JP4918536B2 - Member support device, member support method, component mounting board manufacturing apparatus, and component mounting board manufacturing method - Google Patents

Description

  The present invention relates to a member support device and a member support method for supporting a member when performing operations such as component mounting, solder printing or application, or adhesive application on a member constituting an industrial product.

  2. Description of the Related Art Conventionally, manufacturing steps for industrial products such as electronic devices include many steps for mounting components or applying liquid agents to members such as printed circuit boards (hereinafter simply referred to as “substrates”) that constitute industrial products. ing. Further, such a member often has irregularities on the surface supported when these operations are performed.

  Therefore, in order to perform these operations accurately and reliably, it is necessary to support the work target member in a form corresponding to the unevenness on the support side.

  Therefore, a technique regarding a substrate support device for supporting a substrate regardless of the shape of the back surface of the substrate is also disclosed (for example, see Patent Document 1).

  According to the technique described in Patent Document 1, a plurality of contacts are brought into contact with each other according to the unevenness of the back surface of the substrate. The plurality of contacts abut against the back surface of the substrate in a state where a predetermined urging force is applied.

Thereby, even if it is a case where components are mounted in the back surface of a board | substrate, a board | substrate can be supported according to the uneven | corrugated shape of the back surface.
JP 2006-294981 A

  However, in the above conventional technique, a table holding a plurality of contacts whose heights are aligned is lifted upward from below the substrate. Also, the board used may be a flexible board such as a flexible board from the conventional board, or an IC or semiconductor may be mounted on the back side of the board. In some cases, the ICs etc. that are being damaged are damaged.

  Recently, not only rigid substrates but also rigid flexible substrates with some flexible substrates are used, and when supporting the substrate from the back, the biasing force of each contactor Could have a big impact. Some substrates used are susceptible to impacts, such as ceramic substrates, and chipping or the like may occur due to the contact of a plurality of contacts.

  Therefore, even if the urging force applied to one contact is small, the number of contacts that abut against the substrate simultaneously or substantially simultaneously becomes relatively large, so that a large impact force may be applied to the substrate.

  In view of the above-described conventional problems, the present invention provides a member support device, a member support method, and the like for stably and safely supporting a member when an operation such as mounting a component is performed on the member such as a substrate. An object is to provide a component mounting machine and a component mounting method.

  In order to achieve the above object, a member support device of the present invention is a member support device for supporting a member by a plurality of supports, and a plurality of supports provided at positions facing a surface to be supported by the member. A body, a holding body that holds the plurality of supports so as to be movable in two directions parallel to a supporting direction in which the supporting body supports the member, and the holding body is moved in the supporting direction. Thus, by controlling the driving means to bring the tip portions of the plurality of support bodies into contact with the member, the tip portions of the two or more support bodies among the plurality of support bodies are controlled. Control means for varying the timing at which the respective tip portions of the two or more supports abut against the member by moving the holding body in the support direction in a state where the positions in the support direction are different; support In a state where each tip is in contact with the said member, and a movement limiting means for fixing the position of said plurality of supports.

  Thus, the member support apparatus of this invention moves a some support body to a support direction collectively. In addition, at this time, since the positions of the two or more support bodies in the support direction move toward the member in an uneven state, the contact timing of the tip parts to the member is shifted.

  Thereby, the impact which a some support body gives to a member is disperse | distributed in time series, and the said member is supported safely. In addition, since the positions of the plurality of supports are fixed in a state in which the tip portions of the plurality of supports are in contact with the member, even if the shape of the surface supported by the member is flat, the shape is uneven. Even if it exists, the said member is supported stably.

  Further, the member support device of the present invention further includes a surface that is in contact with a rear end portion that is an end portion opposite to the tip portion of each of the plurality of support bodies, the surface being supported by the member, A base having a rear end abutting surface which is a surface where the distance is not constant, and the control means controls the driving means, thereby allowing rear end portions of the plurality of supports and the abutting surfaces to be controlled. The positions in the supporting direction of the tip portions of the two or more supports may be made different by bringing them into contact with each other.

  With this configuration, the positions in the support direction of the tip portions of the two or more supports are made uneven according to the inclination or shape of the rear end contact surface. In other words, each of the timings at which the tip ends contact the member is changed according to the inclination or shape of the rear end contact surface.

  Further, the control means further changes the posture of the base with respect to the member, thereby tilting the rear end abutting surface with respect to the surface supported by the member, and controlling the driving means. The rear end portions of the plurality of supports may be brought into contact with the rear end contact surface in a state inclined with respect to the surface supported by the member.

  With this configuration, the control means can change the attitude of the base. Accordingly, it is possible to control the shift amount of the position of the tip portions of the two or more supports in the support direction.

  The lengths of the two or more supports in the support direction are different from each other, and the member support device further includes a rear end that is an end opposite to the tip of each of the plurality of supports. A base having a rear end abutting surface that is a surface abutting and having a constant distance from a surface supported by the member; and the control means controls the driving means to control the plurality of It is good also as making the position of the said support direction differ in the front-end | tip part of each of the said 2 or more support bodies by making the rear-end part of a support body contact | abut the said contact surface.

  With this configuration, by changing the difference in length between each of the two or more supports, the amount of shift in timing at which the tip portions of the two or more supports are in contact with the member is changed.

  The movement restricting means includes a plurality of fixing means, and each of the plurality of fixing means fixes a position of one support body of the plurality of support bodies relative to the holding body, to the holding body. Is provided with a plurality of support units, each of the plurality of support units holding the support movably in both directions parallel to the support direction, and having the fixing means, The position of the support relative to the holding body may be fixed by a fixing means.

  With this configuration, the support and the fixing means for fixing the support can be handled as one support unit. Thereby, for example, an operation for increasing or decreasing the number of supports provided in the member support device is facilitated.

  The fixing means includes a functional material disposed on a side surface of the support, and voltage applying means for applying a predetermined voltage to the functional material, and the support unit further includes the functional material. Urging means for applying an urging force against the side surface of the support to the functional material, and the support is movable to the support unit by being in contact with the functional material. The fixing means is configured to apply the predetermined voltage to the functional material in a state where the functional material is pressed against a side surface of the support, thereby holding the support. The position relative to the body may be fixed.

  Thereby, the change of the holding force (fixing force) with respect to the support body which a fixing means exhibits can be performed by changing the magnitude | size of an applied voltage. That is, it is possible to easily control the holding force (fixing force) by the fixing means.

  In addition, the member support device of the present invention is a member support device that supports a member by a plurality of support bodies, the plurality of support bodies provided at positions facing the surface of the member to be supported, and the plurality of the plurality of support bodies. A plurality of individual driving means for bringing the tip of each of the plurality of supports into contact with the member by moving each of the supports in the direction of the member, and two or more of the plurality of individual driving means Control means for changing the timing at which the tip of each of the two or more supports out of the plurality of supports comes into contact with the member by changing the timing of moving the support of each of the individual drive means; It is good also as providing the movement restriction | limiting means which fixes the position of these support bodies in the state which the front-end | tip part of each support body contact | abutted to the said member.

  With this configuration, each of the two or more supports can be moved independently. That is, by shifting the timing of movement of each of the two or more supports, it is possible to vary the timing at which the tips of these supports contact the member.

  The movement restricting unit includes a functional material disposed on a side surface of the plurality of supports, and a voltage applying unit that applies a predetermined voltage to the functional material, and the predetermined amount is applied to the functional material. The positions of the plurality of supports may be fixed by applying a voltage of.

