a shape protruding from the cooler 30.

コイル２０は、筐体５０よりも導電性部材４０により近づくように配置されており、コイル２０と導電性部材４０との間の距離は、コイル２０と筐体５０との間の距離よりも短い。コイル２０と導電性部材４０との間の距離は、導電性部材４０と対向するコイル２０の側面と、コイル２０と対向する導電性部材４０の側面との間の距離である。また、コイル２０と筐体５０との間の距離は、筐体５０と対向するコイル２０の側面と、コイル２０と対向する筐体５０の側面との間の距離である。 The coil 20 is disposed closer to the conductive member 40 than the casing 50, and the distance between the coil 20 and the conductive member 40 is shorter than the distance between the coil 20 and the casing 50. . The distance between the coil 20 and the conductive member 40 is a distance between the side surface of the coil 20 that faces the conductive member 40 and the side surface of the conductive member 40 that faces the coil 20. The distance between the coil 20 and the housing 50 is a distance between the side surface of the coil 20 facing the housing 50 and the side surface of the housing 50 facing the coil 20.

コイル２０と導電性部材４０は、所定の隙間を空けた状態で配置されている。これにより、コイル２０と導電性部材４０は互いに近接している。そして、コイル２０と導電性部材４０は所定の隙間を空けた状態で近接しているため、コイル２０と導電性部材４０との間には、浮遊容量Ｃ_ｌが生じる。また、導電性部材４０の先端部分は、筐体５０の側壁に対して、一定の距離を空けたところに位置している。すなわち、導電性部材４０は、筐体５０に対して直流的に絶縁の状態となるように、配置されている。そして、導電性部材４０の先端と筐体５０の側壁との間には、浮遊容量Ｃ_ｗが生じる。 The coil 20 and the conductive member 40 are disposed with a predetermined gap. Thereby, the coil 20 and the conductive member 40 are close to each other. Since the coil 20 and the conductive member 40 are close to each other with a predetermined gap therebetween, a stray capacitance _Cl is generated between the coil 20 and the conductive member 40. Further, the tip portion of the conductive member 40 is located at a certain distance from the side wall of the housing 50. That is, the conductive member 40 is disposed so as to be in a DC-insulated state with respect to the housing 50. A stray capacitance _Cw is generated between the tip of the conductive member 40 and the side wall of the housing 50.

次に、筐体５０内で発生するノイズの特性について、説明する。電力変換回路７、９に含まれるスイッチング素子のスイッチング動作により、コイル２０から漏れ電流が流れる。この漏れ電流が、コイル２０から浮遊容量を介して筐体５０に流れることで、コモンモードノイズとなる。コモンモードノイズにより筐体５０が振動することで、ノイズが発生し筐体５０から外部空間に放出される。漏れ電流（ノイズ）の発生源となるコイル２０は、導電性部材４０と筐体５０によって、筐体５０内の他の部品から隔離された状態で配置されている。そのため、コイル２０のノイズが、筐体５０内の他の部品に影響することを防ぐことができる。またコイル２０は、導電性部材４０と近接しており、導電性部材４０は冷却器３０と一体になっている。そのため、コイル２０から導電性部材４０を介して冷却器３０まで、熱経路が形成される。これにより、コイル２０の冷却効果も得ることができる。 Next, characteristics of noise generated in the housing 50 will be described. A leakage current flows from the coil 20 by the switching operation of the switching elements included in the power conversion circuits 7 and 9. This leakage current flows from the coil 20 to the housing 50 via the stray capacitance, thereby generating common mode noise. When the housing 50 vibrates due to the common mode noise, noise is generated and emitted from the housing 50 to the external space. The coil 20 that is a source of leakage current (noise) is disposed in a state of being isolated from other components in the casing 50 by the conductive member 40 and the casing 50. Therefore, the noise of the coil 20 can be prevented from affecting other components in the housing 50. The coil 20 is close to the conductive member 40, and the conductive member 40 is integrated with the cooler 30. Therefore, a heat path is formed from the coil 20 to the cooler 30 through the conductive member 40. Thereby, the cooling effect of the coil 20 can also be acquired.

コイル２０から流れる漏れ電流の導通経路は、コイル２０から浮遊容量Ｃ_ｈを介して筐体５０までの経路と、コイル２０から、浮遊容量Ｃ_ｌ、導電性部材４０、及び浮遊容量Ｃ_ｗを介して筐体５０までの経路である。コイル２０から筐体５０までの合成容量（Ｃ_ａ）は、コイル２０から筐体５０までの２つの経路上で生じる浮遊容量（Ｃ_ｈ、Ｃ_ｌ、Ｃ_ｗ）を合成した容量であって、下記式（１）で表される。なお、浮遊容量（Ｃ_ａ）は、コイル２０で発生した漏れ電流が筐体５０流れる経路上の電気容量の合成容量に相当する。 Conduction path of the leakage current flowing from the coil 20, through a path from coil 20 to the housing 50 through the stray capacitance C _h, from the coil 20, the stray capacitance C _l, the conductive member 40, and the stray capacitance C _w The route to the housing 50. The combined capacitance (C _a ) from the coil 20 to the housing 50 is _a capacitance obtained by combining the stray capacitances (C _h , C _l , C _w ) generated on the two paths from the coil 20 to the housing 50, It is represented by the following formula (1). The stray capacitance (C _a ) corresponds to the combined capacitance of the electric capacitance on the path through which the leakage current generated in the coil 20 flows.

また、コイル２０と筐体５０との間の距離は、コイル２０と導電性部材４０との間の距離より長いため、浮遊容量Ｃ_ｈは、浮遊容量Ｃ_ｌより小さい。そのため、式（１）で示される合成量（Ｃ_ａ）は、より小さくなる。 The distance between the coil 20 and the housing 50 is longer than the distance between the coil 20 and the conductive member 40, the stray capacitance C _h is smaller than the stray capacitance C _l. Therefore, the synthesis amount (C _a ) represented by the formula (1) becomes smaller.

例えば、本実施形態と異なり、冷却器３０と筐体５０が一体になっている場合には、コイル２０の漏れ電流は、浮遊容量Ｃ_ｌを介して導電性部材４０に流れ、導電性部材４０から冷却器３０を介して筐体５０に流れる。コイル２０の漏れ電流は、浮遊容量（Ｃ_ｗ）を介して筐体５０に流れない。そのため、コイル２０から筐体５０までの合成容量（Ｃ_ｂ）は、下記式（２）で表される。 For example, unlike the present embodiment, when the cooler 30 and the housing 50 are integrated, the leakage current of the coil 20 flows to the conductive member 40 via the stray capacitance _Cl and the conductive member 40. To the housing 50 through the cooler 30. The leakage current of the coil 20 does not flow to the housing 50 via the stray capacitance (C _w ). Therefore, the combined capacity (C _b ) from the coil 20 to the housing 50 is expressed by the following formula (2).

コイル２０から筐体５０に流れる漏れ電流は、コイル２０と筐体５０との間で生じる浮遊容量（合成容量）が低いほど、小さくなる。例えば、冷却器３０と筐体５０が一体になっている場合に、コイル２０と筐体５０との間の合成容量Ｃ_ｂを低くするためには、コイル２０と筐体５０との間の距離、及び、コイル２０と導電性部材４０との間の距離を長くすることになる。しかしながら、距離を長くすると、筐体５０の体積が増加するため、電源装置の大型化になる。また、コイル２０と導電性部材４０との間の距離を長くすると、コイル２０の熱が、導電性部材４０を介して冷却器３０まで伝わり難くなり、冷却性能が低下する。 The leakage current flowing from the coil 20 to the housing 50 becomes smaller as the stray capacitance (synthetic capacitance) generated between the coil 20 and the housing 50 is lower. For example, if the cooler 30 and the housing 50 are integral, in order to lower the combined capacitance C _b between the coil 20 and the housing 50, the distance between the coil 20 and the housing 50 And the distance between the coil 20 and the electroconductive member 40 is lengthened. However, if the distance is increased, the volume of the housing 50 increases, and thus the power supply apparatus becomes larger. In addition, when the distance between the coil 20 and the conductive member 40 is increased, the heat of the coil 20 becomes difficult to be transmitted to the cooler 30 through the conductive member 40, and the cooling performance is deteriorated.

