JPH07161742A - Method and apparatus for thermocompression bonding - Google Patents
Method and apparatus for thermocompression bondingInfo
- Publication number
- JPH07161742A JPH07161742A JP5341593A JP34159393A JPH07161742A JP H07161742 A JPH07161742 A JP H07161742A JP 5341593 A JP5341593 A JP 5341593A JP 34159393 A JP34159393 A JP 34159393A JP H07161742 A JPH07161742 A JP H07161742A
- Authority
- JP
- Japan
- Prior art keywords
- thermocompression bonding
- suction
- bonding head
- thermocompression
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、一の電子部品を他の電
子部品上に熱圧着する熱圧着方法およびその装置に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocompression bonding method and apparatus for thermocompression bonding one electronic component onto another electronic component.
【０００２】[0002]
【従来の技術】例えば、液晶表示パネルのガラス基板上
に、その液晶表示パネルを駆動するためのＩＣ（Ｉｎｔ
ｅｇｒａｔｅｄ Ｃｉｒｃｕｉｔ：集積回路）チップを
搭載する場合のように、一の電子部品を他の電子部品上
に搭載する方法として、熱圧着装置により熱圧着して搭
載する方法がある。2. Description of the Related Art For example, an IC (Int) for driving a liquid crystal display panel is mounted on a glass substrate of the liquid crystal display panel.
As a method of mounting one electronic component on another electronic component such as a case of mounting an integrated circuit (integrated circuit) chip, there is a method of thermocompression bonding by a thermocompression bonding device.
【０００３】図３は従来の熱圧着装置による熱圧着の仕
方の一例を示したもので、３１は液晶表示パネルを構成
するガラス基板、３２は熱硬化型の導電性接着剤、３３
はＩＣチップ、３４は吸着機能付き熱圧着ヘッドであ
る。図３（ａ）のように、ガラス基板３１の所定位置に
導電性接着剤３２が予め設けられており、その上方位置
には、ＩＣチップ３３が吸着機能付き熱圧着ヘッド３４
に吸着保持されている。FIG. 3 shows an example of a method of thermocompression bonding by a conventional thermocompression bonding apparatus, 31 is a glass substrate constituting a liquid crystal display panel, 32 is a thermosetting conductive adhesive, and 33 is a thermosetting conductive adhesive.
Is an IC chip, and 34 is a thermocompression bonding head with a suction function. As shown in FIG. 3A, a conductive adhesive 32 is preliminarily provided at a predetermined position on the glass substrate 31, and an IC chip 33 is provided at an upper position thereof with a thermocompression bonding head 34 having a suction function.
It is held by adsorption.
【０００４】そして、アライメントした後、図３（ｂ）
のように、熱圧着ヘッド３４が下降して、ガラス基板３
１の導電性接着剤３２上にＩＣチップ３３を載置し、熱
圧着ヘッド３４の加熱による導電性接着剤３２の溶融に
よりガラス基板３１上にＩＣチップ３３が熱圧着され
る。この時、導電性接着剤３２の溶融により蒸気が発生
する。After alignment, FIG. 3 (b)
The thermocompression bonding head 34 descends and the glass substrate 3
The IC chip 33 is placed on the first conductive adhesive 32, and the conductive adhesive 32 is melted by heating the thermocompression bonding head 34, so that the IC chip 33 is thermocompression bonded onto the glass substrate 31. At this time, steam is generated by melting the conductive adhesive 32.
【０００５】そして熱圧着後、熱圧着ヘッド３４による
ＩＣチップ３３の吸着を解除して、図３（ｃ）のよう
に、熱圧着ヘッド３４が上昇する。この時も、導電性接
着剤３２の溶融により蒸気が発生しており、その蒸気と
ともにゴミ等の異物が上昇して熱圧着ヘッド３４に付着
し、熱圧着ヘッド３４の吸着面兼熱圧着面３５にも異物
が付着する。After thermocompression bonding, the adsorption of the IC chip 33 by the thermocompression bonding head 34 is released, and the thermocompression bonding head 34 rises as shown in FIG. 3 (c). Also at this time, steam is generated due to the melting of the conductive adhesive 32, and foreign matter such as dust rises along with the steam and adheres to the thermocompression bonding head 34, and the adsorption surface and thermocompression bonding surface 35 of the thermocompression bonding head 34. Also foreign matter adheres.
