JP2010245236A - Method for supporting substrate, substrate supporting device, component mounting method, and component mounting machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for supporting a substrate, a substrate supporting device, a component mounting method and a component mounting machine, allowing a stable support of the substrate when mounting a component thereon, even if the substrate is highly flexible. <P>SOLUTION: The method for supporting the substrate from below on which the component is mounted from above using a plurality of supports includes an abutting step (S10) of making the substrate into an upper-convexed shape by moving the plurality of supports toward the substrate to abut the substrate, and a holding step (S20) of holding the plurality of supports with a predetermined amount of a holding force so that the plurality of supports are fixed in their respective positions while the substrate is in the upper-convexed state. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate support device and a substrate support method, a component mounter, and a component mounting method that support a substrate when a component is mounted on the substrate.

  Conventionally, in the manufacturing process of industrial products such as electronic devices, various electronic components (hereinafter simply referred to as “components”) including a semiconductor bare chip on a printed circuit board (hereinafter simply referred to as “substrate”) constituting the industrial product. ) And a lot of processes for applying a liquid agent are included.

  In these various processes, it is necessary to stably support the substrate in order to stabilize the operation and improve the operation accuracy.

  In recent years, components are often mounted on a flexible substrate, and the flexible substrate is highly flexible, so that deformation such as bending is likely to occur. Recently, there is a rigid flexible substrate having both a flexible substrate and a conventional substrate (rigid substrate), and deformation such as bending of the substrate may occur greatly.

  Therefore, a technique for stably supporting the substrate is also disclosed (for example, see Patent Document 1).

  The substrate support device described in Patent Document 1 includes a plurality of support pins that support a substrate, and suction holes are provided at the upper ends of the support pins. These suction holes communicate with a vacuum suction chamber, and the back surface of the substrate is adsorbed by sucking air from these suction holes.

  The substrate support device attempts to stabilize the support of the substrate by adsorbing the back surface of the substrate in this way.

  Further, there are cases where the surface supported by the substrate has an uneven shape, such as when one or more components have already been mounted on the back surface of the substrate on which the component is to be mounted.

  Therefore, a technique for stably supporting such a substrate is also disclosed (for example, see Patent Document 1).

  The substrate support apparatus described in Patent Document 2 includes a storage device that stores support pin data. The support pin data is information for specifying the support pin to be raised according to the shape of the substrate to be supported and the presence / absence of components on the back surface of each of the substrates.

  In the board support device, when supporting a certain board, by referring to the support pin data, only the support pin located immediately below the part where the components on the back surface of the board are not mounted is raised.

  Thereby, even when a component is mounted on the back surface of the substrate to be supported, the substrate can be supported.

JP-A-11-112198 Japanese Patent Laid-Open No. 03-120798

  However, as in the substrate support device of Patent Document 1, when the support pins are attracted to the back surface of the substrate, there are components on the back surface. Airtightness may not be maintained and adsorbed air leakage may occur. In addition, there may be a situation in which sufficient suction force cannot be exerted, such as dust clogged in the suction hole at the upper end of the support pin.

  As described above, when the suction force against the substrate is reduced due to leakage of suction air and clogging of the suction holes, it becomes difficult to stably support the substrate.

  Further, when the support pins are selectively raised with reference to the support pin data as in the substrate support device described in Patent Document 2, the size of the support pin data increases as the types of substrates to be handled increase. That is, there is a problem that management of support pin data becomes complicated.

  Further, when a large number of components are already mounted on the surface to be supported by the substrate, the substrate is supported by a very small number of support pins. For this reason, the stability of the substrate may be lost.

  In particular, when supporting a board that is made of a material with high flexibility at least partially, such as a flexible board and a rigid flexible board, stable support improves the reliability of work such as component mounting. It is important to make it.

  In consideration of the above-described conventional problems, the present invention provides a substrate support method, a substrate support apparatus, and a component that can stably support even when the substrate is a highly flexible substrate when the component is mounted on the substrate. It is an object to provide a mounting method and a component mounting machine.

  In order to achieve the above object, a substrate support method of the present invention is a substrate support method for supporting a substrate on which a component is mounted from above using a plurality of supports from below, wherein the plurality of supports is mounted on the substrate. A plurality of supporting members in a state in which the substrate is projected upward by moving in the direction of the substrate and contacting the substrate from below; A holding step of holding the plurality of supports with a predetermined holding force so as to fix the respective positions.

Thus, in the substrate support method of the present invention, the substrate is supported in an upward convex shape.
For example, when a plurality of substrates to be supported are substrates that have the property of being easily deformed such as bending due to their high flexibility, where the deformation is present when supporting the substrate, It is impossible to predict how much the amount (for example, the amount of upward or downward deviation from the normal position of one point on the substrate) is.

  Therefore, in the substrate support method of the present invention, the substrate is positively convexed upward by bringing a plurality of supports into contact with the substrate from below.

  Thereby, for example, the upper end of the support body does not reach the board due to the board being bent, and components are prevented from being mounted in a state where the board floats from the support body. That is, even if the substrate to be supported is a flexible and easily deformable substrate, it is stably supported and enables reliable component mounting.

  Further, the substrate support method of the present invention further includes pressing the substrate by a pressing force of the component against the substrate when the component is mounted on the substrate in a state where the positions of the plurality of supports are held. One or more support bodies on the opposite side to the part may be pushed back to move downward.

  In this manner, the upward shift of the component mounting position due to the upward convex shape of the substrate is absorbed by the downward movement of the support. Thereby, for example, a component with low load resistance can be protected from a pressing force applied during component mounting.

  Further, the component mounting method of the present invention is a component mounting method for mounting a component on a substrate supported by the substrate support method of the present invention, wherein the positions of the plurality of supports are held in the holding step. And a mounting step of mounting the component on the substrate from above the substrate by a suction nozzle that sucks the component.

  Further, the component mounting method of the present invention is a component mounting method for mounting a component on a substrate supported by the substrate support method of the present invention, wherein the component mounting position of the substrate is formed by making the substrate convex upward. A measuring step for measuring the amount of deviation, a correction step for correcting mounting position information indicating the component mounting position using the amount of deviation measured in the measuring step, and a holding step for each of the plurality of supports. A mounting step of mounting the component at the component mounting position by the suction nozzle that sucks the component using the mounting position information corrected in the correction step in a state where the position is held may be included.

  In this way, by correcting the deviation in the height direction of the component mounting position during component mounting, even if the amount of deviation caused by the substrate being convex upward is relatively large, Parts are mounted.

  In addition, the present invention can be realized as a substrate support apparatus that executes various operations included in the substrate support method of the present invention.

  Further, the present invention can also be realized as a component mounter including the substrate support device of the present invention as a device for supporting a substrate.

