JP5105597B2 - LED mounting device - Google Patents

LED mounting device Download PDF

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JP5105597B2
JP5105597B2 JP2007285381A JP2007285381A JP5105597B2 JP 5105597 B2 JP5105597 B2 JP 5105597B2 JP 2007285381 A JP2007285381 A JP 2007285381A JP 2007285381 A JP2007285381 A JP 2007285381A JP 5105597 B2 JP5105597 B2 JP 5105597B2
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led
conductive
radiator
heat
lead wire
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JP2009117417A (en
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功 沖田
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Lossev Technology Corp
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Lossev Technology Corp
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Description

本発明は、１または２以上のＬＥＤを放熱可能な状態で取付ける装置に関する。 The present invention relates to an apparatus for mounting one or more LEDs in a heat dissipative state.

光源としてのＬＥＤ、特に高輝度ＬＥＤは、点灯中に自己発熱をともなうが、その熱は、発光効率や発光素子の寿命に悪影響を及ぼす。このため、ＬＥＤ取付けにあたって放熱手段が必要となる。 An LED as a light source, particularly a high-intensity LED, is accompanied by self-heating during lighting, but the heat adversely affects the light emission efficiency and the life of the light emitting element. For this reason, a heat dissipating means is required for mounting the LED.

従来、高輝度ＬＥＤの放熱は、ＬＥＤのモールド樹脂を介して、ＬＥＤの取付け面、例えばプリント基板の面や金属製の放熱板の面に伝達することによって行われている。その放熱手段によると、モールド樹脂の熱伝導率が低いため、放熱効率は悪い。 Conventionally, heat radiation of a high-brightness LED is performed by transmitting it to the LED mounting surface, for example, the surface of a printed circuit board or the surface of a metal heat dissipation plate via an LED mold resin. According to the heat dissipation means, the heat dissipation efficiency is poor because the thermal conductivity of the mold resin is low.

また、ＬＥＤがプリント基板の導電パターンに対してリード線によりはんだ付けされているとき、導電パターンの面積を拡大することによって、放熱を促進する手段もあるが、導電パターンの熱容量が小さいため、その放熱に限界があった。 In addition, when the LED is soldered to the conductive pattern of the printed circuit board with a lead wire, there is a means for promoting heat dissipation by enlarging the area of the conductive pattern, but since the heat capacity of the conductive pattern is small, There was a limit to heat dissipation.

一方、特許文献１に開示されているように、ＬＥＤ素子自体が放熱可能な基板に組み立てられておれば、その放熱対策は、設計的に必要な範囲に設定できる。しかし、その対策はＬＥＤ素子の製造段階でしかできないため、一般のユーザ側において市販の一般的なＬＥＤの利用・組み込み段階において当該ＬＥＤに対して行える放熱手段となりえない。
特開２００７−１５８２４２公報 On the other hand, as disclosed in Patent Document 1, if the LED element itself is assembled on a heat dissipating substrate, the heat dissipation countermeasure can be set within a design-required range. However, since the countermeasure can be taken only at the manufacturing stage of the LED element, it cannot be a heat radiating means that can be applied to the LED at a general user use / incorporation stage of a general LED.
JP 2007-158242 A

したがって、発明の課題は、一般的なＬＥＤの利用段階で、ＬＥＤを放熱体に取付け、ＬＥＤの発熱を放熱体から効率よく放散することである。 Accordingly, an object of the invention is to attach an LED to a heat radiating body and efficiently dissipate the heat generated by the LED from the heat radiating body in a general LED use stage.

上記の課題のもとに、本発明は、ＬＥＤ取付け装置（１）において、導電性の放熱体（２）の取付け面（３）に、ＬＥＤ（４）のモールドケース（９）の平坦面を密着させて、導電性の放熱体（２）の取付け面（３）に、複数のＬＥＤ（４）を取付け、ＬＥＤ（４）の一方のリード線（５）を導電性の放熱体（２）に溶接により直接接続するとともに、ＬＥＤ（４）の他方のリード線（６）をプリント基板（７）の点灯回路（８）に接続し、導電性の放熱体（２）を点灯回路（８）のコモンとして、複数のＬＥＤ（４）に共通の導電回路を構成するようにしている。 Based on the above problems, the present invention provides an LED mounting device (1) in which the flat surface of the mold case (9) of the LED (4) is attached to the mounting surface (3) of the conductive radiator (2). A plurality of LEDs (4) are mounted on the mounting surface (3) of the conductive radiator (2) in close contact, and one lead wire (5) of the LED (4) is connected to the conductive radiator (2). The other lead wire (6) of the LED (4) is connected to the lighting circuit (8) of the printed circuit board (7), and the conductive radiator (2) is connected to the lighting circuit (8). As a common, a common conductive circuit is configured for the plurality of LEDs (4) .