【０００６】なお、導電性接着剤を用いるほか、ＩＣチ
ップの下面に予め半田バンプを設けておいて、その半田
バンプを加熱により溶融させて熱圧着する場合もあり、
このような半田バンプの溶融によっても蒸気が発生す
る。In addition to using a conductive adhesive, solder bumps may be previously provided on the lower surface of the IC chip, and the solder bumps may be melted by heating and thermocompression bonded.
Steam is also generated by such melting of the solder bumps.
【０００７】[0007]
【発明が解決しようとする課題】このように従来は、熱
圧着時の加熱により発生する蒸気によってゴミ等の異物
が上昇し、熱圧着ヘッド３４に付着し、その吸着面兼熱
圧着面３５にまで異物が付着してしまう欠点があった。Thus, conventionally, foreign matter such as dust rises due to the steam generated by heating during thermocompression bonding, adheres to the thermocompression bonding head 34, and adheres to the adsorption surface and thermocompression bonding surface 35 thereof. There was a drawback that foreign substances would adhere.
【０００８】そのため、熱圧着ヘッド３４の吸着面兼熱
圧着面３５の表面の平坦度が悪くなり、ＩＣチップ３３
の搭載の際の平行度が出なくなってしまう問題がある。
そして、熱圧着ヘッド３４とＩＣチップ３３との間に異
物が介在されることになるため、熱伝導が悪くなるなど
の問題点がある。For this reason, the flatness of the surface of the adsorption and thermocompression bonding surface 35 of the thermocompression bonding head 34 deteriorates, and the IC chip 33
There is a problem that the parallelism when mounting is lost.
Further, since foreign matter is interposed between the thermocompression bonding head 34 and the IC chip 33, there is a problem that the heat conduction is deteriorated.
【０００９】その対策として、熱圧着ヘッドのゴミ付着
面を研磨したり、さらには、熱圧着ヘッドの交換を頻繁
に行うなどが挙げられる。[0009] As a countermeasure, it is possible to polish the dust adhering surface of the thermocompression bonding head, and to replace the thermocompression bonding head frequently.
【００１０】そこで、本発明の目的は、熱圧着時の加熱
により発生する蒸気によるゴミ等の異物が熱圧着ヘッド
に付着するのを防止できるようにした熱圧着方法および
その装置を提供することにある。Therefore, an object of the present invention is to provide a thermocompression bonding method and apparatus capable of preventing foreign matter such as dust caused by steam generated by heating during thermocompression bonding from adhering to a thermocompression bonding head. is there.
【００１１】[0011]
【課題を解決するための手段】以上の課題を解決すべく
請求項１記載の発明は、一の電子部品を他の電子部品上
に載置して、熱圧着ヘッドにより熱圧着する際におい
て、その熱圧着時に発生する蒸気を吸引手段により吸い
取るようにすることを特徴としている。In order to solve the above-mentioned problems, the invention according to claim 1 is to mount one electronic component on another electronic component and to perform thermocompression bonding by a thermocompression bonding head. It is characterized in that the steam generated during the thermocompression bonding is sucked by the suction means.
【００１２】そして、請求項２記載の発明は、一の電子
部品を他の電子部品上に熱圧着する熱圧着ヘッドを備え
た熱圧着装置において、その熱圧着時に発生する蒸気を
吸い取る吸引手段を、例えば、熱圧着ヘッドに組み込む
等して備えるようにした構成を特徴としている。According to a second aspect of the present invention, in a thermocompression bonding apparatus including a thermocompression bonding head for thermocompression bonding one electronic component onto another electronic component, suction means for absorbing vapor generated during the thermocompression bonding is provided. For example, it is characterized in that it is provided by being incorporated in a thermocompression bonding head.
【００１３】[0013]
【作用】本発明によれば、一の電子部品を他の電子部品
上に熱圧着ヘッドで熱圧着する時に発生する蒸気がゴミ
等の異物とともに吸引手段により吸い取られるので、こ
れらゴミ等の異物が熱圧着ヘッドに付着するのを防止で
きる。According to the present invention, the vapor generated when one electronic component is thermocompressed onto another electronic component by the thermocompression bonding head is sucked by the suction means together with the foreign matter such as dust. It can be prevented from adhering to the thermocompression bonding head.
【００１４】[0014]
【実施例】以下に、本発明に係る熱圧着方法およびその
装置の実施例を図１および図２に基づいて説明する。Embodiments of the thermocompression bonding method and apparatus according to the present invention will be described below with reference to FIGS. 1 and 2.
