JP4074722B2 - Component mounting equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting apparatus for mounting electronic components on a substrate, and more particularly to a component mounting apparatus for manufacturing a flat panel display such as a liquid crystal panel.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, as a component mounting apparatus for manufacturing a flat panel display such as a liquid crystal panel, a component mounting apparatus for mounting an electronic component such as a tape carrier component on a liquid crystal substrate (hereinafter referred to as “cell”) is known.
[0003]
In such a component mounting apparatus, as shown in FIGS. 5 (a) and 5 (b), the cell 21 is supported by the stage 2 as the support mechanism 1 and the backup table 5 and is disposed above the backup table 5. The electronic component 22 is crimped to one side of the cell 21 via the anisotropic conductive tape 23 by the crimping head 4.
[0004]
[Problems to be solved by the invention]
However, in the conventional component mounting apparatus described above, the cell 21 is directly sucked and held on the stage 2 having the plurality of vacuum suction holes 2b, so that the height of the upper surface of the backup table 5 and the height of the upper surface of the stage 2 are different. If they are not the same due to misadjustment or the like, as shown in FIG. 5A, stress is applied to the portion A of the cell 21, for example, corresponding to the end of the stage 2 or the backup base 5, resulting from strain or the like. There is a problem that the attracted trace is likely to remain in the cell 21.
[0005]
The present invention has been made in consideration of the above points, and effectively removes stress applied to the substrate when crimping electronic components and the like, and prevents suction marks caused by strain and the like from remaining on the substrate. It is an object of the present invention to provide a component mounting apparatus that can perform such a process.
[0006]
[Means for Solving the Problems]
The present invention provides a component mounting apparatus for mounting an electronic component on a substrate, and a support mechanism for supporting the substrate, and a pressure-bonded object such as an electronic component or a connection member, which is bonded to the side of the substrate supported by the support mechanism. A pressure-bonding mechanism, and the support mechanism includes a stage and a plurality of suction-holding portions provided on the stage for sucking and holding the substrate. The suction-holding portions protrude from the upper surface of the stage and are elastic. A suction pad made of a body is provided, and each of the suction pads is elastically deformed to change an inclination angle of the substrate according to a pressing force applied to the substrate at the time of pressure bonding by the pressure bonding mechanism. This is a component mounting apparatus.
[0007]
According to the present invention, since the inclination angle of the substrate appropriately changes according to the pressing force applied to the substrate, it is possible to effectively remove the stress applied to the substrate when the electronic component or the like is crimped. It is possible to prevent the adsorption traces caused by the remaining on the substrate.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1, 2 and 4 (a), 4 (b), and 4 (c) are diagrams for explaining an embodiment of a component mounting apparatus according to the present invention.
[0009]
First, an outline of the component mounting apparatus according to the present embodiment will be described with reference to FIGS. 4 (a), 4 (b), and 4 (c). As shown in FIGS. 4A, 4B, and 4C, in the component mounting apparatus according to the present embodiment, the cell 21 is first sucked and held on the support mechanism 1, and thus sucked and held in this way. The anisotropic conductive tape 23 is pressure-bonded to one side of the cell 21 by the pressure-bonding head 7 (see FIG. 4A). Thereafter, after temporarily bonding a plurality of electronic components 22 to one side of the cell 21 to which the anisotropic conductive tape 23 is bonded in this way (see FIG. 4B), the plurality of electronic components 22 are bonded to the pressure-bonding head 4. Thus, the liquid crystal panel 20 is manufactured by heating and pressurizing all together and finally pressing the cell 21 (see FIG. 4C). At this time, the portion corresponding to the crimping position of the anisotropic conductive tape 23 or the electronic component 22 on the lower surface of the cell 21 is supported by the backup table 8 or the backup table 5.
[0010]
Next, referring to FIG. 1, the details of the component mounting apparatus according to the present embodiment will be described by taking the main crimping step shown in FIG. 4C as an example of the mounting steps shown in FIGS. 4A, 4B, and 4C. explain.
[0011]
As shown in FIG. 1, the component mounting apparatus 10 includes a support mechanism 1 that supports a cell 21, a crimping head 4 and a backup base 5 for crimping an electronic component 22 to one side of the cell 21 supported by the support mechanism 1. (Crimping mechanism).
[0012]
Among these, the support mechanism 1 has a stage 2 and a plurality of suction pads (suction holding portions) 3 embedded in each of a plurality of recesses 2 a provided on the upper surface of the stage 2. Here, each suction pad 3 is made of an elastic body and protrudes from the upper surface of the stage 2, and the cells 21 are sucked and held on the upper surface of each suction pad 3.
[0013]
Further, the pressure-bonding head 4 is supported so as to be movable up and down, and the cell 21 is temporarily supported on the cell 21 via the anisotropic conductive tape 23 in a state where the cell 21 is supported by the suction pad 3 and the backup base 5 of the support mechanism 1. The electronic component 22 can be crimped onto the cell 21 by pressing the crimped electronic component 22.
[0014]
Next, the operation of the component mounting apparatus shown in FIG. 1 will be described.
[0015]
First, the cell 21 is sucked and held by the upper surfaces of the plurality of suction pads 3 protruding from the upper surface of the stage 2 in the support mechanism 1, and the crimping position of the electronic component 22 in the lower surface of the cell 21 sucked and held in this way. The portion corresponding to is supported by the backup table 5.
[0016]
