KR101175523B1 - 대전 입자 빔렛 노광 시스템 - Google Patents

대전 입자 빔렛 노광 시스템 Download PDF

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Publication number
KR101175523B1
KR101175523B1 KR1020127003554A KR20127003554A KR101175523B1 KR 101175523 B1 KR101175523 B1 KR 101175523B1 KR 1020127003554 A KR1020127003554 A KR 1020127003554A KR 20127003554 A KR20127003554 A KR 20127003554A KR 101175523 B1 KR101175523 B1 KR 101175523B1
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KR
South Korea
Prior art keywords
charged particle
opening
beamlet
lens
array
Prior art date
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Expired - Lifetime
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KR1020127003554A
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English (en)
Korean (ko)
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KR20120025629A (ko
Inventor
피터 크루이트
마르코 잔-자코 빌란트
Original Assignee
마퍼 리쏘그라피 아이피 비.브이.
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Publication of KR20120025629A publication Critical patent/KR20120025629A/ko
Application granted granted Critical
Publication of KR101175523B1 publication Critical patent/KR101175523B1/ko
Assigned to 에이에스엠엘 네델란즈 비.브이. reassignment 에이에스엠엘 네델란즈 비.브이. 권리의 전부이전등록 Assignors: 마퍼 리쏘그라피 아이피 비.브이.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041Photolithographic processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002Details
    • H01J37/3007Electron or ion-optical systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/045Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177Multi-beam, e.g. fly's eye, comb probe
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/043Beam blanking
    • H01J2237/0435Multi-aperture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/045Diaphragms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/045Diaphragms
    • H01J2237/0451Diaphragms with fixed aperture
    • H01J2237/0453Diaphragms with fixed aperture multiple apertures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/049Focusing means
    • H01J2237/0492Lens systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15Means for deflecting or directing discharge
    • H01J2237/1501Beam alignment means or procedures

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020127003554A 2003-05-28 2004-05-27 대전 입자 빔렛 노광 시스템 Expired - Lifetime KR101175523B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US47381003P 2003-05-28 2003-05-28
US60/473,810 2003-05-28
PCT/NL2004/000381 WO2004107050A2 (en) 2003-05-28 2004-05-27 Charged particle beamlet exposure system

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020057022719A Division KR101168200B1 (ko) 2003-05-28 2004-05-27 대전 입자 빔렛 노광 시스템

Publications (2)

Publication Number Publication Date
KR20120025629A KR20120025629A (ko) 2012-03-15
KR101175523B1 true KR101175523B1 (ko) 2012-08-21

Family

ID=33490650

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020127003554A Expired - Lifetime KR101175523B1 (ko) 2003-05-28 2004-05-27 대전 입자 빔렛 노광 시스템
KR1020057022719A Expired - Lifetime KR101168200B1 (ko) 2003-05-28 2004-05-27 대전 입자 빔렛 노광 시스템

Family Applications After (1)

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KR1020057022719A Expired - Lifetime KR101168200B1 (ko) 2003-05-28 2004-05-27 대전 입자 빔렛 노광 시스템

Country Status (8)

Country Link
US (1) US7084414B2 (https=)
EP (2) EP1627412B1 (https=)
JP (1) JP4949843B2 (https=)
KR (2) KR101175523B1 (https=)
CN (1) CN100543920C (https=)
AT (2) ATE524822T1 (https=)
DE (1) DE602004005704T2 (https=)
WO (1) WO2004107050A2 (https=)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7462848B2 (en) * 2003-10-07 2008-12-09 Multibeam Systems, Inc. Optics for generation of high current density patterned charged particle beams
US7928404B2 (en) * 2003-10-07 2011-04-19 Multibeam Corporation Variable-ratio double-deflection beam blanker
US20090008579A1 (en) * 2003-10-07 2009-01-08 Tokyo Electron Limited Electron beam lithography apparatus and design method of patterned beam-defining aperture
CN102005358B (zh) * 2004-05-17 2012-09-12 迈普尔平版印刷Ip有限公司 带电粒子束曝光系统
EP1842103A2 (en) * 2005-01-14 2007-10-10 Arradiance, Inc. Synchronous raster scanning lithographic system
NL1029132C2 (nl) * 2005-05-26 2006-11-28 Univ Delft Tech Inrichting voor het opwekken van evenwijdige stralenbundeldelen.
US8597089B2 (en) * 2005-07-08 2013-12-03 Praxair Technology, Inc. System and method for treating live cargo such as poultry with gas
JP5663717B2 (ja) * 2005-09-06 2015-02-04 カール ツァイス マイクロスコピー ゲーエムベーハーCarl Zeiss Microscopy Gmbh 荷電粒子システム
EP2005460A4 (en) * 2006-03-27 2010-11-24 Multibeam Systems Inc OPTICAL FOR GENERATING CHARGED PARTICLE DATA BEAMS HAVING HIGH CURRENT DENSITY
EP2002458B1 (en) * 2006-04-03 2009-11-04 IMS Nanofabrication AG Particle-beam exposure apparatus with overall-modulation of a patterned beam
US8134135B2 (en) * 2006-07-25 2012-03-13 Mapper Lithography Ip B.V. Multiple beam charged particle optical system
US7569834B1 (en) 2006-10-18 2009-08-04 Kla-Tencor Technologies Corporation High resolution charged particle projection lens array using magnetic elements
EP2019415B1 (en) * 2007-07-24 2016-05-11 IMS Nanofabrication AG Multi-beam source
US8445869B2 (en) 2008-04-15 2013-05-21 Mapper Lithography Ip B.V. Projection lens arrangement
US8890094B2 (en) 2008-02-26 2014-11-18 Mapper Lithography Ip B.V. Projection lens arrangement
JP5268170B2 (ja) * 2008-04-15 2013-08-21 マッパー・リソグラフィー・アイピー・ビー.ブイ. 投影レンズ構成体
US7851774B2 (en) * 2008-04-25 2010-12-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for direct writing to a wafer
WO2009141428A1 (en) * 2008-05-23 2009-11-26 Mapper Lithography Ip B.V. Imaging system
EP2128885A1 (en) * 2008-05-26 2009-12-02 FEI Company Charged particle source with integrated energy filter
EP2399273B1 (en) 2009-02-22 2017-06-28 Mapper Lithography IP B.V. Charged particle lithography apparatus and method of generating vacuum in a vacuum chamber
US20110049393A1 (en) 2009-02-22 2011-03-03 Mapper Lithography Ip B.V. Lithography Machine and Substrate Handling Arrangement
KR101553802B1 (ko) 2009-02-22 2015-09-17 마퍼 리쏘그라피 아이피 비.브이. 진공 챔버에서 진공을 실현하기 위한 장치 및 방법
CN102422380A (zh) * 2009-02-22 2012-04-18 迈普尔平版印刷Ip有限公司 带电粒子微影设备及真空腔室中产生真空的方法
WO2010134018A2 (en) 2009-05-20 2010-11-25 Mapper Lithography Ip B.V. Pattern data conversion for lithography system
KR101757837B1 (ko) 2009-05-20 2017-07-26 마퍼 리쏘그라피 아이피 비.브이. 듀얼 패스 스캐닝
EP2433294B1 (en) * 2009-05-20 2016-07-27 Mapper Lithography IP B.V. Method of generating a two-level pattern for lithographic processing and pattern generator using the same
NL2005584C2 (en) 2009-10-26 2014-09-04 Mapper Lithography Ip Bv Charged particle multi-beamlet lithography system with modulation device.
US8952342B2 (en) 2009-12-17 2015-02-10 Mapper Lithography Ip B.V. Support and positioning structure, semiconductor equipment system and method for positioning
WO2012055936A1 (en) 2010-10-26 2012-05-03 Mapper Lithography Ip B.V. Lithography system, modulation device and method of manufacturing a fiber fixation substrate
US9305747B2 (en) 2010-11-13 2016-04-05 Mapper Lithography Ip B.V. Data path for lithography apparatus
KR101755577B1 (ko) 2010-11-13 2017-07-07 마퍼 리쏘그라피 아이피 비.브이. 애퍼처 어레이 냉각장치를 갖춘 하전 입자 리소그래피 시스템
US8586949B2 (en) 2010-11-13 2013-11-19 Mapper Lithography Ip B.V. Charged particle lithography system with intermediate chamber
US8884255B2 (en) 2010-11-13 2014-11-11 Mapper Lithography Ip B.V. Data path for lithography apparatus
WO2012062934A1 (en) 2010-11-13 2012-05-18 Mapper Lithography Ip B.V. Charged particle beam modulator
EP2681624B1 (en) 2010-12-14 2016-07-20 Mapper Lithography IP B.V. Lithography system and method of processing substrates in such a lithography system
EP2676168B1 (en) 2011-02-16 2018-09-12 Mapper Lithography IP B.V. System for magnetic shielding
JP5951753B2 (ja) 2011-04-22 2016-07-13 マッパー・リソグラフィー・アイピー・ビー.ブイ. リソグラフィ機のクラスタのためのネットワークアーキテクチャおよびプロトコル
TWI514089B (zh) 2011-04-28 2015-12-21 瑪波微影Ip公司 在微影系統中用於轉移基板的設備
US9703213B2 (en) * 2011-09-12 2017-07-11 Mapper Lithography Ip B.V. Substrate processing apparatus
TW201330705A (zh) 2011-09-28 2013-07-16 Mapper Lithography Ip Bv 電漿產生器
CN104272427B (zh) * 2012-03-08 2017-05-17 迈普尔平版印刷Ip有限公司 具有对准传感器和射束测量传感器的带电粒子光刻系统
CN106933063B (zh) 2012-03-20 2019-01-18 迈普尔平版印刷Ip有限公司 电子射束光刻系统
US11348756B2 (en) 2012-05-14 2022-05-31 Asml Netherlands B.V. Aberration correction in charged particle system
NL2010759C2 (en) 2012-05-14 2015-08-25 Mapper Lithography Ip Bv Modulation device and power supply arrangement.
KR101945964B1 (ko) 2012-05-14 2019-02-11 마퍼 리쏘그라피 아이피 비.브이. 하전 입자 다중-빔렛 리소그래피 시스템 및 냉각 장치 제조 방법
CN104428866A (zh) 2012-05-14 2015-03-18 迈普尔平版印刷Ip有限公司 带电粒子光刻系统和射束产生器
US10586625B2 (en) 2012-05-14 2020-03-10 Asml Netherlands B.V. Vacuum chamber arrangement for charged particle beam generator
NL2010760C2 (en) 2013-05-03 2014-11-04 Mapper Lithography Ip Bv Beam grid layout.
EP2816585A1 (en) * 2013-06-17 2014-12-24 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam system and method of operating thereof
WO2015024956A1 (en) 2013-08-23 2015-02-26 Mapper Lithography Ip B.V. Drying device for use in a lithography system
CN108962708A (zh) 2013-11-14 2018-12-07 迈普尔平版印刷Ip有限公司 电极堆栈布置
TWI661457B (zh) 2013-12-30 2019-06-01 荷蘭商Asml荷蘭公司 陰極配置、電子槍以及包含此電子槍的微影系統
KR20170084240A (ko) 2014-11-14 2017-07-19 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법
US9484188B2 (en) 2015-03-11 2016-11-01 Mapper Lithography Ip B.V. Individual beam pattern placement verification in multiple beam lithography
US10096450B2 (en) 2015-12-28 2018-10-09 Mapper Lithography Ip B.V. Control system and method for lithography apparatus
US9981293B2 (en) 2016-04-21 2018-05-29 Mapper Lithography Ip B.V. Method and system for the removal and/or avoidance of contamination in charged particle beam systems
KR102401179B1 (ko) * 2017-12-12 2022-05-24 삼성전자주식회사 전자빔 장치의 어퍼처 시스템, 전자빔 노광 장치 및 전자빔 노광 장치 시스템
CN111971774B (zh) * 2018-03-29 2023-09-29 株式会社日立高新技术 带电粒子束装置
WO2020030483A1 (en) 2018-08-09 2020-02-13 Asml Netherlands B.V. An apparatus for multiple charged-particle beams
NL2022156B1 (en) 2018-12-10 2020-07-02 Asml Netherlands Bv Plasma source control circuit
CN113228224A (zh) * 2018-12-31 2021-08-06 Asml荷兰有限公司 使用多个电子束进行实时立体成像的系统和方法
US11651934B2 (en) 2021-09-30 2023-05-16 Kla Corporation Systems and methods of creating multiple electron beams

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4243866A (en) * 1979-01-11 1981-01-06 International Business Machines Corporation Method and apparatus for forming a variable size electron beam
US4543512A (en) * 1980-10-15 1985-09-24 Tokyo Shibaura Denki Kabushiki Kaisha Electron beam exposure system
US4544847A (en) * 1983-07-28 1985-10-01 Varian Associates, Inc. Multi-gap magnetic imaging lens for charged particle beams
JPS6142132A (ja) * 1984-08-06 1986-02-28 Nippon Telegr & Teleph Corp <Ntt> 荷電ビ−ム露光装置
JPH097538A (ja) * 1995-06-26 1997-01-10 Nippon Telegr & Teleph Corp <Ntt> 荷電ビーム描画装置
JP3908294B2 (ja) * 1996-02-02 2007-04-25 富士通株式会社 電子ビームの電流量を削減する電子ビーム露光装置及び電子ビーム露光方法
US5912469A (en) * 1996-07-11 1999-06-15 Nikon Corporation Charged-particle-beam microlithography apparatus
JP3085454B2 (ja) * 1997-03-13 2000-09-11 日本電気株式会社 荷電粒子線露光方法
KR19990062942A (ko) 1997-12-10 1999-07-26 히로시 오우라 전하 입자 빔 노출 장치
US6014200A (en) * 1998-02-24 2000-01-11 Nikon Corporation High throughput electron beam lithography system
JP4578606B2 (ja) * 2000-02-09 2010-11-10 富士通セミコンダクター株式会社 荷電粒子ビーム描画装置及び荷電粒子ビームサイズの調整方法
US6651513B2 (en) 2000-04-27 2003-11-25 Endress + Hauser Flowtec Ag Vibration meter and method of measuring a viscosity of a fluid
JP4112791B2 (ja) * 2000-10-03 2008-07-02 株式会社アドバンテスト 電子ビーム補正方法及び電子ビーム露光装置
JP4601146B2 (ja) * 2000-10-03 2010-12-22 株式会社アドバンテスト 電子ビーム露光装置
JP2002217089A (ja) * 2001-01-18 2002-08-02 Advantest Corp 電子ビーム偏向装置、電子ビーム偏向装置の製造方法、及び電子ビーム露光装置
JP4647820B2 (ja) 2001-04-23 2011-03-09 キヤノン株式会社 荷電粒子線描画装置、および、デバイスの製造方法

Also Published As

Publication number Publication date
ATE524822T1 (de) 2011-09-15
CN100543920C (zh) 2009-09-23
JP4949843B2 (ja) 2012-06-13
US7084414B2 (en) 2006-08-01
JP2007500948A (ja) 2007-01-18
CN1795529A (zh) 2006-06-28
US20050161621A1 (en) 2005-07-28
WO2004107050A2 (en) 2004-12-09
ATE358885T1 (de) 2007-04-15
KR101168200B1 (ko) 2012-07-25
DE602004005704T2 (de) 2007-12-27
WO2004107050A3 (en) 2005-04-21
DE602004005704D1 (de) 2007-05-16
EP1830384A3 (en) 2007-09-19
EP1830384A2 (en) 2007-09-05
EP1627412A2 (en) 2006-02-22
KR20060036391A (ko) 2006-04-28
KR20120025629A (ko) 2012-03-15
EP1830384B1 (en) 2011-09-14
EP1627412B1 (en) 2007-04-04

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