JPH0765925A - Component mounting stage and hot pressure attaching device using stage - Google Patents

Abstract

PURPOSE:To place a liquid crystal display panel on a hot pressure attaching stage at all times in the intended manner even though the thickness of the lower polarization plate of the panel differs. CONSTITUTION:In such a way movable up and down, an attraction stage 30 is installed in a runoff recess 24 provided on the surface of a stage body 23. When a lower protection film 10 of a liquid crystal panel 6 is placed on the stage 30, a coil spring 29 is elongated by the gravitational force of the panel 6 to cause the stage 30 to sink, and, the undersurface periphery of a lower glass board 7 of the panel 6 contacts the surface of the stage body 23. Therein the stage 30 sinks for an amount corresponding to the total thickness of a lower polarization plate 9 and the film 10. Accordingly the stage position in the vertical direction varies only in compliance with the thickness of the lower polarization plate 9 even though it differs, and therefore, it is possible to place the panel 6 on the stage 21 at all times in the intended manner.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting stage and a thermocompression bonding apparatus using the same.

[0002]

2. Description of the Related Art There is a method of joining two electronic components such as a liquid crystal display panel and a TAB tape by using a thermocompression bonding device. FIG. 3 shows a conventional thermocompression bonding apparatus used in such a joining method. This thermocompression bonding apparatus includes a thermocompression bonding stage 1,
A thermocompression bonding head 2 is provided above the thermocompression bonding stage 1 so as to be vertically movable. The thermocompression bonding stage 1
An escape recess 3 is provided at a predetermined position on the upper surface, and a suction recess 4 is provided in the center of the bottom surface of the escape recess 3. The suction recess 4 is provided to a vacuum pump (not shown) via a suction hole 5 or the like. It has a connected structure.

On the other hand, the liquid crystal display panel 6 includes a lower glass substrate 7 and an upper glass substrate 8. Although not shown, both glass substrates 7 and 8 are adhered to each other via a sealing material, and liquid crystal is sealed between them. A lower polarizing plate 9 and a lower protective film 10 are provided on the lower surface of the lower glass substrate 7. An upper polarizing plate 11 and an upper protective film 12 are provided on the upper surface of the upper glass substrate 8. One end of the lower glass substrate 7 is the upper glass substrate 8
A connection terminal (not shown) is provided on the upper surface of the protruding portion. TAB tape 13
Has a structure in which an IC chip (not shown) for driving the liquid crystal display panel 6 is mounted and a connection terminal (not shown) is provided on the lower surface of one end.

Now, the liquid crystal display panel 6 and the TAB tape 1
In the case of bonding 3 and 3 to each other, first, the liquid crystal display panel 6 is positioned and placed at a predetermined position on the upper surface of the thermocompression bonding stage 1. In this case, the depth of the escape recess 3 of the thermocompression bonding stage 1 is the same as the total thickness of the lower polarizing plate 9 and the lower protective film 10 of the liquid crystal display panel 6. Therefore, the lower surface of the lower glass substrate 7 is placed on the upper surface of the thermocompression bonding stage 1, and the lower surface of the lower protective film 10 is placed on the bottom surface of the escape recess 3. Next, when the vacuum pump is driven to make the suction concave portion 4 a negative pressure, the liquid crystal display panel 6 is adsorbed to the thermocompression bonding stage 1.

Next, a T is formed on the upper surface of one end of the lower glass substrate 7.
The one end of the AB tape 13 is aligned and placed. Then, the thermocompression bonding head 2 is lowered to bring its lower surface into pressure contact with the upper surface of one end of the TAB tape 13. In this state, when a current flows through the thermocompression bonding head 2 to generate heat on the lower surface of the thermocompression bonding head 2, this heat generation causes one end portion of the lower glass substrate 7 and the TA
An anisotropic conductive adhesive (not shown) previously interposed between the one end portion of the B tape 13 and the one end portion of the B tape 13 is melted, whereby the one end lower surface of the TAB tape 13 is joined to the one end upper surface of the lower glass substrate 7. In addition, the connection terminals facing each other in this portion are conductively connected to each other.

By the way, in such a conventional thermocompression bonding apparatus, the depth of the relief recess 3 of the thermocompression bonding stage 1 becomes the same as the total thickness of the lower polarizing plate 9 and the lower protective film 10 of the liquid crystal display panel 6. Therefore, if the lower polarizing plate 9 has a different thickness, the following inconvenience occurs. First, when the thickness of the lower polarizing plate 9 becomes thicker, as shown in FIG.
As shown in (A), the lower surface of the lower glass substrate 7 floats up from the upper surface of the thermocompression bonding stage 1, and if thermocompression bonding is performed in this state, the lower glass substrate 7 may break.
On the other hand, when the thickness of the lower polarizing plate 9 becomes thin, as shown in FIG.
As shown in (B), the lower surface of the lower protective film 8 floats up from the bottom surface of the recess 3 for escape, and as a result, the liquid crystal display panel 6 cannot be adsorbed and fixed, resulting in vibration or the like during thermocompression bonding. The liquid crystal display panel 6 may be misaligned, which may result in a defective conductive connection.