After that, with the cell 21 supported in this manner, the pressure-bonding head 4 is lowered, and the electronic component 22 temporarily pressed onto the cell 21 via the anisotropic conductive tape 23 is pressed. The electronic component 22 is pressure-bonded.
[0017]
At this time, the cell 21 is sucked and held on the upper surface of each suction pad 3 made of an elastic body protruding from the upper surface of the stage 2, so that the pressing force applied to the cell 21 by the crimping head 4 as shown in FIG. by each adsorption pad 3 in response to the pressure to the elastic deformation, it is possible to appropriately change the tilt angle of the cell 21.
[0018]
As described above, according to the present embodiment, the inclination angle of the cell 21 is appropriately changed according to the pressing force applied to the cell 21 by the crimping head 4, so that the height of the upper surface of the backup base 5 that supports the cell 21 and the stage Even if the height of the upper surface of 2 is not completely the same, it is possible to effectively remove the stress applied to the cell 21 when the electronic component 22 is crimped. It can be prevented from remaining.
[0019]
In the above-described embodiment, the case where the electronic component 22 is finally crimped on the cell 21 has been described as an example. However, the present invention is not limited to this, and the process on the cell 21 is performed as shown in FIG. The present invention can be similarly applied to the case where the anisotropic conductive tape 23 is pressure-bonded and the case where the electronic component 22 is temporarily pressure-bonded on the cell 21 as in the step shown in FIG.
[0020]
In the above-described embodiment, the inclination angle of the cell 21 is changed using the elastic deformation of the suction pad 3. However, the present invention is not limited to this. For example, the cell 21 is disposed in the recess 2 a of the stage 2. The suction pad 3 may be urged in the protruding direction by an elastic member such as a spring, and the inclination angle of the cell 21 may be changed using elastic deformation of the elastic member such as the spring.
[0021]
Other Embodiments Next, with reference to FIG. 3, another embodiment of the component mounting apparatus according to the present invention will be described. As shown in FIG. 3, the component mounting apparatus includes an adsorbing elastic body 6 that extends in a plane along the upper surface of the stage 2 as an adsorbing and holding unit of the support mechanism 1 instead of the adsorbing pad 3 shown in FIG. 1. have.
[0022]
According to the present embodiment, similarly to the component mounting apparatus shown in FIG. 1, the elastic body 6 is elastically deformed according to the pressing force applied to the cell 21 by the crimping head 4 or the like, and the inclination angle of the cell 21 is appropriately changed. Therefore, even if the height of the upper surface of the backup base 5 that supports the cell 21 and the height of the upper surface of the stage 2 are not completely the same, the stress applied to the cell 21 when the electronic component 22 is crimped can be effectively removed. For this reason, it is possible to prevent the adsorption trace caused by strain or the like from remaining on the cell 21.
[0023]
In the embodiment shown in FIG. 3 described above, the cell 21 is adsorbed and held by the adsorbability of the elastic body 6 itself. However, the present invention is not limited to this. The cell 21 may be sucked and held by providing a pad or the like.
[0024]
In the above-described embodiment shown in FIGS. 1 and 2 and the embodiment shown in FIG. 3, the component mounting apparatus for manufacturing a flat panel display such as the liquid crystal panel 20 has been described as an example. However, the present invention is not limited to this, and any component mounting apparatus for mounting a component on a substrate on which a suction mark due to strain or the like tends to remain can be applied in the same manner.
[0025]
【The invention's effect】
As described above, according to the present invention, since the inclination angle of the substrate is appropriately changed according to the pressing force applied to the substrate, the stress applied to the substrate at the time of crimping an electronic component or the like can be effectively removed, For this reason, it is possible to prevent the adsorption trace caused by the strain or the like from remaining on the substrate.
[Brief description of the drawings]
FIG. 1 is a diagram showing an embodiment of a component mounting apparatus according to the present invention.
FIG. 2 is a view for explaining the operation of the component mounting apparatus shown in FIG. 1;
FIG. 3 is a diagram showing another embodiment of a component mounting apparatus according to the present invention.
FIG. 4 is a view for explaining a process of mounting an electronic component on a substrate in a manufacturing process of a liquid crystal panel.
FIG. 5 is a view showing a conventional component mounting apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Support mechanism 2 Stage 2a Recessed part 2b Vacuum suction hole 3 Suction pad (Suction holding part)
4, 7 Crimping heads 5, 8 Backup base 6 Elastic body 20 Liquid crystal panel 21 Cell (liquid crystal substrate)
22 Electronic component 23 Anisotropic conductive tape (connection member)

Claims (3)

In a component mounting apparatus that mounts electronic components on a board,
A support mechanism for supporting the substrate;
A crimping mechanism for crimping an object to be crimped such as an electronic component or a connection member to the side of the substrate supported by the support mechanism;
The support mechanism includes a stage and a plurality of suction holding units provided on the stage for sucking and holding the substrate.
The suction holding portion protrudes from the upper surface of the stage and has a suction pad made of an elastic body.
Each of the suction pads is elastically deformed to change the inclination angle of the substrate in accordance with the pressing force applied to the substrate during the pressure bonding by the pressure bonding mechanism. The suction pad component mounting apparatus according to claim 1, characterized in that it is biased toward the projecting direction.   The component mounting apparatus according to claim 1, wherein the suction holding unit includes an elastic body extending in a planar shape along the upper surface of the stage.

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