  Thereby, control of the holding force (fixing force) with respect to the support body by the movement limiting means can be easily performed.

  The functional material may be any one of an electrorheological fluid, a magnetorheological fluid, an electrorheological gel, a magnetorheological gel, or a dielectric material.

  That is, the functional material used for fixing the position of the support may be determined in consideration of the characteristics of each material or the load applied to the support.

  Further, the member support device of the present invention can also function as a device for supporting a substrate in a component mounting machine, a printing machine, or the like.

  Moreover, this invention can also be implement | achieved as a component mounting board manufacturing apparatus provided with the member support apparatus of this invention as an apparatus which supports a board | substrate.

  Specifically, as such a component mounting board manufacturing apparatus, a printing machine including a solder printing unit that prints or applies solder to a substrate, an adhesive application machine including an adhesive application unit that applies an adhesive to the substrate, and There are component mounters equipped with a mounting means for mounting components on a board.

  Moreover, this invention can also be implement | achieved as a member support method including the operation | movement for supporting the member which the member support apparatus of this invention performs.

  Further, the present invention is a component mounting method for mounting a component on a substrate supported by the member support method of the present invention, a solder printing method for printing or applying solder on the substrate supported by the member support method of the present invention, or It can also be realized as an adhesive application method in which an adhesive is applied to a substrate supported by the member support method of the present invention.

  Furthermore, the present invention can be realized as a program including characteristic steps in the member support method of the present invention, realized as a storage medium such as a CD-ROM storing the program, or realized as an integrated circuit. it can. The program can also be distributed via a transmission medium such as a communication network.

  According to the present invention, the member support device is controlled so that the tip portions of the two or more supports are in contact with the member at different timings. That is, as in the prior art, not only simply moving the plurality of supports in the direction of the member, but also active device control is performed so that the tip portions abut on the member at different timings.

  Thereby, the impact when the support comes into contact with the member is dispersed, and the influence of the support on the member when supporting the member such as the substrate can be reduced.

  Further, the positions of the plurality of supports are fixed in a state where the plurality of supports are moved together or independently in the support direction, and their tips are in contact with the member. In other words, the positions of the plurality of supports are fixed in a state where each tip is located at a position corresponding to the shape of the surface supported by the member. Therefore, the member is stably supported.

  Thus, the present invention provides a member support device, a member support method, a component mounter, and a component mounter for stably and safely supporting a member when a component mounting operation is performed on a member such as a board. A component mounting method can be provided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
First, the structure of the substrate support apparatus 10 of Embodiment 1 is demonstrated using FIGS.

  FIG. 1 is an overview diagram showing an overview of a substrate support apparatus 10 according to Embodiment 1 of the present invention.

  A substrate support device 10 shown in FIG. 1 is an example of a member support device of the present invention, and is provided as a device for supporting a substrate in a component mounting machine. The substrate support device 10 can support the substrate 80 conveyed by the conveyance rail 90 from below.

  In the component mounting machine including the board support device 10, the board 80 is supported from below by the board support device 10, so that components can be mounted from above the board 80. The board | substrate 80 is also an example of the member supported by the member support apparatus and member support method of this invention including the components, when the components are mounted.

  As shown in FIG. 1, the direction parallel to the transport direction of the substrate 80 is the X-axis direction, the direction parallel to the lifting shaft 14, that is, the direction parallel to the support direction of the substrate 80 is the Z-axis direction, A direction perpendicular to the axial direction and the Z-axis direction is taken as a Y-axis direction.

  Further, in the following description, for example, when “the support pin 13 abuts on the substrate 80”, the front end portion of the support pin 13 directly abuts on the substrate 80, or the front end portion of the support pin 13 is the back surface of the substrate 80. This means that the component is in contact with the component mounted on the board.

  As shown in FIG. 1, the substrate support apparatus 10 includes a pin unit 11, a shaft holder 6, a drive unit 7, a base 8 a, a base lifting / lowering unit 8 b, and a control unit 20.

  The pin unit 11 is an example of a support unit in the substrate support apparatus of the present invention. In the present embodiment, a plurality of pin units 11 are detachably attached to the shaft holder 6. The pin unit 11 includes a support pin 13 and a lifting shaft 14.

  The support pin 13 is a member that supports the substrate 80 and is connected to a lifting shaft 14 that is held by the pin unit 11 so as to be movable in the vertical direction. The plurality of support pins 13 are provided at positions facing the back surface of the substrate 80 when the substrate 80 is transported.

  The pair of support pins 13 and the lifting shaft 14 is an example of a support in the member support device of the present invention.

  The drive part 7 is being fixed below the conveyance rail 90 of the said component mounting machine. The drive unit 7 moves a plurality of pin units 11 held by the shaft holding body 6 in a lump by moving the shaft holding body 6 in accordance with an instruction from the control unit 20.

  Thereby, the several raising / lowering axis | shaft 14 hold | maintained so that movement to each pin unit 11 moves, and the front-end | tip part of the some support pin 13 can be contact | abutted to a board | substrate.

  In the present embodiment, an air cylinder is employed as the drive unit 7.

  The base 8a is a base having a surface that comes into contact with the rear end of each of the plurality of lifting shafts 14. The base 8a is supported by the four base lifting parts 8b. The operations of the four base lifting / lowering units 8b are controlled by the control unit 20.

  With this configuration, the attitude of the base 8 a, that is, the inclination of the base 8 a with respect to the back surface of the substrate 80 is controlled by the control unit 20.

  The substrate support apparatus 10 according to the first embodiment makes the height positions of the two or more rear end portions different by bringing the rear end portions of the two or more lifting shafts 14 into contact with the inclined base 8a. be able to. As a result, the height positions of two or more of the plurality of support pins 13 can be made different.

  The relationship between the inclination of the base 8a and the height position of the tip of the support pin 13 will be described later with reference to FIG.

  In addition, the base raising / lowering part 8b is an air cylinder, for example. The surface of the base 8a with which the rear end portions of the plurality of lifting shafts 14 abut is an example of the rear end abutting surface in the substrate support apparatus of the present invention.

  FIG. 2 is a perspective view showing an appearance of the pin unit 11 according to the first embodiment.

  As shown in FIG. 2, the pin unit 11 includes a fixing portion 12, a lifting shaft 14, a support pin 13, and a unit side terminal 15.

  The unit side terminal 15 is a terminal for connecting the pin unit 11 and the power supply unit.

  When the pin unit 11 is attached to the shaft holder 6, as shown in FIG. 2, the unit side terminal 15 and the power source side terminal 16 connected to the power source unit come into contact with each other. As a result, a predetermined voltage is supplied to the pin unit 11.

  FIG. 3A is a diagram illustrating an example of the internal structure of the pin unit 11 according to the first embodiment.

  As shown in FIG. 3A, the pin unit 11 includes an electro rheological (ER) gel 17, an electrode 18, a biasing body 19, and a fixing plate 19 a inside the fixing portion 12. Has a set.

  Each of the pair of ER gels 17 is given a biasing force by a biasing body 19 and is pressed against the side surface of the elevating shaft 14. The lifting shaft 14 is slidably held on the pin unit 11 by the frictional force between the ER gel 17 and the lifting shaft 14 by the biasing body 19.

  A biasing force is applied to each of the pair of ER gels 17 by the biasing body 19 such that the lifting shaft 14 does not fall off the pin unit 11 due to its own weight.

  That is, in a state where the pin unit 11 is attached to the shaft holder 6, the lifting shaft 14 included in the pin unit 11 is held movably on the shaft holder 6.

