WO2006132243A1

WO2006132243A1 - Inspection device

Info

Publication number: WO2006132243A1
Application number: PCT/JP2006/311327
Authority: WO
Inventors: Shigeki Ishikawa; Yosuke Mabune
Original assignee: Nhk Spring Co., Ltd.
Priority date: 2005-06-08
Filing date: 2006-06-06
Publication date: 2006-12-14
Also published as: TWI307411B; TW200710404A; JP5244288B2; JP2006343197A

Abstract

An inspection device for detecting disconnection of a thin inspection object of low rigidity with high precision. The inspection device comprises a plurality of conductive contacts brought into contact with a thin filmlike wiring pattern of an inspection object to perform at least either of input or output of an electric signal, a holder member for accommodating the plurality of conductive contacts in an arrangement corresponding to the wiring pattern, and a means for flattening the region in the vicinity of the wiring pattern brought into contact with the plurality of conductive contacts at the time of inspecting electrical connection.

Description

Specification

Inspection device

Technical field

The present invention relates to an inspection for conducting a continuity test on a thin film film-like inspection object having a plurality of conductive regions including a wiring pattern used for input or output of an electric signal formed on the surface. Relates to the device.

Background art

Conventionally, for example, an IC package called TCP (Tape and Arrier Package) such as TAB (Tape Automated Bondmg) A COF (and hip On Film) is used for a driver circuit of a liquid crystal panel constituting a liquid crystal display, for example. This TCP is formed by mounting a semiconductor chip such as an LSI (Large Scale Integrated Circuit) on a thin film substrate having a predetermined wiring pattern formed on the surface.

[0003] When manufacturing a TCP, in order to detect defective products as in the case of other semiconductor integrated circuits, an inspection relating to electrical characteristics is performed. More specifically, the wiring pattern formed on the film substrate is inspected for the presence of electrical shorts and breaks (continuity inspection), and after the semiconductor chip is mounted, the semiconductor chip is subjected to a predetermined inspection via the wiring pattern. Operational characteristics inspection etc. to input / output signals are performed.

[0004] Among the above-mentioned inspections, a technique of using a thin conductive contact and a conductive rubber body is known for disconnection inspection of a film substrate before mounting a semiconductor chip! (Ref. 1). In this technology, the bottom surface of the conductive rubber body is brought into contact with all the wiring patterns while maintaining the contact state between the connection electrodes provided on the film substrate and forming a part of the wiring pattern and the conductive contacts. A predetermined current is passed, and a portion in an insulating state between the conductive contact and the conductive rubber body is detected as a broken portion.

[0005] However, when conducting a disconnection inspection using a conductive rubber body as described above, the conductive rubber body is subject to deterioration over time due to wear or deformation.

[0006] As a technique for solving the above-described problems, a technique for performing a disconnection inspection using a non-contact type sensor. A technique is also disclosed (see, for example, Patent Document 2). In this technology, a predetermined AC signal is supplied to a circuit composed of a connection electrode provided for an inspection object and a sensor having an electrode that forms a capacitive coupling with the connection electrode. Then, a change in capacitance between the electrode to be inspected and the sensor electrode caused by the disconnection is detected as a change in the detection level of the electric signal.

Patent Document 1: Japanese Patent Laid-Open No. 8-184631

Patent Document 2: JP-A-4-244976

Disclosure of the invention

Problems to be solved by the invention

[0008] The above-described film substrate has a very small material thickness and high flexibility as compared with a conventional semiconductor substrate. Therefore, when used in a liquid crystal display, the entire apparatus must be miniaturized. On the other hand, it has the advantage of being able to cause deformation such as warping and undulation because it is thin and lacks rigidity.

[0009] When the disconnection inspection according to the conventional technique described in Patent Document 2 is performed using such a film substrate as an inspection target, the distance between the film substrate and the sensor changes due to the deformation of the film substrate, and the capacitance May deviate from the value that should be taken, and the accuracy of the disconnection inspection may be reduced. For this reason, there is a need for a technology that can detect disconnection with high V and accuracy even for thin film substrates with low rigidity.