本実施形態では、コイル２０から筐体５０までの、漏れ電流の導通経路上に、浮遊容量Ｃ_ｌと浮遊容量Ｃ_ｗが直列に接続された状態となるため、式（１）の右辺の第１項が、浮遊容量Ｃ_ｌより小さくなる。そのため、浮遊容量（Ｃ_ａ）は浮遊容量（Ｃ_ｂ）よりも小さくなり、冷却器３０と筐体５０が一体になっている場合と比較して、本実施形態に係る電源装置１００では、コイル２０から筐体５０に流れる漏れ電流を小さくすることができる。その結果として、筐体５０から発するノイズを抑制できる。 In the present embodiment, the stray capacitance C _l and the stray capacitance C _w are connected in series on the leakage current conduction path from the coil 20 to the housing 50, so that 1 term is smaller than the stray capacitance _{C l.} Therefore, the stray capacitance (C _a ) is smaller than the stray capacitance (C _b ), and in the power supply device 100 according to the present embodiment, compared with the case where the cooler 30 and the housing 50 are integrated, the coil The leakage current flowing from 20 to the housing 50 can be reduced. As a result, noise generated from the housing 50 can be suppressed.

上記のように本実施形態では、コイル２０、冷却器３０及び導電性部材４０を筐体５０に収容し、冷却器３０を筐体５０と直流的に絶縁した状態で配置し、導電性部材４０とコイル２０とを近接するように、コイル２０及び導電性部材４０を配置している。これにより、コイル２０から筐体５０までの浮遊容量（Ｃ_ａ）を低減し、筐体５０から発するノイズを低減することができる。 As described above, in the present embodiment, the coil 20, the cooler 30, and the conductive member 40 are accommodated in the casing 50, and the cooler 30 is disposed in a state of being galvanically insulated from the casing 50. The coil 20 and the conductive member 40 are disposed so that the coil 20 and the coil 20 are close to each other. Thereby, the stray capacitance (C _a ) from the coil 20 to the housing 50 can be reduced, and noise generated from the housing 50 can be reduced.

また本実施形態では、浮遊容量Ｃ_ｌは、浮遊容量Ｃ_ｈより大きい。これにより、コイル２０から筐体５０までの浮遊容量（Ｃ_ａ）を低減し、筐体５０から発するノイズを低減することができる。 In the present embodiment, the stray capacitance _{C l} is greater than the stray capacitance _{C h.} Thereby, the stray capacitance (C _a ) from the coil 20 to the housing 50 can be reduced, and noise generated from the housing 50 can be reduced.

本実施形態に係る電源装置１００の変形例として、コイル２０は冷却器３０に近接するように、配置されてもよい。図３は、変形例に係る電源装置１００の断面図である。 As a modification of the power supply device 100 according to the present embodiment, the coil 20 may be disposed so as to be close to the cooler 30. FIG. 3 is a cross-sectional view of a power supply device 100 according to a modification.

コイル２０は、周囲に位置する筐体５０の内壁及び導電性部材４０の側面よりも、冷却器３０の冷却面３０ａに近づくように配置されている。そして、コイル２０と冷却器３０は、所定の隙間を空けた状態で配置されており、コイル２０と冷却器３０は互いに近接している。コイル２０と冷却器３０との間には、浮遊容量Ｃ^’ _ｌが生じる。コイル２０から流れる漏れ電流の導通経路は、コイル２０から浮遊容量Ｃ_ｈを介して筐体５０までの経路と、コイル２０から、浮遊容量Ｃ^’ _ｌ、冷却器３０、導電性部材４０、及び浮遊容量Ｃ_ｗを介して筐体５０までの経路である。コイル２０から筐体５０までの合成容量（Ｃ^’ _ａ）は、コイル２０から筐体５０までの２つの経路上で生じる浮遊容量（Ｃ_ｈ、Ｃ^’ _ｌ、Ｃ_ｗ）を合成した容量であって、下記式（３）で表される。 The coil 20 is disposed so as to be closer to the cooling surface 30 a of the cooler 30 than the inner wall of the casing 50 and the side surface of the conductive member 40 located around the coil 20. The coil 20 and the cooler 30 are arranged with a predetermined gap therebetween, and the coil 20 and the cooler 30 are close to each other. A stray capacitance C ^′ ₁ is generated between the coil 20 and the cooler 30. Conduction path of the leakage current flowing from the coil 20, the path from the coil 20 to the housing 50 through the stray capacitance C _h, from the coil 20, the stray capacitance C ^_'l, cooler 30, the conductive member 40, and the floating This is a route to the housing 50 via the capacity _Cw . The combined capacity (C ^′ _a ) from the coil 20 to the casing 50 is _a capacity obtained by combining the stray capacitances (C _h , C ^′ _l , C _w ) generated on the two paths from the coil 20 to the casing 50. Is represented by the following formula (3).

上記のように変形例では、冷却器３０とコイル２０とを近接するように、コイル２０及び冷却器３０を配置している。これにより、コイル２０から筐体５０までの浮遊容量（Ｃ^’ _ａ）を低減し、筐体５０から発するノイズを低減することができる。 As described above, in the modification, the coil 20 and the cooler 30 are arranged so that the cooler 30 and the coil 20 are close to each other. Thereby, the stray capacitance (C ^′ _a ) from the coil 20 to the housing 50 can be reduced, and noise generated from the housing 50 can be reduced.

なお、本実施形態において、コイル２０は、冷却器３０及び導電性部材４０に近接するように、配置されてもよい。 In the present embodiment, the coil 20 may be disposed so as to be close to the cooler 30 and the conductive member 40.

また本実施形態において、冷却器３０と筐体５０との間で生じる浮遊容量が導電性部材４０と筐体５０との間で生じる浮遊容量より大きい場合には、コイル２０から浮遊容量Ｃ_ｌを介して導電性部材４０に流れる漏れ電流は、導電性部材４０と筐体５０との間よりも、冷却器３０と筐体５０との間の方が流れ易くなる。このような場合には、上記の浮遊容量Ｃ_ｗを、冷却器３０と筐体５０との間で生じる浮遊容量に置き換えた上で、上記本実施形態の記載を援用することで、本実施形態に係る電源装置１００を実現できる。 In the present embodiment, when the stray capacitance generated between the cooler 30 and the housing 50 is larger than the stray capacitance generated between the conductive member 40 and the housing 50, the stray capacitance C ₁ is reduced from the coil 20. Thus, the leakage current flowing through the conductive member 40 is more likely to flow between the cooler 30 and the housing 50 than between the conductive member 40 and the housing 50. In such a case, the above-mentioned stray capacitance C _w, in terms of replacing the stray capacitance generated between the cooler 30 and the housing 50, by aid of the above description present embodiment, the present embodiment The power supply device 100 according to the above can be realized.

同様に、変形例に係る電源装置１００において、冷却器３０と筐体５０との間で生じる浮遊容量が導電性部材４０と筐体５０との間で生じる浮遊容量より大きい場合には、上記の浮遊容量Ｃ_ｗを、冷却器３０と筐体５０との間で生じる浮遊容量に置き換えた上で、上記本実施形態の記載を援用することで、変形例に係る電源装置１００を実現できる。 Similarly, in the power supply device 100 according to the modified example, when the stray capacitance generated between the cooler 30 and the casing 50 is larger than the stray capacitance generated between the conductive member 40 and the casing 50, the above-described the stray capacitance C _w, in terms of replacing the stray capacitance generated between the cooler 30 and the housing 50, by aid of the description of the present embodiment, it is possible to realize a power supply device 100 according to a modification.

《第２実施形態》
本発明の他の実施形態に係る電源装置１００を説明する。本例では上述した第１実施形態に対して、誘電体６１を備えている点が異なる。これ以外の構成は上述した第１実施形態と同じであり、その記載を援用する。 << Second Embodiment >>
A power supply apparatus 100 according to another embodiment of the present invention will be described. This example differs from the first embodiment described above in that a dielectric 61 is provided. Other configurations are the same as those in the first embodiment described above, and the description thereof is incorporated.