  Moreover, the part which contacts at least both ER gel 17 of the raising / lowering shaft 14, and the part which connects these parts have electroconductivity. For example, the surface of the lifting shaft 14 is covered with a conductive metal.

  Thereby, the elevating shaft 14 also functions as an electrode for applying a voltage to both ER gels 17.

  In such a configuration, a voltage V <b> 1 is applied to the two ER gels 17 via the fixing plate 19 a, the biasing body 19, and the electrode 18, respectively. Thereby, the shear stress in the interface with the raising / lowering axis | shaft 14 improves.

  That is, by applying a predetermined electric field to the ER gel 17 sandwiched between the electrode 18 and the lifting shaft 14, the frictional force with the surface of the lifting shaft 14 that is in contact with the ER gel 17 depends on the magnitude of the electric field. It is going to change.

  In this way, the shear stress at the boundary surface is improved, and the lifting shaft 14 is pressed against the ER gel 17 by the biasing body 19, so that the frictional resistance is between the lifting shaft 14 and the ER gel 17. Acts to limit bidirectional movement parallel to the support direction. That is, the position of the lifting shaft 14 with respect to the shaft holder 6 is substantially fixed.

  Thus, the frictional resistance acting on the lifting shaft 14 acts as a fixing force for the lifting shaft 14, and the vertical movement of the lifting shaft 14 and the support pin 13 is limited.

  Further, when the application of the voltage to the ER gel 17 is stopped, the shear stress on the surface of the ER gel 17 decreases, and the force for fixing the elevating shaft 14 substantially disappears. As a result, the elevating shaft 14 can move with respect to the shaft holder 6.

  Thus, the ER gel 17 having high responsiveness to increase / decrease of the applied voltage is used for fixing the position of the elevating shaft 14. For this reason, the position of the lifting shaft 14 is fixed and the fixing is released instantaneously.

  In addition, generation | occurrence | production and extinction of the shear stress in the ER gel 17 as mentioned above are demonstrated as follows.

  That is, a large number of ER particles having a spherical surface projecting from the gel portion are present on the surface of the ER gel 17, and in a state where no voltage is applied, the electrode slides on the spherical surface of the ER particle.

  Thereby, in the state which does not apply a voltage, a shear stress shows a very low value.

  In addition, when a voltage is applied to the ER gel, particles that have polarization with a multiaxial structure attract each other, and the spherical surface of the ER particles protruding from the surface sinks.

  In addition, the gel portion around the spherical surface that has been sunk by the action rises, and the gel portion comes into contact with the electrode.

  Since the gel portion has very high wetting characteristics, the adhesion of the ER gel to the electrode is increased, thereby exhibiting a large shearing force. In addition, it is considered that the yielding phenomenon of stress occurs immediately before the gel portion bonded to the electrode slips.

  Further, it is considered that the amount of subsidence of the ER particles protruding from the surface changes according to the magnitude of the electric field strength, and at the same time, the adhesion area of the gel portion to the electrode increases and decreases, and the shear stress also changes.

  When the ER gel 17 having the above characteristics is used for the fixing part 12 of the substrate support apparatus 10, a fixing force of the elevating shaft 14 sufficient for supporting the substrate can be obtained by applying a high voltage. In the embodiment, a voltage of 1 KV / mm is applied as the electric field strength.

  In the present embodiment, the movement restricting means in the substrate support apparatus of the present invention is realized by the plurality of fixing portions 12.

  In the first embodiment, the urging member 19 is a helical spring, but it may be a leaf spring or conductive rubber.

  In addition, the pin unit 11 shown in FIG. 3A employs a configuration in which the elevating shaft 14 is grounded and a positive voltage V1 is applied to both electrodes 18. However, the pin unit 11 may adopt other voltage application methods. For example, although two electrodes 18 are used, without grounding the lifting shaft 14, one of the two electrodes may be grounded and a voltage may be applied to the other electrode.

  FIG. 3B is a diagram showing another example of the internal structure of the pin unit 11 according to the first embodiment.

  In the pin unit 11 shown in FIG. 3B, a positive voltage V <b> 1 is applied to one electrode 18, and a negative voltage V <b> 2 is applied to the other electrode 18.

  With this configuration, it is not necessary to ground the elevating shaft 14 and a predetermined voltage is applied to each ER gel 17.

  In the pin unit 11 shown in each of FIGS. 3A and 3B, the magnitude of the voltage applied to the ER gel 17 is variable.

  By changing the magnitude of the voltage applied to the ER gel 17, the shear stress at the interface between the ER gel 17 and the lifting shaft 14 changes. That is, the holding force of the lifting shaft 14 by the ER gel 17 changes.

  FIG. 4 is a diagram showing the relationship between the applied voltage and the holding force by the ER gel 17 in the first embodiment.

  In the graph shown in FIG. 4, the horizontal axis is the electric field intensity value, which is a value obtained by dividing the applied voltage by the thickness of the ER gel 17 sandwiched between the electrode 18 and the lifting shaft 14.

  Here, when paying attention to one ER gel 17 in the present embodiment, the electrodes 18 in contact with the ER gel 17 and the side surfaces of the elevating shaft 14 function as electrodes that generate electric field strength. Therefore, the electric field strength applied to the ER gel 17 is obtained by dividing the applied voltage by the thickness of the ER gel 17. Further, the thickness of the ER gel 17 is constant. Therefore, the magnitude of the electric field strength is proportional to the magnitude of the applied voltage.

  Moreover, the graph shown in FIG. 4 has shown the experimental value in case the magnitude | size of the contact surface of ER gel 17 and the raising / lowering axis | shaft 14 is 12 mm x 54 mm.

  As shown in FIG. 4, when the electric field strength is 1 KV / mm, a holding force of about 150 grams (gr) is exhibited by one ER gel 17. In this case, the holding force of about 300 gr is exhibited by one pin unit 11.

  Moreover, as shown in FIG. 4, the magnitude of the electric field strength and the magnitude of the holding force are substantially proportional. Therefore, the holding force can be changed by controlling the applied voltage.

  Thus, for example, each pin unit 11 can exhibit an appropriate holding force (fixing force) according to the content of component mounting work performed on the substrate to be supported (applied to the substrate when components are mounted).

  Further, for example, it is assumed that the fixing unit 12 cannot hold the elevating shaft 14 only by the urging force by the urging body 19. In this case, the lifting shaft 14 may be slidably held by the fixing portion 12 by applying a voltage to the ER gel 17 that exerts a holding force that does not allow the lifting shaft 14 to fall off the fixing portion 12.

  FIG. 5 is a functional block diagram illustrating a functional configuration of the substrate support apparatus 10 according to the first embodiment.

  As shown in FIG. 5, the substrate support apparatus 10 includes a drive unit 7, a base lifting unit 8 b, and a control unit 20 that controls the fixing unit 12.

  Specifically, the control unit 20 controls the drive unit 7 to raise and lower the shaft holding body 6. Such a control function of the control unit 20 is, for example, a program for a computer having a central processing unit (CPU), a storage device, and an interface for inputting / outputting information to control the operation of the substrate support device 10. It is realized by executing.

  In addition, the control unit 20 controls the plurality of fixing units 12 to fix and release the position of the lifting shaft 14.

  Moreover, the base control part 8c which the control part 20 has is a process part which controls operation | movement of the base raising / lowering part 8b. The base control unit 8c changes the posture of the base 8a by controlling the operation of the base lifting / lowering unit 8b.

  In FIG. 5, only one base lifting / lowering portion 8b is shown for simplification of illustration.