The present invention has been made in view of the above, and an object of the present invention is to provide an inspection apparatus that can detect a disconnection of an inspection target that is thin and has low rigidity with high accuracy. Means for solving the problem

[0011] In order to solve the above-described problem and achieve the object, one embodiment of the present invention is a method in which a plurality of conductive regions including a wiring pattern used for input or output of an electrical signal are formed on a surface, and mounted. An inspection apparatus for performing a continuity inspection of the wiring pattern on a thin film film inspection target on which a predetermined semiconductor chip is mounted, wherein at least one of an input and an output of an electric signal is in contact with the wiring pattern A plurality of conductive contacts to be performed; a holder member that accommodates the plurality of conductive contacts in an arrangement corresponding to the wiring pattern; and the plurality of conductive contacts to be contacted when performing the continuity test. Wiring Flattening means for flattening a region near the pattern.

[0012] In the above invention, the flattening unit may flatten the wiring pattern by applying pressure to the wiring pattern.

[0013] Further, in the above invention, the flattening means includes a plurality of pressing members that are elastically urged and retracted in an axial direction so as to be accommodated in the holder member. The member may have a larger protruding amount from the holder member than the conductive contact in a state where the member is not in contact with the inspection object.

[0014] In the above invention, when the continuity test is performed, the pressing member abuts at least one of the surfaces inside and in the vicinity of a chip mounting area where a predetermined semiconductor chip is mounted during mounting. It may be provided at the position.

[0015] Further, according to the present invention, the holder member includes a first holder member that accommodates the plurality of conductive contacts, and a second holder member that accommodates the pressing member. You may have.

[0016] Further, in the above invention, the pressing member may be provided at a position in contact with a peripheral portion of the wiring pattern that is in contact with the plurality of conductive contacts when the continuity test is performed. .

[0017] In the above invention, the pressing member may be made of a resin with a contact portion contacting the inspection object.

[0018] In the above invention, the flattening means may include negative pressure applying means for applying a negative pressure to the inspection object.

[0019] In the above invention, the negative pressure applying means, at the time of performing the continuity test, at least inside and in the vicinity of a chip mounting area where a predetermined semiconductor chip is mounted at the time of mounting.

V, even if negative pressure is applied to one surface! /

[0020] Further, in the above invention, the negative pressure applying means may apply a negative pressure to a peripheral portion of the wiring pattern in contact with the plurality of conductive contacts when performing the continuity test.

[0021] In the above invention, the negative pressure applying means includes a plurality of holes formed at predetermined positions, and a receiving table on which a part of the inspection target is placed, and a hole formed in the receiving table. Multiple holes provided And a suction unit that performs suction by negative pressure through the unit.

[0022] In the above invention, the continuity test may include a disconnection test using a non-contact sensor.

The invention's effect

[0023] According to the present invention, the plurality of conductive contacts that make contact with the wiring pattern to be inspected in the form of a thin film and perform at least one of input and output of an electric signal, and the plurality of conductive elements A holder member that accommodates the contacts in an arrangement corresponding to the wiring pattern, and a flattening means for flattening a region near the wiring pattern that contacts the plurality of conductive contacts when the continuity test is performed. Thus, it is possible to provide an inspection apparatus that can detect a disconnection of an inspection object that is thin and lacks rigidity with high accuracy.

Brief Description of Drawings

FIG. 1 is a diagram showing a configuration of a main part of an inspection apparatus according to Embodiment 1 of the present invention.

FIG. 2 is a view in the direction of arrow A in FIG.

FIG. 3 is a diagram showing a configuration of a film substrate to be inspected.

FIG. 4 is a cross-sectional view showing a configuration of a conductive contact applied to the inspection apparatus according to Embodiment 1 of the present invention.

FIG. 5 is a cross-sectional view showing a structure of a presser member applied to the inspection apparatus according to Embodiment 1 of the present invention.

FIG. 6 is an explanatory view showing a state in which a deformed film substrate is flattened by a peripheral edge pressing member.

[FIG. 7] FIG. 7 is an explanatory view showing a state in which the conductive contact is connected to the wiring pattern of the film substrate.

FIG. 8 is a diagram showing a state of the inspection apparatus after the film substrate is flattened.

