JP2010219101A - Electronic component mounting structure, head, mounter, and method of manufacturing electronic component mounting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reliably join an electronic component to a substrate. <P>SOLUTION: The electronic component mounting structure includes: the substrate 2a; electrode terminals 2b, 2e arranged on a surface of the substrate 2a; an electronic component body 3a facing the surface of the substrate 2a; bumps 3b, 3c, which project on a surface of the electronic component body 3a facing the substrate and are in contact with the electrode terminals 2b, 2e; and a sealing member R which surrounds the electrode terminals 2b, 2e and the bumps 3b, 3c, and are interposed between the surface of the substrate 2a and the electronic component body 3a. A pressure of a space S1 surrounded by the substrate 2a, electronic component body 3a, and sealing member R is lower than a peripheral pressure. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component mounting structure, a head for mounting the electronic component on a substrate, a mounter for mounting the electronic component on the substrate, and a method of manufacturing the electronic component mounting structure.

  In the manufacturing process of a liquid crystal display device, when an electronic component such as an IC chip is bonded to a glass substrate by COG (Chip On Glass), conventionally, for example, ACF (Anisotropic Conductive Film) used for conductive particles has been used as an adhesive. (See Patent Document 1).

JP 2000-012613 A

  By the way, the miniaturization of electronic components has progressed, and the bumps of the IC chip and the electrodes of the substrate connected to the bumps have been reduced in area and pitch. However, it is necessary to increase the area of the electrodes and the bumps so that the conductive particles can be securely sandwiched, which hinders downsizing of the electronic device. On the other hand, it is necessary to increase the number of conductive particles in order to sandwich conductive particles even with an electrode having a small area, but a short circuit easily occurs between electrodes with a narrow pitch. Therefore, a problem to be solved by the present invention is to ensure that the electronic component can be bonded to the substrate.

In order to solve the above problems, according to the electronic component mounting structure of the present invention,
A substrate,
An electrode provided on the substrate;
An electronic component provided on the substrate, having a bump connected to the electrode;
And a sealing material surrounding a decompressed space between the substrate and the electronic component.

Preferably, the space is a vacuum.
Preferably, the space has a gauge pressure of -100 kPa or less.
Preferably, the sealing material is an ultraviolet curable or thermosetting resin.
The substrate is provided with a TFT, a signal line connected to the source of the TFT, and a scanning line connected to the gate of the TFT, and the IC chip is connected to at least one of the signal line and the scanning line. May be.

According to the mounter head of the present invention,
A bonding tool for crimping the held electronic components to the substrate;
A partition wall surrounding the electronic component held by the bonding tool and a first space around the electronic component;
A suction port for sucking the gas in the first space in a state where the partition wall is in contact with the substrate;
And a nozzle for applying a sealing material that blocks the second space between the substrate and the electronic component from the surroundings.

According to the mounter of the present invention,
A stage on which the substrate is placed;
A head body that moves up and down on the stage;
A bonding tool attached to the head body and crimping an electronic component to the substrate;
A partition wall surrounding the electronic component held by the bonding tool and a first space around the electronic component;
A decompression device that decompresses the gas in the first space in a state where the partition wall is in contact with the substrate;
And a nozzle for applying a sealing material that blocks the second space between the substrate and the electronic component from the surroundings in a state where the partition wall is in contact with the substrate.

According to the electronic component mounting structure manufacturing method of the present invention,
An electronic component main body is made to face the surface of the substrate, bumps provided on the surface of the electronic component main body facing the substrate are brought into contact with electrodes formed on the surface of the substrate, and the electronic component main body and the substrate The space between the substrate and the electrode is surrounded by the sealing material, and the sealing material is interposed between the surface of the substrate and the electronic component body, and the applied sealing material is surrounded by the sealing material. It is characterized by curing the stop material.

According to another electronic component mounting structure manufacturing method of the present invention,
The electronic component main body is opposed to the surface of the substrate, bumps provided on the surface of the electronic component main body facing the substrate are brought into contact with the electrodes formed on the surface of the substrate, and the electronic component main body is heated. In the state where the gas around the electronic component body is expanded, the bump and the electrode are surrounded by a sealing material, and the sealing material is interposed between the surface of the substrate and the electronic component body. The applied sealing material is cured, and then the electronic component body is cooled to reduce the space between the electronic component body and the substrate.

  According to the present invention, they are pressed against each other by the negative pressure generated between the electronic component and the substrate, and a gap is less likely to be generated between the electrode and the bump. Therefore, the electronic component can be reliably bonded to the substrate.