  Furthermore, the present invention can be realized as a program including the characteristic steps in the substrate support method of the present invention, realized as a storage medium such as a CD-ROM storing the program, or realized as an integrated circuit. it can. The program can also be distributed via a transmission medium such as a communication network.

  The present invention provides a substrate support method, a substrate support apparatus, a component mounting method, and a component mounter that can stably support a substrate even when the substrate is a highly flexible substrate when mounting the component on the substrate. can do.

It is a top view which shows the structure outline | summary of the component mounting machine of embodiment of this invention. It is a general-view figure which shows the general appearance of the board | substrate support apparatus of embodiment of this invention. FIG. 3A is a top view illustrating an example of a substrate supported by the substrate support apparatus according to the embodiment. FIG. 3B is a side view of the substrate shown in FIG. It is a perspective view which shows the external appearance of the pin unit in embodiment. (A) is a figure which shows an example of the internal structure of the pin unit of embodiment, (B) is a figure which shows another example of the internal structure of the pin unit of embodiment. It is a figure which shows the relationship between the applied voltage and the retention strength by ER gel in embodiment. It is a figure which shows the wiring with respect to the several pin unit in embodiment. It is a functional block diagram which shows the functional structure of the board | substrate support apparatus of embodiment. It is a flowchart which shows the outline | summary of operation | movement of the component mounting machine when the board | substrate support apparatus of embodiment supports a board | substrate. It is a schematic diagram which shows the flow of operation | movement of the component mounting machine in embodiment. It is a figure which shows a mode that the support pin in embodiment moves below in the case of component mounting. (A) is a figure which shows a mode that the conveyance conveyor in embodiment fixes the both ends of a board | substrate, (B) is a mode that the amount of bending of a board | substrate reduces by a movable rail moving. FIG. (A) is a figure which shows an example of the structure for implement | achieving control of the holding force with respect to a raising / lowering axis | shaft using ER fluid, (B) controls the holding force with respect to a raising / lowering axis | shaft using electrostatic force. It is a figure which shows an example of the structure for implement | achieving. It is a figure which shows an example of the structure for implement | achieving control of the holding force with respect to a raising / lowering axis | shaft using an air cylinder. It is a figure which shows the board | substrate support apparatus which has a function which raises several support pins separately.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, the configuration of the component mounter 100 according to the embodiment will be described with reference to FIG.

FIG. 1 is a plan view showing a schematic configuration of a component mounter 100 according to an embodiment of the present invention.
A component mounter 100 shown in FIG. 1 includes a conveyor 90, a component supply unit 110, a transfer head 120, a nozzle station 130, a substrate support device 10, a substrate recognition camera 122, and a component recognition camera 131. Prepare.

  The board 80 carried into the component mounting machine 100 is transported to a predetermined position by the transport conveyor 90 and positioned. The positioned substrate 80 is supported by the substrate support device 10.

  The transfer head 120 has a plurality of suction nozzles. The plurality of suction nozzles suck parts supplied from the part supply unit 110. Thereafter, the transfer head 120 moves above the substrate 80 supported by the substrate support apparatus 10.

  When the transfer head 120 moves above the substrate 80, each of the plurality of suction nozzles mounts a component that is sucked on the substrate 80.

  The substrate recognition camera 122 is provided integrally with the transfer head 120, moves on the substrate 80 together with the transfer head 120, and recognizes the position of the substrate mark provided at the corner of the substrate 80.

  The substrate recognition camera 122 recognizes the image of the substrate mark, thereby obtaining a correction amount based on the amount of displacement of the substrate 80 in the direction parallel to the XY plane, the amount of rotational displacement of the substrate 80, the amount of expansion and contraction of the substrate 80, and the like. . The obtained correction amount is used to correct the component mounting position during component mounting.

  Further, the component recognition camera 131 can recognize the suction state of the component sucked by the transfer head 120 in two dimensions or three dimensions. A correction amount is obtained based on the amount of deviation between the center position of the suction nozzle and the center position of the component recognized by the component recognition camera 131, the tilt amount of the component, and the like. The obtained correction amount is used for correcting the component mounting position together with the correction amount based on the board mark.

  These series of component mounting operations are performed until the mounting of the number and types of components allocated to the component mounting machine 100 to the board 80 is completed.

  When the component mounting operation on the substrate 80 is completed, the substrate 80 is unloaded by the transfer conveyor 90, the next substrate 80 is loaded into the component mounting machine 100, and the above-described component mounting operation is repeated.

  Moreover, the transfer head 120 moves to the upper part of the nozzle station 130 and replaces the suction nozzle attached to the transfer head 120 with the suction nozzle held by the nozzle station 130 as necessary.

  The conveyor 90 has a fixed rail 90a and a movable rail 90b. The fixed rail 90a is fixed to the component mounting machine 100, but the movable rail 90b is movable in the Y-axis direction. That is, the horizontal width (width in the Y-axis direction) of the transfer conveyor 90 is variable, and thus the transfer conveyor 90 can transfer substrates 80 of various sizes.

  Next, the board | substrate support apparatus 10 with which the component mounting machine 100 is provided is demonstrated using FIGS.

FIG. 2 is an overview diagram showing an overview of the substrate support apparatus 10 according to the embodiment of the present invention.
A board support device 10 shown in FIG. 2 is provided in the component mounter 100 as a device for supporting the board 80. The board | substrate support apparatus 10 can support the board | substrate 80 conveyed by the conveyance conveyor 90 from the downward direction.

  In the component mounter 100, the substrate 80 is supported from below by the substrate support device 10, so that components can be mounted from above the substrate 80. The board | substrate 80 is also an example of the board | substrate supported by the board | substrate support apparatus and board | substrate support method of this invention including the components, when the components are mounted.

  As shown in FIG. 2, the direction parallel to the transport direction of the substrate 80 is the X-axis direction, the direction parallel to the lifting shaft 14, that is, the direction parallel to the support direction of the substrate 80 is the Z-axis direction, A direction perpendicular to the axial direction and the Z-axis direction is taken as a Y-axis direction.

  Further, in the following description, for example, when “the support pin 13 abuts on the substrate 80”, the front end portion of the support pin 13 directly abuts on the substrate 80, or the front end portion of the support pin 13 is the back surface of the substrate 80. This means that the component is in contact with the component mounted on the board.

  Furthermore, when the board | substrate 80 is pinched | interposed into the jig | tool, it includes that the front-end | tip part of the support pin 13 contact | abuts to the said jig | tool.

  As shown in FIG. 2, the substrate support apparatus 10 includes a pin unit 11, a moving body 6, a drive unit 7, a base 8, a control unit 20, and a power supply unit 26.

  In the present embodiment, a plurality of pin units 11 are detachably attached to the moving body 6. The pin unit 11 includes a support pin 13 and a lifting shaft 14.