FIG. 9 is a top view showing a configuration of a cradle that forms part of the inspection apparatus according to Embodiment 2 of the present invention.

FIG. 10 is a cross-sectional view taken along line BB in FIG.

FIG. 11 is a view showing a state where a film substrate is placed on a cradle and negative pressure is applied. FIG. 12 is a top view showing a configuration of a cradle that forms part of an inspection apparatus according to a modification of the second embodiment of the present invention.

FIG. 13 is a cross-sectional view taken along line CC of FIG.

Explanation of symbols

I, 5 contact unit

2 Film substrate

3, 4, 6 cradle

I I, 12, 51 Holder member

11a First part

l ib Second part

12a 3rd part

12b 4th member

13, 52 Base attachment

14 Conductive contact

15 Lead wire

16 Center pressing member

17 Edge holding member

21 Base material

22 Wiring pattern

23 Inner lead

24 Outer lead

25 Connecting electrode

26 Chip mounting area

31 sensors

41, 61 Place

42 Suction unit

43, 44, 64, 66 hole

45, 67 Access passage 46, 68 Vacuum hole

47 nozzles

48 hose

49 Vacuum pump

63, 65 Groove

71 Pipe member

72 socket

111, 121a, 121b, 131 opening

141, 142 needle member

141a Flange

143, 162, 172 None

161, 171 Plunger

161a ゝ 171a Contact part

161b ゝ 171b Protrusion

161c, 171c Tip

161d, 171d connecting part

421 Through hole

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, best modes for carrying out the present invention (hereinafter referred to as “embodiments”) will be described with reference to the accompanying drawings. The drawings are only schematic, and the relationship between the thickness and width of each part, the ratio of the thickness of each part, etc. may differ from the actual ones. There may be some parts that have different dimensional relationships and ratios.

(Embodiment 1)

FIG. 1 is a diagram showing the configuration of the main part of the inspection apparatus according to Embodiment 1 of the present invention. The inspection apparatus shown in FIG. 1 has a contact unit 1 for inputting / outputting electric signals to / from an inspection object and a thin film substrate 2 to be inspected, and a contact unit for inspection. And a cradle 3 for sandwiching the film substrate 2 with the pedestal 1. FIG. 2 is a view in the direction of arrow A in FIG. 1, and is a bottom view showing the configuration of the bottom surface portion of the contact unit 1. The contact unit 1 is installed corresponding to the wiring pattern of the film substrate 2, and establishes an electrical connection between the film substrate 2 and an inspection circuit (not shown) for inspecting the electrical characteristics of the film substrate 2. A plurality of conductive contacts 14 are provided. In addition, the contact unit 1 is used as a presser member that is urged and urged so as to expand and contract with respect to the axial direction. A plurality of center part pressing members 16 to be attached, and a plurality of peripheral part pressing members 17 to press the peripheral part of the wiring pattern of the film substrate 2 to the cradle 3 are provided. Among these, the conductive contact 14 and the peripheral edge pressing member 17 are accommodated and held in a substantially rectangular parallelepiped holder member 11 (first holder member). The center pressing member 16 is accommodated and held in a holder member 12 (second holder member) that is fitted in the hollow portion of the holder member 11. These holder members 11 and 12 are fixed and supported integrally with the base member 13 by using screws or the like.

The axial directions of the conductive contact 14 and the peripheral edge pressing member 17 held by the holder member 11 are all parallel. Also, the axial direction of the center pressing member 16 held by the holder member 12 is also parallel to the axial direction of the conductive contact 14 and the peripheral pressing member 17. As described above, the axial directions of the conductive contact 14, the center pressing member 16, and the peripheral pressing member 17 are preferably parallel to each other, but the present invention is applied only when force is applied. Of course not.

FIG. 3 is a diagram showing a configuration of the film substrate 2 to be inspected. The film substrate 2 shown in the figure has a thickness of several tens; a polyimide tape having a thickness of about zm (micrometer) and a plurality of wiring patterns 22 along a longitudinal direction of a long tape-like base material 21 formed thereon. Are arranged regularly. The wiring pattern 22 has a one-to-one correspondence between the inner lead 23 connected to the semiconductor chip during mounting, the connection electrode 25 used for electrical connection with an external device, and the inner lead 23 and the connection electrode 25. And outer leads 24 to be connected.