上記のように、ＬＥＤ（４）のモールドケース（９）は、その平坦面を導電性の放熱体（２）の取付け面（３）に密着させて、取付け面（３）に取付けられる。導電性の放熱体（２）は、を点灯回路（８）のコモンとして、複数のＬＥＤ（４）に共通の導電回路を構成する。 As described above, LED (4) mold case (9), the to the flat surface in close contact with the mounting surface (3) of the conductive heat dissipation member (2), Ru mounted on a mounting surface (3). The conductive heat radiating body (2) constitutes a common conductive circuit for the plurality of LEDs (4), with the common for the lighting circuit (8).

本発明では、次の効果が得られる。ＬＥＤ（４）の熱が一方のリード線（５）を経由して熱容量の大きな放熱体（２）に伝導し、放熱体（２）から効率よく放散するから、ＬＥＤ（４）の放熱効率がよく、ＬＥＤ（４）の長寿命が可能となり、発光特性も長期にわたって安定となる。ＬＥＤ（４）の一方のリード線（５）が導電性の放熱体（２）に直接接続されるから、導電性の放熱体（２）リード線（５）の溶接（ろう接法・レーザ接合）が放熱体（２）の面で簡単に行え、複数のＬＥＤ（４）のリード線（５）の溶接作業も容易となる。 In the present invention, the following effects can be obtained. The heat of the LED (4) is conducted to the heat radiating body (2) having a large heat capacity via the one lead wire (5) and efficiently dissipated from the heat radiating body (2). Well, the LED (4) can have a long life and the light emission characteristics are stable over a long period of time. Since one lead wire (5) of the LED (4) is directly connected to the conductive radiator (2), welding of the conductive radiator (2) lead wire (5) (brazing method / laser bonding) ) Can be easily performed on the surface of the heat dissipating body (2), and the welding work of the lead wires (5) of the plurality of LEDs (4) is also facilitated.

ＬＥＤ（４）のモールドケース（９）が放熱体（２）の取付け面（３）に密着状態で取付けられていると、モールドケース（９）からも放熱体（２）に放熱できるから、放熱効果が上がる。また、ＬＥＤ（４）の取付け工程において、一方のリード線（５）は、導電性の放熱体（２）に直接接続されるから、導電性の放熱体（２）とリード線（５）との溶接が放熱体（２）の面で簡単に行え、複数のＬＥＤ（４）のリード線（５）の溶接作業も容易となる。 If the mold case (9) of the LED (4) is attached in close contact with the mounting surface (3) of the radiator (2), heat can be dissipated from the mold case (9) to the radiator (2). The effect goes up. In addition, in the LED (4) mounting step, one lead wire (5) is directly connected to the conductive radiator (2), so the conductive radiator (2) and the lead wire (5) Can be easily performed on the surface of the radiator (2), and the welding work of the lead wires (5) of the plurality of LEDs (4) is also facilitated.

図１および図２は、本発明に係るＬＥＤ取付け装置１を示す。ＬＥＤ取付け装置１は、１または２以上のＬＥＤ４を取付けるために、導電性の放熱体２と、ＬＥＤ４の点灯制御のために、プリント基板７の上で点灯回路８を有している。１または２以上のＬＥＤ４は、導電性の放熱体２の取付け面３に、ＬＥＤ４の一方のリード線５を放熱体２の上面に直接溶接により固定され、電気的に接続されており、またＬＥＤ４の他方のリード線６をプリント基板７の点灯回路８の導電パターン１３に溶接により電気的に接続される。 1 and 2 show an LED mounting device 1 according to the present invention. The LED mounting device 1 includes a conductive heat dissipating body 2 for mounting one or more LEDs 4 and a lighting circuit 8 on a printed circuit board 7 for controlling the lighting of the LEDs 4. One or two or more LEDs 4 are electrically connected to the mounting surface 3 of the conductive radiator 2 by directly welding one lead wire 5 of the LED 4 to the upper surface of the radiator 2. The other lead wire 6 is electrically connected to the conductive pattern 13 of the lighting circuit 8 of the printed circuit board 7 by welding.