  The support pin 13 is a member that supports the substrate 80 and is connected to a lifting shaft 14 that is held by the pin unit 11 so as to be movable in the vertical direction. Further, the plurality of pin units 11 are provided at positions where the support pins 13 of each of the pin units 11 face the back surface of the upper substrate 80.

  The pair of support pins 13 and the lifting shaft 14 are an example of a support in the substrate support method and the substrate support apparatus of the present invention.

  The drive unit 7 is an air cylinder in the present embodiment, and is fixed to the base 8. The drive unit 7 moves the plurality of pin units 11 held by the moving body 6 in a lump by moving the moving body 6 in accordance with an instruction from the control unit 20. Thereby, the tip portions of the plurality of support pins 13 can be brought into contact with the substrate 80.

  The plurality of elevating shafts 14 can move in both directions parallel to the supporting direction independently of the moving body 6. Therefore, even when a mounted component is present on the surface supported by the substrate 80, even if the surface supported by the substrate 80 has an uneven shape, the plurality of support pins 13 abut along the shape.

  Further, the control unit 20 applies a predetermined voltage to each pin unit 11 by controlling the power supply unit 26 in a state where the plurality of support pins 13 are in contact with the substrate 80. As a result, each pin unit 11 supports the substrate 80 by holding the lifting shaft 14 of the pin unit 11 with a holding force corresponding to the applied voltage.

  Further, the control unit 20 controls the holding force at which each pin unit 11 holds the lifting shaft 14 by controlling the magnitude of the voltage applied to the plurality of pin units 11.

  FIG. 3A is a top view illustrating an example of the substrate 80 supported by the substrate support apparatus 10 according to the embodiment.

FIG. 3B is a cross-sectional view taken along line AA of the substrate 80 shown in FIG.
A substrate 80 shown in these drawings is a rigid flexible substrate integrally including a flexible substrate 80b and a rigid substrate 80a.

  As shown in FIG. 3A, the substrate 80 includes four rigid substrates 80a and two flexible substrates 80b.

  Here, generally, a flexible substrate is obtained by applying printed wiring to a resin sheet, and a plurality of wiring patterns are formed on one flexible substrate. Also, a flexible circuit board is configured by mounting components such as an IC, a capacitor, a resistor, a coil, and a connector on the wiring pattern. And this flexible circuit board is built in an apparatus.

  Such a flexible circuit board can reduce the thickness and thickness of the board. Further, since it can be bent and folded, it has the feature that it can be downsized without the need for a special joint portion even with respect to the movable portion of the device, following the complicated shape of the device.

  In particular, a resin sheet having a thickness of about 10 μm is possible, and a flexible substrate having a thickness of about 30 μm including a wiring pattern made of copper foil has been put into practical use.

  Thus, since the flexible substrate is very thin, the shape can be changed flexibly according to the shape of the device to be incorporated, while deformation such as bending is likely to occur. There is also a drawback that can prevent proper support.

  For example, the board 80 may be bent as shown in FIG. 3B when it is carried into the component mounter 100.

  As described above, the substrate support device 10 of the present embodiment uses the plurality of support pins 13 to make the substrate 80 convex upward with respect to the substrate 80 that is easily deformed and thus difficult to stably support. To do. Thereby, the stable support of the board | substrate 80 is implement | achieved.

  The operation of the component mounter 100 when the substrate 80 is supported by the plurality of support pins 13 will be described later with reference to FIGS. 9 and 10.

  Hereinafter, the configuration of the pin unit 11 having the support pins 13 will be described with reference to FIGS. 4 and 5.

FIG. 4 is a perspective view showing the appearance of the pin unit 11 in the embodiment.
As shown in FIG. 4, the pin unit 11 includes a holding portion 12, a lifting shaft 14, a support pin 13, and a unit side terminal 15.

  The unit side terminal 15 is a terminal for connecting the pin unit 11 and the power supply unit 26.

  When the pin unit 11 is attached to the moving body 6, as shown in FIG. 4, the unit side terminal 15 and the power source side terminal 16 connected to the power source unit 26 come into contact with each other. As a result, a predetermined voltage is supplied to the pin unit 11.

  FIG. 5A is a diagram illustrating an example of the internal structure of the pin unit 11 in the embodiment.

  As shown in FIG. 5 (A), the pin unit 11 includes an electro rheological (ER) gel 17, an electrode 18, an urging body 19, and a fixing plate 19a on the inside of the holding portion 12. Has a set.

  Each of the pair of ER gels 17 is given a biasing force by a biasing body 19 and is pressed against the side surface of the elevating shaft 14. The lifting shaft 14 is movably held by the pin unit 11 by the frictional force between the ER gel 17 and the lifting shaft 14 by the biasing body 19.

  In addition, when the urging | biasing force of the urging | biasing body 19 is small, the case where the pin unit 11 falls down by the dead weight of the raising / lowering shaft 14 is also considered.

  Therefore, in such a case, the voltage applied to the pin unit 11 is adjusted, and the voltage is applied to such an extent that the elevating shaft 14 does not fall out of the pin unit 11 due to its own weight.

  In this manner, if the lifting shaft 14 is held by the pin unit 11 with a holding force that does not fall off the pin unit 11 due to its own weight or a slightly stronger holding force, the movable body 6 rises and the support pin 13 Is in contact with the back surface of the substrate 80, a highly flexible substrate such as the substrate 80 is convex upward.

  Of course, when the holding force by the pin unit 11 is extremely weak so that the substrate 80 cannot be convex upward, the applied voltage is adjusted in advance so that the holding force to the extent that the substrate 80 can be convex upward is exhibited, Change it to a larger value.

  Instead of the method of adjusting the voltage described above, the urging body 19 may be replaced with an urging body having a stronger urging force, and the elevating shaft 14 may be held by the pin unit 11. In other words, when the support pins 13 are in contact with the back surface of the substrate 80 and the substrate 80 is not convex upward, the urging body 19 may be replaced with one having a stronger urging force.

  The control of the voltage applied to the pin unit 11 will be described later with reference to FIGS.

  In a state where the pin unit 11 having such a structure is attached to the moving body 6, the lifting shaft 14 included in the pin unit 11 is held movably by the moving body 6.

  As described above, the movable body 6 that holds the elevating shaft 14 so as to be movable is raised, and the plurality of support pins 13 are brought into contact with the substrate 80, whereby the flexible substrate 80 can be made convex upward.

  Moreover, the part which contacts at least both ER gel 17 of the raising / lowering shaft 14, and the part which connects these parts have electroconductivity. For example, the surface of the lifting shaft 14 is covered with a conductive metal.

  Thereby, the elevating shaft 14 also functions as an electrode for applying a voltage to both ER gels 17.