[0007]

As described above, in the conventional thermocompression bonding apparatus, when the thickness of the lower polarizing plate 9 is increased, the lower glass substrate 7 may be broken, while the lower glass substrate 7 is broken. When the thickness of the polarizing plate 9 becomes thin, there is a problem that a conductive connection failure may occur.
It should be noted that it is conceivable that a plurality of thermocompression bonding stages having different depths of the recessed recesses 3 depending on the thickness of the lower polarizing plate 9 are prepared and used in exchange, but in this case, replacement work is required. Not only that, but there is another problem in that unused thermocompression bonding stages must be stored. An object of the present invention is to mount a component having a protrusion on the lower surface side, such as a liquid crystal display panel having a lower polarization plate on the lower surface side, even if the thickness of the lower surface side protrusion is different. (EN) Provided are a component mounting stage and a thermocompression bonding apparatus using the same.

[0008]

According to a first aspect of the present invention, there is provided a component mounting stage comprising a stage main body having an escape recess on an upper surface thereof and an adsorption stage vertically movable in the escape recess of the stage main body. A component having a projecting portion on the lower surface side is mounted on the stage body by mounting the lower surface projecting portion on the suction stage. According to a second aspect of the thermocompression bonding apparatus, the component mounting stage according to the first aspect is used as a thermocompression bonding stage.

[0009]

According to the present invention, when a component is placed on the stage body, the vertical position of the suction stage changes in accordance with the thickness of the lower surface side protrusion of the component, so that the lower surface side protrusion of the component occurs. Even if the thickness of the part is different, it can always be mounted as expected.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A shows a main part of a thermocompression bonding apparatus according to an embodiment of the present invention. The thermocompression bonding apparatus includes a thermocompression bonding stage (component mounting stage) 21 and a thermocompression bonding head 22 provided above the thermocompression bonding stage 21 so as to be vertically movable. The thermocompression bonding stage 21 includes a stage body 23. The stage body 23 is
A relief recess 24 is provided at a predetermined position on the upper surface, a fool hole 25 is provided at the center of the bottom of the relief recess 24, and a cylindrical shape is provided at a plurality of bottoms of the relief recess 24 around the fool hole 25. The structure is such that a guide member 26 is provided. A shaft 27 is vertically inserted through the guide member 26. The flange 2 is provided at the bottom of the shaft 27.
8 are provided. A coil spring 29 is wound around the shaft 27 below the stage body 23. The upper end of the coil spring 29 is fixed to the lower surface of the guide member 26, and the lower end is fixed to the upper surface of the flange 28. A suction stage 30 is attached to the upper portions of the plurality of shafts 27. As a result, the suction stage 30 is vertically movable within the escape recess 24 of the stage body 23. The suction stage 30 is provided with a suction concave portion 31 in the center of the upper surface, and the suction concave portion 31 is formed in the suction hole 3.
2 and a suction hose 33 are connected to a vacuum pump (not shown). The suction hose 33 is inserted into the fool hole 25 of the stage body 23 so as to be vertically movable. Then, when nothing is placed on the thermocompression bonding stage 21, the upper surface of the suction stage 30 is almost the same as the upper surface of the stage body 23 because the coil spring 29 extends due to gravity of the suction stage 30 and the shaft 27. Located in the same position.

Next, using this thermocompression bonding apparatus, as shown in FIG.
A case where the liquid crystal display panel 6 and the TAB tape 13 are bonded to each other as shown in FIG. In addition,
Since the liquid crystal display panel 6 and the TAB tape 13 have the same structure as in the case of the conventional example shown in FIG. 3, the same reference numerals are given and the description thereof is omitted.

Now, the liquid crystal display panel 6 and the TAB tape 1
When joining 3 and 3 to each other, first, the lower surface of the lower protective film 10 of the liquid crystal display panel 6 is positioned and placed on the upper surface of the suction stage 30. Then, the coil spring 29
Is extended by the gravity of the liquid crystal display panel 6,
The suction stage 30 and the shaft 27 descend, the liquid crystal display panel 6 descends accordingly, and the lower surface periphery of the lower glass substrate 7 of the liquid crystal display panel 6 contacts the upper surface of the stage body 23. This state is the state shown in FIG. In this state, the periphery of the lower surface of the lower glass substrate 7 is placed on the upper surface of the stage body 23, and the adsorption stage 30 descends by an amount corresponding to the total thickness of the lower polarizing plate 9 and the lower protective film 10, and this descends. The lower protective film 10 is placed on the upper surface of the suction stage 30. Therefore, after that, when the suction concave portion 31 is made to have a negative pressure by driving the vacuum pump, the liquid crystal display panel 6 is sucked by the suction stage 30.

Next, T is formed on the upper surface of one end of the lower glass substrate 7.
The one end of the AB tape 13 is aligned and placed. After that, the thermocompression bonding head 22 is lowered and the lower surface thereof is TAB.
The tape 13 is pressed against the upper surface of one end. In this state, when a current flows through the thermocompression bonding head 22 to generate heat on the lower surface of the thermocompression bonding head 22, this heat generation causes an anisotropic conductive adhesive that is previously interposed between one end of the lower glass substrate 7 and one end of the TAB tape 13. The agent (not shown) is melted, whereby the lower surface of one end of the TAB tape 13 is joined to the upper surface of one end of the lower glass substrate 7, and the connecting terminals facing each other in this portion are conductively connected to each other.