導電性の放熱体２は、放熱特性の観点から、熱伝導率の良好で熱容量の大きな金属材料としてアルミニウムまたは銅製のブロック体により構成されており、その平坦て面で取付け面３を形成し、他の部分例えば下面などの面に多数の放熱用のフイン１１を一体的に形成している。 The conductive heat dissipating body 2 is composed of a block body made of aluminum or copper as a metal material having a good heat conductivity and a large heat capacity from the viewpoint of heat dissipating characteristics, and the mounting surface 3 is formed by a flat surface thereof. A large number of fins 11 for heat dissipation are integrally formed on other portions such as a lower surface.

ＬＥＤ４は、放熱のために、ＬＥＤ４のモールドケース９の底面を放熱体２の取付け面３に密着させて取付けられ、レンズ１２を発光方向に向けている。 The LED 4 is mounted with the bottom surface of the mold case 9 of the LED 4 in close contact with the mounting surface 3 of the radiator 2 for heat dissipation, and the lens 12 faces the light emitting direction.

放熱体２がアルミニウム製のとき、ＬＥＤ４の一方のリード線５は、放熱体２の取付け面３に、レーザ溶接、または高周波溶接などの手段により直接固定され、電気的に接続される。また、放熱体２が銅製のとき、ＬＥＤ４の一方のリード線５は、放熱体２の取付け面３に、はんだ付けなどのろう付け手段により直接固定され、電気的に接続される。このようにして、放熱体２は、導電機能によって、点灯回路８のコモンとして、複数のＬＥＤ４に共通の導電回路を構成する。 When the radiator 2 is made of aluminum, one lead wire 5 of the LED 4 is directly fixed and electrically connected to the mounting surface 3 of the radiator 2 by means such as laser welding or high-frequency welding. When the radiator 2 is made of copper, one lead wire 5 of the LED 4 is directly fixed and electrically connected to the mounting surface 3 of the radiator 2 by brazing means such as soldering. In this way, the radiator 2 constitutes a conductive circuit common to the plurality of LEDs 4 as a common of the lighting circuit 8 by a conductive function.

ＬＥＤ４の取付け工程において、一方のリード線５は、導電性の放熱体２に直接接続されるから、導電性の放熱体２とリード線５との溶接（ろう接法・レーザ接合）が放熱体２の面で簡単に行え、複数のＬＥＤ４のリード線５の溶接作業も容易となる。ＬＥＤ４の他方のリード線６は、点灯回路８の導電パターン１３の所定の位置にはんだ付けなどの固着手段により電気的に接続される。 In the LED 4 mounting process, one lead wire 5 is directly connected to the conductive heat radiating body 2, so welding (brazing method / laser bonding) between the conductive heat radiating body 2 and the lead wire 5 is performed by the heat radiating body. 2 can be easily performed, and the welding work of the lead wires 5 of the plurality of LEDs 4 is also facilitated. The other lead wire 6 of the LED 4 is electrically connected to a predetermined position of the conductive pattern 13 of the lighting circuit 8 by fixing means such as soldering.

プリント基板７は、ユニット化のために、放熱体２に取付けられ、それと一体となっている。このユニット化のために、放熱体２は、例えば取付け面３にプリント基板７の輪郭と同じ大きさの収納用の溝１０を一体的に形成しており、プリント基板７は、収納用の溝１０の内に納められ、はめ込みなどの固定手段により溝１０の内部に取付けられる。この取付け状態で、プリント基板７の点灯回路８のコモン側端子（図示せず）は、共通の導電回路となっている導電性の放熱体２にはんだ付けや圧接などの手段により電気的に接続される。 The printed circuit board 7 is attached to and integrated with the radiator 2 for unitization. For this unitization, the radiator 2 is integrally formed with, for example, a storage groove 10 having the same size as the outline of the printed circuit board 7 on the mounting surface 3. 10 and is attached to the inside of the groove 10 by fixing means such as fitting. In this mounted state, the common side terminal (not shown) of the lighting circuit 8 of the printed circuit board 7 is electrically connected to the conductive heat radiating body 2 which is a common conductive circuit by means such as soldering or pressure contact. Is done.

点灯回路８は、複数の電気素子１４とこれらを接続する導電パターン１３によって構成されており、図示しない電源回路や点灯条件の判別回路に接続され、１または２以上のＬＥＤ４について点灯条件を判別し、点灯条件の成立時に、対応のＬＥＤ４を所望の点灯態様で点灯させ、レンズ１２から発光させる。 The lighting circuit 8 includes a plurality of electric elements 14 and a conductive pattern 13 that connects them, and is connected to a power supply circuit (not shown) or a lighting condition determination circuit, and determines the lighting conditions for one or more LEDs 4. When the lighting condition is satisfied, the corresponding LED 4 is turned on in a desired lighting mode, and light is emitted from the lens 12.