  In such a configuration, a voltage V <b> 1 is applied to the two ER gels 17 via the fixing plate 19 a, the biasing body 19, and the electrode 18, respectively. Thereby, the shear stress in the interface with the raising / lowering axis | shaft 14 improves.

  That is, by applying a predetermined electric field to the ER gel 17 sandwiched between the electrode 18 and the lifting shaft 14, the frictional force with the surface of the lifting shaft 14 that is in contact with the ER gel 17 depends on the magnitude of the electric field. It is going to change.

  Thus, the shear stress at the boundary surface is improved, and the ER gel 17 is pressed against the lifting shaft 14 by the biasing body 19, so that the friction between the lifting shaft 14 and the ER gel 17 is caused. Resistance acts to limit bidirectional movement parallel to the support direction. That is, the lifting shaft 14 is held with a holding force that allows the support pins 13 connected to the lifting shaft 14 to support the substrate 80.

  Further, when the application of the voltage to the ER gel 17 is stopped, the shear stress on the surface of the ER gel 17 decreases, and the force for fixing the elevating shaft 14 substantially disappears. Thereby, the raising / lowering axis | shaft 14 will be in the state which can be moved with respect to the moving body 6 reasonably.

  Thus, the ER gel 17 having high responsiveness to increase / decrease of the applied voltage is used for fixing the position of the elevating shaft 14. For this reason, the position of the lifting shaft 14 is fixed and the fixing is released instantaneously.

  It is desirable that the tip portion of the support pin 13 that contacts the back surface of the substrate is made of a non-conductive material.

  In addition, generation | occurrence | production and extinction of the shear stress in the ER gel 17 as mentioned above are demonstrated as follows.

  That is, a large number of ER particles having a spherical surface projecting from the gel portion are present on the surface of the ER gel 17, and in a state where no voltage is applied, the electrode slides on the spherical surface of the ER particle.

Thereby, in the state which does not apply a voltage, a shear stress shows a very low value.
In addition, when a voltage is applied to the ER gel 17, particles having polarization with a multiaxial structure attract each other, and the spherical surface of the ER particles protruding from the surface sinks.

  In addition, the gel portion around the spherical surface that has been sunk by the action rises, and the gel portion comes into contact with the electrode.

  Since the gel portion has very high wetting characteristics, the adhesion of the ER gel 17 to the electrode is increased, thereby exhibiting a large shearing force. In addition, it is considered that the yielding phenomenon of stress occurs immediately before the gel portion bonded to the electrode slips.

  Further, it is considered that the amount of subsidence of the ER particles protruding from the surface changes according to the magnitude of the electric field strength, and at the same time, the adhesion area of the gel portion to the electrode increases and decreases, and the shear stress also changes.

  When the ER gel 17 having the above characteristics is used for the holding unit 12 of the substrate support apparatus 10, it is possible to obtain a holding force for the lifting shaft 14 sufficient to support the substrate 80 by applying a high voltage. . In the embodiment, a voltage of 1 KV / mm is applied as the electric field strength.

  In the embodiment, the urging body 19 is a helical spring, but it may be a leaf spring or a conductive rubber.

  Further, in the pin unit 11 shown in FIG. 5A, a configuration is adopted in which the elevating shaft 14 is grounded and a positive voltage V <b> 1 is applied to both electrodes 18. However, the pin unit 11 may adopt other voltage application methods.

  For example, two electrodes 18 are used as in the pin unit 11 shown in FIG. 5A, but one of the electrodes is grounded and a voltage is applied to the other electrode without grounding the lifting shaft 14. It may be.

  FIG. 5B is a diagram illustrating another example of the internal structure of the pin unit 11 in the embodiment.

  In the pin unit 11 shown in FIG. 5B, a positive voltage V <b> 1 is applied to one electrode 18, and a negative voltage V <b> 2 is applied to the other electrode 18.

  With this configuration, it is not necessary to ground the elevating shaft 14 and a predetermined voltage is applied to each ER gel 17. In particular, when the absolute values of V1 and V2 are substantially equal, the voltage value of the lifting shaft 14 is maintained near zero.

  In the pin unit 11 shown in each of FIGS. 5A and 5B, the magnitude of the voltage applied to the ER gel 17 is variable.

  By changing the magnitude of the voltage applied to the ER gel 17, the shear stress at the interface between the ER gel 17 and the lifting shaft 14 changes. That is, the holding force of the lifting shaft 14 by the ER gel 17 changes.

  FIG. 6 is a diagram showing the relationship between the applied voltage and the holding force by the ER gel 17 in the embodiment.

  In the graph shown in FIG. 6, the horizontal axis is the electric field strength value, which is a value obtained by dividing the applied voltage by the thickness of the ER gel 17 sandwiched between the electrode 18 and the lifting shaft 14.

  Here, when paying attention to one ER gel 17 in the present embodiment, the electrodes 18 in contact with the ER gel 17 and the side surfaces of the elevating shaft 14 function as electrodes that generate electric field strength. Therefore, the electric field strength applied to the ER gel 17 is obtained by dividing the applied voltage by the thickness of the ER gel 17. Further, the thickness of the ER gel 17 is constant. Therefore, the magnitude of the electric field strength is proportional to the magnitude of the applied voltage.

  Moreover, the graph shown in FIG. 6 has shown the experimental value in case the magnitude | size of the contact surface of ER gel 17 and the raising / lowering axis | shaft 14 is 12 mm x 54 mm.

  As shown in FIG. 6, when the electric field strength is 1 KV / mm, a holding force of about 150 grams (gr) is exhibited by one ER gel 17. In this case, the holding force of about 300 gr is exhibited by one pin unit 11.

  Further, as shown in FIG. 6, the magnitude of the electric field strength and the magnitude of the holding force are substantially proportional. Therefore, it is possible to change the holding force in each pin unit 11 by controlling the applied voltage.

FIG. 7 is a diagram illustrating wiring for a plurality of pin units 11 in the embodiment.
As shown in FIG. 7, adjacent pin units 11 are connected by a single power supply side terminal 16.

  Further, the elevating shaft 14 of each pin unit 11 is grounded, and a voltage is applied to the ER gel 17 of each pin unit 11 by a power supply unit 26. On / off of voltage application by the power supply unit 26 and the magnitude of the applied voltage are controlled by the control unit 20.

  That is, the change of the holding force with respect to the elevating shaft 14 in each pin unit 11 is realized by the control unit 20 controlling the magnitude of the voltage applied to each pin unit 11.

FIG. 8 is a functional block diagram illustrating a functional configuration of the substrate support apparatus 10 according to the embodiment.
As shown in FIG. 8, the substrate support apparatus 10 includes a drive unit 7, a plurality of pin units 11, a control unit 20, a measurement unit 25, and a power supply unit 26.