【００１５】先ず、図１は本発明を適用した熱圧着装置
における一例としての熱圧着ヘッド１の概略構成を示す
もので、２は吸着面兼熱圧着面、３は吸着孔、４は吸引
孔、５は吸引チューブ、６は吸い取り口、７は吸引配
管、８は吸引源、９は吸引手段である。熱圧着ヘッド１
は、吸着機能付きのもので、即ち、下端面の吸着面兼熱
圧着面２に開口する吸着孔３を有し、この吸着孔３の上
端が図示しない配管を介して真空ポンプに接続されてい
る。First, FIG. 1 shows a schematic structure of a thermocompression bonding head 1 as an example of a thermocompression bonding apparatus to which the present invention is applied. Reference numeral 2 is a suction / thermocompression bonding surface, 3 is a suction hole, and 4 is a suction hole. 5 is a suction tube, 6 is a suction port, 7 is a suction pipe, 8 is a suction source, and 9 is a suction means. Thermocompression bonding head 1
Has an adsorption function, that is, has an adsorption hole 3 that opens to the adsorption surface and thermocompression bonding surface 2 at the lower end surface, and the upper end of this adsorption hole 3 is connected to a vacuum pump through a pipe (not shown). There is.
【００１６】この吸着機能付き熱圧着ヘッド１を備える
熱圧着装置には、ＩＣチップ１３（図２参照）が載置さ
れる図示しない部品ステージと、液晶表示パネルのガラ
ス基板１１（図２参照）が載置される図示しない熱圧着
ステージが備えられている。吸着機能付き熱圧着ヘッド
１は、上下動自在であるとともに、部品ステージの上方
位置と熱圧着ステージの上方位置との間で移動自在とな
っている。In the thermocompression bonding apparatus equipped with the thermocompression bonding head 1 having the adsorption function, a component stage (not shown) on which an IC chip 13 (see FIG. 2) is mounted, and a glass substrate 11 (see FIG. 2) of a liquid crystal display panel. A thermocompression bonding stage (not shown) on which is mounted is provided. The thermocompression bonding head 1 with a suction function is vertically movable and movable between the upper position of the component stage and the upper position of the thermocompression bonding stage.
【００１７】熱圧着装置には、さらに、熱圧着時に発生
する蒸気を吸い取る吸引手段９が備えられている。即
ち、実施例では、熱圧着ヘッド１の左右に、上下方向に
貫通する吸引孔４，４をそれぞれ形成して、この吸引孔
４，４に下方から吸引チューブ５，５をそれぞれ挿入固
定している。The thermocompression bonding apparatus is further provided with suction means 9 for sucking vapor generated during thermocompression bonding. That is, in the embodiment, the suction holes 4 and 4 penetrating in the vertical direction are formed on the left and right of the thermocompression bonding head 1, and the suction tubes 5 and 5 are inserted and fixed from below into the suction holes 4 and 4, respectively. There is.
【００１８】この吸引チューブ５，５は、下半部が前記
吸着面兼熱圧着面２に指向するようそれぞれ傾斜して、
その吸着面兼熱圧着面２の上方近傍に臨む下端部の吸い
取り口６，６をそれぞれ開口している。また、前記吸引
孔４，４の上端は、適宜の吸引配管７，７を介して真空
ポンプや吸引ファン等の吸引源８にそれぞれ接続されて
いる。こうして、熱圧着ヘッド１の吸着面兼熱圧着面２
の上方近傍に吸い取り口６，６がそれぞれ開口した吸引
手段９が構成されている。The lower portions of the suction tubes 5 and 5 are inclined so that the lower half portions thereof are directed to the adsorption surface / thermocompression bonding surface 2, respectively,
The suction ports 6 and 6 at the lower end facing the vicinity of the upper side of the suction surface / thermocompression bonding surface 2 are opened. The upper ends of the suction holes 4 and 4 are connected to suction sources 8 such as vacuum pumps and suction fans via appropriate suction pipes 7 and 7, respectively. Thus, the adsorption surface and the thermocompression bonding surface 2 of the thermocompression bonding head 1
Suction means 9 is formed in the vicinity of the upper part of which suction ports 6 and 6 are opened.