ＬＥＤ４の点灯時に、自己発熱によって、ＬＥＤ４に熱が発生するが、この熱は、一方のリード線５を経由して、熱容量の大きな放熱体２に伝導され、放熱体２に蓄熱され、同時に表面効率よく放散される。放熱体２に多数の放熱用のフイン１１があると、放熱体２の放熱面積が増加するから、一層、放熱効果が上がって、有利である。このように、ＬＥＤ４の放熱効率がよく、ＬＥＤ４の長寿命が可能となり、発光特性も長期にわたって安定となる。ＬＥＤ４のモールドケース９が放熱体２の取付け面３に密着状態で取付けられていると、モールドケース９からも放熱体２に放熱できるから、放熱効果が一層上がる。 When the LED 4 is turned on, heat is generated in the LED 4 due to self-heating, but this heat is conducted to the heat radiating body 2 having a large heat capacity via one lead wire 5, and is stored in the heat radiating body 2, and at the same time Efficiently dissipates. If there are a large number of fins 11 for heat dissipation in the heat dissipating body 2, the heat dissipating area of the heat dissipating body 2 is increased. Thus, the heat dissipation efficiency of the LED 4 is good, the LED 4 can have a long life, and the light emission characteristics are stable over a long period of time. If the mold case 9 of the LED 4 is attached in close contact with the attachment surface 3 of the radiator 2, heat can be radiated from the mold case 9 to the radiator 2.

本発明は、あらゆる形式のＬＥＤに適用でき、ＬＥＤ４を光源とする各種の用途の装置に利用できる。また、プリント基板７およびその点灯回路８は、ＬＥＤ取付け装置１に付属する基板および回路であるが、他の装置のプリント基板およびそのプリント基板の回路に組み込むこともできる。 The present invention can be applied to all types of LEDs, and can be used for various types of apparatuses using the LED 4 as a light source. The printed circuit board 7 and its lighting circuit 8 are a circuit board and a circuit attached to the LED mounting device 1, but can be incorporated into a printed circuit board of another device and a circuit of the printed circuit board.

本発明に係るＬＥＤ取付け装置１の平面図である。It is a top view of LED mounting device 1 concerning the present invention. 本発明に係るＬＥＤ取付け装置１の側面図である。It is a side view of LED mounting device 1 concerning the present invention.

１ ＬＥＤ取付け装置
２ 放熱体
３ 取付け面
４ ＬＥＤ
５ リード線
６ リード線
７ プリント基板
８ 点灯回路
９ モールドケース
１０ 収納用の溝
１１ フイン
１２ レンズ
１３ 導電パターン
１４ 電気素子 1 LED mounting device 2 radiator 3 mounting surface 4 LED
5 Lead wire 6 Lead wire 7 Printed circuit board 8 Lighting circuit 9 Mold case 10 Groove for housing 11 Fin 12 Lens 13 Conductive pattern 14 Electrical element

Claims (1)

導電性の放熱体（２）の取付け面（３）に、ＬＥＤ（４）のモールドケース（９）の平坦面を密着させて、導電性の放熱体（２）の取付け面（３）に、複数のＬＥＤ（４）を取付け、ＬＥＤ（４）の一方のリード線（５）を導電性の放熱体（２）に溶接により直接接続するとともに、ＬＥＤ（４）の他方のリード線（６）をプリント基板（７）の点灯回路（８）に接続し、導電性の放熱体（２）を点灯回路（８）のコモンとして、複数のＬＥＤ（４）に共通の導電回路を構成する、ことを特徴とするＬＥＤ取付け装置（１）。 The flat surface of the mold case (9) of the LED (4) is brought into close contact with the mounting surface (3) of the conductive radiator (2), and the mounting surface (3) of the conductive radiator (2) A plurality of LEDs (4) are mounted, and one lead wire (5) of the LED (4) is directly connected to the conductive heat radiating body (2) by welding, and the other lead wire (6) of the LED (4). Is connected to the lighting circuit (8) of the printed circuit board (7), and the conductive radiator (2) is used as the common of the lighting circuit (8) to form a common conductive circuit for the plurality of LEDs (4). LED mounting device (1) characterized by the above.
JP2007285381A 2007-11-01 2007-11-01 LED mounting device Expired - Fee Related JP5105597B2 (en)

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JP5531209B2 (en) * 2009-03-02 2014-06-25 株式会社オプトデザイン LED substrate, LED lighting unit and LED lighting device
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