  The measurement unit 25 is a processing unit that measures the amount of deviation of each component mounting position due to the substrate 80 being convex upward. For example, the measuring unit 25 measures the amount of upward displacement of each component mounting position by scanning the upper surface of the supported substrate 80 with a laser.

  In addition, the measurement unit 25 receives the recognition result by the board recognition camera 122, and measures the amount of deviation of each component mounting position in the X direction and Y direction from each component mounting position. That is, the measurement unit 25 measures the three-dimensional deviation amount of each component mounting position.

  It should be noted that the amount of displacement in the X direction and the Y direction of each component mounting position is the amount of displacement of the board mark obtained from the substrate recognition camera 122 when the amount of upward displacement of each component mounting position is relatively large. It may be calculated by taking into account the upward displacement amount of each component mounting position.

  The deviation amount of each component mounting position measured by the measurement unit 25 is transmitted to the control unit 20. The control unit 20 corrects the mounting position information indicating each component mounting position according to the received deviation amount of each component mounting position. The mounting position information also includes information indicating the lowering distance of the suction nozzle when mounting a component at the component mounting position.

  In addition, the control part 20 acquires the mounting position information before correction | amendment from the mounting data which the component mounting machine 100 has memorize | stored, for example.

  The mounting data is various data used when the component mounter 100 mounts components on the board 80. The mounting data includes information indicating the mounting points of various substrates 80, information indicating the sizes of various components, information on the mounting order of components, information indicating the correspondence between the types of components and the types of suction nozzles, and usage Contains information about the board to be used.

  The control unit 20 further uses the corrected mounting position information together with the correction amount based on the suction state of the component obtained from the recognition result of the component recognition camera 131 to control the operations of the transfer head 120 and the plurality of suction nozzles. .

  Thereby, for example, when the board 80 is made convex upward, a certain component mounting position is shifted in the X direction, the Y direction, and the Z direction, and the center position of the suction nozzle is shifted from the center position of the component. Even when the suction nozzle is sucked by the suction nozzle, the component is appropriately mounted at the position to be mounted.

  That is, in the substrate support apparatus 10 of the present embodiment, the substrate 80 is supported so as to be convex upward in order to stably support the substrate 80 that is very flexible and easily deforms such as bending. .

  Therefore, at least one component mounting position on the upper surface of the substrate 80 is shifted upward. Therefore, in the present embodiment, the component is appropriately mounted on the board by correcting the deviation amount.

  The control function of the control unit 20 is, for example, for a computer having a central processing unit (CPU), a storage device, and an interface for inputting / outputting information to control the operation of the substrate support device 10. It is realized by executing the program.

  Next, operation | movement of the board | substrate support apparatus 10 of embodiment is demonstrated using FIG. 9 and FIG.

  FIG. 9 is a flowchart showing an outline of the operation of the component mounting machine 100 when the board support device 10 supports the board 80.

  The operation of each component of the board support device 10 and the component mounter 100 shown below is controlled by the control unit 20.

  As shown in FIG. 9, the plurality of support pins 13 are brought into contact with the back surface of the substrate 80, so that the substrate 80 is convex upward (S10).

  In a state where the substrate 80 is convex upward, each pin unit 11 holds the elevating shaft 14 with a predetermined holding force so as to fix the position of the support pin 13 that it has (S20). Specifically, a predetermined voltage is applied to each pin unit 11. Thereby, each raising / lowering axis | shaft 14 is hold | maintained with predetermined | prescribed holding force, and the position of the some support pin 13 is fixed to such an extent that component mounting with respect to the board | substrate 80 is possible. Further, the substrate 80 is maintained in an upward convex shape.

  The measuring unit 25 measures the amount of upward displacement of each component mounting position on the upper surface of the substrate 80. Further, the control unit 20 corrects the mounting position information corresponding to each component mounting position based on the shift amount of each component mounting position received from the measurement unit 25 (S30).

  When the component mounting machine 100 mounts a certain component on the board, the suction nozzle that sucks the component is used as the corrected mounting position information corresponding to the mounting position of the component and the recognition result of the component recognition camera 131. The component is mounted on the board 80 by operating using the correction amount based on the correction amount (S40).

The above operation will be described with reference to FIG.
FIG. 10 is a schematic diagram showing a flow of operations of the component mounter 100 in the embodiment.

  In addition, in order to show clearly that the board | substrate 80 is supported, illustration of components, such as the conveyance conveyor 90, is abbreviate | omitted.

  As shown in FIG. 10, [1] the substrate 80 is transported above the substrate support apparatus 10. At this time, it is assumed that the substrate 80 is bent as shown in FIG.

  [2] The drive unit 7 raises the moving body 6. As a result, the plurality of support pins 13 collectively move upward and come into contact with the substrate 80.

  In the present embodiment, before the moving body 6 is raised, the upper ends of the plurality of support pins 13 are aligned at the same height position (position in the Z-axis direction). At this time, each support pin 13 is said to be in the “initial position”.

  Further, the ascending distance of the moving body 6 is at an initial position when the back surface of the substrate 80 is a plane parallel to the XY plane so that the upper end of the support pin 13 is in contact with the back surface of the substrate 80 with certainty. The distance is set longer than the distance between the upper end of the support pin 13 and the plane.

  For example, when the distance between the upper end of the support pin 13 in the initial position and the plane is X mm, the ascending distance of the moving body 6 is set to be X mm + several mm. Specifically, “X” is preferably a small value, but in the embodiment, the operation is performed between about 5 mm and 40 mm. “X” is determined according to the distortion or unevenness of the back surface of the substrate 80. For example, when a component is mounted on the back surface, “X” is determined by the height of the component.

  When the movable body 6 is lifted in this way, the substrate 80 has the flexible substrate 80b having high flexibility, and thus has an upward convex shape due to a slight upward pressing force by the support pins 13.

  Thereafter, a predetermined voltage is applied to each pin unit 11, and the positions of the plurality of support pins are fixed with a force that allows component mounting on the board 80.

  [3] A component is mounted by the suction nozzle 121 on the substrate 80 thus convex upward. Specifically, before mounting the component, the measurement unit 25 measures the amount of deviation of the mounting position of the component by scanning the upper surface of the substrate 80 using a laser.

  Further, the component recognition camera 131 measures the amount of positional deviation of the component with respect to the suction nozzle.

  Using the correction amounts based on the various displacements thus measured, the operations of the transfer head 120 and the suction nozzle are controlled. Thereby, the component sucked by the suction nozzle is appropriately mounted at a position where the board 80 is to be mounted.

  [4] Thereafter, when mounting other components, as described above, the transfer head 120 and the mounting head 120 according to the displacement amount of the component mounting position, the displacement amount of the sucked component with respect to the suction nozzle, and the like. The operation of the suction nozzle is controlled. Thereby, the other components are also appropriately mounted at the position where the board 80 is to be mounted.

