JP2012112904A - Probe card, semiconductor inspection device, and semiconductor inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe card, a semiconductor inspection device and a semiconductor inspection method capable of accurately inspecting a semiconductor device formed on a TAB tape and improving the service life of the probe card.SOLUTION: This probe card includes TAB tape pressing bodies at positions facing the both sides of the TAB tape that, when being mounted on a test head, is absorbed and supported by a pusher. When a pusher is brought closer to the test head, before the tip of a probe needle comes into contact with an electrode of a semiconductor device on the TAB tape, the TAB tape pressing bodies come into contact with both sides of the TAB tape, and press the both sides of the TAB tape towards the pusher side. The semiconductor inspection device including the TAB tape pressing body, and a semiconductor inspection method performed using the semiconductor inspection device are provided.

Description

  The present invention relates to a probe card, a semiconductor inspection apparatus, and a semiconductor inspection method. More specifically, the present invention relates to a probe card used for inspecting the electrical characteristics of a semiconductor element carried on a TAB tape, and to the TAB tape. The present invention relates to a semiconductor inspection apparatus and a semiconductor inspection method for inspecting electrical characteristics of a semiconductor element.

  2. Description of the Related Art A semiconductor inspection apparatus for inspecting electrical characteristics of a semiconductor element such as a liquid crystal drive driver formed on a TAB tape by using a TAB (Tape Automated Bonding) technique has been conventionally known as disclosed in Patent Documents 1 to 4, for example. FIG. 10 shows a schematic diagram of an example.

  That is, in FIG. 10, reference numeral 101 denotes a semiconductor inspection apparatus, and the semiconductor inspection apparatus 101 includes a handler 102 and a tester 103. 104 is a device reel, 105 is a receiving reel, 106 and 106 are sprockets, and T is a TAB tape. The sprockets 106 and 106 have a function of engaging the sprocket teeth with a sprocket hole provided in the TAB tape T and feeding the TAB tape T in a direction from the device reel 104 toward the receiving reel 105. Reference numeral 107 denotes a pusher, 108 denotes an XY moving stage, and 109 denotes a driving device that moves the pusher 107 in the vertical direction. 110 is a probe card, 111 is a test head, and p is a probe needle attached to the probe card 110.

FIG. 11 is a bottom view of the pusher 107. For convenience, the TAB tape T sucked and supported by the pusher 107 is also shown. 112 suction port provided a number to the pusher 107, S is a semiconductor element formed on the TAB tape _107, d 1, _{d 2} is the electrode of each semiconductor element S, the semiconductor device S and the electrode _{d 1} , D ₂ d are connected by a large number of wirings (not shown). h is a sprocket hole provided on both sides of the TAB tape T.

  FIG. 12 is a cross-sectional view of the pusher 107. Reference numeral 112 denotes the above-described suction port, and 113 denotes a suction pipe. As shown in FIG. 12, many suction ports 112 penetrate the bottom surface of the pusher 107, and when the suction pipe 113 is connected to suction means (not shown) and the inside of the pusher 107 is sucked to negative pressure through the suction pipe 113. The TAB tape T is sucked into the suction port 112 and sucked and supported on the surface of the pusher 107. The TAB tape T adsorbed and supported on the surface of the pusher 107 is moved in the XY direction together with the pusher 107 by the XY moving stage 108 and is aligned at a predetermined position. When the alignment is completed, the pusher 107 is lowered toward the probe card 110 by the driving device 109, and the electrodes of the semiconductor elements S and S formed on the TAB tape T come into contact with the probe needle p of the probe card 110 to electrically Inspection of physical characteristics is performed.

However, according to the knowledge obtained by the present inventors, when the semiconductor element S on the TAB tape T is inspected using the semiconductor inspection apparatus 101 as described above, sometimes the probe needle p of the probe card 110 and In some cases, sufficient contact with the electrodes d ₁ and d ₂ of the semiconductor element S cannot be obtained. In addition, the probe needle p may be overdriven excessively and the probe needle may be bent or the height thereof may vary. When such a phenomenon occurs, not only an accurate inspection cannot be performed, but also the inconvenience that the probe card must be repaired or replaced.