図４は、電源装置１００の構成のうち、コイル２０、導電性部材４０及び誘電体６１の断面図である。誘電体６１は、コイル２０と導電性部材４０との間に配置されている。誘電体６１は板状に形成されており、誘電体６１の両主面のうち、一方の主面はコイル２０の側面に接合されており、他方の主面は導電性部材４０の側面に接合されている。誘電体６１は、浮遊容量（Ｃ_ｌ）を低減するために、コイル２０と導電性部材４０との間に狭持されている。 FIG. 4 is a cross-sectional view of the coil 20, the conductive member 40, and the dielectric 61 in the configuration of the power supply device 100. The dielectric 61 is disposed between the coil 20 and the conductive member 40. The dielectric 61 is formed in a plate shape, and one of the main surfaces of the dielectric 61 is bonded to the side surface of the coil 20, and the other main surface is bonded to the side surface of the conductive member 40. Has been. The dielectric 61 is sandwiched between the coil 20 and the conductive member 40 in order to reduce the stray capacitance (C _l ).

本実施形態では、誘電体６１がコイル２０と導電性部材４０との間に配置されているため、コイル２０から筐体５０までの浮遊容量（Ｃ_ａ）を低減し、筐体５０から発するノイズを低減することができる。また、コイル２０の熱が、誘電体６１を介して導電性部材４０に伝わりやすくなるため、冷却効果を高めることができる。 In the present embodiment, since the dielectric 61 is disposed between the coil 20 and the conductive member 40, the stray capacitance (C _a ) from the coil 20 to the housing 50 is reduced, and noise generated from the housing 50. Can be reduced. Further, since the heat of the coil 20 is easily transferred to the conductive member 40 through the dielectric 61, the cooling effect can be enhanced.

本実施形態に係る電源装置１００の変形例として、誘電体６１の代わりに、コイル２０と導電性部材４０との間に樹脂６２を配置してもよい。図５は、電源装置１００の構成のうち、コイル２０、導電性部材４０及び樹脂６２の断面図である。これにより、コイル２０から筐体５０までの浮遊容量（Ｃ_ａ）を低減し、筐体５０から発するノイズを低減することができる。また、コイル２０の熱が、樹脂６２を介して導電性部材４０に伝わりやすくなるため、冷却効果を高めることができる。 As a modification of the power supply device 100 according to this embodiment, a resin 62 may be disposed between the coil 20 and the conductive member 40 instead of the dielectric 61. FIG. 5 is a cross-sectional view of the coil 20, the conductive member 40, and the resin 62 in the configuration of the power supply device 100. Thereby, the stray capacitance (C _a ) from the coil 20 to the housing 50 can be reduced, and noise generated from the housing 50 can be reduced. Moreover, since the heat of the coil 20 is easily transmitted to the conductive member 40 through the resin 62, the cooling effect can be enhanced.

なお、誘電体６１又は樹脂６２は、コイル２０と導電性部材４０との間に限らず、コイル２０と冷却器３０との間に配置してもよい。 The dielectric 61 or the resin 62 is not limited to be disposed between the coil 20 and the conductive member 40 but may be disposed between the coil 20 and the cooler 30.

《第３実施形態》
本発明の他の実施形態に係る電源装置１００を説明する。本例では上述した第１実施形態に対して、絶縁基板６３及びグリース６４を備えている点が異なる。これ以外の構成は上述した第１実施形態と同じであり、その記載を援用する。 << Third Embodiment >>
A power supply apparatus 100 according to another embodiment of the present invention will be described. This example is different from the first embodiment described above in that an insulating substrate 63 and a grease 64 are provided. Other configurations are the same as those in the first embodiment described above, and the description thereof is incorporated.

図６は、電源装置１００の構成のうち、コイル２０、導電性部材４０、絶縁基板６３、及びグリース６４の断面図である。絶縁基板６３及びグリース６４は、コイル２０と導電性部材４０との間に配置されている。絶縁基板６３は板状に形成されている。絶縁基板６３の両主面のうち、一方の主面はコイル２０の側面に接合されている。他方の主面は、グリース６４を介して導電性部材４０の側面に接合されている。 FIG. 6 is a cross-sectional view of the coil 20, the conductive member 40, the insulating substrate 63, and the grease 64 in the configuration of the power supply device 100. The insulating substrate 63 and the grease 64 are disposed between the coil 20 and the conductive member 40. The insulating substrate 63 is formed in a plate shape. Of the two main surfaces of the insulating substrate 63, one main surface is joined to the side surface of the coil 20. The other main surface is joined to the side surface of the conductive member 40 via the grease 64.

本実施形態では、コイル２０と導電性部材４０が、グリース６４を介して接合されているため、コイル２０と筐体５０との間の浮遊容量（Ｃ_ａ）を低減し、筐体５０から発するノイズを低減することができる。また、コイル２０の熱が、グリース６４を介して導電性部材４０に伝わりやすくなるため、冷却効果を高めることができる。 In this embodiment, since the coil 20 and the conductive member 40 are joined via the grease 64, the stray capacitance (C _a ) between the coil 20 and the housing 50 is reduced, and the coil 50 is emitted from the housing 50. Noise can be reduced. Further, since the heat of the coil 20 is easily transferred to the conductive member 40 via the grease 64, the cooling effect can be enhanced.

本実施形態に係る電源装置１００の変形例として、グリース６４の代わりに、コイル２０と導電性部材４０とを、ハンダ６５で接合してもよい。図７は、電源装置１００の構成のうち、コイル２０、導電性部材４０、絶縁基板６３及びハンダ６５の断面図である。図７に示すように、絶縁基板６３の主面が、ハンダ６５により導電性部材４０の側面に接合されている。 As a modification of the power supply device 100 according to the present embodiment, the coil 20 and the conductive member 40 may be joined by solder 65 instead of the grease 64. FIG. 7 is a cross-sectional view of the coil 20, the conductive member 40, the insulating substrate 63, and the solder 65 in the configuration of the power supply device 100. As shown in FIG. 7, the main surface of the insulating substrate 63 is joined to the side surface of the conductive member 40 by solder 65.

これにより、コイル２０と筐体５０との間の浮遊容量（Ｃ_ａ）を低減し、筐体５０から発するノイズを低減することができる。また、コイル２０の熱が、はんだ６５を介して導電性部材４０に伝わりやすくなるため、冷却効果を高めることができる。 Thereby, the stray capacitance (C _a ) between the coil 20 and the housing 50 can be reduced, and noise generated from the housing 50 can be reduced. Further, since the heat of the coil 20 is easily transmitted to the conductive member 40 via the solder 65, the cooling effect can be enhanced.

なお、図６に示したグリース６４による接合構造は、コイル２０と導電性部材４０との間に限らず、コイル２０と冷却器３０との間に適用してもよい。また、図７に示したはんだ６５による接合構造は、コイル２０と導電性部材４０との間に限らず、コイル２０と冷却器３０との間に適用してもよい。 6 may be applied not only between the coil 20 and the conductive member 40 but also between the coil 20 and the cooler 30. 7 may be applied not only between the coil 20 and the conductive member 40 but also between the coil 20 and the cooler 30.

《第４実施形態》
本発明の他の実施形態に係る電源装置１００を説明する。本例では上述した第１実施形態に対して、複数のコイル２１、２２が導電性部材４０に近接している点が異なる。これ以外の構成は上述した第１実施形態と同じであり、第１〜第３実施形態の記載を適宜、援用する。図８は、本実施形態に係る電源装置１００の断面図である。 << 4th Embodiment >>
A power supply apparatus 100 according to another embodiment of the present invention will be described. This example differs from the first embodiment described above in that a plurality of coils 21 and 22 are close to the conductive member 40. Other configurations are the same as those in the first embodiment described above, and the descriptions of the first to third embodiments are incorporated as appropriate. FIG. 8 is a cross-sectional view of the power supply device 100 according to the present embodiment.

コイル２１は、トランス２、トランス４、チョークコイル６、トランス８、トランス１１のうち少なくとも１つのコイルに相当する。また、コイル２２は、トランス２、トランス４、チョークコイル６、トランス８、トランス１１のうち少なくとも１つのコイルに相当する。 The coil 21 corresponds to at least one of the transformer 2, the transformer 4, the choke coil 6, the transformer 8, and the transformer 11. The coil 22 corresponds to at least one of the transformer 2, the transformer 4, the choke coil 6, the transformer 8, and the transformer 11.