  As described above, the substrate support apparatus 10 according to the present embodiment supports the substrate 80 in an upwardly convex shape when supporting the substrate 80.

  Here, since the substrate 80 is highly flexible, deformation such as bending is likely to occur. When the substrate 80 having such characteristics is supported, it is unpredictable at which position the deformation is at that time and how much.

  In addition, when the substrate 80 is deformed and has flexibility, even if the unevenness on the upper surface of the substrate 80 is measured with a laser or the like, the state is not maintained, and an accurate measurement result can be obtained. It is difficult. For this reason, it is difficult to appropriately mount the component sucked by the suction nozzle on the substrate.

  Therefore, the substrate support device 10 makes the substrate 80 positively convex by bringing the plurality of support pins 13 into contact with the substrate 80 from below, and maintains the substrate 80 in a predetermined shape. In this state, the component mounting machine 100 measures the position of the upper surface of the board 80. Thereby, the component mounting machine 100 can accurately measure the position of the upper surface of the substrate 80, and by using the measurement result, the component sucked by the suction nozzle is appropriately mounted at the position where the component is to be mounted. be able to.

  When mounting a component on a highly flexible substrate such as the substrate 80, the component may be mounted by being sandwiched by a jig in order to correct the bending of the substrate 80.

  However, the region where the component is mounted cannot be sandwiched with a jig. Therefore, for example, even when a flexible substrate is sandwiched between jigs, the bending cannot be completely corrected, and may be carried into the component mounting machine 100 with at least a part thereof being bent.

  In such a case, if it is the board | substrate support apparatus 10 of embodiment, the said flexible substrate can be stably supported by a predetermined | prescribed shape by making the said flexible substrate convex upward, and, thereby, reliable component mounting is possible. It becomes possible.

  The plurality of elevating shafts 14 are held by the moving body 6 so as to be independently movable in the vertical direction. Therefore, even when a part is mounted on the back surface of the substrate 80, even if the supported surface of the substrate 80 is uneven, each of the plurality of support pins 13 has a height along the uneven shape. The substrate 80 can be supported in this position.

  That is, the substrate 80 can be stably supported regardless of whether the surface to be supported of the substrate 80 is a flat surface or an uneven shape.

  Further, when the support pins 13 are in contact with the back surface of the substrate, the substrate support device 10 is given a downward force (reaction force from the substrate 80) of a predetermined magnitude or more at the tip of the support pins 13. Sometimes, even if the moving body 6 rises, the support pin 13 does not rise. Therefore, since the back surface of the substrate 80 does not work more than a predetermined force, the highly flexible substrate 80 is not excessively deformed.

  Further, even when the substrate support device 10 supports a rigid substrate having a rigidity higher than that of the flexible substrate, after the movable body 6 is lifted by a predetermined distance and the plurality of support pins 13 abut on the rigid substrate. The rigid substrate is stably supported by performing the above-described series of operations of holding the elevating shaft 14 with a predetermined holding force.

  That is, even when a flexible board, a rigid board, and a rigid flexible board are mixed and sequentially carried into the component mounting machine 100, the board support device 10 only performs a common series of operations for each board. The plurality of substrates can be sequentially and stably supported. In other words, the substrate support apparatus 10 does not need to change the operation according to the flexibility or rigidity of the substrate to be supported.

  In the present embodiment, the measurement unit 25 can measure the amount of deviation of each component mounting position on the substrate 80 by scanning with a laser or the like. Further, the measurement unit 25 can accurately recognize the position of the substrate by recognizing the substrate mark by the substrate recognition camera 122 mounted on the transfer head 120.

  Furthermore, the component recognition camera 131 recognizes the suction state of the component sucked by the suction nozzle, and as a result, the amount of positional deviation of the component with respect to the suction nozzle is measured.

  Based on these measurement results, the control unit 20 according to the embodiment calculates the descending distance and the positioning correction amount of the suction nozzle 121 for each of a plurality of components to be mounted on the substrate 80. The control unit 20 controls the transfer head 120 and the like using these calculation results, so that each of the plurality of components is mounted accurately at the position to be mounted on the upper surface of the substrate 80.

  Here, the component mounting machine 100 absorbs the upward shift amount of the component mounting position by correcting the descending distance of the suction nozzle 121 as described above. However, for example, by moving the support pin 13 downward by the pressing force of the suction nozzle 121 during component mounting, the vertical displacement of the component mounting position due to the substrate 80 being convex upward may be absorbed. .

FIG. 11 is a diagram illustrating a state in which the support pin 13 moves downward during component mounting.
In the substrate support apparatus 10 of the present embodiment, the substrate 80 is supported by the plurality of support pins 13 in an upward convex state.

  In this state, the suction nozzle 121 descends based on the height of the component 81 so that the component 81 is mounted on the upper surface of the substrate 80 on the assumption that the substrate 80 is flat. That is, the suction nozzle 121 moves down based on the initial mounting data that has not been corrected.

  In this case, one or more support pins 13 on the opposite side of the component 81 across the substrate 80 are moved downward by the pressing force of the component 81 against the substrate 80. That is, the support pin 13 is pushed back.

  That is, the holding force by the pin unit 11 with respect to the elevating shaft 14 connected to the support pin 13 is a value such that the support pin 13 moves downward by the pressing force of the component 81 against the substrate 80.

  Since the support pin 13 is moved downward against the holding force with respect to the lifting shaft 14, it is more desirable to control the holding force according to the load resistance of the component 81.

  For example, the control unit 20 acquires load bearing information, which is information indicating the load bearing capacity of the component 81, and controls the magnitude of the voltage applied to the pin unit 11 according to the load bearing information. The holding force for the lifting shaft 14 is changed. Specifically, the magnitude of the applied voltage to the pin unit 11 is reduced as the load resistance is lower.

  Load-bearing information includes part size, information indicating the size of a part such as a large part or small part, information indicating the type of a part such as a chip part or IC, or the maximum allowable value for the load of the part. There is information to show.

  In other words, the information indicating the load resistance of a component does not have to be the magnitude of the load that the component can withstand, and it is possible to determine the level of load resistance of the component based on the size or type of the component. is there.

  For example, when the maximum permissible value for the load for each type of component is known, the substrate support apparatus 10 yields the holding force for the elevating shaft 14 to a load larger than the maximum permissible value, and the elevating shaft 14 moves. Control to a degree.

  That is, if the maximum allowable value for the load of a certain component is 100 gr, the holding force with respect to the lifting shaft 14 is set to 100 gr or less so that a force larger than 100 gr can be applied from above the lifting shaft 14 via the component and the substrate 80. When the situation where it is hung occurs, it is possible to move the elevating shaft 14 downward.