JP-A-7-239366 JP 2003-161759 A International Publication WO2008 / 120519A1 JP 2009-121868 A

  The present invention was made in order to solve the disadvantages of the conventional semiconductor inspection apparatus, and can accurately inspect the semiconductor elements formed on the TAB tape, and the probe needle is excessive. It is an object of the present invention to provide a probe card, a semiconductor inspection apparatus, and a semiconductor inspection method in which the probe needle does not bend due to overdrive and the height thereof does not vary.

  The present inventors have repeatedly searched for the cause of the above-described disadvantages in the conventional semiconductor inspection apparatus. As a result, the inconveniences as described above occur in the conventional semiconductor inspection apparatus when the probe needle of the probe card comes into contact with the electrode of the semiconductor element on the TAB tape, and the TAB tape that is adsorbed and supported on the pusher I found out that it was a little moving. As a result of further investigations, the TAB tape moves when the probe needle and the electrode are in contact with each other. When the TAB tape is distorted or the like, the suction near the both ends of the TAB tape by the pusher becomes insufficient. For example, as shown in FIG. 13, it was found that both side portions t and t of the TAB tape T are lifted from the surface of the pusher 107.

  In order to sufficiently adsorb both side portions t and t of the TAB tape T, the number of suction ports 112 provided in the pusher 107 is increased at portions corresponding to both sides t and t of the TAB tape T. Can be considered. However, as described above, the sprocket holes h for driving are formed in both side portions t, t of the TAB tape T, and the number of suction ports 112 is increased at portions corresponding to the vicinity of both side portions t, t of the TAB tape T. There are limits to this. Although it is conceivable to increase the suction force by the pusher 107, it is necessary to use a large suction device in order to increase the suction force, which makes the device large and unfavorable in terms of energy. When there is distortion or the like, there is a possibility that the increased suction force does not reach both sides t and t of the TAB tape T.

  Under such circumstances, the present inventors conducted further research and repeated trial and error. As a result, the TAB tape pressing body was provided at a position facing both sides of the TAB tape that is adsorbed and supported by the pusher. When the pusher is moved relatively close to the test head, the two sides of the TAB tape are stimulated by bringing them into contact with both sides of the TAB tape before the probe needle attached to the probe card. Thus, it has been found that adsorption by the pusher can be assisted and lifting from the pusher on both sides of the TAB tape can be eliminated. The TAB tape, which is lifted from both sides and sufficiently absorbed and supported by the pusher, will not move or be displaced even when the probe needle contacts the electrode of the semiconductor element.

  That is, the present invention relates to a test head on which a probe card is mounted, a pusher provided at a position facing the test head and having suction means for sucking and supporting a TAB tape on the surface, and the pusher to the test head A probe card for use in a semiconductor inspection apparatus having means for moving relative to a head, the probe card being on both sides of a TAB tape that is adsorbed and supported by the pusher when mounted on the test head The TAB pressing body has a TAB pressing body at a position opposite to the tip of the probe needle mounted on the probe card when the pusher is moved relatively close to the test head. Is in contact with both sides of the TAB tape before contacting with the electrodes of the semiconductor elements on the TAB tape, By providing a probe card is TAB tape pressing body for pressing the side portions of the serial TAB tape to the pusher side, is intended to solve the foregoing problems.

  In a preferred aspect of the probe card of the present invention, the TAB tape pressing body is a long film whose both ends in the longitudinal direction are fixed to the probe card. Moreover, in a further preferred aspect of the probe card of the present invention, the long film is fixed to the probe card so that the central portion protrudes in an arch shape. When the TAB tape pressing body is a long film and is fixed to the probe card so that its central portion protrudes in an arch shape, the leaf spring effect is obtained by the elasticity of the film itself, There is an advantage that the both sides of the TAB tape can be more reliably pressed by the tape pressing body.

