JP4949843B2 - 荷電粒子ビームレット露光システム - Google Patents

荷電粒子ビームレット露光システム Download PDF

Info

Publication number
JP4949843B2
JP4949843B2 JP2006532135A JP2006532135A JP4949843B2 JP 4949843 B2 JP4949843 B2 JP 4949843B2 JP 2006532135 A JP2006532135 A JP 2006532135A JP 2006532135 A JP2006532135 A JP 2006532135A JP 4949843 B2 JP4949843 B2 JP 4949843B2
Authority
JP
Japan
Prior art keywords
charged particle
aperture
beamlet
particle beam
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006532135A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007500948A5 (https=
JP2007500948A (ja
Inventor
ウィーランド、マルコ・ジャン−ジャコ
クルイト、ピーター
Original Assignee
マッパー・リソグラフィー・アイピー・ビー.ブイ.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by マッパー・リソグラフィー・アイピー・ビー.ブイ. filed Critical マッパー・リソグラフィー・アイピー・ビー.ブイ.
Publication of JP2007500948A publication Critical patent/JP2007500948A/ja
Publication of JP2007500948A5 publication Critical patent/JP2007500948A5/ja
Application granted granted Critical
Publication of JP4949843B2 publication Critical patent/JP4949843B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041Photolithographic processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002Details
    • H01J37/3007Electron or ion-optical systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/045Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177Multi-beam, e.g. fly's eye, comb probe
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/043Beam blanking
    • H01J2237/0435Multi-aperture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/045Diaphragms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/045Diaphragms
    • H01J2237/0451Diaphragms with fixed aperture
    • H01J2237/0453Diaphragms with fixed aperture multiple apertures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/049Focusing means
    • H01J2237/0492Lens systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15Means for deflecting or directing discharge
    • H01J2237/1501Beam alignment means or procedures

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2006532135A 2003-05-28 2004-05-27 荷電粒子ビームレット露光システム Expired - Fee Related JP4949843B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US47381003P 2003-05-28 2003-05-28
US60/473,810 2003-05-28
PCT/NL2004/000381 WO2004107050A2 (en) 2003-05-28 2004-05-27 Charged particle beamlet exposure system

Publications (3)

Publication Number Publication Date
JP2007500948A JP2007500948A (ja) 2007-01-18
JP2007500948A5 JP2007500948A5 (https=) 2007-07-12
JP4949843B2 true JP4949843B2 (ja) 2012-06-13

Family

ID=33490650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006532135A Expired - Fee Related JP4949843B2 (ja) 2003-05-28 2004-05-27 荷電粒子ビームレット露光システム

Country Status (8)