【００１９】次に、以上の熱圧着装置を用いた熱圧着の
仕方の一例について図２を基に説明する。図２におい
て、１１は液晶表示パネルのガラス基板、１２は熱硬化
型の異方導電性接着剤、１３はＩＣチップであり、先
ず、図２（ａ）に示すように、熱圧着ステージ上のガラ
ス基板１１上の所定位置に異方導電性接着剤１２が予め
設けられており、その上方位置には、部品ステージから
ＩＣチップ１３が吸着機能付き熱圧着ヘッド１に吸着保
持して運ばれている。Next, an example of a method of thermocompression bonding using the above thermocompression bonding apparatus will be described with reference to FIG. In FIG. 2, 11 is a glass substrate of a liquid crystal display panel, 12 is a thermosetting anisotropic conductive adhesive, and 13 is an IC chip. First, as shown in FIG. An anisotropic conductive adhesive 12 is preliminarily provided at a predetermined position on the glass substrate 11, and an IC chip 13 is adsorbed and held by the thermocompression bonding head 1 having an adsorption function from the component stage to a position above the anisotropic conductive adhesive 12. There is.
【００２０】そして、アライメントした後、図２（ｂ）
に示すように、熱圧着ヘッド１が下降して、ガラス基板
１１の異方導電性接着剤１２上にＩＣチップ１３を載置
して加圧し、熱圧着ヘッド１の加熱による異方導電性接
着剤１２の溶融によりガラス基板１１上にＩＣチップ１
３が熱圧着される。この異方導電性接着剤１２の溶融に
より蒸気が発生し、その蒸気とともにゴミ等の異物が上
昇する。After alignment, FIG. 2 (b)
As shown in FIG. 2, the thermocompression bonding head 1 descends, the IC chip 13 is placed on the anisotropic conductive adhesive 12 of the glass substrate 11 and pressed, and the anisotropic bonding by heating the thermocompression bonding head 1 is performed. The IC chip 1 is formed on the glass substrate 11 by melting the agent 12.
3 is thermocompression bonded. Steam is generated by the melting of the anisotropic conductive adhesive 12, and foreign substances such as dust rise with the steam.
【００２１】この場合、少なくともその蒸気発生に先行
して、前記吸引源８を運転動作しておくことにより、図
２（ｃ）にも拡大して示したように、熱圧着ヘッド１の
吸着面兼熱圧着面２の上方近傍にそれぞれ開口した吸い
取り口６，６によって、蒸気およびゴミ等の異物がそれ
ぞれ吸引される。吸引された蒸気および異物は、吸引チ
ューブ５，５、吸引配管７，７を経て吸引源８に回収さ
れる。In this case, at least prior to the generation of the vapor, the suction source 8 is operated so that the adsorption surface of the thermocompression bonding head 1 can be expanded as shown in FIG. 2 (c). Foreign substances such as steam and dust are sucked by the suction ports 6 and 6 which are opened in the vicinity of the upper side of the thermocompression bonding surface 2. The sucked vapor and foreign matter are collected by the suction source 8 through the suction tubes 5 and 5 and the suction pipes 7 and 7.
【００２２】さらに、熱圧着後、熱圧着ヘッド１による
ＩＣチップ１３の吸着を解除して、図２（ｄ）に示すよ
うに、熱圧着ヘッド１が上昇する。この時も、異方導電
性接着剤１２の溶融により蒸気が発生しており、その蒸
気とともにゴミ等の異物が上昇するが、前記と同様、前
記吸引源８の運転動作を継続しておくことにより、熱圧
着ヘッド１の吸着面兼熱圧着面２に異物が付着しないも
のとなる。Further, after the thermocompression bonding, the adsorption of the IC chip 13 by the thermocompression bonding head 1 is released, and the thermocompression bonding head 1 rises as shown in FIG. 2 (d). Also at this time, steam is generated due to the melting of the anisotropic conductive adhesive 12, and foreign matters such as dust rise with the steam, but the operation of the suction source 8 should be continued as described above. As a result, foreign matter does not adhere to the adsorption surface and thermocompression bonding surface 2 of the thermocompression bonding head 1.
【００２３】ここで、熱圧着ヘッド１の上昇位置への移
動後、吸引源８を蒸気が発生しなくなるまで数秒間運転
動作状態にしておくことで、必要十分な吸引機能を具備
できる。このように、熱圧着時から熱圧着後にわたって
十分な吸引を行うことより、ゴミ等の異物が熱圧着ヘッ
ド１に付着するのを防止できる。従って、熱圧着作業が
良好に行えるものとなる。また、熱圧着ヘッド１に対す
るゴミ付着時の研磨が不要となり、熱圧着ヘッド１の交
換頻度も低くなる。Here, after the thermocompression bonding head 1 is moved to the raised position, the suction source 8 is kept in operation for several seconds until steam is no longer generated, so that a necessary and sufficient suction function can be provided. Thus, by performing sufficient suction from the time of thermocompression bonding to after thermocompression bonding, it is possible to prevent foreign matter such as dust from adhering to the thermocompression bonding head 1. Therefore, the thermocompression bonding work can be favorably performed. Further, it is not necessary to polish the thermocompression bonding head 1 when dust is attached, and the frequency of replacement of the thermocompression bonding head 1 is reduced.