[0031] A predetermined semiconductor chip is mounted at the time of mounting on the side near the center of the group of wiring patterns 22 and the end of each inner lead 23 that is different from the end connected to the outer lead 24. A chip mounting area 26 is provided. This chip mounting area 26 is TAB In this case, it is called a device hole and has a rectangular opening. On the other hand, in the case of COF, the chip mounting area 26 is made of the same material as the surrounding area, not the opening. Needless to say, the arrangement pattern of the connection electrodes 25 on the film substrate 2 completely corresponds to the arrangement pattern in the holder member 11 of the conductive contact 14.

FIG. 4 is a cross-sectional view showing a configuration of the conductive contact 14. The conductive contact 14 shown in the figure has needle-like members 141 and 142 disposed at both ends thereof, and these needle-like members 141 and 142 are connected and biased by a panel member 143. The needle-like members 141 and 142 and the panel member 143 are made of a conductive material such as metal. Further, the needle-like members 141, 142 and the panel member 143 are accommodated and held in the opening 111 of the holder member 11 so as to have the same axis, and the tip force of the needle-like member 141 on the S film substrate 2 side. On the other hand, the tip of the needle-like member 142 is connected to a lead wire 15 accommodated in the opening 131 of the base member 13 and receives supply of an electric signal or the like through the lead wire 15. In FIG. 4, the needle-like member 141 positioned vertically below the needle-like member 142 and the panel member 143 is provided with a flange portion 14 la and serves to prevent the holder member 11 from being removed.

When the tip of the needle-like member 141 of the conductive contact 14 having the above configuration abuts on the connection electrode 25 on the film substrate 2, the elastic contact force from the panel member 143 causes the connection to the connection electrode 25. Reduce the impact.

[0034] The holder member 11 that holds the conductive contact 14 is configured by superposing the first member 11a and the second member l ib. For this reason, it is possible to easily attach or replace the conductive contact 14 to the opening 11 1.

Next, the configuration of the center pressing member 16 will be described with reference to the cross-sectional view of FIG. A center-holding member 16 shown in FIG. 5 is in contact with the film substrate 2 and can be expanded and contracted within a predetermined range in a direction parallel to the expansion and contraction direction of the conductive contact 14, and one end of the plunger 161. A panel member 162 that abuts and urges the plunger 161 in the axial direction. The center pressing member 16 is fitted and held in a receptacle-type pipe member 71. This pipe member 71 is provided in a socket 72 that is provided in each of the third member 12a and the fourth member 12b constituting the holder member 12 and is fitted in the openings 121a and 121b that communicate coaxially. Contained. As is clear from FIG. 5, only one of the openings 121a is an opening, and the other is a closed end. On the other hand, the opening 121b is an open end at both ends.

[0036] The plunger 161 of the center pressing member 16 has a cylindrical contact portion 161a that contacts the film substrate 2 and a diameter substantially the same as the inner diameter of the pipe member 71. The protruding portion 161b that protrudes and the distal end portion 161c that fits into the connector portion of the receptacle-type noise member 71 and serves to prevent the plunger 161 from being removed from the noise member 71 are coaxially connected to the protruding portion 161b and the distal end portion 161c. A rod-shaped connecting portion 161d. Of these, the tip portion 161c is in contact with the end portion of the panel member 162 that is also housed and held in the pipe member 71, and the contact portion 16la is the surface of the film substrate 2 and the inner portion of the chip mounting region 26 and As the contact unit 1 descends, it gradually enters the inside of the pipe member 71. For this reason, the protrusion amount of the contact portion 161a from the holder member 12 gradually decreases. At this time, the panel member 162 has a function of mitigating that the plunger 161 is displaced at a stroke due to the resistance from the film substrate 2.

[0037] In the center-holding member 16 having the above-described configuration, at least the contact portion 161a of the plunger 161 only needs to be formed of a material having insulating properties such as grease. The diameter R of the contact portion 161a at the tip of the center pressing member 16 is preferably large enough to avoid the wiring pattern 22, and is specifically about 1 to 2 mm.