Country Link
US (1) US7084414B2 (https=)
EP (2) EP1627412B1 (https=)
JP (1) JP4949843B2 (https=)
KR (2) KR101175523B1 (https=)
CN (1) CN100543920C (https=)
AT (2) ATE524822T1 (https=)
DE (1) DE602004005704T2 (https=)
WO (1) WO2004107050A2 (https=)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7462848B2 (en) * 2003-10-07 2008-12-09 Multibeam Systems, Inc. Optics for generation of high current density patterned charged particle beams
US7928404B2 (en) * 2003-10-07 2011-04-19 Multibeam Corporation Variable-ratio double-deflection beam blanker
US20090008579A1 (en) * 2003-10-07 2009-01-08 Tokyo Electron Limited Electron beam lithography apparatus and design method of patterned beam-defining aperture
CN102005358B (zh) * 2004-05-17 2012-09-12 迈普尔平版印刷Ip有限公司 带电粒子束曝光系统
EP1842103A2 (en) * 2005-01-14 2007-10-10 Arradiance, Inc. Synchronous raster scanning lithographic system
NL1029132C2 (nl) * 2005-05-26 2006-11-28 Univ Delft Tech Inrichting voor het opwekken van evenwijdige stralenbundeldelen.
US8597089B2 (en) * 2005-07-08 2013-12-03 Praxair Technology, Inc. System and method for treating live cargo such as poultry with gas
JP5663717B2 (ja) * 2005-09-06 2015-02-04 カール ツァイス マイクロスコピー ゲーエムベーハーCarl Zeiss Microscopy Gmbh 荷電粒子システム
EP2005460A4 (en) * 2006-03-27 2010-11-24 Multibeam Systems Inc OPTICAL FOR GENERATING CHARGED PARTICLE DATA BEAMS HAVING HIGH CURRENT DENSITY
EP2002458B1 (en) * 2006-04-03 2009-11-04 IMS Nanofabrication AG Particle-beam exposure apparatus with overall-modulation of a patterned beam
US8134135B2 (en) * 2006-07-25 2012-03-13 Mapper Lithography Ip B.V. Multiple beam charged particle optical system
US7569834B1 (en) 2006-10-18 2009-08-04 Kla-Tencor Technologies Corporation High resolution charged particle projection lens array using magnetic elements
EP2019415B1 (en) * 2007-07-24 2016-05-11 IMS Nanofabrication AG Multi-beam source
US8445869B2 (en) 2008-04-15 2013-05-21 Mapper Lithography Ip B.V. Projection lens arrangement
US8890094B2 (en) 2008-02-26 2014-11-18 Mapper Lithography Ip B.V. Projection lens arrangement
JP5268170B2 (ja) * 2008-04-15 2013-08-21 マッパー・リソグラフィー・アイピー・ビー.ブイ. 投影レンズ構成体
US7851774B2 (en) * 2008-04-25 2010-12-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for direct writing to a wafer
WO2009141428A1 (en) * 2008-05-23 2009-11-26 Mapper Lithography Ip B.V. Imaging system
EP2128885A1 (en) * 2008-05-26 2009-12-02 FEI Company Charged particle source with integrated energy filter
EP2399273B1 (en) 2009-02-22 2017-06-28 Mapper Lithography IP B.V. Charged particle lithography apparatus and method of generating vacuum in a vacuum chamber
US20110049393A1 (en) 2009-02-22 2011-03-03 Mapper Lithography Ip B.V. Lithography Machine and Substrate Handling Arrangement
KR101553802B1 (ko) 2009-02-22 2015-09-17 마퍼 리쏘그라피 아이피 비.브이. 진공 챔버에서 진공을 실현하기 위한 장치 및 방법
CN102422380A (zh) * 2009-02-22 2012-04-18 迈普尔平版印刷Ip有限公司 带电粒子微影设备及真空腔室中产生真空的方法
WO2010134018A2 (en) 2009-05-20 2010-11-25 Mapper Lithography Ip B.V. Pattern data conversion for lithography system
KR101757837B1 (ko) 2009-05-20 2017-07-26 마퍼 리쏘그라피 아이피 비.브이. 듀얼 패스 스캐닝
EP2433294B1 (en) * 2009-05-20 2016-07-27 Mapper Lithography IP B.V. Method of generating a two-level pattern for lithographic processing and pattern generator using the same
NL2005584C2 (en) 2009-10-26 2014-09-04 Mapper Lithography Ip Bv Charged particle multi-beamlet lithography system with modulation device.
US8952342B2 (en) 2009-12-17 2015-02-10 Mapper Lithography Ip B.V. Support and positioning structure, semiconductor equipment system and method for positioning
WO2012055936A1 (en) 2010-10-26 2012-05-03 Mapper Lithography Ip B.V. Lithography system, modulation device and method of manufacturing a fiber fixation substrate
US9305747B2 (en) 2010-11-13 2016-04-05 Mapper Lithography Ip B.V. Data path for lithography apparatus
KR101755577B1 (ko) 2010-11-13 2017-07-07 마퍼 리쏘그라피 아이피 비.브이. 애퍼처 어레이 냉각장치를 갖춘 하전 입자 리소그래피 시스템
US8586949B2 (en) 2010-11-13 2013-11-19 Mapper Lithography Ip B.V. Charged particle lithography system with intermediate chamber
US8884255B2 (en) 2010-11-13 2014-11-11 Mapper Lithography Ip B.V. Data path for lithography apparatus
WO2012062934A1 (en) 2010-11-13 2012-05-18 Mapper Lithography Ip B.V. Charged particle beam modulator
EP2681624B1 (en) 2010-12-14 2016-07-20 Mapper Lithography IP B.V. Lithography system and method of processing substrates in such a lithography system
EP2676168B1 (en) 2011-02-16 2018-09-12 Mapper Lithography IP B.V. System for magnetic shielding
JP5951753B2 (ja) 2011-04-22 2016-07-13 マッパー・リソグラフィー・アイピー・ビー.ブイ. リソグラフィ機のクラスタのためのネットワークアーキテクチャおよびプロトコル
TWI514089B (zh) 2011-04-28 2015-12-21 瑪波微影Ip公司 在微影系統中用於轉移基板的設備
US9703213B2 (en) * 2011-09-12 2017-07-11 Mapper Lithography Ip B.V. Substrate processing apparatus
TW201330705A (zh) 2011-09-28 2013-07-16 Mapper Lithography Ip Bv 電漿產生器
CN104272427B (zh) * 2012-03-08 2017-05-17 迈普尔平版印刷Ip有限公司 具有对准传感器和射束测量传感器的带电粒子光刻系统
CN106933063B (zh) 2012-03-20 2019-01-18 迈普尔平版印刷Ip有限公司 电子射束光刻系统
US11348756B2 (en) 2012-05-14 2022-05-31 Asml Netherlands B.V. Aberration correction in charged particle system
NL2010759C2 (en) 2012-05-14 2015-08-25 Mapper Lithography Ip Bv Modulation device and power supply arrangement.
KR101945964B1 (ko) 2012-05-14 2019-02-11 마퍼 리쏘그라피 아이피 비.브이. 하전 입자 다중-빔렛 리소그래피 시스템 및 냉각 장치 제조 방법
CN104428866A (zh) 2012-05-14 2015-03-18 迈普尔平版印刷Ip有限公司 带电粒子光刻系统和射束产生器
US10586625B2 (en) 2012-05-14 2020-03-10 Asml Netherlands B.V. Vacuum chamber arrangement for charged particle beam generator
NL2010760C2 (en) 2013-05-03 2014-11-04 Mapper Lithography Ip Bv Beam grid layout.
EP2816585A1 (en) * 2013-06-17 2014-12-24 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam system and method of operating thereof
WO2015024956A1 (en) 2013-08-23 2015-02-26 Mapper Lithography Ip B.V. Drying device for use in a lithography system
CN108962708A (zh) 2013-11-14 2018-12-07 迈普尔平版印刷Ip有限公司 电极堆栈布置
TWI661457B (zh) 2013-12-30 2019-06-01 荷蘭商Asml荷蘭公司 陰極配置、電子槍以及包含此電子槍的微影系統
KR20170084240A (ko) 2014-11-14 2017-07-19 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법
US9484188B2 (en) 2015-03-11 2016-11-01 Mapper Lithography Ip B.V. Individual beam pattern placement verification in multiple beam lithography
US10096450B2 (en) 2015-12-28 2018-10-09 Mapper Lithography Ip B.V. Control system and method for lithography apparatus
US9981293B2 (en) 2016-04-21 2018-05-29 Mapper Lithography Ip B.V. Method and system for the removal and/or avoidance of contamination in charged particle beam systems
KR102401179B1 (ko) * 2017-12-12 2022-05-24 삼성전자주식회사 전자빔 장치의 어퍼처 시스템, 전자빔 노광 장치 및 전자빔 노광 장치 시스템
CN111971774B (zh) * 2018-03-29 2023-09-29 株式会社日立高新技术 带电粒子束装置
WO2020030483A1 (en) 2018-08-09 2020-02-13 Asml Netherlands B.V. An apparatus for multiple charged-particle beams
NL2022156B1 (en) 2018-12-10 2020-07-02 Asml Netherlands Bv Plasma source control circuit
CN113228224A (zh) * 2018-12-31 2021-08-06 Asml荷兰有限公司 使用多个电子束进行实时立体成像的系统和方法
US11651934B2 (en) 2021-09-30 2023-05-16 Kla Corporation Systems and methods of creating multiple electron beams