  In another preferred aspect of the probe card of the present invention, the TAB tape pressing body is a prismatic or cylindrical elastic body. One or a plurality of prismatic or cylindrical TAB tape pressing bodies are disposed at positions facing both sides of the TAB tape that is adsorbed and supported by the pusher when the probe card of the present invention is mounted on the test head, When the pusher is brought relatively close to the test head, the probe needle mounted on the probe card comes into contact with both sides of the TAB tape before the tip of the probe needle contacts the electrode of the semiconductor element on the TAB tape. It comes into contact with each other, stimulates both sides, assists the pusher in adsorbing the TAB tape, and presses the TAB tape toward the pusher. Note that the TAB tape pressing body used in the present invention preferably has antistatic properties so that dust and the like are not adsorbed from the surroundings due to static electricity.

  As described above, it is most simple and preferable that the TAB tape pressing body is attached to the probe card mounted on the test head. However, when the pusher is moved relatively close to the test head, the tip of the probe needle of the probe card is used. The TAB tape pressing body may be attached to anything as long as the part can contact both sides of the TAB tape before contacting the electrode of the semiconductor element on the TAB tape. Also good.

  That is, the present invention includes a test head on which a probe card is mounted, a pusher provided at a position facing the test head and having suction means for sucking and supporting a TAB tape on the surface, and the pusher as the test head. A semiconductor inspection apparatus having a means for moving the pusher relative to the test head at a position opposite to both sides of the TAB tape that is sucked and fixed to the pusher. The tip of the probe needle of the probe card comes into contact with both sides of the TAB tape before contacting the electrode of the semiconductor element on the TAB tape, and both sides of the TAB tape are brought to the pusher side. By providing a semiconductor inspection apparatus provided with a TAB tape pressing body to be pressed, the above problem can be solved. It is.

  Furthermore, the present invention relates to a step of sucking and supporting the TAB tape on the surface of the pusher by suction, and moving the TAB tape sucked and supported on the pusher relative to the test head so that the electrode of the semiconductor element on the TAB tape. And a step of bringing the probe needles of the probe card attached to the test head into contact with each other, and before the probe needles contact the electrodes of the semiconductor element, both sides of the TAB tape The above-described problems are solved by providing a semiconductor inspection method in which a TAB tape pressing body is brought into contact with a portion and both sides of the TAB tape are pressed toward the pusher.

  According to the probe card, the semiconductor inspection apparatus, and the semiconductor inspection method of the present invention, the TAB tape is more securely adsorbed and fixed onto the pusher, and the probe needle of the probe card contacts the electrode of the semiconductor element on the TAB tape. In some cases, the TAB tape does not move. Therefore, it is possible to accurately inspect the semiconductor element, and to inspect the semiconductor element without excessively overdriving the probe needle and bending the probe needle or causing variations in its height. The advantage that it can be obtained.

It is a top view which shows an example of the probe card of this invention. It is X-X 'sectional drawing of FIG. It is a figure which shows the state which the probe card and pusher of this invention approach. It is a figure which shows the state which the probe card and pusher of this invention approached, and the TAB tape press body contacted the TAB tape. It is a side view which shows the state by which the TAB tape was adsorbed and supported by the pusher to the both sides by the probe card of this invention. It is a top view which shows another example of the probe card of this invention. It is a front view which shows another example of the probe card of this invention. It is a figure which shows the state which the probe card and pusher of this invention approached, and the TAB tape press body contacted the TAB tape. It is a figure which shows an example of the semiconductor inspection apparatus of this invention. It is a figure which shows an example of the conventional semiconductor inspection apparatus. It is a bottom view of the pusher used for the conventional semiconductor inspection apparatus. FIG. 12 is a Y-Y ′ cross-sectional view of FIG. 11. It is a figure which shows the state which the both sides of the TAB tape have floated from the pusher.

  Hereinafter, the present invention will be described in detail with reference to the drawings, but the present invention is not limited to the illustrated one.

FIG. 1 is a plan view showing an example of the probe card of the present invention, and only the probe unit portion is shown for convenience. In FIG. 1, 1 is a probe card, 2 is a wiring board, 3 is a needle holder, and p is a probe needle. As shown in the figure, a number of probe needles p are provided on the wiring board 2 of the probe card 1 by the needle holder 3. Is attached. P1 to P4 represent a row of probe needles p. The plurality of probe needles p in the P1 row and the plurality of probe needles p in the P2 row correspond to the plurality of electrodes d ₁ and d _{2 of} one semiconductor element S, and P3 The plurality of probe needles p in the row and the plurality of probe needles p in the P4 row correspond to the plurality of electrodes d ₁ and d _{2 of the} other semiconductor element S. That is, the illustrated probe card 1 is a type of probe card that can inspect two semiconductor elements S and S simultaneously. Needless to say, the probe card 1 of the present invention may be of a type that inspects one or more semiconductor elements S at a time.

  4 is a TAB tape pressing body, and 5 is a fixing portion of the TAB tape pressing body 4. As shown in the figure, the TAB tape pressing body 4 is long, and both end portions thereof are fixed to the fixing portions 5 and 5. The TAB tape pressing body 4 is on both sides of the probe needle p on the wiring board 2, and the distance between one TAB tape pressing body 4 and the other TAB tape pressing body 4 is the both sides of the TAB tape to be inspected. Almost corresponds to the interval of the parts. That is, the positions where the TAB tape pressing bodies 4 and 4 are attached face both side portions of the TAB tape T adsorbed and supported by the pusher 107 when the probe card 1 is mounted on the test head 111 of the semiconductor inspection apparatus 101. Is in position.

2 is a cross-sectional view taken along the line XX ′ of FIG. As shown in the figure, the TAB tape pressing body 4 is fixed to the wiring board 2 of the probe card 1 at both ends in the longitudinal direction of the fixing portions 5 and 5. The attachment angle of the TAB tape pressing body 4 at the fixing portions 5 and 5 is slightly upward, and the TAB tape pressing body 4 is attached to the fixing portions 5 and 5 so that the central portion O forms an arch projecting slightly upward. Yes. The TAB tape pressing body 4 is located above the tip of the probe needles p and p, that is, at a position farther from the wiring board 2 than the tip of the probe needles p and p. Therefore, when the pusher 107 is brought close to the probe card 1 as will be described later, the TAB tape is pressed before the probe needles p and p come into contact with the plurality of electrodes d ₁ and d ₂ of the semiconductor element S on the TAB tape T. The body 4 comes into contact with both sides of the TAB tape T. Further, as described above, the TAB tape pressing body 4 is attached to the fixing portions 5 and 5 so that the central portion O has an arch shape that slightly protrudes upward. The TAB tape T is stimulated and pushed back to the pusher 107 side, assisting the suction by the pusher 107, and the movement of the TAB tape T supported on the pusher 107 even if the pusher 107 continues to descend. It follows and bends and presses both sides of the TAB tape T evenly.

  The TAB tape pressing body 4 may be made of any material as long as it can contact and transmit the pressing force to both sides of the TAB tape T, for example, a synthetic resin film, paper, non-woven fabric. Etc. can be used. However, it is preferable to use a synthetic resin film such as polyester, for example, from the viewpoint of elasticity and durability when supported and fixed in an upwardly protruding arch shape. The TAB tape pressing body 4 is preferably provided with antistatic properties so as not to attract surrounding dust and dust during use. In addition, as a means for fixing the TAB tape pressing body 4 to the fixing portions 5 and 5, for example, an adhesive can be used.

Next, the operation of the probe card 1 of the present invention will be described with reference to FIGS. As shown in FIG. 3, the TAB tape T is adsorbed and supported on the lower surface of the pusher 107, and the plurality of electrodes d ₁ and d _{2 of the} semiconductor elements S ₁ and S ₂ to be inspected and the plurality of probes of the probe card 1. The needle p is in a state of being aligned with each other. On the other hand, the TAB tape pressing body 4 is fixed to the fixing portions 5 and 5 in a state where the central portion O swells in an arch shape protruding upward. The semiconductor elements S ₁ and S ₂ are inspected by lowering the pusher 107 toward the probe card 1 from this state.

FIG. 4 shows a state in which the pusher 107 is lowered toward the probe card 1 and the protruding central portion O of the TAB tape pressing body 4 is in contact with both side portions of the TAB tape T adsorbed and supported by the pusher 107. As described above, the TAB tape pressing body 4 is located above the tip of the probe needle p, that is, at a position farther from the wiring board 2 of the probe card 1 than the tip of the probe needle p. The TAB tape pressing body 4 comes into contact with both side portions of the TAB tape T before it comes into contact with the plurality of electrodes d ₁ and d _{2 of the} semiconductor elements S ₁ and S ₂ formed on the TAB tape T. Next, when the pusher 107 continues to descend further, the TAB tape pressing body 4 expands the contact area with the TAB tape T while flexing following the movement of the TAB tape T, and the semiconductor elements S ₁ and S ₂ to be inspected. Is in contact with both sides of the TAB tape T over almost the front surface of the area on the TAB tape on which is formed. By this contact, both sides of the TAB tape T are stimulated, and even if there are parts floating from the pusher 107 on both sides of the TAB tape T, the floating parts are pushed back to the pusher 107 side. Thus, the suction force from the suction port 112 at the position where the TAB tape T is applied effectively acts on both sides of the TAB tape T. For this reason, the TAB tape T is reliably sucked and supported by the pusher 107 including both sides thereof.

FIG. 5 is a side view showing the relationship between the probe card 1 and the pusher 107 at this time. As shown in the figure, the TAB tape pressing bodies 4 and 4 are in contact with both end portions t and t of the TAB tape T, and the TAB tape T is adsorbed and supported by the pusher 107 including both side portions t and t. If the TAB tape T is in a state of being supported by the pusher 107 including both sides t, t, the pusher 107 is further lowered so that the probe needle p is connected to the semiconductor elements S ₁ and S ₂ on the TAB tape T. Even if it comes into contact with the plurality of electrodes d ₁ and d ₂ , the TAB tape T does not move, and no positional deviation occurs. As a result, electrical contact between the probe needle p and the electrodes d ₁ and d ₂ is ensured. Further, since the probe needle p is not overdriven excessively, there is no possibility that the probe needle p is bent or the height of the tip end thereof is not varied.

FIG. 6 is a plan view showing another example of the probe card 1 of the present invention, and FIG. 7 is a side view thereof. For convenience, only the probe unit portion is shown. In the probe card 1 of this example, the TAB tape pressing body 4 has a quadrangular prism shape formed of an elastic material, such as rubber or resin, and the probe needle on the wiring board 2 of the probe card 1. On both sides of p, a plurality are arranged with a space between each other. The distance between the TAB tape pressing body 4 located on one side of the probe needle p and the TAB tape pressing body 4 located on the other side substantially corresponds to the distance between both sides of the TAB tape T to be inspected. The TAB tape pressing body 4 is attached to the probe card 1 at both sides of the TAB tape T that is sucked and fixed to the pusher 107 when the probe card 1 is mounted on the test head 111 of the semiconductor inspection apparatus 101. It is the position which opposes. Further, the upper surface of the TAB tape pressing body 4 is located at a position higher than the tip of the probe needle p, that is, a position farther from the wiring board 2 than the tip of the probe needle p. For this reason, when the pusher 107 that sucks and supports the TAB tape T approaches the probe card 1, the tip of the probe needle p is before contact with the plurality of electrodes d ₁ and d ₂ of the semiconductor element S on the TAB tape T. In addition, the upper surface of the TAB tape pressing body 4 comes into contact with both side portions of the TAB tape T. Instead of the elastic quadrangular prism-shaped TAB tape pressing body 4 described above, a prismatic or cylindrical elastic body such as a triangular prism or pentagonal prism may be used as the TAB tape pressing body 4 or long. The TAB tape pressing body 4 may be formed by forming a long film into a U-shape and fixing both ends of the film to the wiring board 2.

  FIG. 8 shows a state where the pusher 107 for sucking and supporting the TAB tape T is lowered and the upper surface of the TAB tape pressing body 4 is in contact with both side portions of the TAB tape T. As shown in the figure, when the upper surface of the TAB tape pressing body 4 comes into contact with both side portions of the TAB tape T, the TAB tape pressing body 4 is bent by its own elasticity, and the upper surface of the TAB tape pressing body 4 is in contact with both side portions of the TAB tape T. Follow the movement. For this reason, the TAB tape pressing body 4 can stimulate both sides of the TAB tape T or can effectively transmit the pressing force to both sides of the TAB tape T. In this way, if the TAB tape pressing body 4 and both sides of the TAB tape T are in contact with each other, even if there are portions floating from the pusher 107 on both sides of the TAB tape T, both sides of the TAB tape T are Since it is stimulated by the contact with the TAB tape pressing body 4 and is pushed back to the pusher 107 side, the suction force from the suction port 112 at the corresponding position effectively acts on both sides of the TAB tape T, and TAB The tape T is surely sucked and supported by the pusher 107 including both sides thereof.

  As described above, the probe card 1 of the present invention includes the TAB tape pressing body 4, and when this is mounted on the test head of the semiconductor inspection apparatus and the semiconductor element is inspected, the TAB tape T includes both sides thereof. Since it is reliably adsorbed and supported by the pusher 107, an accurate inspection can be performed, and there is no possibility of excessive overdrive of the probe needle p or variation in the height of the probe needle p. Therefore, the semiconductor inspection apparatus in which the probe card 1 of the present invention is mounted on the test head is the semiconductor inspection apparatus of the present invention.

  Further, as described above, the TAB tape pressing body 4 does not necessarily have to be attached to the probe card, and may be attached to the semiconductor inspection apparatus itself in some cases. FIG. 9 is a view showing an example of the semiconductor inspection apparatus according to the present invention in which the semiconductor inspection apparatus itself includes the TAB tape pressing body 4. In FIG. 9, reference numeral 6 denotes a semiconductor inspection apparatus according to the present invention. The semiconductor inspection apparatus 6 includes a long TAB tape pressing body 4 having both ends fixed to fixing portions 5 and 5. However, the fixing portions 5 and 5 are not on the probe card 110 but are attached to the test head 111 by the attachment members 7 and 7. Although only the TAB tape pressing body 4 on the near side is shown in the figure, it is said that another TAB tape pressing body 4 is also attached to the other side (back side of the paper surface) across the probe needle p. Not too long.

  As shown in FIG. 9, the TAB tape pressing body 4 is fixed to the fixing portions 5 and 5 so as to form an arch projecting slightly upward at the center, and is positioned above the tip portion of the probe needle p. Therefore, when the pusher 107 that sucks and supports the TAB tape T descends toward the probe card 110, before the tip of the probe needle p contacts the electrode of the semiconductor element formed on the TAB tape T, Since the TAB tape pressing body 4 comes into contact with both sides of the TAB tape T, even if both sides of the TAB tape T are lifted from the pusher 107, both sides of the TAB tape T are brought into contact with the TAB tape pressing body 4 due to contact with the TAB tape pressing body 4. In response to the stimulus, the pusher 107 is pushed back so that the suction force from the suction port 112 at the corresponding position effectively acts on both sides of the TAB tape T. It made. As a result, the TAB tape T is surely sucked and supported by the pusher 107 including both sides thereof. In this example, the fixing portions 5 and 5 for fixing the TAB tape pressing body 4 are attached to the test head 111, but it is needless to say that they may be attached to other members constituting the semiconductor inspection apparatus 6. . Further, in this example, the film-like TAB tape pressing body 4 whose both ends are fixed to the fixing portions 5 and 5 is shown, but instead of the film-like TAB tape pressing body 4, a prismatic or columnar elastic body is used. Of course, the body may be used as the TAB tape pressing body 4.

  Using the semiconductor inspection apparatus 6 of the present invention as described above or the semiconductor inspection apparatus 101 equipped with the probe card 1 of the present invention, the semiconductor inspection method of the present invention is performed as follows. In other words, the device reel 104 and the receiving reel 105 are operated to move the TAB tape T so that the semiconductor element to be inspected comes to a predetermined position on the pusher 107, and then the suction means is operated to make the inside of the pusher 107 negative. The TAB tape T is sucked and supported on the pusher 107 by sucking the pressure. When the TAB tape T is adsorbed and supported on the pusher 107, the pusher 107 is moved by the XY stage 108 to align with the probe card 1 or 110.