  Next, operation | movement of the board | substrate support apparatus 10 of Embodiment 1 is demonstrated using FIGS.

  FIG. 6 is a flowchart showing an outline of the operation when the substrate support apparatus 10 supports the substrate.

  As shown in FIG. 6, the substrate support apparatus 10 raises the plurality of support pins 13 so that the plurality of support pins 13 abut on the substrate 80 at different timings (S100).

  Specifically, in the present embodiment, the base control unit 8c included in the control unit 20 operates at least one base lifting / lowering unit 8b to change the posture of the base 8a. Thereby, the base 8a is tilted. Further, the control unit 20 operates the drive unit 7 to move the shaft holder 6 in the direction of the base 8a.

  The base control unit 8c operates the four base lifting / lowering parts 8b to move the base 8a in the direction of the shaft holding body 6 so that the back surface of the substrate 80 and the tip of the support pin 13 of the lifting / lowering shaft 14 are moved. You may make it adjust the distance.

  In either case, the rear end portion of each lifting shaft 14 abuts on the base 8a, and the initial position of each support pin 13 is changed to a position along the inclination of the base 8a (S101). That is, the positions in the support direction of the tip portions of two or more support pins 13 among the plurality of support pins 13 are set to different positions.

  FIG. 7 is a diagram showing the relationship between the inclination of the base 8a and the initial position of each support pin 13 in the first embodiment. Note that [1] to [5] described in FIG. 7 represent the column numbers of the support pins 13.

  As shown in FIG. 7, when the base 8a is tilted with respect to the X axis, the initial position of each support pin 13 decreases from [1] to [5].

  In this state, the control unit 20 operates the drive unit 7 to raise the shaft holder 6 (S102). As a result, the timing of the support pins 13 in different rows coming into contact with the substrate 80 is shifted.

  FIG. 8 is a diagram illustrating an example of timing at which the plurality of support pins 13 abut on the substrate 80 in the first embodiment. FIG. 8 shows a case where a substrate 80 on which no component is mounted on the back surface is supported.

  As shown in the upper left diagram of FIG. 8, when the initial positions of the plurality of support pins 13 are different for each row, when the shaft holder 6 is lifted, first, the tips of the support pins 13 belonging to [1] are placed on the substrate 80. Abut.

  Thereafter, when the shaft holder 6 is further raised, the support pins 13 come into contact with the substrate 80 in the order of [2] to [5].

  In this way, after all the support pins 13 have come into contact with the substrate 80, the control unit 20 controls the drive unit 7 to stop the rise of the shaft holder 6.

  The control unit 20 further fixes the position of the elevating shaft 14 in a state where each support pin 13 is in contact with the substrate 80 (S110).

  Specifically, the control unit 20 turns on a power switch for applying a voltage to each pin unit 11. Thereby, in each pin unit 11, the fixing force demonstrated using FIG. 3 and FIG. 4 generate | occur | produces, and the position of each raising / lowering axis | shaft 14 is fixed substantially.

  Thereafter, when the mounting of the components on the board 80 is completed, the control unit 20 controls the driving unit 7 to lower the shaft holding body 6. Thereby, the position of each support pin 13 returns to the position shown in the upper left figure of FIG.

  The substrate support apparatus 10 can sequentially support the substrates 80 sequentially loaded by repeating the above operation.

  As described above, in the substrate support apparatus 10 according to the first embodiment, the control unit 20 controls the driving unit 7 to thereby support the tip portions of the two or more support pins 13 among the plurality of support pins 13. The shaft holder 6 is moved in the support direction in a state where the positions are different. As a result, the timing at which the tips of the two or more support pins 13 come into contact with the substrate 80 is made different.

  Specifically, the control unit 20 controls the drive unit 7 to move the shaft holding body 6 in the direction of the tilted base 8a. Thereby, the rear-end part of the several raising / lowering shaft 14 hold | maintained at the shaft holding body 6 contact | abuts to the base 8a, and the position with respect to the shaft holding body 6 of the several raising / lowering shaft 14 shifts | deviates.

  As a result, the initial positions of the plurality of support pins 13 are different from each other, and the timing at which the plurality of support pins 13 come into contact with the substrate 80 is shifted.

  As described above, the timing at which the plurality of support pins 13 come into contact with the substrate 80 is shifted, so that the impact applied to the substrate 80 by the support pins 13 is dispersed, and the substrate 80 is safely supported.

  FIG. 8 shows a case where no component is mounted on the back surface of the substrate 80. However, even when components are mounted on the back surface of the substrate 80, the safety when supporting the substrate is improved as compared with the conventional case.

  For example, in the related art, all of the plurality of support pins that come into contact with the portion on the back surface of the board where the components are not mounted are in contact with the back surface at substantially the same timing.

  However, with the substrate support apparatus 10 according to the first embodiment, the contact timings of the support pins 13 that contact the parts on the back surface of the substrate that are not mounted can be shifted.

  In FIG. 8, a part having the same height as the difference between the initial positions of the support pins 13 of [1] and [2] exists at the position corresponding to the support pins 13 of [2] on the back surface of the substrate 80. Assume that In this case, the support pins 13 included in [1] and [2] are brought into contact with the substrate 80 substantially simultaneously.

  However, the possibility of such a case occurring is very low, and in most cases, the timing of abutting the plurality of support pins 13 on the substrate 80 is shifted at least for each row.

  Further, the attitude of the base 8 a can be changed by the base control unit 8 c of the control unit 20. Therefore, for example, the board support device 10 acquires height information of various components mounted on the back surface of the board 80 from the component library of the component mounter, and the base 8a according to the height information. You may change the posture.

  That is, by changing the posture of the base 8a, the amount of deviation of the height position between the plurality of support pins 13 may be changed so that the amount of deviation and the height of these parts do not coincide.

  As described above, the substrate support device 10 according to the first embodiment performs positive control to vary the initial position in the height direction of at least two of the plurality of support pins 13 in the height direction. The impact exerted on the substrate 80 by the plurality of support pins 13 can be made weaker than before.

  Further, even when the substrate support device 10 sequentially supports the substrates 80 having different uneven shapes on the back surface of the substrate, the substrate support device 10 can accurately support the substrate according to each shape.

  7 and 8 show examples in which the base 8a is inclined only with respect to the X-axis direction. However, the inclination of the base 8a is not limited to this, and may not be parallel to both the X-axis direction and the Y-axis direction, for example.

  FIG. 9A is a diagram illustrating a case where the base 8a in the first embodiment is not parallel to the X-axis direction and the Y-axis direction.

  As shown in FIG. 9A, assuming a plane parallel to the XY plane below the base 8a, the distances between the four corners of the base 8a and the plane are h1, h2, h3, and h4. These relationships are h1> h2> h3> h4.

  When the base 8a is tilted in this way, the initial positions of almost all the support pins 13 can be varied.

  Moreover, the surface which contact | abuts the rear-end part of the several raising / lowering axis | shaft 14 of the base 8a may not be one plane.

  FIG. 9B is a diagram showing a first example of another shape of the base 8a, and FIG. 9C is a diagram showing a second example of another shape of the base 8a.

  Whether the base 8a has the shape shown in FIG. 9B or the shape shown in FIG. 9C, the initial positions of the plurality of support pins 13 can be made different.

  That is, the base 8a only needs to have a surface that is in contact with the rear end portions of the plurality of lifting shafts 14 and whose distance from the surface on which the member to be supported is supported is not constant.

  Further, when the base 8a has the shape shown in FIG. 9C, the support pins 13 can be sequentially brought into contact with each other from the vicinity of the center of the substrate 80 toward the outside.