As described above, in this thermocompression bonding apparatus, when the liquid crystal display panel 6 is mounted on the thermocompression bonding stage 21, the lower glass substrate 7 is mounted on the upper surface of the stage body 23 around the lower surface of the lower glass substrate 7, and the lower polarizing plate 9 is placed. The suction stage 30 is lowered by an amount corresponding to the total thickness of the lower protection film 10 and the lower protection film 10.
Will be placed. Therefore, even if the total thickness of the lower polarizing plate 9 and the lower protective film 10 is different, the vertical position of the adsorption stage 30 only changes according to the total thickness of the lower polarizing plate 9 and the lower protective film 10. ,
Therefore, the liquid crystal display panel 6 can always be mounted on the thermocompression bonding stage 21 as expected.

Next, FIGS. 2A and 2B show the essential parts of a thermocompression bonding apparatus according to another embodiment of the present invention. In these figures, parts having the same names as those in FIGS. 1A and 1B are designated by the same reference numerals, and the description thereof will be appropriately omitted. In this thermocompression bonding apparatus, a cylinder 41 is provided at a predetermined position on the lower surface of the stage main body 23, and a piston rod 42 of this cylinder 41 is vertically movably inserted into a fool hole 43 provided at the center of the bottom of the escape recess 24. Has been done. Then, when nothing is placed on the thermocompression bonding stage 21, as shown in FIG.
The protrusion of the piston rod 42 pushes up the suction stage 30 by the upper portion of the piston rod 42, and the upper surface of the suction stage 30 is located above the upper surface of the stage body 23.

Now, with this thermocompression bonding apparatus, the liquid crystal display panel 6
When the TAB tape 13 and the TAB tape 13 are bonded to each other, first, as shown in FIG. 2A, the lower surface of the lower protective film 10 of the liquid crystal display panel 6 is simply placed on the upper surface of the suction stage 30. In this state, since the upper surface of the suction stage 30 is located above the upper surface of the stage body 23, the lower surface of the lower glass substrate 7 is located above the upper surface of the stage body 23. Then, in this state, the liquid crystal display panel 6 is positioned by a positioning mechanism (not shown). In this case, since the lower surface periphery of the lower glass substrate 7 does not rub against the upper surface of the stage body 23, it is possible to prevent the lower surface periphery of the lower glass substrate 7 from being scratched. Further, since it is not necessary to position the liquid crystal display panel 6 at another place, it is not necessary to separately provide a positioning stage, the device can be simplified, and the operation time can be shortened.

Next, when the vacuum recess is driven to make the suction concave portion 31 have a negative pressure, the liquid crystal display panel 6 is sucked onto the suction stage 30. Next, when the piston rod 42 of the cylinder 41 is retracted, as shown in FIG. 2 (B), the coil spring 29 extends due to the gravity of the liquid crystal display panel 6, and the suction stage 30 and the shaft 27 descend. Along with this, the liquid crystal display panel 6 also descends, and the lower surface periphery of the lower glass substrate 7 of the liquid crystal display panel 6 contacts the upper surface of the stage body 23. The following is the same as in the case of the above-described embodiment, so the description thereof will be omitted.

[0018]

As described above, according to the present invention, when a component is placed on the stage body, the vertical position of the suction stage changes according to the thickness of the lower surface side protrusion of the component. Thus, even if the thickness of the lower surface side protruding portion of the component is different, the component can always be mounted as expected.

[Brief description of drawings]

FIG. 1A is a sectional view of a main part of a thermocompression bonding apparatus according to an embodiment of the present invention, and FIG. 1B is a sectional view showing a state in which a liquid crystal display panel is placed on the thermocompression bonding stage.

FIG. 2A is a sectional view of an essential part of a thermocompression bonding stage of a thermocompression bonding apparatus according to another embodiment of the present invention, in which the liquid crystal display panel is simply placed, and FIG. 2B shows the liquid crystal display panel. Sectional drawing of the state mounted as expected.

FIG. 3 is a partial sectional view of a conventional thermocompression bonding apparatus.

4 (A) and 4 (B) are cross-sectional views each illustrating a problem of the conventional thermocompression bonding apparatus.

[Explanation of symbols]

 6 Liquid crystal display panel (component) 21 Thermocompression bonding stage (component mounting stage) 23 Stage body 24 Escape recess 30 Adsorption stage

Claims (2)

[Claims] 1. A stage main body having a relief recess on an upper surface thereof, and a suction stage vertically movable in the relief recess of the stage body, and a component having a protrusion on a lower surface side thereof has a lower surface. A component mounting stage characterized in that a side protrusion is placed on the suction stage and is placed on the stage body. 2. A thermocompression bonding apparatus, wherein the component mounting stage according to claim 1 is used as a thermocompression bonding stage.