JP4918536B2 - 部材支持装置、部材支持方法、部品実装基板製造装置および部品実装基板製造方法 - Google Patents

部材支持装置、部材支持方法、部品実装基板製造装置および部品実装基板製造方法 Download PDF

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Publication number
JP4918536B2
JP4918536B2 JP2008285186A JP2008285186A JP4918536B2 JP 4918536 B2 JP4918536 B2 JP 4918536B2 JP 2008285186 A JP2008285186 A JP 2008285186A JP 2008285186 A JP2008285186 A JP 2008285186A JP 4918536 B2 JP4918536 B2 JP 4918536B2
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Japan
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support
supports
contact
substrate
fixing
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Japanese (ja)
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JP2010114242A (ja
JP2010114242A5 (enExample
Inventor
正行 梶山
寛二 秦
眞透 瀬野
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Publication of JP2010114242A5 publication Critical patent/JP2010114242A5/ja
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JP2008285186A 2008-11-06 2008-11-06 部材支持装置、部材支持方法、部品実装基板製造装置および部品実装基板製造方法 Expired - Fee Related JP4918536B2 (ja)

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JP2008285186A JP4918536B2 (ja) 2008-11-06 2008-11-06 部材支持装置、部材支持方法、部品実装基板製造装置および部品実装基板製造方法

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JP2008285186A JP4918536B2 (ja) 2008-11-06 2008-11-06 部材支持装置、部材支持方法、部品実装基板製造装置および部品実装基板製造方法

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JP2010114242A JP2010114242A (ja) 2010-05-20
JP2010114242A5 JP2010114242A5 (enExample) 2010-10-28
JP4918536B2 true JP4918536B2 (ja) 2012-04-18

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5690791B2 (ja) * 2012-09-24 2015-03-25 ヤマハ発動機株式会社 基板処理装置
JP7620411B2 (ja) * 2020-10-13 2025-01-23 株式会社Fuji 作業機

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2565181B2 (ja) * 1988-04-14 1996-12-18 ソニー株式会社 基板位置決め装置
JP3421713B2 (ja) * 1995-10-31 2003-06-30 株式会社エヌ・イー・エフ 押さえ機能付き薄板位置決め装置
JP4074722B2 (ja) * 1999-03-04 2008-04-09 芝浦メカトロニクス株式会社 部品実装装置

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