コイル２１は、導電性部材４０の両側面（両主面）のうち、一方の側面４０ａに対して近接するように配置されている。また、コイル２２は、導電性部材４０の両側面（両主面）のうち、他方の側面４０ｂに対して近接するように配置されている。導電性部材４０は、コイル２１とコイル２２との間に配置されることで、筐体５０内の空間を隔てる隔壁としての機能をもつ。そして、導電性部材４０で区切られた２つの空間のうち、一方の空間にはコイル２１が配置され、他方の空間にはコイル２２が配置されている。 The coil 21 is disposed so as to be close to one side surface 40 a of both side surfaces (both main surfaces) of the conductive member 40. Further, the coil 22 is disposed so as to be close to the other side surface 40 b of both side surfaces (both main surfaces) of the conductive member 40. The conductive member 40 is disposed between the coil 21 and the coil 22 so as to function as a partition wall that separates the space in the housing 50. Of the two spaces separated by the conductive member 40, the coil 21 is disposed in one space, and the coil 22 is disposed in the other space.

上記のように、本実施形態では、コイル２１とコイル２２との間に導電性部材４０が近接して配置されている。これにより、コイル２１から筐体５０までの浮遊容量、及び、コイル２２から筐体５０までの浮遊容量をそれぞれ低減し、筐体５０から発するノイズを低減することができる。また、コイル２１とコイル２２との間は、導電性部材４０で区切られているため、一方のコイルで発生するノイズが他方のコイルに影響を与えることを防止できる。 As described above, in the present embodiment, the conductive member 40 is disposed close to the coil 21 and the coil 22. Thereby, the stray capacitance from the coil 21 to the housing 50 and the stray capacitance from the coil 22 to the housing 50 can be reduced, respectively, and noise generated from the housing 50 can be reduced. Further, since the coil 21 and the coil 22 are separated by the conductive member 40, it is possible to prevent noise generated in one coil from affecting the other coil.

なお、本実施形態に係る電源装置１００の変形例として、コイル２１は、冷却器３０の両側面（両主面）のうち、一方の側面３０ａに対して近接するように配置されていてもよい。また、コイル２２は、冷却器３０の両側面（両主面）のうち、他方の側面３０ｂに対して近接するように配置されていてもよい。 As a modification of the power supply device 100 according to the present embodiment, the coil 21 may be disposed so as to be close to one side surface 30a of both side surfaces (both main surfaces) of the cooler 30. . Moreover, the coil 22 may be arrange | positioned so that it may adjoin with respect to the other side surface 30b among the both sides | surfaces (both main surfaces) of the cooler 30. FIG.

《第５実施形態》
本発明の他の実施形態に係る電源装置１００を説明する。本例では上述した第１実施形態に対して、複数のコイル２３〜２５が導電性部材４０に近接している点が異なる。これ以外の構成は上述した第１実施形態と同じであり、第１〜第３実施形態の記載を適宜、援用する。図９は、本実施形態に係る電源装置１００の断面図である。 << 5th Embodiment >>
A power supply apparatus 100 according to another embodiment of the present invention will be described. This example differs from the first embodiment described above in that a plurality of coils 23 to 25 are close to the conductive member 40. Other configurations are the same as those in the first embodiment described above, and the descriptions of the first to third embodiments are incorporated as appropriate. FIG. 9 is a cross-sectional view of the power supply device 100 according to the present embodiment.

コイル２３〜２５は、トランス２、トランス４、チョークコイル６、トランス８、トランス１１のうち少なくとも１つのコイルにそれぞれ相当する。 The coils 23 to 25 correspond to at least one of the transformer 2, the transformer 4, the choke coil 6, the transformer 8, and the transformer 11, respectively.

コイル２３、２４は、導電性部材４０の両側面（両主面）のうち、一方の側面４０ａに対して近接するように配置されている。また、コイル２５は、導電性部材４０の両側面（両主面）のうち、他方の側面４０ｂに対して近接するように配置されている。導電性部材４０は、コイル２３、２４とコイル２５との間に配置されることで、筐体５０内の空間を隔てる隔壁としての機能をもつ。そして、導電性部材４０で区切られた２空間のうち、一方の空間にはコイル２３、２４が配置され、他方の空間にはコイル２５が配置されている。 The coils 23 and 24 are disposed so as to be close to one side surface 40 a of both side surfaces (both main surfaces) of the conductive member 40. Further, the coil 25 is disposed so as to be close to the other side surface 40 b of both side surfaces (both main surfaces) of the conductive member 40. The conductive member 40 is disposed between the coils 23 and 24 and the coil 25, thereby having a function as a partition wall that separates the space in the housing 50. Of the two spaces separated by the conductive member 40, the coils 23 and 24 are disposed in one space, and the coil 25 is disposed in the other space.

上記のように、本実施形態では、コイル２３、２４とコイル２５との間に導電性部材４０が近接して配置されている。これにより、コイル２３から筐体５０までの浮遊容量、コイル２４から筐体５０までの浮遊容量、及びコイル２５から筐体５０までの浮遊容量をそれぞれ低減し、筐体５０から発するノイズを低減することができる。また、コイル２３、２４とコイル２５との間は、導電性部材４０で区切られているため、一方のコイルで発生するノイズが他方のコイルに影響を与えることを防止できる。 As described above, in this embodiment, the conductive member 40 is disposed close to the coils 23 and 24 and the coil 25. Thereby, the stray capacitance from the coil 23 to the housing 50, the stray capacitance from the coil 24 to the housing 50, and the stray capacitance from the coil 25 to the housing 50 are reduced, respectively, and noise generated from the housing 50 is reduced. be able to. Further, since the coils 23, 24 and the coil 25 are separated by the conductive member 40, it is possible to prevent noise generated in one coil from affecting the other coil.

なお、本実施形態に係る電源装置１００の変形例として、コイル２３，２４は、冷却器３０の両側面（両主面）のうち、一方の側面３０ａに対して近接するように配置されていてもよい。また、コイル２５は、冷却器３０の両側面（両主面）のうち、他方の側面３０ｂに対して近接するように配置されていてもよい。 In addition, as a modification of the power supply device 100 according to the present embodiment, the coils 23 and 24 are arranged so as to be close to one side surface 30 a of both side surfaces (both main surfaces) of the cooler 30. Also good. Moreover, the coil 25 may be arrange | positioned so that it may adjoin with respect to the other side surface 30b among the both sides | surfaces (both main surfaces) of the cooler 30. FIG.

《第６実施形態》
本発明の他の実施形態に係る電源装置１００を説明する。本例では上述した第１実施形態に対して、複数のコイル２１、２２が導電性部材４０に近接している点が異なる。これ以外の構成は上述した第１実施形態と同じであり、第１〜第３実施形態の記載を適宜、援用する。図１０は、本実施形態に係る電源装置１００の断面図である。 << 6th Embodiment >>
A power supply apparatus 100 according to another embodiment of the present invention will be described. This example differs from the first embodiment described above in that a plurality of coils 21 and 22 are close to the conductive member 40. Other configurations are the same as those in the first embodiment described above, and the descriptions of the first to third embodiments are incorporated as appropriate. FIG. 10 is a cross-sectional view of the power supply device 100 according to the present embodiment.

コイル２１、２２は、導電性部材４０の両側面（両主面）のうち、一方の側面４０ａに対して近接するように配置されている。コイル２１の側面と導電性部材４０の側面４０ａとの間の距離（ｄ_１）は、コイル２２の側面と導電性部材４０の側面４０ａとの間の距離（ｄ_２）よりも長い。そのため、コイル２１と導電性部材４０との間に生じる浮遊容量（Ｃ_ｌ１）は、コイル２２と導電性部材４０との間に生じる浮遊容量（Ｃ_ｌ２）よりも小さい。 The coils 21 and 22 are disposed so as to be close to one side surface 40 a of both side surfaces (both main surfaces) of the conductive member 40. The distance (d ₁ ) between the side surface of the coil 21 and the side surface 40 a of the conductive member 40 is longer than the distance (d ₂ ) between the side surface of the coil 22 and the side surface 40 a of the conductive member 40. Therefore, the stray capacitance (C _l1 ) generated between the coil 21 and the conductive member 40 is smaller than the stray capacitance (C _l2 ) generated between the coil 22 and the conductive member 40.