[0038] By the way, the diameter R of the contact portion 161a of the center pressing member 16 should be determined depending on which package the film substrate 2 is applied to. For example, when the film substrate 2 is applied to TAB, the chip mounting region 26 forms an opening, and therefore the diameter R of the contact portion 161a must be larger than the width of the opening. On the other hand, when applied to the film substrate 2 force SCOF, even if the diameter R of the contact portion 161a is smaller than the width of the chip mounting region 26, the region can be flattened. It is more preferable that the value is smaller than the width of the chip mounting area 26. In this sense, for example, the diameter of the contact portion 171a of the peripheral portion pressing member 17 may be different from the diameter of the contact portion 161a of the center portion pressing member 16.

[0039] The force that has been described so far for the structure of the center pressing member 16 In the first embodiment, the center pressing member 16 and the peripheral pressing member 17 have the same structure. sand That is, the peripheral edge pressing member 17 includes a plunger 171 (abutting portion 171a, projecting portion 171b, tip portion 171c, connecting portion 17 Id) and a panel member 172 having the same configuration as the plunger 161 and the panel member 162, respectively. . The peripheral edge pressing member 17 is also accommodated in the pipe member 71 in the holder member 12. The point that the pipe member 71 is held by the socket 72 embedded in the holder member 12 is the same as in the case of the center pressing member 16.

[0040] By the way, the conductive contact 14, the center pressing member 16, and the peripheral pressing member 17 that also project the bottom force of each holder of the contact unit 1 are in contact with the film substrate 2, and in this state, The amount of protrusion H of the plunger 161 and 171 from the bottom of the main body of the contact unit 1 (see FIG. 5) is the amount of protrusion h from the bottom of the main body of the contact unit 1 of the needle member 141 of the conductive contact 14 (see FIG. 4). H> h, which is larger than

Next, the configuration of the cradle 3 will be described. A non-contact type sensor 31 is disposed on the surface of the central portion of the cradle 3 (see FIG. 1). This sensor 31 is formed by using one or more thin electrode forces, a metal conductor such as a copper plate or an iron plate, and a thin film insulating film such as PET. The connection electrode 25 can be capacitively coupled. The surface area of the sensor 31 exposed on the mounting surface of the film substrate 2 of the cradle 3 is slightly larger than the area of the chip mounting area 26.

[0042] When performing a disconnection inspection of the film substrate 2 using the sensor 31 having the above-described configuration, an AC signal is selectively input to each conductive contact 14, and a sensor is sent in accordance with the AC signal. A change in the signal level of the output signal output from the sensor 31 is detected by a predetermined circuit. When the film substrate 2 is disconnected, an electrostatic capacity that should not originally exist is generated, so that the signal level force output from the sensor 31 is smaller than the expected value. Therefore, the broken portion of the film substrate 2 can be detected by detecting the change in the signal level.

[0043] FIGS. 6 and 7 show that when the contact unit 1 according to the first embodiment is used to inspect the film substrate 2, the contact unit 1 is lowered to the wiring pattern 22 of the film substrate 2. FIG. 6 is an explanatory view showing a situation when the contact 14 is brought into contact with the contact 14; Of these, FIG. 6 shows that the film substrate 2 that has undergone deformation such as warping or undulation is flattened by the peripheral-side pressing member 17. Shows the situation. Further, FIG. 7 shows a state where the conductive contact 14 is brought into contact with the wiring pattern 22 (connection electrode 25 thereof) by further lowering the contact unit 1 after reaching the state of FIG. .

First, FIG. 6 will be described. Since the bottom surface of the contact portion 171a of the peripheral edge pressing member 17 protrudes downward from the tip end portion of the conductive contact 14, when the contact unit 1 is lowered, the peripheral edge pressing member 17 First reaches the film substrate 2 and starts pressing the film substrate 2 downward. At this time, since the film substrate 2 is pressed by the elastic force of the panel member 172 having the same configuration as the panel member 16 2 (see FIG. 5) of the center pressing member 16, the impact applied to the film substrate 2 is not affected. The film substrate 2 can be returned to its original flat shape while being softened. The solid line in FIG. 6 shows a state in which the inner region of the peripheral edge pressing member 17 is generally flattened. Although not shown, since the center pressing member 16 performs the same operation as the peripheral edge pressing member 17, the area near the chip mounting area 26 is flattened in the same manner as described above. Nah ...