  That is, by changing the posture of the base 8a or the shape of the base 8a, it is possible to change in what order and timing the support pins 13 abut on the substrate 80.

  Therefore, for example, the contact order and contact timing of the support pins 13 that can easily correct the distortion of the substrate 80 may be obtained, and the posture of the base 8a or the shape of the base 8a may be determined according to the result.

  In the first embodiment, the example in which the inclination of the base 8a is controlled by the base control unit 8c is shown. However, when the inclination of the base 8a can be determined in advance, the base 8a may be fixed to a predetermined inclination without using the base control unit 8c.

  In the first embodiment, the total length of the lifting shaft 14 and the support pin 13 used is the same or substantially the same. However, the timing of contacting the back surface of the substrate 80 is made different by making the total length of the elevating shaft 14 and the support pins 13 different from each other by making the base 8a horizontal without giving it an inclination. The same effect as in the first embodiment can be obtained.

(Embodiment 2)
As a second embodiment of the present invention, unlike the first embodiment, a substrate support device 30 capable of independently moving each of the plurality of support pins 13 will be described.

  First, the structure of the substrate support apparatus 30 of Embodiment 2 is demonstrated using FIGS. 10-12.

  FIG. 10 is an overview diagram showing an overview of the substrate support apparatus 30 of the second embodiment.

  A substrate support device 30 shown in FIG. 10 is another example of the member support device of the present invention. The substrate support device 30 is provided as a device for supporting the substrate in the component mounter, like the substrate support device 10 of the first embodiment.

  The board | substrate support apparatus 30 is provided with the support pin 13, the raising / lowering axis | shaft 14, the fixing | fixed part 21, the shaft holding body 6a, the separate drive part 7a, and the base 8d. The fixing | fixed part 21 has ER gel similarly to the fixing | fixed part 12 of Embodiment 1 (not shown in FIG. 10).

  The individual drive unit 7 a is a component that moves the support pins 13 in the support direction to bring the support pins 13 into contact with the substrate 80. Moreover, the individual drive part 7a is being fixed to the base 8d.

  In addition, the individual drive part 7a is an example of the structure part which implement | achieves execution of the contact step in the member support method of this invention. Moreover, in this Embodiment, the drive means in the member support apparatus of this invention is implement | achieved by the several separate drive part 7a. Specifically, the individual drive unit 7a is an air cylinder.

  The shaft holder 6a is a component that holds the elevating shaft 14 so as to be movable, and is fixed to the base 8d or the component mounting machine in parallel with the base 8d at a predetermined distance.

  Further, the shaft holder 6 a has a fixing portion 21. While the lifting shaft 14 is not fixed by the fixing portion 21, it can move in the Z-axis direction with respect to the shaft holder 6a.

  The fixing unit 21 is a component that restricts the vertical movement of the lifting shaft 14 by fixing the position of the lifting shaft 14 in a state where the support pin 13 is in contact with the substrate 80. Details of the fixing portion 21 will be described later with reference to FIG.

  In the present embodiment, movement restriction means in the substrate support apparatus of the present invention is realized by some or all of the plurality of fixing portions 21.

  The base 8 d is a base that is the basis of the substrate support device 30. Unlike the base 8a in the first embodiment, the base 8d is fixed to the component mounter, and the relative position in the component mounter is constant.

  FIG. 11A is a perspective view showing a configuration outline of the fixing portion 21 in the second embodiment, and FIG. 11B is a plan view showing a configuration outline of the fixing portion 21.

  As shown in FIG. 11A and FIG. 11B, the fixing portion 21 has an ER gel 22 and an electrode 23 for applying a predetermined voltage to the ER gel 22. The predetermined voltage in this embodiment is V1.

  The fixing portion 21 further has magnets 24 on the upper and lower sides on the same side as the ER gel 22 with respect to the lifting shaft 14.

  Specifically, the magnet 24 exhibits a function of pressing the lift shaft 14 and the ER gel 22 by attracting the excited lift shaft 14. Magnet 24 is a permanent magnet in the present embodiment.

  Note that, as the pressing force by the magnet 24, for example, a maximum value in a range that does not hinder the smooth vertical movement of the elevating shaft 14 by the individual driving unit 7a is determined.

  The material of the elevating shaft 14 is, for example, iron and has a property of being attracted to the magnet 24, and also functions as an electrode for applying the voltage V1 to the ER gel 22. That is, the voltage V <b> 1 is applied to the ER gel 22 through the lifting shaft 14 and the electrode 23.

  In the case where the lifting shaft 14 is pressed against the ER gel 22 using magnetic force as in the present embodiment, the lifting shaft can be used as long as it has the property of being attracted to the magnet 24 and is a conductive substance. The 14 materials are not limited to specific ones.

  Further, the substance having the property of being attracted to the magnet 24 and the conductive substance may not be the same. For example, the elevating shaft 14 may be iron covered with an aluminum thin film.

  The lifting shaft 14 may be hollow. Further, the elevating shaft 14 may be formed by using, for example, a non-metal such as plastic as a core material, and the surface thereof being covered with a substance having a property of being attracted to the magnet 24 and conductivity.

  That is, at least the elevating shaft 14 only needs to be configured so that the surface thereof is electrically conductive and is attracted by the magnet 24.

  Moreover, as long as the voltage V1 can be applied to the ER gel 22 together with the electrode 23, only a part of the lifting shaft 14 may have conductivity.

  Moreover, the electrode 23 which each fixing | fixed part 21 has, and each raising / lowering axis | shaft 14 are connected to the power supply part 26, and can turn on and off a voltage application.

  Specifically, when the switch of the power supply unit 26 is on, the voltage V <b> 1 is applied to the ER gel 22 existing between the electrode 23 and the lifting shaft 14.

  Further, the shear stress generated by applying a voltage to the ER gel 22 is as described with reference to FIG.

  Further, as shown in FIGS. 11A and 11B, the shaft holder 6a has a holding hole 6b for holding the elevating shaft 14 so as to be movable. There is a slight gap (for example, several tens of microns) between the inner surface of the holding hole 6 b and the lifting shaft 14.

  However, the lifting shaft 14 is pressed against the ER gel 22 by the attractive force of the magnet 24. Therefore, when the switch of the power supply unit 26 is turned on, the voltage V1 is applied to the ER gel 22 via the lifting shaft 14 and the electrode 23, and the vertical movement (Z-axis direction) of the lifting shaft 14 is restricted. The

  Further, when the voltage V1 is not applied to the ER gel 22, the elevating shaft 14 is movable with respect to the ER gel 22, and the presence of the gap causes the inner surface of the holding hole 6b to hinder the movement of the elevating shaft 14. Never become.

  Furthermore, even when the ER gel 22 or the lifting shaft 14 is worn, the presence of the magnet 24 ensures the contact between the lifting shaft 14 and the ER gel 22. That is, the fixing force of the position of the elevating shaft 14 by the ER gel 22 is ensured.

  FIG. 12 is a functional block diagram illustrating a functional configuration of the substrate support apparatus 30 according to the second embodiment.

  In FIG. 12, a set of the fixing portion 21, the support pin 13, the lifting shaft 14, and the individual driving portion 7 a is defined as a support portion 25. That is, the substrate support device 30 includes a plurality of support portions 25.

  As shown in FIG. 12, each operation of the fixing unit 21 and each operation of the individual driving unit 7 a are controlled by the control unit 40.