導電性部材４０と対向するコイル２１の側面の表面積をＳ_１とし、導電性部材４０と対向するコイル２２の側面の表面積をＳ_２とし、コイル２１、２２と導電性部材４０との間の誘電率をεとすると、浮遊容量（Ｃ_ｌ１）及び浮遊容量（Ｃ_ｌ２）は下記式（４）及び（５）でそれぞれ表される。 The surface area of the side surface of the coil 21 facing the conductive member 40 is S ₁ , the surface area of the side surface of the coil 22 facing the conductive member 40 is S _2, and the dielectric between the coils 21, 22 and the conductive member 40 is set. Once the rate and epsilon, the stray capacitance _{(C l1)} and stray capacitance _{(C l2)} is represented by the following formulas (4) and (5).

コイル２１の側面と筐体５０の側面との間の距離は、コイル２２の側面と筐体５０の側面との間の距離よりも短い。そのため、コイル２１と筐体５０との間に生じる浮遊容量（Ｃ_ｈ１）は、コイル２２と筐体５０との間に生じる浮遊容量（Ｃ_ｈ２）よりも大きい。 The distance between the side surface of the coil 21 and the side surface of the housing 50 is shorter than the distance between the side surface of the coil 22 and the side surface of the housing 50. Therefore, the stray capacitance (C _h1 ) generated between the coil 21 and the housing 50 is larger than the stray capacitance (C _h2 ) generated between the coil 22 and the housing 50.

コイル２１から流れる漏れ電流の導通経路は、コイル２１から浮遊容量Ｃ_ｈ１を介して筐体５０までの経路と、コイル２１から、浮遊容量Ｃ_ｌ１、導電性部材４０、及び浮遊容量Ｃ_ｗを介して筐体５０までの経路である。コイル２１から筐体５０までの合成容量（Ｃ_ａ１）は、下記式（６）で表される。 Conduction path of the leakage current flowing from the coil 21, through a path from the coil 21 to the housing 50 through the stray capacitance _{C h1,} from the coil 21, the stray capacitance _{C l1,} the conductive member 40, and the stray capacitance _{C w} The route to the housing 50. The combined capacity (C _a1 ) from the coil 21 to the housing 50 is expressed by the following formula (6).

コイル２２から流れる漏れ電流の導通経路は、コイル２２から浮遊容量Ｃ_ｈ２を介して筐体５０までの経路と、コイル２２から、浮遊容量Ｃ_ｌ２、導電性部材４０、及び浮遊容量Ｃ_ｗを介して筐体５０までの経路である。コイル２２から筐体５０までの合成容量（Ｃ_ａ２）は、下記式（７）で表される。 Conduction path of the leakage current flowing from the coil 22, through a path from the coil 22 to the housing 50 through the stray capacitance _{C h2,} from the coil 22, the stray capacitance _{C l2,} the conductive member 40, and the stray capacitance _{C w} The route to the housing 50. The combined capacity (C _a2 ) from the coil 22 to the housing 50 is expressed by the following formula (7).

そして、図１に示した電源装置１００の回路において、コイル２１に接続された電流経路のインダクタンスをＬ_１として、コイル２２に接続された電流経路のインダクタンスをＬ_２とすると、下記式（８）の条件を満たす場合に、筐体５０から発生されるノイズの抑制効果が高くなる。なお、インダクタンス（Ｌ_１、Ｌ_２）は、コイル２１、２２が電気的に接続されている配線の寄生インダクタンスである。 Then, in the circuit of the power supply device 100 shown in FIG. 1, the inductance of the current path connected to the coil 21 as L _1, the inductance of the current path connected to the coil 22 and L _2, the following formula (8) When this condition is satisfied, the effect of suppressing noise generated from the housing 50 is enhanced. The inductances (L ₁ , L ₂ ) are parasitic inductances of the wirings to which the coils 21 and 22 are electrically connected.

インダクタンス（Ｌ_１）とインダクタンス（Ｌ_２）が等しい場合には、合成容量（Ｃ_ａ１）と合成容量（Ｃ_ａ２）を等しくすることで、式（８）を満たす。合成容量（Ｃ_ａ１）と合成容量（Ｃ_ａ２）を等しくするためには、上記の表面積（Ｓ_１、Ｓ_２）又は距離（ｄ_１、ｄ_２）を調整すればよい。 When the inductance (L ₁ ) is equal to the inductance (L ₂ ), the combined capacitance (C _a1 ) and the combined capacitance (C _a2 ) are made equal to satisfy Equation (8). In order to make the combined capacity (C _a1 ) equal to the combined capacity (C _a2 ), the surface area (S ₁ , S ₂ ) or the distance (d ₁ , d ₂ ) may be adjusted.

なお、インダクタンス（Ｌ_１）及びインダクタンス（Ｌ_２）は、厳密に等しくならなくてもよい。また、インダクタンス（Ｌ_１）及びインダクタンス（Ｌ_２）が等しくならない場合には、式（８）を満たすように、表面積（Ｓ_１、Ｓ_２）又は距離（ｄ_１、ｄ_２）を調整すればよい。 Note that the inductance (L ₁ ) and the inductance (L ₂ ) do not have to be exactly equal. If the inductance (L ₁ ) and the inductance (L ₂ ) are not equal, the surface area (S ₁ , S ₂ ) or the distance (d ₁ , d ₂ ) should be adjusted so as to satisfy the equation (8). Good.

上記の本実施形態では、式（８）を満たすように、コイル２１、２２が筐体５０内に配置されている。これにより、筐体５０から発するノイズをさらに低減することができる。また、式（８）の条件に加えて、インダクタンス（Ｌ_１）とインダクタンス（Ｌ_２）が等しい場合には、表面積（Ｓ_１、Ｓ_２）又は距離（ｄ_１、ｄ_２）を調整して、合成容量（Ｃ_ａ１）と合成容量（Ｃ_ａ２）を等しくする。これにより、浮遊容量の対称性が向上するため、さらにノイズの発生を抑えることができる。 In the present embodiment, the coils 21 and 22 are arranged in the housing 50 so as to satisfy the equation (8). Thereby, the noise emitted from the housing 50 can be further reduced. In addition to the condition of equation (8), when the inductance (L ₁ ) and the inductance (L ₂ ) are equal, the surface area (S ₁ , S ₂ ) or the distance (d ₁ , d ₂ ) is adjusted. The combined capacity (C _a1 ) and the combined capacity (C _a2 ) are made equal. Thereby, since the symmetry of the stray capacitance is improved, the generation of noise can be further suppressed.

なお、本実施形態に係る電源装置１００の変形例として、コイル２１、２２は、冷却器３０と近接するように、配置されてもよい。このとき、コイル２１と筐体５０との間に生じる浮遊容量、コイル２１と冷却器３０との間に生じる浮遊容量、コイル２２と筐体５０との間に生じる浮遊容量、及び、コイル２２と冷却器３０との間に生じる浮遊容量が、上記式（８）を満たすように、コイル２１、２２の側面の表面積、コイル２１、２２と冷却器３０との間の距離、及び、コイル２１、２２と筐体５０との間の距離が調整されればよい。 As a modification of the power supply device 100 according to the present embodiment, the coils 21 and 22 may be disposed so as to be close to the cooler 30. At this time, the stray capacitance generated between the coil 21 and the casing 50, the stray capacitance generated between the coil 21 and the cooler 30, the stray capacitance generated between the coil 22 and the casing 50, and the coil 22 The surface area of the side surfaces of the coils 21, 22, the distance between the coils 21, 22 and the cooler 30, and the coil 21, so that the stray capacitance generated between the cooler 30 satisfies the above formula (8). The distance between 22 and the housing | casing 50 should just be adjusted.

《第７実施形態》
本発明の他の実施形態に係る電源装置１００を説明する。本例では上述した第１実施形態に対して、複数のコイル２１、２２が導電性部材４０に近接している点が異なる。これ以外の構成は上述した第１実施形態と同じであり、第１〜第３実施形態の記載を適宜、援用する。 << 7th Embodiment >>
A power supply apparatus 100 according to another embodiment of the present invention will be described. This example differs from the first embodiment described above in that a plurality of coils 21 and 22 are close to the conductive member 40. Other configurations are the same as those in the first embodiment described above, and the descriptions of the first to third embodiments are incorporated as appropriate.