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4243866A (en) * 1979-01-11 1981-01-06 International Business Machines Corporation Method and apparatus for forming a variable size electron beam
US4543512A (en) * 1980-10-15 1985-09-24 Tokyo Shibaura Denki Kabushiki Kaisha Electron beam exposure system
US4544847A (en) * 1983-07-28 1985-10-01 Varian Associates, Inc. Multi-gap magnetic imaging lens for charged particle beams
JPS6142132A (ja) * 1984-08-06 1986-02-28 Nippon Telegr & Teleph Corp <Ntt> 荷電ビ−ム露光装置
JPH097538A (ja) * 1995-06-26 1997-01-10 Nippon Telegr & Teleph Corp <Ntt> 荷電ビーム描画装置
JP3908294B2 (ja) * 1996-02-02 2007-04-25 富士通株式会社 電子ビームの電流量を削減する電子ビーム露光装置及び電子ビーム露光方法
US5912469A (en) * 1996-07-11 1999-06-15 Nikon Corporation Charged-particle-beam microlithography apparatus
JP3085454B2 (ja) * 1997-03-13 2000-09-11 日本電気株式会社 荷電粒子線露光方法
KR19990062942A (ko) 1997-12-10 1999-07-26 히로시 오우라 전하 입자 빔 노출 장치
US6014200A (en) * 1998-02-24 2000-01-11 Nikon Corporation High throughput electron beam lithography system
JP4578606B2 (ja) * 2000-02-09 2010-11-10 富士通セミコンダクター株式会社 荷電粒子ビーム描画装置及び荷電粒子ビームサイズの調整方法
US6651513B2 (en) 2000-04-27 2003-11-25 Endress + Hauser Flowtec Ag Vibration meter and method of measuring a viscosity of a fluid
JP4112791B2 (ja) * 2000-10-03 2008-07-02 株式会社アドバンテスト 電子ビーム補正方法及び電子ビーム露光装置
JP4601146B2 (ja) * 2000-10-03 2010-12-22 株式会社アドバンテスト 電子ビーム露光装置
JP2002217089A (ja) * 2001-01-18 2002-08-02 Advantest Corp 電子ビーム偏向装置、電子ビーム偏向装置の製造方法、及び電子ビーム露光装置
JP4647820B2 (ja) 2001-04-23 2011-03-09 キヤノン株式会社 荷電粒子線描画装置、および、デバイスの製造方法