  Specifically, the control unit 40 controls the operation of the fixing unit 21 by controlling the switching on and off of the switch of the power supply unit 26 illustrated in FIG. 11. Further, by controlling the opening and closing of a valve between the individual drive unit 7a, which is an air cylinder, and an air pressure source (not shown in FIG. 12), the push-up and lowering of the support pin 13 are controlled.

  Next, operation | movement of the board | substrate support apparatus 30 of Embodiment 2 is demonstrated using FIGS.

  FIG. 13 is a flowchart showing an outline of an operation when the substrate support apparatus 30 according to the second embodiment supports a substrate.

  As shown in FIG. 13, the substrate support apparatus 30 raises the plurality of support pins 13 so that the plurality of support pins 13 abut on the substrate 80 at different timings (S200).

  Thereby, the tip portions of the plurality of support pins 13 come into contact with the substrate 80.

  Specifically, in the present embodiment, the control unit 40 controls the plurality of individual driving units 7 a to raise the plurality of support pins 13 for each group including one or more support pins 13.

  That is, one or more support pins 13 belonging to the first group are raised (S201), and then one or more support pins 13 belonging to the second group are raised (S202).

  That is, a first moving step of moving one support pin 13 of the plurality of support pins 13 in the direction of the substrate 80 during the operation of bringing the tip portions of the plurality of support pins 13 into contact with the substrate 80; A second moving step of moving the support pins 13 other than the one support pin 13 in the direction of the substrate 80 at a timing different from the timing of the movement of the one support pin 13 in the first movement step. .

  Thereafter, the control unit 40 fixes the position of each lifting shaft 14 by turning on a switch that applies a predetermined voltage to each fixing unit 21 in a state where all the support pins 13 are in contact with the substrate 80. (S210).

  Thus, the board | substrate support apparatus 30 of this Embodiment has shifted the raise timing of the some support pin 13 by controlling the some separate drive part 7a. As a result, the timing at which the plurality of support pins 13 abut on the substrate 80 is shifted.

  FIG. 14 is a diagram for explaining the arrangement of the support pins 13 in the second embodiment.

  As shown in FIG. 14, the shaft holder 6a according to the second embodiment has a plurality of holding holes 6b on which the elevating shaft 14 slides, and a plurality of support pins 13 are arranged at positions corresponding to these. Is done.

  That is, as shown in FIG. 14, when the rows A to D and the columns [1] to [5] are defined, one support pin 13 is arranged at a position where each row and each column intersect. . In addition, one individual drive unit 7 a is arranged below each support pin 13.

  FIG. 15 is a diagram for explaining the arrangement of the individual drive units 7a in the second embodiment.

  As shown in FIG. 15, each of the plurality of individual driving units 7a is defined as A1 to D5. Each of the names A1 to D5 represents a combination of a row and a column. For example, the individual driving unit 7a corresponding to the B row [3] column is represented as “B3”.

  Corresponding to each of these A1 to D5, there is a valve (not shown) for controlling on and off of the supply of air pressure from the air pressure source. These valves are controlled by the control unit 40. That is, the control part 40 controls each operation | movement of A1-D5 by controlling ON and OFF of these valves.

  Note that turning on the valve means opening the valve, and turning off the valve means closing the valve.

  FIG. 16 is a diagram illustrating an example of operation timings of the plurality of individual driving units 7 a under the control of the control unit 40.

  In the example shown in FIG. 16, the control unit 40 shifts the timing for turning on the valve for each individual drive unit 7a.

  Specifically, the control unit 40 operates the individual drive unit 7a belonging to the A row and the individual drive unit 7a belonging to the D row alternately, and then the individual drive unit 7a belonging to the B row and the C row. The individual driving units 7a belonging to the above are alternately operated.

  As a result, the support pins 13 belonging to the A row and the support pins 13 belonging to the D row alternately rise, and then the support pins 13 belonging to the B row and the support pins 13 belonging to the C row alternately rise. .

  FIG. 17 is a diagram illustrating another example of the operation timings of the plurality of individual driving units 7 a under the control of the control unit 40.

  In the example illustrated in FIG. 17, the control unit 40 shifts the timing for turning on the valve for each column to which the individual driving unit 7 a belongs.

  Specifically, the control unit 40 first operates the individual drive units 7a belonging to the [1] column, and then sequentially operates the individual drive units 7a belonging to the [2] to [5] columns.

  FIG. 18 is a diagram illustrating the operation of the substrate support apparatus 30 when each valve is turned on at the timing shown in FIG.

  When the valves of each of the plurality of individual driving units 7a are turned on at the timing shown in FIG. 17, as shown in FIG. 18, the support pins 13 belonging to the [5] row in order from the support pins 13 belonging to the [1] row. Ascending up in time series.

  As a result, the timing of contact with the substrate 80 of each of the plurality of support pins 13 is shifted.

  As described above, the substrate support apparatus 30 according to the second embodiment includes a plurality of individual driving units 7a that independently move the plurality of support pins 13, and further controls the plurality of individual driving units 7a. Is provided.

  The control unit 40 controls the two or more individual driving units 7a so that the timing at which the two or more support pins 13 move in the support direction, that is, the timing at which they rise, deviate from each other.

  That is, in the substrate support device 30, the control unit 40 controls the plurality of individual driving units 7 a to positively change the timing at which the plurality of support pins 13 come into contact with the substrate 80.

  As described above, the timing at which the plurality of support pins 13 come into contact with the substrate 80 is shifted, so that the impact applied to the substrate 80 by the support pins 13 is dispersed, and the substrate 80 is safely supported.

  Each support pin 13 stops when it abuts on the substrate 80. Therefore, even when components are mounted on the back surface of the substrate 80, the plurality of support pins 13 stop at positions along the concavo-convex shape formed by these components. Further, the plurality of support pins 13 are fixed by the fixing portion 21 in that state.

  As described above, the substrate support apparatus 30 according to the second embodiment is an apparatus that can support the substrate 80 stably and safely, similarly to the substrate support apparatus 10 according to the first embodiment.

  FIG. 18 shows a case where no component is mounted on the back surface of the substrate 80. However, even in the case where components are mounted on the back surface of the substrate 80, it is the same as in the first embodiment in that the safety when supporting the substrate 80 is improved as compared with the conventional case.

(Supplementary items of Embodiments 1 and 2)
In the first and second embodiments, the drive unit 7 and the individual drive unit 7a may not be air cylinders. If the drive unit 7 and the individual drive unit 7a can be controlled by the control unit 20 or 40 and can raise the elevating shaft 14 and the support pin 13 until the upper end of the support pin 13 contacts the substrate, for example, hydraulic pressure Alternatively, another type of device using a motor or the like may be used.

  Similarly, the base lifting / lowering unit 8b may be another type of device instead of an air cylinder.

  Further, the support pin 13 and the elevating shaft 14 may not be separate. For example, the upper end portion of the lifting shaft 14 may serve as the support pin 13.

  The substrate supporting devices 10 and 30 include 20 sets of support pins 13 and lifting shafts 14. However, the number of sets is not limited to a specific one.

  Moreover, the board | substrate which the board | substrate support apparatuses 10 and 30 support is not limited to a specific kind. For example, a rigid substrate using an inflexible material for the insulator base material or a flexible substrate using a flexible material may be used. Further, it may be a rigid-flex board that is a multilayer board having a rigid part on which components are mounted and a bendable flex part.

  Since the substrate support devices 10 and 30 do not continue to push the substrate with the elastic force of the spring, the substrate is supported so as to maintain a safe and normal posture even when supporting such a substrate that is easily deformed. Can be supported.