コイル２１、２２は、導電性部材４０の両側面（両主面）のうち、一方の側面４０ａに対して近接するように配置されている。コイル２１と筐体５０との間には浮遊容量（Ｃ_ｈ３）が生じ、コイル２１と導電性部材４０との間には浮遊容量（Ｃ_ｌ３）が生じ、コイル２２と筐体５０との間には浮遊容量（Ｃ_ｈ４）が生じ、コイル２２と導電性部材４０との間には浮遊容量（Ｃ_ｌ４）が生じる。 The coils 21 and 22 are disposed so as to be close to one side surface 40 a of both side surfaces (both main surfaces) of the conductive member 40. A stray capacitance (C _h3 ) is generated between the coil 21 and the casing 50, and a stray capacitance (C _l3 ) is generated between the coil 21 and the conductive member 40, so that a _gap between the coil 22 and the casing 50 is generated. stray capacitance _{(C h4)} is occurs, the stray capacitance between the coil 22 and the conductive member 40 _{(C l4)} occurs.

コイル２１から流れる漏れ電流の導通経路は、コイル２１から浮遊容量Ｃ_ｈ３を介して筐体５０までの経路と、コイル２１から、浮遊容量Ｃ_ｌ３、導電性部材４０、及び浮遊容量Ｃ_ｗを介して筐体５０までの経路である。コイル２１から筐体５０までの合成容量（Ｃ_ａ３）は、下記式（９）で表される。 Conduction path of the leakage current flowing from the coil 21, through a path from the coil 21 to the housing 50 through the stray capacitance _{C h3,} from the coil 21, the stray capacitance _{C l3,} the conductive member 40, and the stray capacitance _{C w} The route to the housing 50. The combined capacity (C _a3 ) from the coil 21 to the housing 50 is represented by the following formula (9).

コイル２２から流れる漏れ電流の導通経路は、コイル２２から浮遊容量Ｃ _ｈ４を介して筐体５０までの経路と、コイル２２から、浮遊容量Ｃ_ｌ４、導電性部材４０、及び浮遊容量Ｃ_ｗを介して筐体５０までの経路である。コイル２２から筐体５０までの合成容量（Ｃ_ａ４）は、下記式（１０）で表される。 Conduction path of the leakage current flowing from the coil 22, through a path from the coil 22 to the housing 50 through the stray capacitance C _h4, the coil 22, the stray capacitance _{C l4,} the conductive member 40, and the stray capacitance _{C w} The route to the housing 50. The combined capacity (C _a4 ) from the coil 22 to the housing 50 is represented by the following formula (10).

そして、合成容量（Ｃ_ａ３）と合成容量（Ｃ_ａ４）が等しくなるように、浮遊容量（Ｃ_ｌ３、Ｃ_ｌ４、Ｃ_ｈ３、Ｃ_ｈ４）を形成するコイル２１、２２の側面の表面積、コイル２１、２２と筐体５０との間の距離、コイル２１、２２と導電性部材４０との間の距離が調整されている。これにより、浮遊容量の対称性が向上するため、ノイズの発生を抑えることができる。 Then, the surface area of the side surfaces of the coils 21 and 22 forming the stray capacitances (C ₁₃ , C ₁₄ , C _h3 , C _h4 ), the coil 21 so that the combined capacitance (C _a3 ) and the combined capacitance (C _a4 ) are equal. , 22 and the distance between the casing 50 and the distance between the coils 21 and 22 and the conductive member 40 are adjusted. Thereby, since the symmetry of the stray capacitance is improved, the generation of noise can be suppressed.

《第８実施形態》
本発明の他の実施形態に係る電源装置１００を説明する。本例では上述した第１実施形態に対して、半導体素子７０を備えている点が異なる。これ以外の構成は上述した第１実施形態と同じであり、第１〜第７実施形態の記載を適宜、援用する。図１２は、電源装置１００の断面図である。 << Eighth Embodiment >>
A power supply apparatus 100 according to another embodiment of the present invention will be described. This example is different from the first embodiment described above in that a semiconductor element 70 is provided. Other configurations are the same as those of the first embodiment described above, and the descriptions of the first to seventh embodiments are incorporated as appropriate. FIG. 12 is a cross-sectional view of the power supply device 100.

電源装置１００は、電源装置１００は、半導体素子７０と、冷却器３０と、導電性部材４０と、筐体５０とを備えている。なお、図１２は、電源装置１００を構成する部品の一部を示しており、電源装置１００は、図１２に示す構成以外に、コイル２０を備えている。なお、筐体５０内におけるコイル２０の位置は、第１〜第７実施形態で示したコイル２０の位置と同様である。 The power supply device 100 includes a semiconductor element 70, a cooler 30, a conductive member 40, and a housing 50. FIG. 12 shows a part of the components constituting the power supply apparatus 100, and the power supply apparatus 100 includes a coil 20 in addition to the configuration shown in FIG. In addition, the position of the coil 20 in the housing 50 is the same as the position of the coil 20 shown in the first to seventh embodiments.

半導体素子７０は、電力変換回路７、９に含まれるスイッチング素子（トランジスタ）に相当する。また、半導体素子７０は、電源装置１００に含まれる各部品のうち、発熱する部品の１つである。半導体素子７０は、筐体５０と直流的に絶縁した状態で、筐体５０内に設けられている。半導体素子７０は、筐体５０の側壁に対して、一定の距離を空けて配置されている。筐体５０の側壁は、半導体素子７０の周囲に位置する、筐体５０の内壁である。 The semiconductor element 70 corresponds to a switching element (transistor) included in the power conversion circuits 7 and 9. The semiconductor element 70 is one of the components that generate heat among the components included in the power supply device 100. The semiconductor element 70 is provided in the housing 50 in a state where it is galvanically insulated from the housing 50. The semiconductor element 70 is arranged with a certain distance from the side wall of the housing 50. The side wall of the housing 50 is an inner wall of the housing 50 that is located around the semiconductor element 70.

半導体素子７０は、モジュール化されており、半導体素子７０の側面（図１２に示すｙｚ面）が、筐体５０の側面（ｙｚ面）と対向するように配置されている。また、筐体５０は、導電性をもっている。そのため、半導体素子７０の側面と筐体５０の側面との間で、浮遊容量Ｃ_ｉが生じる。 The semiconductor element 70 is modularized, and is disposed such that the side surface (yz surface shown in FIG. 12) of the semiconductor element 70 faces the side surface (yz surface) of the housing 50. Moreover, the housing | casing 50 has electroconductivity. Therefore, stray capacitance C _i is generated between the side surface of the semiconductor element 70 and the side surface of the housing 50.

半導体素子７０と導電性部材４０は、所定の隙間を空けた状態で配置されている。これにより、半導体素子７０と導電性部材４０は互いに近接している。そして、半導体素子７０と導電性部材４０は所定の隙間を空けた状態で近接しているため、半導体素子７０と導電性部材４０との間には、浮遊容量Ｃ_ｍが生じる。 The semiconductor element 70 and the conductive member 40 are arranged with a predetermined gap. Thereby, the semiconductor element 70 and the conductive member 40 are close to each other. Since the semiconductor element 70 and the conductive member 40 are close to each other with a predetermined gap therebetween, a stray capacitance _Cm is generated between the semiconductor element 70 and the conductive member 40.

半導体素子７０から流れる漏れ電流の導通経路は、半導体素子７０から浮遊容量Ｃ_ｉを介して筐体５０までの経路と、半導体素子７０から、浮遊容量Ｃ_ｍ、導電性部材４０、及び浮遊容量Ｃ_ｗを介して筐体５０までの経路である。半導体素子７０から筐体５０までの合成容量（Ｃ_ｐ）は、コイル２０から筐体５０までの２つの経路上で生じる浮遊容量（Ｃ_ｉ、Ｃ_ｍ、Ｃ_ｗ）を合成した容量であって、下記式（１１）で表される。なお、浮遊容量（Ｃ_ｐ）は、半導体素子７０で発生した漏れ電流が筐体５０流れる経路上の電気容量の合成容量に相当する。 The conduction path of the leakage current flowing from the semiconductor element 70 includes the path from the semiconductor element 70 to the housing 50 via the stray capacitance C _i , the stray capacitance C _m , the conductive member 40, and the stray capacitance C from the semiconductor element 70. _This is a route to the housing 50 via _w . The combined capacitance (C _p ) from the semiconductor element 70 to the housing 50 is a capacitance obtained by combining the stray capacitances (C _i , C _m , C _w ) generated on the two paths from the coil 20 to the housing 50. Is represented by the following formula (11). Note that the stray capacitance (C _p ) corresponds to the combined capacitance of the electric capacitance on the path through which the leakage current generated in the semiconductor element 70 flows.