【００２４】以上の実施例のように、異方導電性接着剤
を用いるほか、ＩＣチップの下面に予め半田バンプを設
けておいて、その半田バンプを加熱により溶融させて熱
圧着する場合もあり、このような半田バンプの溶融によ
っても蒸気が発生する。従って、そのような蒸気も本発
明による吸引手段９によって吸い込み口６，６から吸い
取ることができる。As in the above embodiments, in addition to using the anisotropic conductive adhesive, solder bumps may be previously provided on the lower surface of the IC chip, and the solder bumps may be melted by heating and thermocompression bonded. Steam is also generated by the melting of the solder bumps. Therefore, such vapor can also be sucked from the suction ports 6 and 6 by the suction means 9 according to the present invention.
【００２５】なお、以上の実施例においては、液晶表示
パネルのガラス基板上にＩＣチップを熱圧着したが、本
発明はこれに限定されるものではなく、他の電子部品上
に一の電子部品を熱圧着するものであれば何れにも適用
できる。また、実施例では、吸引手段を熱圧着ヘッドに
備えたが、熱圧着ヘッドとは別に吸引手段を設けるよう
にしてもよい。さらに、吸引手段の構成も任意であり、
その他、吸着機能を持たない熱圧着ヘッドでもよい等、
具体的な細部構造等についても適宜に変更可能であるこ
とは勿論である。In the above embodiments, the IC chip was thermocompression bonded onto the glass substrate of the liquid crystal display panel, but the present invention is not limited to this, and one electronic component is placed on another electronic component. Any method can be applied as long as it is thermocompression bonded. Further, in the embodiment, the suction means is provided in the thermocompression bonding head, but the suction means may be provided separately from the thermocompression bonding head. Furthermore, the structure of the suction means is arbitrary,
In addition, a thermocompression bonding head that does not have a suction function may be used.
It goes without saying that the specific detailed structure and the like can be changed as appropriate.
【００２６】[0026]
【発明の効果】以上のように、本発明に係る熱圧着方法
およびその装置によれば、一の電子部品を他の電子部品
上に熱圧着ヘッドで熱圧着する時に発生する蒸気をゴミ
等の異物とともに吸引手段により吸い取って、これらゴ
ミ等の異物が熱圧着ヘッドに付着するのを防止できるた
め、熱圧着作業が良好に行え、熱圧着ヘッドに対して、
ゴミ付着時の研磨が不要となり、交換頻度も低くできる
などの利点が得られる。As described above, according to the thermocompression bonding method and the apparatus therefor of the present invention, the steam generated when one electronic component is thermocompressed onto another electronic component by the thermocompression bonding head can be removed from dust or the like. The foreign matter such as dust can be prevented from adhering to the thermocompression bonding head by sucking it together with the foreign matter by the suction means, so that the thermocompression bonding work can be performed well, and
There is an advantage that polishing is not necessary when dust adheres and the frequency of replacement can be reduced.
【図１】本発明を適用した熱圧着装置における一例とし
ての熱圧着ヘッドの概略構成を示す縦断正面図である。FIG. 1 is a vertical sectional front view showing a schematic configuration of a thermocompression bonding head as an example in a thermocompression bonding apparatus to which the present invention is applied.
【図２】本発明による熱圧着の仕方を例示したもので、
（ａ）は熱圧着前の状態を示す概略正面図、（ｂ）は熱
圧着時を示す概略正面図、（ｃ）は（ｂ）の半部拡大
図、（ｄ）は熱圧着後の状態を示す概略正面図である。FIG. 2 illustrates an example of a thermocompression bonding method according to the present invention,
(A) is a schematic front view showing a state before thermocompression bonding, (b) is a schematic front view showing thermocompression bonding, (c) is a half enlarged view of (b), (d) is a state after thermocompression bonding It is a schematic front view which shows.
【図３】従来の熱圧着装置による熱圧着の仕方を例示し
たもので、（ａ）は熱圧着前の状態を示す概略正面図、
（ｂ）は熱圧着時を示す概略正面図、（ｃ）は熱圧着後
の状態を示す概略正面図である。FIG. 3 is a view exemplifying a method of thermocompression bonding by a conventional thermocompression bonding apparatus, in which (a) is a schematic front view showing a state before thermocompression bonding;
(B) is a schematic front view showing thermocompression bonding, and (c) is a schematic front view showing a state after thermocompression bonding.