It is a front view which shows the display part unit manufactured with the said mounter. It is a side view which shows the display part unit manufactured with the said mounter. It is a longitudinal cross-sectional view which shows the electronic component mounting structure in the embodiment. It is a top view which shows the electronic component mounting structure in the embodiment. It is a top view which shows the mounter in embodiment of this invention. It is a perspective view which shows the crimping | compression-bonding apparatus in the embodiment. It is a longitudinal cross-sectional view which shows the head of the mounter in the same embodiment. It is a bottom view which shows the head of the mounter in the same embodiment. It is a block diagram which shows the circuit structure of the mounter in the same embodiment. It is a longitudinal cross-sectional view which shows the mounting process of the electronic component in the same embodiment. It is a longitudinal cross-sectional view which shows the mounting process of the electronic component in the same embodiment.

  Hereinafter, preferred embodiments for carrying out the present invention will be described with reference to the drawings. However, although various technically preferable limitations for implementing the present invention are given to the embodiments described below, the scope of the invention is not limited to the following embodiments and illustrated examples.

First, the configuration of the display unit 1 will be described.
FIG. 1 is a front view showing the display unit 1, and FIG. 2 is a side view showing the display unit 1. The display unit 1 forms an image displayed on a liquid crystal display device, and includes a liquid crystal display panel 2, an IC chip 3, and an FPC (Flexible Printed Circuits) substrate 4.

  The liquid crystal display panel 2 includes a glass substrate 2a and a glass substrate 2c. The glass substrate 2a is a rectangular transparent plate-like member. On the upper surface of the display area, a plurality of TFTs (Thin Film Transistors) connected to a plurality of pixel electrodes for applying a voltage to the liquid crystal, A plurality of signal lines connected to each source of a plurality of TFT groups arranged in each row, a scanning line connected to each gate of the plurality of TFT groups arranged in every row, and the like are provided. The non-display area of the glass substrate 2a is provided with a plurality of wirings 2d connected to signal lines, scanning lines, etc., and electrode terminals 2b (shown in FIG. 3) at the respective ends of the plurality of wirings 2d. Are arranged in a line. The glass substrate 2a is provided with a plurality of wirings 2f connected to the FPC board 4, and electrode terminals 2e (shown in FIG. 3) are arranged in a line at each end of the plurality of wirings 2f. ing. The glass substrate 2c in FIG. 1 is a transparent plate-like member whose left and right widths are equal to the width of the glass substrate 2a and whose vertical width is slightly shorter than the width of the glass substrate 2a, and is bonded to the upper surface of the glass substrate 2a. Yes. A liquid crystal (not shown) is filled between the glass substrate 2a and the glass substrate 2c, and the periphery thereof is sealed with a sealing material (not shown). The IC chip 3 is disposed in a non-display area protruding from the lower end surface of the glass substrate 2c in the glass substrate 2a, and the electrode terminals 2b are connected to the output bumps 3b (shown in FIG. 3) of the IC chip 3, The electrode terminal 2e is connected to the input bump 3c (shown in FIG. 3) of the IC chip 3. An alignment mark (not shown) for positioning with the IC chip 3 is attached to the non-display area of the glass substrate 2a.

  The FPC board 4 is a strip-like flexible member that connects the liquid crystal display panel 2 and an electronic device (not shown) for driving the liquid crystal display panel 2. One end of the FPC board 4 is connected to a plurality of wirings 2f located at the end of the liquid crystal display panel 2, and the other end of the FPC board 4 is connected to an electronic device.

  An IC chip 3 as an electronic component is mounted on the upper surface of the liquid crystal display panel 2. The IC chip 3 has an elongated plate-like chip body 3a, output bumps 3b, and input bumps 3c (shown in FIG. 3). The chip body 3a is provided with an alignment mark (not shown) for alignment with the liquid crystal display panel 2. A plurality of output bumps 3b and input bumps 3c are provided on the lower surface of the chip body 3a along the two long sides of the chip body 3a. The interval between adjacent output bumps 3b and the width of the column are substantially equal to the interval between adjacent electrode terminals 2b and the width of the column, and the interval between adjacent input bumps 3c and the width of the column are adjacent to each other. It is almost equal to the interval between 2e and the width of the column.

  Here, the mounting structure of the IC chip 3 will be specifically described. FIG. 3 is a longitudinal sectional view showing a state in which the IC chip 3 is mounted on the upper surface of the glass substrate 2a, and FIG. 4 is a top view showing a state in which the IC chip 3 is mounted on the upper surface of the glass substrate 2a. The lower surface of the chip body 3a faces the upper surface of the glass substrate 2a, and the bumps 3b and 3c are placed on the electrode terminals 2b and 2e, respectively. Since the chip body 3a is supported by the electrode terminals 2b and 2e and the bumps 3b and 3c, the upper surface of the glass substrate 2a and the lower surface of the chip body 3a are separated from each other, and a space S1 is formed. The electrode terminals 2b and 2e, the bumps 3b and 3c, and the surrounding space S1 are surrounded by a sealing material R. The sealing material R is a resin cured by ultraviolet rays or heat, and the chip body 3a is bonded to the upper surface of the glass substrate 2a by the sealing material R. The sealing material R is solidified along the side peripheral surface of the chip body 3a and is fixed to the upper surface of the glass substrate 2a. When the mounted IC chip 3 is viewed from above, as shown in FIG. 4, the periphery is surrounded by the sealing material R without a gap, so that it is shielded from the external atmosphere and airtightness is maintained. Thus, the space S1 surrounded by the upper surface of the glass substrate 2a, the lower surface of the IC chip 3, and the sealing material R is sealed. The space S1 is depressurized from the atmospheric pressure, and more preferably, the gauge pressure of the space S1 is −100 kPa or less.

  By configuring the display unit 1 using this mounting structure, the air pressure in the space S1 is lower than the outside. As a result, atmospheric pressure is applied to the upper surface of the IC chip 3 and the lower surface of the liquid crystal display panel 2, and the IC chip 3 and the liquid crystal display panel 2 are pressed against each other. Therefore, the electrode terminals 2b, 2e and the bumps 3b, 3c are pressed against each other by the negative pressure in the space S1, and the electrode terminals 2b, 2e and the bumps 3b, 3c are kept in direct contact with each other.

Next, the configuration of the mounter 100 will be described.
FIG. 5 is a top view of the mounter 100. The mounter 100 manufactures the display unit 1 by mounting the IC chip 3 on the liquid crystal display panel 2 and connecting the FPC board 4. The mounter 100 includes a mounter body 10, a liquid crystal display panel supply unit 20, an IC chip supply unit 30, an FPC supply unit 40, a display unit unit carry-out unit 50, a crimping unit 60, and a display unit unit carry-out unit 80.

  The mounter body 10 is an inverted T-shaped base when viewed from above, and includes a control unit 11 (shown in FIG. 9) for driving various devices attached to the mounter body 10 and a space S2 to be described later. A decompression device 12 (illustrated in FIG. 9) for making a decompressed atmosphere, a resin supply device 13 (illustrated in FIG. 9) for delivering a liquid resin, and the like are stored.

  The crimping part 60 is provided at the upper center of the mounter body 10 and includes a crimping stage 61, a resin curing device 62 including an ultraviolet irradiation source or a heat source, and a camera 63. The crimping stage 61 is a table on which the liquid crystal display panel 2 is placed, and is provided on the mounter body 10. The crimping stage 61 is provided so as to be movable in the front-rear direction (vertical direction in FIG. 5) and the left-right direction (left-right direction in FIG. 5), and around the axis in the vertical direction (direction perpendicular to the paper surface in FIG. 5). It is provided rotatably. The resin curing device 62 irradiates or heats the ultraviolet rays toward the IC chip 3 placed on the liquid crystal display panel 2. The camera 63 is provided on the pressure-bonding stage 61 and detects the positions of the alignment marks on the liquid crystal display panel 2 and the IC chip 3.

  The liquid crystal display panel supply unit 20 is provided in the upper part of the mounter body 10 and on the left hand of the crimping unit 60, and includes a pallet 21 and a robot 22. The pallet 21 is provided so as to be detachable from the mounter main body 10, and the liquid crystal display panels 2 carried in from the previous process are regularly arranged vertically and horizontally. The IC chip 3 is not yet mounted on the liquid crystal display panel 2 arranged on the pallet 21, and electrode terminals 2b and 2e are formed on the upper surface of the glass substrate 2a. The robot 22 moves the liquid crystal display panel 2 and is provided above the pallet 21. The robot 22 includes an arm 23 that can move in the front-rear direction (vertical direction in FIG. 5) with respect to the mounter body 10, and an arm 24 that is attached to the lower part of the arm 23 and can move in the left-right direction with respect to the arm 23. ing. Further, the end portion of the arm 24 is provided with a suction portion 25. The adsorbing unit 25 adsorbs and lifts the liquid crystal display panel 2 and is movable in the vertical direction (a direction perpendicular to the paper surface of FIG. 5) with respect to the arm 24. Further, the suction unit 25 can freely move on the pallet 21 to an arbitrary position by the robot 22, and can freely reciprocate between the pallet 21 and the crimping unit 60.

  The FPC supply unit 40 is provided in the upper part of the mounter body 10 and on the right hand side of the crimping unit 60 and includes a pallet 41. The pallet 41 is provided so as to be detachable from the mounter body 10, and the FPC boards 4 connected to the liquid crystal display panel 2 are regularly arranged vertically and horizontally on the pallet 41.

  The display unit carry-out unit 50 is provided in the upper part of the mounter main body 10 and on the right hand side of the FPC supply unit 40 and includes a pallet 51 and a robot 52. The pallet 51 is provided so as to be detachable from the mounter main body 10, and the display unit 1 to be carried out to the next process is regularly arranged thereon. The robot 52 moves the display unit 1 and is provided above the pallet 21. The robot 52 also serves as a robot that moves the FPC board 4. The robot 52 includes an arm 53 that can move in the front-rear direction (vertical direction in FIG. 5) with respect to the mounter body 10, and an arm 54 that is attached to the lower part of the arm 53 and can move in the left-right direction with respect to the arm 53. ing. In addition, a bonding tool 55 that also serves as a suction portion is provided at the end of the arm 54. The bonding tool 55 sucks and lifts the FPC board 4 and the display unit 1 and is movable in the vertical direction (direction perpendicular to the paper surface of FIG. 5) with respect to the arm 54. Further, the bonding tool 55 can be freely moved to an arbitrary position on the pallet 41 and the pallet 51 by the robot 52, and can freely reciprocate between the pallet 41 and the pallet 51 and the crimping portion 60. Yes.

  The IC chip supply unit 30 is provided at the top of the mounter body 10 and at the back of the crimping unit 60, and includes a pallet 31 and a robot 32. The pallet 31 is provided so as to be detachable from the mounter body 10, and the IC chips 3 are regularly arranged vertically and horizontally on the pallet 31. The IC chips 3 arranged on the pallet 31 are not yet mounted on the liquid crystal display panel 2, and bumps 3b and 3c are projected on the lower surface of the chip body 3a. The robot 32 moves the IC chip 3 and is provided above the pallet 31. The robot 32 includes an arm 33 movable in the front-rear direction (vertical direction in FIG. 5) with respect to the mounter body 10 and an arm 34 attached to the lower portion of the arm 33 and movable in the left-right direction with respect to the arm 33. ing. A rail 34a (shown in FIG. 6) is provided at the end of the arm 34, and a crimping device 35 is attached via the rail 34a. The crimping device 35 can freely move on the pallet 31 to an arbitrary position by the robot 32 and can freely reciprocate between the pallet 31 and the crimping portion 60. The crimping device 35 is connected to the decompression device 12 and the resin supply device 13 by a tube or the like.

  Next, the configuration of the crimping device 35 will be specifically described. FIG. 6 is a perspective view showing the crimping device 35. The crimping device 35 is attached to the tip of the arm 34 of the robot 32, attracts and lifts the IC chip 3, and crimps the IC chip 3 to the liquid crystal display panel 2. The crimping device 35 includes an elevating unit 36, a machine body 37, and a head 7.

The elevating part 36 moves the head 7 in the vertical direction. The back surface of the elevating unit 36 is engaged with a rail 34a provided on the arm 34, and the elevating unit 36 is guided by the rail 34a so as to be movable in the vertical direction. The elevating unit 36 is moved up and down by a motor. An airframe 37 is provided on the front surface of the elevating unit 36. The head 7 is attached to the lower part of the body 37.
The airframe 37 is provided so as to be swingable around a rotation shaft 37a extending in the front-rear direction, and is provided so as to be swingable around a rotation shaft 37b extending in the left-right direction. Thereby, the angles of the machine body 37 and the head 7 around the rotation shaft 37a can be adjusted, and the angles of the machine body 37 and the head 7 around the rotation shaft 37b can be adjusted.
The head 7 can move up and down with respect to the body 37 and is attached to the lower portion of the body 37. An air cylinder 39 is attached to the upper part of the body 37. The air cylinder 39 pushes the head 7 downward and raises the head 7 upward. In place of the air cylinder 39, the head 7 may be pushed out and retracted by a hydraulic cylinder, an electromagnetic solenoid, a motor or other drive unit.