When the alignment is completed, the driving device 109 is operated to lower the pusher 107 with respect to the probe card 1 or 110. In the middle of the lowering, the TAB tape pressing body 4 is placed on the TAB tape T before the tip of the probe needle p contacts the electrodes d ₁ and d _{2 of the} semiconductor element S formed on the TAB tape T. Touch both sides of the. By this contact, both sides of the TAB tape T are stimulated and pressed upward from below, so even if both sides of the TAB tape T are lifted from the pusher 107, they are pushed back to the pusher 107 side. Thus, the suction force from the suction port 112 at the position where the TAB tape T is applied effectively acts on both sides of the TAB tape T. As a result, the TAB tape T is securely supported by the pusher 107 including both sides thereof. When the pusher 107 further descends, the tip of the probe needle p comes into contact with the electrodes d ₁ and d _{2 of the} semiconductor element S formed on the TAB tape T, and the electrical characteristics of the semiconductor element S are inspected. .

  As described above, according to the probe card, the semiconductor inspection apparatus, and the semiconductor inspection method of the present invention, in the inspection of the semiconductor element in which the TAB tape is sucked and supported by the pusher and brought into contact with the probe card, the TAB tape is sucked and supported by the pusher. Therefore, even if the probe needle and the electrode of the semiconductor element come into contact with each other, the TAB tape does not move, and a more accurate inspection can be performed. In addition, there is no possibility that the probe needle will be overdriven excessively or the height of the probe needle will vary, so that the life of the probe card can be extended. Thus, the present invention has great industrial utility in the industry that requires inspection of semiconductor elements.

DESCRIPTION OF SYMBOLS 1 Probe card 2 Wiring board 3 Needle presser 4 TAB tape pressing body 5 Fixed part 6 Semiconductor inspection apparatus 7 Mounting member 101 Semiconductor inspection apparatus 102 Handler 103 Tester 104 Device reel 105 Housing reel 106 Sprocket 107 Pusher 108 XY movement stage 109 Drive apparatus 110 Probe card 111 Test head 112 Suction port 113 Suction tube T TAB tape S Semiconductor element d ₁ , d ₂ electrode h Sprocket hole p Probe needle t Side part

Claims (9)

  A test head on which a probe card is mounted; a pusher provided at a position facing the test head and having suction means for sucking and supporting a TAB tape on the surface; and the pusher relative to the test head A probe card used in a semiconductor inspection apparatus having means for moving the probe card to a position opposite to both sides of the TAB tape that is sucked and supported by the pusher when mounted on the test head. The TAB pressing body has a probe needle mounted on the TAB tape when the pusher is moved relatively close to the test head. Prior to contact with the electrodes of the semiconductor element, both sides of the TAB tape are brought into contact with both sides of the TAB tape. Probe card is a TAB tape pressing body for pressing the parts on the pusher side.   The probe card according to claim 1, wherein the TAB tape pressing body is a long film having both ends in the longitudinal direction fixed to the probe card.   The probe card according to claim 2, wherein the film is fixed to the probe card such that a central portion protrudes in an arch shape.   The probe card according to claim 1, wherein the TAB tape pressing body is a prismatic or cylindrical elastic body.   The probe card according to claim 1, wherein the TAB tape pressing body has antistatic properties.   A test head on which a probe card is mounted; a pusher provided at a position facing the test head and having suction means for sucking and supporting a TAB tape on the surface; and the pusher relative to the test head A semiconductor inspection apparatus having means for moving the probe to the position opposite to both sides of the TAB tape that is attracted and fixed to the pusher when the pusher is moved relatively close to the test head. TAB tape pressing that contacts both sides of the TAB tape before the tip of the probe needle of the card contacts the electrode of the semiconductor element on the TAB tape and presses both sides of the TAB tape toward the pusher Semiconductor inspection equipment with a body.   The semiconductor inspection apparatus according to claim 6, wherein the TAB tape pressing body has antistatic properties.   A process of adsorbing and supporting the TAB tape on the surface of the pusher by suction, and moving the TAB tape adsorbed and supported on the pusher relative to the test head and mounting it on the electrode of the semiconductor element on the TAB tape and the test head A step of contacting the probe needle of the probe card with the TAB tape on both sides of the TAB tape before the probe needle contacts the electrode of the semiconductor element. A semiconductor inspection method comprising contacting a body and pressing both sides of the TAB tape toward the pusher.   The semiconductor inspection method according to claim 8, wherein the TAB tape pressing body has antistatic properties.

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