１ 熱圧着ヘッド ２ 吸着面兼熱圧着面 ３ 吸着孔 ４ 吸引孔 ５ 吸引チューブ ６ 吸い取り口 ７ 吸引配管 ８ 吸引源 ９ 吸引手段 １１ ガラス基板 １２ 導電性接着剤 １３ ＩＣチップ 1 Thermocompression bonding head 2 Adsorption surface / thermocompression bonding surface 3 Adsorption hole 4 Suction hole 5 Suction tube 6 Suction port 7 Suction pipe 8 Suction source 9 Suction means 11 Glass substrate 12 Conductive adhesive 13 IC chip
Claims (2)
て、熱圧着ヘッドにより熱圧着する熱圧着方法におい
て、 前記熱圧着時に発生する蒸気を吸引手段により吸い取る
ことを特徴とする熱圧着方法。1. A thermocompression bonding method in which one electronic component is placed on another electronic component and thermocompression-bonded by a thermocompression-bonding head, wherein vapor generated during the thermocompression-bonding is sucked by a suction means. Thermocompression bonding method.
する熱圧着ヘッドを備えた熱圧着装置において、 前記熱圧着時に発生する蒸気を吸い取る吸引手段を備え
たことを特徴とする熱圧着装置。2. A thermocompression bonding apparatus including a thermocompression bonding head for thermocompression bonding one electronic component onto another electronic component, the thermal compression bonding device including suction means for absorbing vapor generated during the thermocompression bonding. Crimping device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5341593A JPH07161742A (en) | 1993-12-10 | 1993-12-10 | Method and apparatus for thermocompression bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5341593A JPH07161742A (en) | 1993-12-10 | 1993-12-10 | Method and apparatus for thermocompression bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07161742A true JPH07161742A (en) | 1995-06-23 |
Family
ID=18347285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5341593A Pending JPH07161742A (en) | 1993-12-10 | 1993-12-10 | Method and apparatus for thermocompression bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07161742A (en) |
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|---|---|---|---|---|
| JP2000271889A (en) * | 1999-02-18 | 2000-10-03 | Johnson & Johnson Vision Care Inc | Method and device for conveying object |
| JP2000294573A (en) * | 1999-04-07 | 2000-10-20 | Casio Comput Co Ltd | Bonding apparatus |
| WO2018092306A1 (en) * | 2016-11-21 | 2018-05-24 | 株式会社新川 | Electronic component mounting device |
| US20190067238A1 (en) * | 2017-08-25 | 2019-02-28 | Micron Technology, Inc. | Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool |
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-
1993
- 1993-12-10 JP JP5341593A patent/JPH07161742A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000271889A (en) * | 1999-02-18 | 2000-10-03 | Johnson & Johnson Vision Care Inc | Method and device for conveying object |
| JP2000294573A (en) * | 1999-04-07 | 2000-10-20 | Casio Comput Co Ltd | Bonding apparatus |
| WO2018092306A1 (en) * | 2016-11-21 | 2018-05-24 | 株式会社新川 | Electronic component mounting device |
| KR20190084111A (en) | 2016-11-21 | 2019-07-15 | 가부시키가이샤 신가와 | Electronic component mounting device |
| CN110214366A (en) * | 2016-11-21 | 2019-09-06 | 株式会社新川 | Electronic component mounting equipment |
| JPWO2018092306A1 (en) * | 2016-11-21 | 2019-10-10 | 株式会社新川 | Electronic component mounting equipment |
| US10734259B2 (en) | 2016-11-21 | 2020-08-04 | Shinkawa Ltd. | Electronic component mounting apparatus |
| US20190067238A1 (en) * | 2017-08-25 | 2019-02-28 | Micron Technology, Inc. | Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool |
| CN109427645A (en) * | 2017-08-25 | 2019-03-05 | 美光科技公司 | For preventing the method and system of grafting material pollution semiconductor processing tools |
| US10700038B2 (en) * | 2017-08-25 | 2020-06-30 | Micron Technology, Inc. | Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool |
| KR20190037459A (en) * | 2017-09-29 | 2019-04-08 | 삼성전자주식회사 | Jig for bonding a semiconductor chip, apparatus for bonding a semiconductor chip including the jig, and method of bonding a semiconductor chip using the apparatus |
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