Also Published As

Publication number Publication date
ATE524822T1 (de) 2011-09-15
CN100543920C (zh) 2009-09-23
US7084414B2 (en) 2006-08-01
JP2007500948A (ja) 2007-01-18
CN1795529A (zh) 2006-06-28
US20050161621A1 (en) 2005-07-28
WO2004107050A2 (en) 2004-12-09
ATE358885T1 (de) 2007-04-15
KR101175523B1 (ko) 2012-08-21
KR101168200B1 (ko) 2012-07-25
DE602004005704T2 (de) 2007-12-27
WO2004107050A3 (en) 2005-04-21
DE602004005704D1 (de) 2007-05-16
EP1830384A3 (en) 2007-09-19
EP1830384A2 (en) 2007-09-05
EP1627412A2 (en) 2006-02-22
KR20060036391A (ko) 2006-04-28
KR20120025629A (ko) 2012-03-15
EP1830384B1 (en) 2011-09-14
EP1627412B1 (en) 2007-04-04

Similar Documents

Publication Publication Date Title
JP4949843B2 (ja) 荷電粒子ビームレット露光システム
CN102105960B (zh) 成像系统
TWI534849B (zh) 投影透鏡配置
KR101068607B1 (ko) 복수 개의 빔렛 발생 장치
JP4995261B2 (ja) パターン化ビームの総合変調を持つ粒子ビーム露光装置
KR101119890B1 (ko) 전자 빔 노출 시스템
US5831270A (en) Magnetic deflectors and charged-particle-beam lithography systems incorporating same
CN102017053B (zh) 投影透镜装置
JP2011517130A5 (https=)
CN102687232A (zh) 调节装置及使用其的带电粒子多射束光刻系统
JP4843679B2 (ja) 荷電粒子ビーム曝露システム
US6157039A (en) Charged particle beam illumination of blanking aperture array
KR20010007211A (ko) 하전 입자 빔 결상 방법, 하전 입자 빔 결상 장치 및 하전입자 빔 노광 장치
KR102468349B1 (ko) 멀티 빔용 애퍼처 기판 세트 및 멀티 하전 입자 빔 장치
JP4181533B2 (ja) 電子ビーム描画装置
JP3983772B2 (ja) 荷電粒子ビーム応用装置
US6023067A (en) Blanking system for electron beam projection system
US20250323010A1 (en) Multi charged particle beam irradiation apparatus and adjusting method thereof
GB2369241A (en) Charged particle beam exposure device with aberration correction

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070528

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070528

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100311

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100316

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100616

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100623

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100916

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110315

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110614

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110621

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110913

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120207

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120308

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150316

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4949843

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees