DE602004005704T2 - Belichtungssystem unter Verwendung von Beamlets geladener Teilchen - Google Patents

Belichtungssystem unter Verwendung von Beamlets geladener Teilchen Download PDF

Info

Publication number
DE602004005704T2
DE602004005704T2 DE602004005704T DE602004005704T DE602004005704T2 DE 602004005704 T2 DE602004005704 T2 DE 602004005704T2 DE 602004005704 T DE602004005704 T DE 602004005704T DE 602004005704 T DE602004005704 T DE 602004005704T DE 602004005704 T2 DE602004005704 T2 DE 602004005704T2
Authority
DE
Germany
Prior art keywords
aperture
charged particles
lens
group
small
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004005704T
Other languages
German (de)
English (en)
Other versions
DE602004005704D1 (de
Inventor
Pieter Kruit
Marco Jan-Jaco Wieland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mapper Lithopraphy IP BV
Original Assignee
Mapper Lithopraphy IP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mapper Lithopraphy IP BV filed Critical Mapper Lithopraphy IP BV
Publication of DE602004005704D1 publication Critical patent/DE602004005704D1/de
Application granted granted Critical
Publication of DE602004005704T2 publication Critical patent/DE602004005704T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041Photolithographic processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002Details
    • H01J37/3007Electron or ion-optical systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/045Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177Multi-beam, e.g. fly's eye, comb probe
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/043Beam blanking
    • H01J2237/0435Multi-aperture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/045Diaphragms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/045Diaphragms
    • H01J2237/0451Diaphragms with fixed aperture
    • H01J2237/0453Diaphragms with fixed aperture multiple apertures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/049Focusing means
    • H01J2237/0492Lens systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15Means for deflecting or directing discharge
    • H01J2237/1501Beam alignment means or procedures

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE602004005704T 2003-05-28 2004-05-27 Belichtungssystem unter Verwendung von Beamlets geladener Teilchen Expired - Lifetime DE602004005704T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US47381003P 2003-05-28 2003-05-28
US473810P 2003-05-28
PCT/NL2004/000381 WO2004107050A2 (en) 2003-05-28 2004-05-27 Charged particle beamlet exposure system

Publications (2)

Publication Number Publication Date
DE602004005704D1 DE602004005704D1 (de) 2007-05-16
DE602004005704T2 true DE602004005704T2 (de) 2007-12-27

Family

ID=33490650

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004005704T Expired - Lifetime DE602004005704T2 (de) 2003-05-28 2004-05-27 Belichtungssystem unter Verwendung von Beamlets geladener Teilchen

Country Status (8)

Country Link
US (1) US7084414B2 (https=)
EP (2) EP1830384B1 (https=)
JP (1) JP4949843B2 (https=)
KR (2) KR101175523B1 (https=)
CN (1) CN100543920C (https=)
AT (2) ATE524822T1 (https=)
DE (1) DE602004005704T2 (https=)
WO (1) WO2004107050A2 (https=)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7928404B2 (en) * 2003-10-07 2011-04-19 Multibeam Corporation Variable-ratio double-deflection beam blanker
US20090008579A1 (en) * 2003-10-07 2009-01-08 Tokyo Electron Limited Electron beam lithography apparatus and design method of patterned beam-defining aperture
US7462848B2 (en) * 2003-10-07 2008-12-09 Multibeam Systems, Inc. Optics for generation of high current density patterned charged particle beams
KR101099487B1 (ko) * 2004-05-17 2011-12-28 마퍼 리쏘그라피 아이피 비.브이. 대전 입자 빔 노광 시스템
JP2008527750A (ja) * 2005-01-14 2008-07-24 アラディアンス インコーポレイテッド 同期ラスタ走査リソグラフィ・システム
NL1029132C2 (nl) * 2005-05-26 2006-11-28 Univ Delft Tech Inrichting voor het opwekken van evenwijdige stralenbundeldelen.
US8597089B2 (en) * 2005-07-08 2013-12-03 Praxair Technology, Inc. System and method for treating live cargo such as poultry with gas
JP5663717B2 (ja) * 2005-09-06 2015-02-04 カール ツァイス マイクロスコピー ゲーエムベーハーCarl Zeiss Microscopy Gmbh 荷電粒子システム
JP2009531855A (ja) * 2006-03-27 2009-09-03 マルチビーム システムズ インコーポレイテッド 高電流密度パターン化荷電粒子ビーム生成のための光学系
US7781748B2 (en) * 2006-04-03 2010-08-24 Ims Nanofabrication Ag Particle-beam exposure apparatus with overall-modulation of a patterned beam
US8134135B2 (en) 2006-07-25 2012-03-13 Mapper Lithography Ip B.V. Multiple beam charged particle optical system
US7569834B1 (en) 2006-10-18 2009-08-04 Kla-Tencor Technologies Corporation High resolution charged particle projection lens array using magnetic elements
EP2019415B1 (en) 2007-07-24 2016-05-11 IMS Nanofabrication AG Multi-beam source
US8890094B2 (en) 2008-02-26 2014-11-18 Mapper Lithography Ip B.V. Projection lens arrangement
US8445869B2 (en) 2008-04-15 2013-05-21 Mapper Lithography Ip B.V. Projection lens arrangement
WO2009127659A2 (en) 2008-04-15 2009-10-22 Mapper Lithography Ip B.V. Beamlet blanker arrangement
US7851774B2 (en) * 2008-04-25 2010-12-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for direct writing to a wafer
CN102105960B (zh) * 2008-05-23 2014-01-29 迈普尔平版印刷Ip有限公司 成像系统
EP2128885A1 (en) * 2008-05-26 2009-12-02 FEI Company Charged particle source with integrated energy filter
CN102422380A (zh) * 2009-02-22 2012-04-18 迈普尔平版印刷Ip有限公司 带电粒子微影设备及真空腔室中产生真空的方法
KR20110139699A (ko) 2009-02-22 2011-12-29 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 장치 및 기판 핸들링 배열체
EP2399272A1 (en) 2009-02-22 2011-12-28 Mapper Lithography IP B.V. A method and arrangement for realizing a vacuum in a vacuum chamber
KR101687955B1 (ko) 2009-02-22 2016-12-20 마퍼 리쏘그라피 아이피 비.브이. 하전입자 리소그래피 장치 및 진공 챔버에 진공을 발생시키는 방법
CN102460631B (zh) 2009-05-20 2015-03-25 迈普尔平版印刷Ip有限公司 两次扫描
CN102460632B (zh) * 2009-05-20 2015-11-25 迈普尔平版印刷Ip有限公司 产生二级图案以供光刻处理的方法和使用该方法的图案产生器
KR101614460B1 (ko) 2009-05-20 2016-04-21 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템을 위한 패턴 데이터 전환
EP2494579B1 (en) 2009-10-26 2017-08-02 Mapper Lithography IP B.V. Charged particle multi-beamlet lithography system, modulation device, and method of manufacturing thereof
US8952342B2 (en) * 2009-12-17 2015-02-10 Mapper Lithography Ip B.V. Support and positioning structure, semiconductor equipment system and method for positioning
KR101725299B1 (ko) 2010-10-26 2017-04-10 마퍼 리쏘그라피 아이피 비.브이. 변조 디바이스 및 이를 사용하는 하전 입자 멀티-빔렛 리소그래피 시스템
WO2012062932A1 (en) 2010-11-13 2012-05-18 Mapper Lithography Ip B.V. Charged particle lithography system with intermediate chamber
US8604411B2 (en) 2010-11-13 2013-12-10 Mapper Lithography Ip B.V. Charged particle beam modulator
US8884255B2 (en) 2010-11-13 2014-11-11 Mapper Lithography Ip B.V. Data path for lithography apparatus
US9305747B2 (en) 2010-11-13 2016-04-05 Mapper Lithography Ip B.V. Data path for lithography apparatus
EP2638560B1 (en) 2010-11-13 2017-02-22 Mapper Lithography IP B.V. Charged particle lithography system with aperture array cooling
JP6158091B2 (ja) 2010-12-14 2017-07-05 マッパー・リソグラフィー・アイピー・ビー.ブイ. リソグラフィシステム及びこのようなリソグラフィシステムで基板を処理する方法
CN103477285A (zh) 2011-02-16 2013-12-25 迈普尔平版印刷Ip有限公司 用于磁屏蔽的系统
JP5951753B2 (ja) 2011-04-22 2016-07-13 マッパー・リソグラフィー・アイピー・ビー.ブイ. リソグラフィ機のクラスタのためのネットワークアーキテクチャおよびプロトコル
US8936994B2 (en) * 2011-04-28 2015-01-20 Mapper Lithography Ip B.V. Method of processing a substrate in a lithography system
CN103930829A (zh) 2011-09-12 2014-07-16 迈普尔平版印刷Ip有限公司 基板处理装置
TW201330705A (zh) 2011-09-28 2013-07-16 Mapper Lithography Ip Bv 電漿產生器
WO2013132064A2 (en) 2012-03-08 2013-09-12 Mapper Lithography Ip B.V. Charged particle lithography system with alignment sensor and beam measurement sensor
US9123507B2 (en) 2012-03-20 2015-09-01 Mapper Lithography Ip B.V. Arrangement and method for transporting radicals
EP2850635B1 (en) 2012-05-14 2016-04-27 Mapper Lithography IP B.V. Charged particle multi-beamlet lithography system and cooling arrangement manufacturing method
NL2010759C2 (en) 2012-05-14 2015-08-25 Mapper Lithography Ip Bv Modulation device and power supply arrangement.
US11348756B2 (en) 2012-05-14 2022-05-31 Asml Netherlands B.V. Aberration correction in charged particle system
US10586625B2 (en) 2012-05-14 2020-03-10 Asml Netherlands B.V. Vacuum chamber arrangement for charged particle beam generator
CN107359101B (zh) 2012-05-14 2019-07-12 Asml荷兰有限公司 带电粒子射束产生器中的高电压屏蔽和冷却
NL2010760C2 (en) 2013-05-03 2014-11-04 Mapper Lithography Ip Bv Beam grid layout.
EP2816585A1 (en) * 2013-06-17 2014-12-24 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam system and method of operating thereof
US9922801B2 (en) 2013-08-23 2018-03-20 Mapper Lithography Ip B.V. Drying apparatus for use in a lithography system
NL2013814B1 (en) 2013-11-14 2016-05-10 Mapper Lithography Ip Bv Multi-electrode vacuum arrangement.
JP6590811B2 (ja) 2013-12-30 2019-10-16 エーエスエムエル ネザーランズ ビー.ブイ. 陰極構成体、電子銃、及びこのような電子銃を有するリソグラフィシステム
KR20170084240A (ko) 2014-11-14 2017-07-19 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법
US9484188B2 (en) 2015-03-11 2016-11-01 Mapper Lithography Ip B.V. Individual beam pattern placement verification in multiple beam lithography
US10096450B2 (en) 2015-12-28 2018-10-09 Mapper Lithography Ip B.V. Control system and method for lithography apparatus
US9981293B2 (en) 2016-04-21 2018-05-29 Mapper Lithography Ip B.V. Method and system for the removal and/or avoidance of contamination in charged particle beam systems
KR102401179B1 (ko) * 2017-12-12 2022-05-24 삼성전자주식회사 전자빔 장치의 어퍼처 시스템, 전자빔 노광 장치 및 전자빔 노광 장치 시스템
CN111971774B (zh) * 2018-03-29 2023-09-29 株式会社日立高新技术 带电粒子束装置
JP2021532545A (ja) * 2018-08-09 2021-11-25 エーエスエムエル ネザーランズ ビー.ブイ. 複数の荷電粒子ビームのための装置
NL2022156B1 (en) 2018-12-10 2020-07-02 Asml Netherlands Bv Plasma source control circuit
WO2020141041A1 (en) * 2018-12-31 2020-07-09 Asml Netherlands B.V. Systems and methods for real time stereo imaging using multiple electron beams
US11651934B2 (en) 2021-09-30 2023-05-16 Kla Corporation Systems and methods of creating multiple electron beams

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4243866A (en) * 1979-01-11 1981-01-06 International Business Machines Corporation Method and apparatus for forming a variable size electron beam
EP0049872B1 (en) * 1980-10-15 1985-09-25 Kabushiki Kaisha Toshiba Electron beam exposure system
US4544847A (en) * 1983-07-28 1985-10-01 Varian Associates, Inc. Multi-gap magnetic imaging lens for charged particle beams
JPS6142132A (ja) * 1984-08-06 1986-02-28 Nippon Telegr & Teleph Corp <Ntt> 荷電ビ−ム露光装置
JPH097538A (ja) * 1995-06-26 1997-01-10 Nippon Telegr & Teleph Corp <Ntt> 荷電ビーム描画装置
JP3908294B2 (ja) * 1996-02-02 2007-04-25 富士通株式会社 電子ビームの電流量を削減する電子ビーム露光装置及び電子ビーム露光方法
US5912469A (en) * 1996-07-11 1999-06-15 Nikon Corporation Charged-particle-beam microlithography apparatus
JP3085454B2 (ja) * 1997-03-13 2000-09-11 日本電気株式会社 荷電粒子線露光方法
KR19990062942A (ko) 1997-12-10 1999-07-26 히로시 오우라 전하 입자 빔 노출 장치
US6014200A (en) * 1998-02-24 2000-01-11 Nikon Corporation High throughput electron beam lithography system
JP4578606B2 (ja) * 2000-02-09 2010-11-10 富士通セミコンダクター株式会社 荷電粒子ビーム描画装置及び荷電粒子ビームサイズの調整方法
US6651513B2 (en) 2000-04-27 2003-11-25 Endress + Hauser Flowtec Ag Vibration meter and method of measuring a viscosity of a fluid
JP4601146B2 (ja) * 2000-10-03 2010-12-22 株式会社アドバンテスト 電子ビーム露光装置
JP4112791B2 (ja) * 2000-10-03 2008-07-02 株式会社アドバンテスト 電子ビーム補正方法及び電子ビーム露光装置
JP2002217089A (ja) * 2001-01-18 2002-08-02 Advantest Corp 電子ビーム偏向装置、電子ビーム偏向装置の製造方法、及び電子ビーム露光装置
JP4647820B2 (ja) 2001-04-23 2011-03-09 キヤノン株式会社 荷電粒子線描画装置、および、デバイスの製造方法

Also Published As

Publication number Publication date
EP1627412B1 (en) 2007-04-04
EP1830384B1 (en) 2011-09-14
JP2007500948A (ja) 2007-01-18
US20050161621A1 (en) 2005-07-28
JP4949843B2 (ja) 2012-06-13
EP1830384A3 (en) 2007-09-19
EP1627412A2 (en) 2006-02-22
US7084414B2 (en) 2006-08-01
CN100543920C (zh) 2009-09-23
KR101175523B1 (ko) 2012-08-21
EP1830384A2 (en) 2007-09-05
DE602004005704D1 (de) 2007-05-16
KR20120025629A (ko) 2012-03-15
ATE358885T1 (de) 2007-04-15
KR101168200B1 (ko) 2012-07-25
KR20060036391A (ko) 2006-04-28
CN1795529A (zh) 2006-06-28
WO2004107050A2 (en) 2004-12-09
WO2004107050A3 (en) 2005-04-21
ATE524822T1 (de) 2011-09-15

Similar Documents

Publication Publication Date Title
DE602004005704T2 (de) Belichtungssystem unter Verwendung von Beamlets geladener Teilchen
DE69432098T2 (de) Elektronenstrahl-Lithographie-System
DE69132110T2 (de) Verfahren und vorrichtung zur belichtung
EP1835523B1 (de) Phasenkontrast-Elektronenmikroskop
DE3219573C2 (de) Elektronenstrahlunterbrecher
EP0352552B1 (de) Verfahren zum Beleuchten eines Objektes in einem Transmissions-Elektronenmikroskop und dazu geeignetes Elektronenmikroskop
EP0191440A1 (de) Lithografiegerät zur Erzeugung von Mikrostrukturen
DE2056620B2 (de) Justiervorrichtung fuer eine vorrichtung zum bestrahlen eines werkstueckes in der form eines musters
DE19848070A1 (de) Niedrigenergie-Elektronenstrahllithographie
DE2620262A1 (de) Rechner-gesteuertes elektronenstrahllithographie-verfahren
DE10312989A1 (de) Lithographiesystem mit Strahl aus geladenen Teilchen, Lithographieverfahren, das einen Strahl aus geladenen Teilchen verwendet, Verfahren zum Steuern eines Strahls aus geladenen Teilchen, und Verfahren zur Herstellung eines Halbleiterbauteils
DE102007024353B4 (de) Monochromator und Strahlquelle mit Monochromator
DE2702445A1 (de) Korpuskularstrahloptisches geraet zur verkleinernden abbildung einer maske auf ein zu bestrahlendes praeparat
DE69213111T2 (de) Maske und Korpuskularbestrahlungsverfahren mit dieser Maske
DE10020714A1 (de) Elektronenstrahl-Belichtungsvorrichtung
DE69220513T2 (de) Ionenstrahl-austastvorrichtung und verfahren
EP0603555B1 (de) Verfahren zur Beleuchtung mit einem fokussierten Elektronenstrahl und zugehöriges elektronen-optisches Beleuchtungssystem
EP0106154B1 (de) Varioformstrahl-Ablenkobjektiv für Neutralteilchen und Verfahren zu seinem Betrieb
DE10237141A1 (de) Strahlführungssystem, Abbildungsverfahren und Elektronenmikroskopiesystem
DE10028327A1 (de) Vorrichtung und Verfahren für bildformende Strahlen aus geladenen Teilchen und Bestrahlungsvorrichtung mit Strahlen aus geladenen Teilchen
DE3145606C2 (de) Rasterelektronenmikroskop
DE19522362C2 (de) Elektronenstrahl-Schreibvorrichtung und -Verfahren
DE102023120127B4 (de) Teilchenoptische Anordnung, insbesondere Vielstrahl-Teilchenmikroskop, mit einer Magnetanordnung zum Separieren eines primären und eines sekundären teilchenoptischen Strahlenganges mit verbesserter Performance
DE3510961A1 (de) Justiervorrichtung
DE19946447B4 (de) Teilchenoptisches Abbildungssystem für Lithographiezwecke

Legal Events

Date Code Title Description
8364 No opposition during term of opposition