また、半導体素子７０と筐体５０との間の距離は、半導体素子７０と導電性部材４０との間の距離より長いため、浮遊容量Ｃ_ｉは、浮遊容量Ｃ_ｍより小さい。そのため、式（１１）で示される合成量（Ｃ_ｐ）は、より小さくなる。 Further, since the distance between the semiconductor element 70 and the housing 50 is longer than the distance between the semiconductor element 70 and the conductive member 40, the stray capacitance C _i is smaller than the stray capacitance C _m . Therefore, the synthesis amount (C _p ) represented by the formula (11) becomes smaller.

上記のように本実施形態では、半導体素子７０、冷却器３０及び導電性部材４０を筐体５０に収容し、冷却器３０を筐体５０と直流的に絶縁した状態で配置し、導電性部材４０と半導体素子７０とを近接するように、半導体素子７０及び導電性部材４０を配置している。これにより、半導体素子７０から筐体５０までの浮遊容量（Ｃ_ｐ）を低減し、筐体５０から発するノイズを低減することができる。 As described above, in the present embodiment, the semiconductor element 70, the cooler 30, and the conductive member 40 are accommodated in the housing 50, and the cooler 30 is arranged in a state of being galvanically insulated from the housing 50. The semiconductor element 70 and the conductive member 40 are arranged so that 40 and the semiconductor element 70 are close to each other. Thereby, the stray capacitance (C _p ) from the semiconductor element 70 to the housing 50 can be reduced, and noise generated from the housing 50 can be reduced.

また本実施形態では、浮遊容量Ｃ_ｍは、浮遊容量Ｃ_ｉより大きい。これにより、半導体素子７０から筐体５０までの浮遊容量（Ｃ_ｐ）を低減し、筐体５０から発するノイズを低減することができる。 In the present embodiment, the stray capacitance C _m is larger than the stray capacitance C _i . Thereby, the stray capacitance (C _p ) from the semiconductor element 70 to the housing 50 can be reduced, and noise generated from the housing 50 can be reduced.

本実施形態に係る電源装置１００の変形例として、半導体素子７０は冷却器３０に近接するように、配置されてもよい。図１３は、変形例に係る電源装置１００の断面図である。 As a modification of the power supply device 100 according to the present embodiment, the semiconductor element 70 may be arranged so as to be close to the cooler 30. FIG. 13 is a cross-sectional view of a power supply device 100 according to a modification.

半導体素子７０は、周囲に位置する筐体５０の内壁及び導電性部材４０の側面よりも、冷却器３０の冷却面３０ａに近づくように配置されている。そして、半導体素子７０と冷却器３０は、所定の隙間を空けた状態で配置されており、半導体素子７０と冷却器３０は互いに近接している。半導体素子７０と冷却器３０との間には、浮遊容量Ｃ^’ _ｍが生じる。半導体素子７０から流れる漏れ電流の導通経路は、半導体素子７０から浮遊容量Ｃ_ｉを介して筐体５０までの経路と、半導体素子７０から、浮遊容量Ｃ^’ _ｍ、冷却器３０、導電性部材４０、及び浮遊容量Ｃ_ｗを介して筐体５０までの経路である。半導体素子７０から筐体５０までの合成容量（Ｃ^’ _ｐ）は、コイル２０から筐体５０までの２つの経路上で生じる浮遊容量（Ｃ_ｉ、Ｃ^’ _ｍ、Ｃ_ｗ）を合成した容量であって、下記式（１２）で表される。 The semiconductor element 70 is disposed so as to be closer to the cooling surface 30 a of the cooler 30 than the inner wall of the casing 50 and the side surface of the conductive member 40 located around the semiconductor element 70. The semiconductor element 70 and the cooler 30 are arranged with a predetermined gap therebetween, and the semiconductor element 70 and the cooler 30 are close to each other. A stray capacitance C ^′ _m is generated between the semiconductor element 70 and the cooler 30. The conduction path of the leakage current flowing from the semiconductor element 70 includes the path from the semiconductor element 70 to the housing 50 via the stray capacitance C _i , the stray capacitance C ^′ _m from the semiconductor element 70, the cooler 30, and the conductive member 40. , And a path to the housing 50 via the stray capacitance _Cw . The combined capacitance (C ^′ _p ) from the semiconductor element 70 to the housing 50 is a capacitance obtained by combining the stray capacitance (C _i , C ^′ _m , C _w ) generated on the two paths from the coil 20 to the housing 50. It is represented by the following formula (12).

上記のように変形例では、冷却器３０と半導体素子７０とを近接するように、半導体素子７０及び冷却器３０を配置している。これにより、半導体素子７０から筐体５０までの浮遊容量（Ｃ^’ _ａ）を低減し、筐体５０から発するノイズを低減することができる。 As described above, in the modification, the semiconductor element 70 and the cooler 30 are arranged so that the cooler 30 and the semiconductor element 70 are close to each other. Thereby, the stray capacitance (C ^′ _a ) from the semiconductor element 70 to the housing 50 can be reduced, and noise generated from the housing 50 can be reduced.

なお、本実施形態において、半導体素子７０は、冷却器３０及び導電性部材４０に近接するように、配置されてもよい。 In the present embodiment, the semiconductor element 70 may be disposed so as to be close to the cooler 30 and the conductive member 40.

なお、本実施形態において、半導体素子７０と導電性部材４０との間、又は、半導体素子７０と冷却器３０の間には、第２実施形態と同様の誘電体６１又は樹脂６２を配置してもよい。また、本実施形態において、半導体素子７０と導電性部材４０との間、又は、半導体素子７０と冷却器３０の間は、第３実施形態と同様に、グリース６４又はハンダ６５により接合されていてもよい。 In the present embodiment, the same dielectric 61 or resin 62 as that in the second embodiment is disposed between the semiconductor element 70 and the conductive member 40 or between the semiconductor element 70 and the cooler 30. Also good. Further, in the present embodiment, the semiconductor element 70 and the conductive member 40 or the semiconductor element 70 and the cooler 30 are joined by the grease 64 or the solder 65 as in the third embodiment. Also good.

また、本実施形態において、半導体素子７０は複数の半導体素子を有し、複数の半導体素子７０が導電性部材４０又は冷却器３０に近接してもよい。複数の半導体素子７０が導電性部材４０又は冷却器３０に近接する場合に、複数の半導体素子７０の位置は、第４実施形態における複数のコイル２１、２２の位置に対応させればよい。 In the present embodiment, the semiconductor element 70 may include a plurality of semiconductor elements, and the plurality of semiconductor elements 70 may be close to the conductive member 40 or the cooler 30. When the plurality of semiconductor elements 70 are close to the conductive member 40 or the cooler 30, the positions of the plurality of semiconductor elements 70 may correspond to the positions of the plurality of coils 21 and 22 in the fourth embodiment.

また本実施形態において、半導体素子７０は３つ以上の半導体素子を有し、３つ以上の半導体素子７０が導電性部材４０又は冷却器３０に近接してもよい。３つ以上の半導体素子７０が導電性部材４０又は冷却器３０に近接する場合に、３つ以上の半導体素子７０の位置は、第５実施形態における複数のコイル２３〜２５の位置に対応させればよい。 In the present embodiment, the semiconductor element 70 may include three or more semiconductor elements, and the three or more semiconductor elements 70 may be close to the conductive member 40 or the cooler 30. When three or more semiconductor elements 70 are close to the conductive member 40 or the cooler 30, the positions of the three or more semiconductor elements 70 are made to correspond to the positions of the plurality of coils 23 to 25 in the fifth embodiment. That's fine.