  In the first and second embodiments, the substrate support devices 10 and 20 that support the substrate in the component mounter have been described.

  FIG. 19 is a plan view showing a schematic configuration of the component mounter 100 including the board support device 10 or 30.

  A component mounter 100 shown in FIG. 19 includes a transport rail 90, a component supply unit 110, a transfer head 120, a nozzle station 130, and a substrate support device 10 (30).

  The board 80 carried into the component mounter 100 is transported to a predetermined position by the transport rail 90. The board | substrate 80 conveyed to the predetermined position is supported by the board | substrate support apparatus 10 (30). Moreover, the transfer head 120 adsorbs the components supplied from the component supply unit 110 and moves to above the substrate 80 supported by the substrate support device 10 (30). Further, the component is mounted on the substrate 80. These series of component adsorption and mounting operations are performed until the mounting of the components on the board 80 is completed.

  When the mounting of the component on the substrate 80 is completed, the substrate 80 is unloaded by the transport rail 90, the next substrate is loaded into the component mounting machine 100, and the above-described component mounting operation is repeated.

  Moreover, the transfer head 120 moves to the upper part of the nozzle station 130 as necessary, and replaces the nozzle attached to the transfer head 120 with the nozzle held by the nozzle station 130.

  In the component mounter 100, the component mounting operation is performed in this way.

  As described above, the substrate support devices 10 and 30 are useful as devices for supporting a substrate from below in a component mounter.

  However, the present invention can also be applied as a member supporting apparatus and a supporting method in other apparatuses.

  For example, the present invention can also be applied as a substrate support apparatus and a support method in various component mounting board manufacturing apparatuses for manufacturing a component mounting board.

  As such a component mounting board manufacturing apparatus, in addition to a component mounting machine, a printer provided with a solder printing means for printing or applying solder on a board, an adhesive application provided with an adhesive applying means for applying an adhesive to the board There are machines.

  For example, in a screen printing machine that applies a conductive paste such as solder paste to a substrate, when the conductive paste is applied to the substrate, the squeegee applies the conductive paste to the substrate over the masked substrate except for the application location. Move to fill. That is, the substrate receives a force from above from the squeegee.

  Therefore, it is important to support the substrate firmly and safely in the screen printer. In addition, when a component is mounted on the back surface of the substrate, that is, the back surface of the substrate may have an uneven shape, the member support device and the member support method of the present invention are used as a substrate support method in a screen printer and Use as a support device is useful.

  Moreover, it can be used not only when a conductive paste such as a solder paste is applied to a substrate with a squeegee, but also when the conductive paste is applied with a coating machine.

  In addition, the effect of the present invention can be obtained if it is also used for supporting a substrate when an adhesive is applied before mounting a component on the substrate.

  Further, the present invention is also useful as a support method and a support device for supporting, for example, a metal having irregularities on the surface to be supported, work such as polishing, cutting, and component mounting on wood or the like.

  The member support device and the member support method according to the present invention allow a plurality of support members to contact each other when the member is subjected to some work, with the timing being substantially shifted from the opposite side of the member to the work side. A method and an apparatus for fixing the position of a support in a state where the support is in contact.

  Therefore, the present invention is not limited to the case where the member to be supported is a substrate on which no component is mounted on the back surface and a substrate on which one or more components are mounted on the back surface, as in the substrate support devices 10 and 30. It can be implemented as a member support device and a member support method during various operations on various members constituting the industrial product.

  Further, the support direction does not need to be a support direction from bottom to top as in the substrate support devices 10 and 30. For example, when a component is attached while applying a force to the right side surface of a certain member, the direction in which the member is supported is a direction from left to right. In this case, the support may be brought into contact with the member from the left side of the member, and the position of the support may be fixed in the contacted state.

  In short, as described above, regardless of what material the member to be supported is, what uneven shape is on the side opposite to the work side, and in which direction the support direction is Regardless of whether it is present, the present invention can be implemented, and the member to be supported can be supported in a safe and normal posture.

  Specifically, the size, shape, hardness, number, and arrangement of the support and the position of the support are fixed according to the size and weight of the member to be supported, the magnitude of the force applied during work, etc. What is necessary is just to determine the fixing force at the time of doing.

  Thus, the present invention can be implemented as a method and apparatus for supporting a member regardless of the material and support direction of the member, and can support the member stably and safely.

  Moreover, the fixed part 12 and the fixed part 21 fixed the position of the raising / lowering axis | shaft 14 using ER gel. However, the position of the lifting shaft 14 may be fixed by another means.

  For example, you may fix the position of the raising / lowering axis | shaft 14 using ER fluid. In this case, the ER fluid may be prevented from leaking using a sealing material such as packing.

  Further, for example, the position of the elevating shaft 14 may be fixed by using a Magneto Rheological (MR) fluid whose viscosity increases by applying a magnetic field or an MR gel obtained by gelling an MR fluid.

  In this case, an electromagnet is used as means for applying a magnetic field to the MR fluid or MR gel, and a power supply unit for applying a voltage to the ER gel 17 in the first embodiment or the ER gel 22 in the second embodiment is connected to the electromagnet. do it.

  Further, for example, the position of the elevating shaft 14 may be fixed using a dielectric material.

  For example, two electrodes each covered with an insulator are arranged so as to sandwich the lifting shaft 14, and the lifting shaft is grounded. A positive voltage is applied to the two electrodes. As a result, the two electrodes have a positive potential, and a negative potential appears on the side of the lift shaft 14 of each insulator. Further, the two surfaces on both electrode sides of the lifting shaft 14 are positively charged.

  Thereby, an electrostatic force attracting each other acts between the lifting shaft 14 and the two insulators, and this electrostatic force acts as a force for fixing the lifting shaft 14.

  Further, the position of the lifting shaft 14 may be mechanically fixed. For example, the position of the lifting shaft 14 may be fixed by a mechanism that sandwiches the lifting shaft with rubber.

  That is, as long as the position of the lifting shaft 14 can be substantially fixed, the mechanism or mechanism for fixing the position of the lifting shaft 14 is not limited to a specific one.

  The present invention can be applied to a method and an apparatus for supporting a member when an operation is performed on the member. In particular, a component mounting machine for mounting a component such as a semiconductor element in a component mounting on a substrate, a printing machine for printing a conductive paste such as a solder paste on a substrate, and a component support method in an adhesive application machine for applying an adhesive, and It is useful as a component support device.

  The present invention is also useful as a component mounter, a screen printer, or the like that executes the component support method described above or includes the component support device.

1 is an overview diagram showing an overview of a substrate support apparatus according to a first embodiment. FIG. 3 is a perspective view showing an external appearance of a pin unit in the first embodiment. (A) is a figure which shows an example of the internal structure of the pin unit in Embodiment 1, (B) is a figure which shows another example of the internal structure of the pin unit in Embodiment 1. FIG. It is a figure which shows the relationship between the applied voltage in Embodiment 1, and the retention strength by ER gel. FIG. 3 is a functional block diagram illustrating a functional configuration of the substrate support apparatus according to the first embodiment. It is a flowchart which shows the outline | summary of operation | movement when the board | substrate support apparatus of Embodiment 1 supports a board | substrate. It is a figure which shows the relationship between the inclination of the base in Embodiment 1, and the initial position of each support pin. 6 is a diagram illustrating an example of timing at which a plurality of support pins abut on a substrate in Embodiment 1. FIG. (A) is a figure which shows the case where the base in Embodiment 1 is not parallel to an X-axis direction and a Y-axis direction, (B) is a figure which shows the 1st example of another shape of a base. (C) is a figure which shows the 2nd example of another shape of a base. FIG. 5 is an overview diagram showing an overview of a substrate support apparatus according to a second embodiment. (A) is a perspective view which shows the structure outline | summary of the fixing | fixed part in Embodiment 2, (B) is a top view which shows the structure outline | summary of the fixing | fixed part in Embodiment 2. FIG. FIG. 6 is a functional block diagram illustrating a functional configuration of a substrate support apparatus according to a second embodiment. It is a flowchart which shows the outline | summary of operation | movement when the board | substrate support apparatus of Embodiment 2 supports a board | substrate. FIG. 10 is a diagram for explaining an arrangement of support pins in the second embodiment. FIG. 10 is a diagram for explaining an arrangement of individual drive units in the second embodiment. FIG. 10 is a diagram illustrating an example of operation timings of a plurality of individual drive units under the control of a control unit in the second embodiment. FIG. 10 is a diagram illustrating another example of operation timings of a plurality of individual drive units under the control of a control unit in the second embodiment. It is a figure which shows operation | movement of the board | substrate support apparatus when each valve | bulb is turned on at the timing shown in FIG. It is a top view which shows the structure outline | summary of the component mounting machine provided with the board | substrate support apparatus of Embodiment 1 or 2.

Explanation of symbols

6, 6a Shaft holder 6b Holding hole 7 Drive unit 7a Individual drive unit 8a, 8d Base 8b Base lift unit 8c Base control unit 10, 30 Substrate support device 11 Pin unit 12, 21 Fixing unit 13 Support pin 14 Lift Axis 15 Unit side terminal 16 Power source side terminal 17, 22 ER gel 18, 23 Electrode 19 Biasing body 19a Fixing plate 20 Control part 24 Magnet 25 Support part 26 Power supply part 40 Control part 80 Substrate 90 Transport rail 100 Component mounting machine 110 Parts Supply unit 120 Transfer head 130 Nozzle station

Claims (12)

A member support device for supporting a member by a plurality of supports,
A plurality of supports provided at positions facing the supported surface of the member;
A holding body that holds the plurality of supports so as to be movable in both directions parallel to a support direction in which the support supports the member;
Drive means for bringing the tip of each of the plurality of supports into contact with the member by moving the holding body in the support direction;
By controlling the driving means, by moving the holding body in the support direction in a state in which the position of the support direction of each of the two or more support bodies of the plurality of support bodies is different, Control means for varying the timing at which the respective tip portions of the two or more supports contact the member;
A member support device, comprising: movement restriction means for fixing the positions of the plurality of supports in a state in which tips of the plurality of supports are in contact with the member. Further, each of the plurality of supports is a surface that is in contact with a rear end portion that is an end portion on the opposite side to the front end portion, and is a surface that is not constant in distance from the supported surface of the member. A base having a rear end abutting surface;
The control means controls the driving means to bring the rear end portions of the plurality of support bodies into contact with the rear end contact surfaces, whereby the front end portions of the two or more support bodies are brought into contact with each other. The member support device according to claim 1, wherein positions in the support direction are made different. The control means further changes the posture of the base relative to the member, thereby tilting the rear end abutting surface with respect to the surface supported by the member, and controlling the driving means, The member support device according to claim 2, wherein rear end portions of a plurality of supports are brought into contact with the rear end contact surface inclined with respect to a surface supported by the member. The lengths in the support direction of the two or more supports are different from each other,
The member support device is further a surface that abuts on a rear end portion that is an end portion on the opposite side of the tip portion of each of the plurality of support bodies, and a distance from a surface on which the member is supported is constant. Comprising a base having a rear end abutment surface,
The control means controls the driving means to bring the rear end portions of the plurality of support bodies into contact with the rear end contact surfaces, whereby the front end portions of the two or more support bodies are brought into contact with each other. The member support device according to claim 1, wherein positions in the support direction are made different. The movement restricting means includes a plurality of fixing means,
Each of the plurality of fixing means fixes the position of one of the plurality of supports relative to the holding body,
A plurality of support units are attached to the holding body,
Each of the plurality of support units holds the support so as to be movable in both directions parallel to the support direction, has the fixing means, and the fixing means positions the support with respect to the holding body. The member supporting device according to claim 2, wherein the member supporting device is fixed. The fixing means includes a functional material disposed on a side surface of the support, and voltage applying means for applying a predetermined voltage to the functional material,
The support unit further includes a biasing unit that applies a biasing force to the functional material to press the functional material against a side surface of the support.
The support is held movably on the support unit by being in contact with the functional material,
The fixing means fixes the position of the support relative to the holding body by applying the predetermined voltage to the functional material in a state where the functional material is pressed against a side surface of the support. And
The member support device according to claim 5, wherein the functional material is any one of an electrorheological fluid, a magnetorheological fluid, an electrorheological gel, a magnetorheological gel, or a dielectric material. A member support device for supporting a member by a plurality of supports,
A plurality of supports provided at positions facing the supported surface of the member;
A plurality of individual driving means for abutting the tip of each of the plurality of supports to the member by moving each of the plurality of supports in the direction of the member;
By changing the timing of moving the support of each of the two or more individual drive means of the plurality of individual drive means, the tip of each of the two or more support bodies of the plurality of support bodies becomes the member. Control means for varying the timing of contact;
A member support device, comprising: movement restriction means for fixing the positions of the plurality of supports in a state in which tips of the plurality of supports are in contact with the member. The movement restricting unit includes a functional material disposed on a side surface of the plurality of supports, and a voltage applying unit that applies a predetermined voltage to the functional material, and the predetermined voltage is applied to the functional material. Is applied to fix the positions of the plurality of supports,
The member support device according to claim 7, wherein the functional material is one of an electrorheological fluid, a magnetorheological fluid, an electrorheological gel, a magnetorheological gel, or a dielectric material. A component mounting board manufacturing apparatus for manufacturing a component mounting board,
The member support device according to any one of claims 1 to 8,
Manufacturing a component mounting board comprising: a solder printing unit that prints or applies solder to a substrate that is the member supported by the member supporting device; an adhesive application unit that applies an adhesive; or a mounting unit that mounts a component. apparatus. A member support method for supporting a member by a plurality of supports,
The plurality of supports are held by a single holding body so as to be movable in both directions parallel to a support direction, which is a direction for supporting the member,
The member support method includes:
A tip end positioning step for changing the positions in the support direction of the tip ends of two or more supports out of the plurality of supports in a state where the plurality of supports are held by the holder;
An abutting step of raising the holding body and abutting the distal end portions of the plurality of support members against the member after the distal end portion positioning step;
A member supporting method comprising: a fixing step of fixing positions of the plurality of supports in a state in which tips of the plurality of supports are in contact with the member in the contact step. A member support method for supporting a member by a plurality of supports,
An abutting step of abutting the respective distal ends of the plurality of supports against the member by moving the plurality of supports in the direction of the member;
A fixing step of fixing the positions of the plurality of supports in a state in which the tips of the plurality of supports are in contact with the member in the contact step;
The contact step includes
A first moving step of moving one of the plurality of supports in the direction of the member;
A second movement step of moving a support body other than the one support body in the direction of the member at a timing different from the movement timing of the one support body in the first movement step. A component mounting board manufacturing method for manufacturing a component mounting board,
A support step for supporting a substrate by the member support method according to claim 10 or 11,
A component mounting board manufacturing method comprising: a solder printing step for printing or applying solder to the substrate supported in the supporting step; an adhesive application step for applying an adhesive; or a mounting step for mounting a component.

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