In the state shown by the solid line in FIG. 6, it is desirable that the tip of the conductive contact 14 is not yet in contact with the wiring pattern 22. Therefore, the protruding amount of the conductive contact 14 from the holder member 11 may be designed in view of this point. That is, the protruding amount h of the conductive contact 14 from the holder member 11 in the initial state is the thickness of the film substrate 2 (the thickness of the base material 21 and the wiring pattern 22) and the contact unit 1 such as the center pressing member 16 or the like. Determine the optimum value after considering the amount of protrusion H from the top!

Thereafter, when the contact unit 1 is further lowered, the peripheral edge pressing member 17 is gradually reduced while receiving the elastic force, and eventually, as shown by the solid line in FIG. The tip of 14 contacts the connection electrode 25 of the wiring pattern 22. FIG. 8 is a view of the state shown in FIG. 7 when the contact unit 1 is viewed as a whole. As shown in FIG. 8, the portion of the film substrate 2 that is pressed by the center pressing member 16 and the peripheral pressing member 17 is substantially flat, so the positional relationship between the sensor 31 and the film substrate 2 Is almost constant. Therefore, the change in the capacitance due to the deformation of the film substrate 2 becomes almost negligible, the operation sensitivity of the sensor 31 is improved, and the operation is stabilized. As a result, it is possible to perform a disconnection inspection with higher accuracy. [0047] When the contact unit 1 is lowered, the center pressing member 16 and the peripheral pressing member 17 contact the film substrate 2 earlier than the conductive contact 14, and the conductive contact 14 contacts. Since the film substrate 2 is almost flat at the time of starting, the tips of the plurality of conductive contacts 14 start to contact the wiring pattern 22 almost simultaneously. As a result, the degree of wear of each conductive contact 14 after many inspections is substantially uniform regardless of the installation position. Therefore, the contact of the conductive contact 14 to the film substrate 2 can be stabilized, and the durability of the conductive contact 14 itself can be improved.

[0048] According to Embodiment 1 of the present invention described above, a film substrate having a thin film shape

A plurality of conductive contacts that contact at least one of input and output of electrical signals in contact with the wiring pattern of (inspection target) and the plurality of conductive contacts are parallel to each other in the axial direction. A holder member that is accommodated in an arrangement corresponding to the wiring pattern, and a center pressing member that flattens a region near the wiring pattern that comes into contact with the plurality of conductive contacts when the continuity test is performed. A flat plate means), it is possible to detect a disconnection of a thin film substrate having a low rigidity with high accuracy. As a result, the reliability of the inspection itself can be improved.

[0049] According to the first embodiment, as a kind of flattening means, a peripheral edge pressing member that presses the peripheral edge of the wiring pattern is provided, so that the conductive contact of the film substrate during inspection is provided. Deformation such as warpage and undulation in the region near the contacting surface can be eliminated, and the contact state of the peripheral portion with the conductive contact can be ensured. As a result, the contact between the individual conductive contacts and the contact electrode is uniform, so that the wear of a plurality of conductive contacts is made uniform without the wear of a specific conductive contact progressing quickly. It is possible to improve the durability of the inspection apparatus itself.

[0050] (Embodiment 2)

In the second embodiment of the present invention, as a part of the flattening means for flattening the film substrate 2, a hole for sucking with a negative pressure is provided for the cradle on which the film substrate 2 is placed. Features. FIG. 9 is a top view showing a configuration of a cradle that forms part of the inspection apparatus according to the second embodiment. FIG. 10 is a cross-sectional view taken along line BB in FIG. The cradle 4 shown in these drawings includes a mounting portion 41 on which the film substrate 2 is mounted, and a negative pressure that is fixed to the mounting portion 41. And a suction part 42 to which a suction nozzle is attached.

[0051] The same non-contact type sensor 31 as described in the first embodiment is embedded in the substantially central portion of the surface of the mounting portion 41, and at the periphery of the sensor 31 on the surface of the mounting portion 41. Has holes 43 for negative pressure suction (in FIG. 9, six holes 43 are formed). In addition, a plurality of holes 44 (12 in FIG. 9) are also formed near the edge of the surface of the mounting portion 41. Each hole 43 and 44 communicates with a vacuum hole 46 (described later) of the suction part 42 through a communication passage 45. The diameter of the holes 43 and 44 is about 1 mm. On the other hand, the suction part 42 has a vacuum hole 46 formed in the surface facing the mounting part 41, and the bottom surface of the vacuum hole part 46 is open at the surface not facing the mounting part 41. It communicates with a through-hole portion 421 having. A suction nozzle 47 is attached to the through-hole portion 421. The nozzle 47 is connected to a vacuum generating device such as a vacuum pump 49 via a hose 48.

FIG. 11 is a diagram showing a state in which the film substrate 2 is placed on the cradle 4 and the negative pressure is increased by the vacuum pump 49. As shown in FIG. 11, in the contact unit 5 that accommodates the conductive contact 14, the holder member 51 is fixedly supported by the base member 52. The holder member 51 can accommodate a plurality of conductive contacts 14 according to the wiring pattern 22 of the film substrate 2 (the lead wire 15 is omitted).

As shown in FIG. 11, by covering the film substrate 2 with a negative pressure, at least a portion of the film substrate 2 placed on the placement portion 41 is generally flattened. . As a result, the positional relationship between the sensor 31 and the film substrate 2 is kept constant, and the accuracy during the disconnection inspection can be improved. In addition, since a plurality of conductive contacts 14 are in contact with the wiring pattern (connecting electrode 25) at the same time during the inspection, the progress of the wear of the conductive contacts 14 is also substantially the same, making it durable as an inspection device. Can be improved.

[0054] According to the second embodiment of the present invention described above, by applying a negative pressure to the film substrate to be inspected, the film substrate is fixed substantially parallel to the cradle. The distance between the sensor and the film substrate is almost constant, which improves the operational sensitivity of the sensor embedded in the cradle and stabilizes its operation. For this reason, as in the first embodiment, the disconnection inspection can be performed accurately and reliably, and the progress of wear of the conductive contact is substantially uniform. As a result, durability can be improved.

[0055] Furthermore, according to the second embodiment, it is only necessary to apply a negative pressure when flattening the film substrate! Therefore, there is almost no risk of damaging the surface of the film substrate! There is also an advantage.

[0056] (Modification of Embodiment 2)

FIG. 12 is a top view showing a configuration of a cradle applied to an inspection apparatus according to a modification of the second embodiment. FIG. 13 is a cross-sectional view taken along the line CC in FIG. In the cradle 6 shown in these drawings, a groove portion 63 that surrounds the vicinity of the sensor 31 is provided in the mounting portion 61, and holes 64 are formed at predetermined intervals on the bottom surface of the groove portion 63. (In FIG. 12, six holes 64 are formed). In addition, four groove portions 65 are provided along the four corners of the placement portion 61 at the peripheral portion of the placement portion 61, and holes 66 are formed at predetermined intervals on the bottom surface of each groove portion 65. (In FIG. 12, there are three holes 66 in one groove 65). The diameters of the grooves 63 and 65 are about lmm, and their depths are about the same. Each of the holes 64 and 66 communicates with the vacuum hole 46 of the suction part 42 through the communication passage 67. The configuration of the suction part 42 is the same as that of the second embodiment, and the point that it is connected to the vacuum pump 49 via the nozzle 47 and the hose 48 is the same as that of the second embodiment.

[0057] The method of applying the negative pressure when the film substrate 2 is flattened using the cradle 6 having the above-described configuration is the same as that of the second embodiment. Therefore, the effect obtained is the same.

[0058] (Other Embodiments)

So far, the best mode for carrying out the present invention has been described in detail for the first and second embodiments. The present invention should not be limited only by these two embodiments. For example, only one of the center pressing member and the peripheral edge pressing member as the flattening means provided in the inspection apparatus according to the present invention may be provided. When only the center pressing member is provided, the accuracy of the sensor can be particularly improved. On the other hand, when only the peripheral edge pressing member is provided, it is possible to suppress variation in wear of the conductive contact and to realize stable contact with the film substrate. it can.