また本実施形態において、半導体素子７０が複数の半導体素子を有する場合に、複数の半導体素子７０は、所定の条件を満たすように、配置されてもよい。所定の条件は、第６実施形態のコイル２１、２２をそれぞれ半導体素子７０に置き換えた上で、式（８）で表される条件式である。ただし、合成容量（Ｃ_ａ１、Ｃ_ａ２）は、コイル２１、２２をそれぞれ半導体素子７０に置き換えたときの容量に相当し、インダクタンス（Ｌ_１、Ｌ_２）は、複数の半導体素子７０に接続される、それぞれの電流経路のインダクタンスである。 In the present embodiment, when the semiconductor element 70 includes a plurality of semiconductor elements, the plurality of semiconductor elements 70 may be arranged so as to satisfy a predetermined condition. The predetermined condition is a conditional expression represented by Expression (8) after replacing the coils 21 and 22 of the sixth embodiment with the semiconductor element 70 respectively. However, the combined capacitance (C _a1 , C _a2 ) corresponds to the capacitance when the coils 21 and 22 are replaced with the semiconductor elements 70, respectively, and the inductances (L ₁ , L ₂ ) are connected to the plurality of semiconductor elements 70. The inductance of each current path.

また本実施形態において、半導体素子７０が複数の半導体素子を有する場合に、複数の半導体素子７０は、合成容量（Ｃ_ａ３）と合成容量（Ｃ_ａ４）が等しくなるように、配置されてもよい。ただし、合成容量（Ｃ_ａ３、Ｃ_ａ４）は、第７実施形態において、コイル２１、２２をそれぞれ半導体素子７０に置き換えたときの容量に相当する。 In the present embodiment, when the semiconductor element 70 includes a plurality of semiconductor elements, the plurality of semiconductor elements 70 may be arranged such that the combined capacitance (C _a3 ) and the combined capacitance (C _a4 ) are equal. . However, the combined capacitance (C _a3 , C _a4 ) corresponds to a capacitance when the coils 21 and 22 are replaced with the semiconductor elements 70 in the seventh embodiment, respectively.

２０…コイル
２１〜２５コイル
３０…冷却器
３０ａ…冷却面
４０…導電性部材
５０…筐体
６１…誘電体
６２…樹脂
６３…絶縁基板
６４…グリース
６５…ハンダ
７０…半導体素子
１００…電源装置 DESCRIPTION OF SYMBOLS 20 ... Coil 21-25 Coil 30 ... Cooler 30a ... Cooling surface 40 ... Conductive member 50 ... Case 61 ... Dielectric 62 ... Resin 63 ... Insulating substrate 64 ... Grease 65 ... Solder 70 ... Semiconductor element 100 ... Power supply device

Claims

Coils,
A cooler having electrical conductivity and cooling the coil;
A conductive member that is electrically connected to the cooler and shields noise generated in the coil;
Having conductivity, the coil, the cooler, and a housing that houses the conductive member;
The cooler is arranged in a DC-insulated state with the casing;
The said coil is a power supply device which adjoins at least any one member of the said cooler or the said electroconductive member rather than the said housing | casing .

The first stray capacitance generated between the cooler or the conductive member adjacent to the coil and the coil is larger than a second stray capacitance generated between the coil and the housing. Power supply.

The power supply device according to claim 1, further comprising a dielectric disposed between the cooler or the conductive member adjacent to the coil and the coil.

The power supply device according to claim 1, further comprising a resin disposed between the cooler or the conductive member adjacent to the coil and the coil.

The power supply device according to claim 1 or 2, wherein the cooler or the conductive member adjacent to the coil and the coil are joined via grease.

The power supply device according to claim 1 or 2, wherein the cooler or the conductive member adjacent to the coil and the coil are joined via solder.

The coil has a plurality of coils;
The power supply device according to any one of claims 1 to 6, wherein the cooler or the conductive member is disposed in proximity between the plurality of coils.

The coil has a first coil and a second coil;
A first combined capacitance (C ₁ ), a second combined capacitance (C ₂ ), a first inductance (L ₁ ) of a current path connected to the first coil, and a current path connected to the second coil second inductance (L ₂₎ power supply device according to any one of claims 1 to 7, satisfying the following formula (1).

However, the first combined capacity is
The stray capacitance generated between the cooler or the conductive member adjacent to the first coil and the first coil, the stray capacitance generated between the first coil and the housing, and the cooling Is a capacity obtained by synthesizing stray capacitance generated between the container or the conductive member and the housing,
The second combined capacity is
The stray capacitance generated between the cooler or the conductive member adjacent to the second coil and the second coil, the stray capacitance generated between the second coil and the housing, and the cooling Or a capacitance obtained by combining the stray capacitance generated between the conductive member and the housing.

The coil has a first coil and a second coil;
The third combined capacity and the fourth combined capacity are equal,
The third combined capacity is
The stray capacitance generated between the cooler or the conductive member adjacent to the first coil and the first coil, the stray capacitance generated between the first coil and the housing, and the cooling Or a capacity obtained by synthesizing the conductive member and the housing,
The fourth combined capacity is
The stray capacitance generated between the cooler or the conductive member adjacent to the second coil and the second coil, the stray capacitance generated between the second coil and the housing, and the cooling The power supply device according to any one of claims 1 to 7, which is a capacity obtained by synthesizing stray capacitance generated between a container or the conductive member and the housing.

Comprising a semiconductor element housed in the housing;
The power supply device according to any one of claims 1 to 9, wherein the semiconductor element is closer to at least one member of the cooler and the conductive member than the casing .

A third stray capacitance generated between the semiconductor element and the cooler or the conductive member adjacent to the semiconductor element is larger than a fourth stray capacitance generated between the semiconductor element and the housing. Item 11. The power supply device according to Item 10.

The power supply device according to claim 10 or 11, further comprising a dielectric disposed between the semiconductor element and the cooler or the conductive member adjacent to the semiconductor element.

The power supply device according to claim 10 or 11, comprising a resin disposed between the semiconductor element and the cooler or the conductive member adjacent to the semiconductor element.

The power supply device according to claim 10 or 11, wherein the cooler or the conductive member adjacent to the semiconductor element and the semiconductor element are bonded via grease.

The power supply device according to claim 10 or 11, wherein the cooler or the conductive member adjacent to the semiconductor element and the semiconductor element are joined via solder.

The semiconductor element has a plurality of semiconductor elements,
The power supply device according to any one of claims 10 to 15, wherein the cooler or the conductive member is disposed close to the plurality of semiconductor elements.

The semiconductor element includes a first semiconductor element and a second semiconductor element,
A fifth combined capacitor (C ₅ ), a sixth combined capacitor (C ₆ ), a third inductance (L ₃ ) of a current path connected to the first semiconductor element, and a current connected to the second semiconductor element fourth inductance _{(L 4)} is a power supply device according to any one of claims 10 to 15 which satisfies the following formula (2) paths.

However, the fifth combined capacity is
A stray capacitance generated between the cooler or the conductive member adjacent to the first semiconductor element and the first semiconductor element, a stray capacitance generated between the first semiconductor element and the housing, and , A capacity obtained by synthesizing the stray capacitance generated between the cooler or the conductive member and the housing,
The sixth combined capacity is
A stray capacitance generated between the cooler or the conductive member adjacent to the second semiconductor element and the second semiconductor element, a stray capacitance generated between the second semiconductor element and the housing, and , A capacity obtained by synthesizing stray capacitance generated between the cooler or the conductive member and the housing.

The semiconductor element includes a first semiconductor element and a second semiconductor element,
The seventh composite capacity and the eighth composite capacity are equal,
The seventh combined capacity is
A stray capacitance generated between the cooler or the conductive member adjacent to the first semiconductor element and the first semiconductor element and a stray capacitance generated between the first semiconductor element and the housing are combined. And the stray capacitance generated between the cooler or the conductive member and the housing,
The eighth combined capacity is
A stray capacitance generated between the cooler or the conductive member adjacent to the second semiconductor element and the second semiconductor element, a stray capacitance generated between the second semiconductor element and the housing, and The power supply apparatus according to any one of claims 10 to 15, which is a capacity obtained by combining stray capacitance generated between the cooler or the conductive member and the housing.