  Thus, as in the present embodiment, when the component mounting position is shifted upward by making the substrate 80 convex upward, when an excessive load is applied to the component due to the shift, the load is released. In addition, the support pin 13 can be moved downward.

  Further, when the substrate 80 is supported by the substrate support device 10, for example, the substrate 80 may be pulled in the Y-axis direction so as to reduce the deformation amount of the substrate 80.

  FIG. 12A is a diagram illustrating a state in which the conveyance conveyor 90 fixes both ends of the substrate 80.

  FIG. 12B is a diagram illustrating a state in which the amount of bending of the substrate 80 is reduced by the movement of the movable rail 90b.

  As shown in FIG. 12A, the transfer conveyor 90 includes a plurality of fixing members 91 for fixing the substrate 80 so that the substrate 80 does not move in the X direction and the Y direction when components are mounted.

  One end side parallel to the X axis of the substrate 80 is fixed to the fixed rail 90a by the plurality of fixing members 91, and the other end side is fixed to the movable rail 90b.

  After the substrate 80 is fixed in this way, as shown in FIG. 12B, the movable rail 90b moves in the direction of increasing the rail width. As a result, the substrate 80 is pulled in the Y-axis direction, and the amount of bending is reduced.

  For example, the substrate support apparatus 10 raises the moving body 6 and brings the plurality of support pins 13 into contact with the substrate 80 in a state where the bending amount of the substrate 80 is reduced in this way. Further, in this state, each lifting shaft 14 is held with a predetermined holding force so as to fix the positions of the plurality of support pins 13.

  In this case, the substrate 80 is supported by the plurality of support pins 13 in a state where a predetermined tension is applied to the substrate 80. Therefore, the stability of the upper surface of the highly flexible substrate 80 is improved as a whole, and component mounting onto the substrate 80 can be more reliably performed.

  Further, when a predetermined tension is applied to the substrate 80 and pressed from below by the plurality of support pins 13, the amount of displacement of each component mounting position on the upper surface of the substrate 80 is the predetermined tension acting on the substrate 80. Decrease than if not.

  That is, the amount of upward displacement of each component mounting position on the upper surface of the substrate 80 decreases. Therefore, for example, it is possible to perform component mounting substantially without any problem without correcting the descending distance of the suction nozzle 121.

(Supplementary items of the embodiment)
In the present embodiment, the pin unit 11 includes the ER gel 17 and controls the holding force for the lifting shaft 14 by controlling the voltage applied to the ER gel 17.

  However, the method for realizing the holding force control for the lifting shaft 14 may be realized by other mechanisms.

  Hereinafter, another method for realizing the control of the holding force with respect to the lifting shaft 14 will be described with reference to FIGS. 13 to 15.

  FIG. 13A is a diagram illustrating an example of a configuration for realizing the holding force control for the lifting shaft 14 using the ER fluid 60.

  The holding unit 12a illustrated in FIG. 13A includes an ER fluid 60, a packing 55 that traps the ER fluid 60 in the holding unit 12a, and two electrodes 61.

  The ER fluid 60 is a functional material that changes the holding force with respect to the lifting shaft 14 in accordance with the magnitude of the applied voltage, like the ER gel 17 described above.

  In this configuration, the elevating shaft 14 is slidably held with respect to the holding portion 12a by a frictional force with the rubber packing 55, for example.

  In addition, the power supply unit 26 is connected to the two electrodes 61, and the power supply unit 26 is controlled by the control unit 20. That is, the voltage applied to the ER fluid 60 is controlled by the control unit 20, and thereby the holding force of the holding unit 12 a with respect to the lifting shaft 14 is controlled.

  As described above, even when the ER fluid 60 is used to hold the lifting shaft 14, it is possible to control the holding force with respect to the lifting shaft 14 as in the above-described embodiment.

  In FIG. 13A, one of the two electrodes is connected to the positive electrode of the power supply unit 26 and the other is connected to the negative electrode, so that a predetermined voltage is applied to the ER fluid 60. However, the elevating shaft 14 may have conductivity, the elevating shaft 14 may be grounded, and a predetermined voltage may be applied to both the electrodes.

  FIG. 13B is a diagram illustrating an example of a configuration for realizing control of holding force with respect to the lifting shaft 14 using electrostatic force.

  A holding portion 12b shown in FIG. 13B includes insulators 75 arranged so as to sandwich the elevating shaft 14, and electrodes 72 included in the respective insulators 75. The lifting shaft 14 is grounded.

  The two electrodes 72 are connected to the power supply unit 26 and are each applied with a positive voltage. As a result, the two electrodes 72 have a positive potential, and a negative potential appears on the lifting shaft 14 side of each insulator 75. In addition, the two surfaces on the electrode 72 side of the lifting shaft 14 are positively charged.

  Thereby, an electrostatic force attracting each other acts between the lifting shaft 14 and the two insulators 75, and this electrostatic force acts as a force for holding the lifting shaft 14.

  Further, the magnitude of the applied voltage and the electrostatic force have a positive correlation. Accordingly, the control unit 20 can control the holding force of the holding unit 12b with respect to the lifting shaft 14 by controlling the magnitude of the voltage applied to the two electrodes 72.

Thus, even when the insulator 75, which is a dielectric, is used to hold the lifting shaft 14,
Similar to the above-described embodiment, it is possible to control the holding force with respect to the lifting shaft 14.

  FIG. 14 is a diagram illustrating an example of a configuration for realizing control of holding force with respect to the lifting shaft 14 using an air cylinder.

  The holding portion 12c shown in FIG. 14 is an air cylinder having an operating shaft that can contact the side surface of the elevating shaft 14. The holding part 12 c is connected to the pneumatic pressure source 86 via the electromagnetic valve 85. The electromagnetic valve 85 is controlled by the control unit 20.

Moreover, the raising / lowering axis | shaft 14 is hold | maintained at the mobile body 6 so that sliding is possible by magnetic force, for example.
In this configuration, the control unit 20 controls the magnitude of the air pressure supplied to the holding unit 12 c by controlling the electromagnetic valve 85.

  Thereby, the force with which the operating shaft of the holding portion 12c presses the side surface of the lifting shaft 14, that is, the holding force of the holding portion 12c with respect to the lifting shaft 14 is controlled.

  As described above, even when an air cylinder is used for holding and fixing the lifting shaft 14, it is possible to control the holding force with respect to the lifting shaft 14 as in the above-described embodiment.

Moreover, you may use functional materials other than ER fluid etc. for the holding | maintenance of the raising / lowering axis | shaft 14, and fixation.
For example, using a Magneto Rheological (MR) fluid whose viscosity increases by applying a magnetic field, an MR gel obtained by gelling an MR fluid, or a functional material whose viscoelasticity changes in response to an electric or magnetic field The elevating shaft 14 may be held and fixed.

