JP4954515B2 - 表示装置の作製方法 - Google Patents
表示装置の作製方法 Download PDFInfo
- Publication number
- JP4954515B2 JP4954515B2 JP2005257447A JP2005257447A JP4954515B2 JP 4954515 B2 JP4954515 B2 JP 4954515B2 JP 2005257447 A JP2005257447 A JP 2005257447A JP 2005257447 A JP2005257447 A JP 2005257447A JP 4954515 B2 JP4954515 B2 JP 4954515B2
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- Prior art keywords
- insulating film
- film
- sheet material
- substrate
- display device
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Images
Classifications
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
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| US7968382B2 (en) * | 2007-02-02 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| KR101538281B1 (ko) | 2007-04-13 | 2015-07-22 | 가부시키가이샤 니콘 | 표시 소자의 제조 방법과 제조 장치 |
| KR101004849B1 (ko) | 2008-09-02 | 2010-12-28 | 삼성전기주식회사 | 박막소자 제조방법 |
| KR20100027526A (ko) * | 2008-09-02 | 2010-03-11 | 삼성전기주식회사 | 박막 소자 제조방법 |
| JP2010153813A (ja) | 2008-11-18 | 2010-07-08 | Semiconductor Energy Lab Co Ltd | 発光装置及びその作製方法、並びに、携帯電話機 |
| CN102859728A (zh) * | 2010-04-27 | 2013-01-02 | 信越化学工业株式会社 | 发光装置及发光装置的制造方法 |
| JP6314835B2 (ja) * | 2012-12-21 | 2018-04-25 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンスパネルの製造方法及び製造装置 |
| CN104885567B (zh) * | 2012-12-21 | 2016-12-14 | 柯尼卡美能达株式会社 | 有机电致发光面板及其制造方法和制造装置 |
| KR102309244B1 (ko) | 2013-02-20 | 2021-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101462586B1 (ko) * | 2014-05-22 | 2014-11-19 | 주식회사 코엠에스 | 수직형 양면 롤 타입 반도체용 필름 동시 박리 장치 및 박리 방법 |
| JP2016021560A (ja) * | 2014-06-20 | 2016-02-04 | 株式会社半導体エネルギー研究所 | 剥離装置 |
| CN107409447A (zh) * | 2015-03-20 | 2017-11-28 | 味之素株式会社 | 封装体的制造方法 |
| JP7105543B2 (ja) * | 2017-05-26 | 2022-07-25 | エルジー ディスプレイ カンパニー リミテッド | 有機表示素子 |
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| JPH05313151A (ja) * | 1992-05-08 | 1993-11-26 | Idemitsu Kosan Co Ltd | 液晶素子の製造方法 |
| JP2004140380A (ja) * | 1996-08-27 | 2004-05-13 | Seiko Epson Corp | 薄膜デバイスの転写方法、及びデバイスの製造方法 |
| JP4748859B2 (ja) * | 2000-01-17 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
| JP4765170B2 (ja) * | 2001-01-24 | 2011-09-07 | ソニー株式会社 | 表示装置の製造方法 |
| JP4244120B2 (ja) * | 2001-06-20 | 2009-03-25 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
| JP2003142666A (ja) * | 2001-07-24 | 2003-05-16 | Seiko Epson Corp | 素子の転写方法、素子の製造方法、集積回路、回路基板、電気光学装置、icカード、及び電子機器 |
| KR100944886B1 (ko) * | 2001-10-30 | 2010-03-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제조 방법 |
| JP2004047691A (ja) * | 2002-07-11 | 2004-02-12 | Seiko Epson Corp | 半導体装置の製造方法、電気光学装置、及び電子機器 |
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