[0059] Further, as the flattening means, the various pressing members described in the first embodiment and the second embodiment. You may comprise the test | inspection apparatus which has a hole part demonstrated by (2). In this case, attention should be paid so that the contact position of the pressing member and the drilling position of the hole do not overlap.

Note that the conductive contact applied to the inspection apparatus according to the present invention is not limited to the above-described conductive contact 14 (see FIG. 4). In other words, any of various types of conventionally known conductive contacts can be applied to the inspection apparatus according to the present invention.

[0061] As described above, the present invention can include various embodiments and the like not described herein, and V, V, within the scope not departing from the technical idea specified by the claims. It is possible to make various design changes.

Industrial applicability

[0062] As described above, the inspection apparatus according to the present invention applies to a thin film-like inspection target in which a plurality of conductive regions including a wiring pattern used for input or output of an electric signal are formed on the surface. It is useful for the continuity inspection of the wiring pattern, and is particularly suitable for detecting the disconnection of the thin object and lack of rigidity.

Claims

The scope of the claims

[1] A plurality of conductive regions including a wiring pattern used for input or output of an electric signal is formed on the surface, and the wiring pattern is applied to a thin film film-like inspection target on which a predetermined semiconductor chip is mounted at the time of mounting. An inspection device for performing a continuity test of

A plurality of conductive contacts that contact at least one of an input and an output of an electrical signal in contact with the wiring pattern;

A holder member for accommodating the plurality of conductive contacts in an arrangement corresponding to the wiring pattern;

A flattening means for flattening a region near the wiring pattern in contact with the plurality of conductive contacts when performing the continuity test;

An inspection apparatus comprising:

[2] The flattening means includes

2. The inspection apparatus according to claim 1, wherein the wiring pattern is flattened by applying pressure to the wiring pattern.

[3] The flattening means includes

A plurality of presser members that are elastically urged and retracted relative to the axial direction and accommodated in the holder member;

3. The inspection apparatus according to claim 1, wherein the plurality of pressing members have a larger protruding amount from the holder member than the conductive contact in a state where the plurality of pressing members are not in contact with the inspection object.

[4] The pressing member is

4. The device according to claim 3, wherein when performing the continuity test, the continuity test is provided at a position in contact with at least one of the inside and the vicinity of a chip mounting area where a predetermined semiconductor chip is mounted during mounting. Inspection device.

[5] The holder member is

A first holder member that houses the plurality of conductive contacts;

A second holder member for accommodating the pressing member;

5. The inspection apparatus according to claim 4, further comprising:

[6] The pressing member is

4. The inspection apparatus according to claim 3, wherein when performing the continuity inspection, the inspection apparatus is provided at a position that contacts a peripheral portion of the wiring pattern that contacts the plurality of conductive contacts.

[7] The pressing member is

4. The inspection apparatus according to claim 3, wherein the contact portion that contacts the inspection object is made of resin.

[8] The flattening means includes

3. The inspection apparatus according to claim 1, further comprising negative pressure applying means for applying a negative pressure to the inspection object.

[9] The negative pressure applying means includes

9. The inspection apparatus according to claim 8, wherein when conducting the continuity test, a negative pressure is applied to at least one of the inside and the vicinity of a chip mounting area where a predetermined semiconductor chip is mounted during mounting.

[10] The negative pressure applying means includes:

9. The inspection apparatus according to claim 8, wherein when performing the continuity test, negative pressure is applied to a peripheral portion of the wiring pattern that contacts the plurality of conductive contacts.

[11] The negative pressure applying means includes:

A plurality of holes formed in predetermined positions, and a suction base for placing a part of the inspection object thereon, and suction means for performing suction by a negative pressure through the plurality of holes formed in the base The inspection apparatus according to claim 8, further comprising:

12. The inspection apparatus according to claim 1, wherein the continuity inspection includes a disconnection inspection using a non-contact type sensor.