  In this case, an electromagnet may be used as means for applying a magnetic field to the MR fluid or MR gel, and the power supply unit 26 in the embodiment may be connected to the electromagnet. In addition, the control unit 20 can control the power supply unit 26 to control the strength of the magnetic field applied to the MR fluid or MR gel.

  In the embodiment, the driving unit 7 is an air cylinder. However, a device other than an air cylinder may be used. As long as the drive part 7 can be controlled by the control part 20 and can raise the raising / lowering shaft 14 and the support pin 13 until the board | substrate 80 becomes upper convex shape, for example, the other type using hydraulic pressure or a motor etc. The apparatus may be used.

  Further, the support pin 13 and the elevating shaft 14 may not be separate. For example, the upper end portion of the lifting shaft 14 may serve as the support pin 13.

  In the embodiment, the substrate support apparatus 10 includes 20 sets of support pins 13 and lifting shafts 14. However, the number of sets is not limited to a specific one.

  The component mounter 100 may be an electronic component mounter or a semiconductor component mounter. In either case, the substrate 80 is appropriately supported by the substrate support device 10, and components can be mounted on the substrate while protecting the components.

  Further, the types of components that the component mounter 100 mounts on the board 80 are not limited to specific ones. For example, any of a small chip component, a large chip component, and a semiconductor IC may be used. In addition, when the semiconductor bare chip is directly mounted on the electrode on the substrate 80, the same effect as that shown in the present invention can be obtained.

  Moreover, the board | substrate support apparatus 10 of embodiment raises the several support pin 13 collectively by raising the mobile body 6 to which the several pin unit 11 was attached.

  However, each of the support pins 13 may be raised by an individual driving unit.

  FIG. 15 is a diagram showing a substrate support device 50 having a function of raising the plurality of support pins 13 individually.

  A substrate support apparatus 50 shown in FIG. 15 includes a plurality of sets of support pins 13 and a lifting shaft 14. In addition, drive units 7 a corresponding to the respective lifting shafts 14 are arranged on the base 8.

  Each drive part 7a is an air cylinder, for example, and can raise / lower the raising / lowering axis | shaft 14 attached to self.

  For example, when the substrate mounter 50 is provided in the component mounter 100 instead of the substrate support device 10, the control unit 20 of the component mounter 100 controls the drive units 7 a, so that the plurality of lifting shafts 14 are arranged. Move up and down.

  A shaft holding body 30 for holding the lifting shaft 14 is provided in parallel with the base 8, and the lifting shaft 14 penetrates the shaft holding body 30 up and down.

  The shaft holder 30 includes, for example, a configuration for holding the lifting shaft 14 by the ER gel 17 shown in FIG. 5A for each lifting shaft 14. As a result, in a state where the plurality of support pins 13 are in contact with the substrate 80 and the substrate 80 is convex upward, each lifting shaft 14 is held with a predetermined holding force so as to fix the position of the support pins 13. Can be held.

  The shaft holder 30 may hold each lifting shaft 14 with a predetermined holding force using a functional material other than the ER gel 17.

  The present invention can be applied to a substrate support device, a component mounter, and the like used when components are mounted on a substrate. In particular, it is useful as an electronic component mounter, a substrate support method and a substrate support apparatus in a semiconductor component mounter.

  The present invention is also useful as a component mounter or the like that executes the above-described substrate support method or includes the above-described substrate support device.

6 Moving body 7, 7a Drive unit 8 Base 10, 50 Substrate support device 11 Pin unit 12, 12a, 12b, 12c Holding unit 13 Support pin 14 Lifting shaft 15 Unit side terminal 16 Power source side terminal 17 ER gel 18, 61, 72 Electrode 19 Energizing body 19a Fixed plate 20 Control unit 25 Measuring unit 26 Power supply unit 30 Shaft holder 55 Packing 60 ER fluid 75 Insulator 80 Substrate 80a Rigid substrate 80b Flexible substrate 81 Parts 85 Electromagnetic valve 86 Pneumatic source 90 Conveyor 90a Fixed rail 90b Movable rail 91 Fixed member 100 Component mounter 110 Component supply unit 120 Transfer head 121 Suction nozzle 122 Substrate recognition camera 130 Nozzle station 131 Component recognition camera

Claims (8)

A substrate support method for supporting a substrate on which a component is mounted from above using a plurality of supports from below,
An abutting step for making the substrate convex upward by moving the plurality of supports in the direction of the substrate and abutting the substrate;
A holding step of holding the plurality of supports with a predetermined holding force so as to fix the positions of the plurality of supports in a state where the substrate is convex upward. Furthermore, when a component is mounted on the substrate in a state where the positions of the plurality of supports are held, the component is pressed against the substrate by the pressing force of the component on the opposite side of the component. The substrate supporting method according to claim 1, further comprising: a pushing back step in which the one or more supports move downward. A component mounting method for mounting a component on a substrate supported by the substrate support method according to claim 1,
A component mounting method including a mounting step of mounting the component on the substrate from above the substrate by a suction nozzle that sucks the component in a state where the positions of the plurality of supports are held in the holding step. A component mounting method for mounting a component on a substrate supported by the substrate support method according to claim 1,
A measurement step of measuring a deviation amount of a component mounting position of the board due to the board being convex upward;
A correction step of correcting mounting position information indicating the component mounting position using the deviation amount measured in the measuring step;
In the state in which the positions of the plurality of supports are held in the holding step, the component is placed in the component mounting position by the suction nozzle that sucks the component using the mounting position information corrected in the correction step. A component mounting method including a mounting step to be mounted on. A substrate support device for supporting a substrate on which a component is mounted from above using a plurality of supports from below,
Contact means for moving the plurality of supports in the direction of the substrate and contacting the substrate from below to make the substrate convex upward;
A substrate support apparatus comprising: holding means for holding the positions of the plurality of supports with a predetermined holding force so as to fix the positions of the plurality of supports in a state in which the substrate is convex upward. . The predetermined holding force is a value by which one or more supports opposite to the component are moved downward by pressing the component against the substrate when the component is mounted on the substrate. The substrate support apparatus according to claim 5. The substrate support apparatus according to claim 5 or 6,
A component mounting machine comprising: a suction nozzle that sucks a component and mounts the component on the substrate from above the substrate in a state where the positions of the plurality of supports are held by the holding unit. The substrate support apparatus according to claim 5;
A suction nozzle that sucks the component and mounts the sucked component on the substrate;
A measuring means for measuring a deviation amount of a component mounting position of the board due to the board being convex upward;
Correction means for correcting mounting position information indicating the component mounting position using the deviation amount measured by the measuring means;
With the holding means holding the position of each of the plurality of supports, the component is mounted on the component by the suction nozzle that sucks the component using the mounting position information corrected in the correction step. A component mounting machine including a control means to be mounted on.

Images