  Next, the configuration of the head 7 will be specifically described. FIG. 7 is a longitudinal sectional view showing the head 7, and FIG. 8 is a bottom view showing the head 7. The head 7 is provided at the lower part of the machine body 37 and sucks the IC chip 3 and mounts the IC chip 3 on the liquid crystal display panel 2. The head 7 includes a head main body 71, a bonding tool 72, a nozzle 73, a partition wall 74, and a pressure sensor 75.

  The head main body 71 is attached to the lower part of the body 37. In the left and right side portions of the head main body 71, suction ports 71a penetrating in the vertical direction are formed. Both suction ports 71 a are connected to the decompression device 12. Further, a plurality of holes 71 b penetrating in the vertical direction are formed in the peripheral portion of the head main body 71. All the upper ends of the holes 71 b are connected to the resin supply device 13.

  The bonding tool 72 is a heating resistor that is heated by the control of the control unit 11 when the IC chip 3 is crimped. The bonding tool 72 is provided at the center of the lower surface of the head main body 71 and sucks and holds the IC chip 3 on the lower surface of the bonding tool 72. In this state, it is thermocompression bonded to the glass substrate 2a. On the lower surface of the bonding tool 72, a plurality of suction holes 72a are formed which communicate with the decompression device 12 and suck and hold the IC chip 3 in contact with the bonding tool 72 with a negative pressure. A plurality of holes 71 b are arranged so as to surround the bonding tool 72.

  The nozzles 73 are respectively connected to the lower ends of the holes 71b and discharge the resin supplied from the resin supply device 13. These nozzles 73 are arranged so as to surround the bonding tool 72. The nozzles 73 hang down from the lower surface of the head main body 71. The vertical lengths of the nozzles 73 with respect to the lower surface of the head main body 71 are all equal, and the positions of the lower ends of these nozzles 73 are aligned horizontally.

  The partition 74 isolates the space around the IC chip 3 from the outside when the IC chip 3 is mounted on the liquid crystal display panel 2. The partition wall 74 is attached to the lower surface of the head main body 71 and hangs down from the lower surface of the head main body 71. The partition wall 74 is provided in a frame shape, all the nozzles 73 are disposed inside the partition wall 74, and these nozzles 73 are surrounded by the partition wall 74. At the lower end of the partition wall 74, a heat resistant rubber elastic sealing material 74a is provided over the entire circumference. The vertical length of the partition wall 74 with respect to the lower surface of the head body 71 is longer than that of the nozzle 73 and is substantially equal to the combined length of the bonding tool 72 and the thickness of the IC chip 3.

  The pressure sensor 75 detects the gas pressure (gauge pressure) inside the partition wall 74 in the crimping process, is inside the partition wall 74, and is on the lower surface of the head body 71 and above the lower surface of the bonding tool 72. It is attached. The pressure sensor 75 is thermally insulated by the head body 71 so that heat generated by the bonding tool 72 does not easily propagate.

  FIG. 9 is a block diagram showing a circuit configuration of the mounter 100. The control unit 11 is a microcomputer having a CPU, RAM, ROM and the like. The positions of the alignment marks of the liquid crystal display panel 2 and the IC chip 3 detected by the camera 63, the position of the head 7 detected by a position sensor (not shown), and the gas pressure detected by the pressure sensor 75 are output to the control unit 11. The The control unit 11 controls the decompression device 12, the resin supply device 13, the crimping device 35, the robots 22, 32, 52, the crimping stage 61, the resin curing device 62, and the like according to a program stored in the ROM.

The control unit 11 has a function of controlling the crimping stage 61 based on the detection positions of the alignment marks of the liquid crystal display panel 2 and the IC chip 3 by the camera 63 by a program stored in the ROM. Specifically, the position of each alignment mark is detected by the camera 63, and the alignment mark X of the IC chip 3 in the horizontal direction X, the front-rear direction shift Y, and the rotation shift based on the alignment mark of the liquid crystal display panel 2. Each θ is calculated. Then, the crimping stage 61 is moved or rotated so that the calculated values X, Y, and θ are zero.
The control unit 11 has a function of controlling the vertical movement of the head 7 based on the detection height of the position sensor. Specifically, when the head 7 is lowered to a predetermined position, that is, the position where the IC chip 3 attracted by the head 7 comes into contact with the glass substrate 2a, the lowering of the head is stopped and the operation of the head is changed to the pressure mode. Switch.
In addition, the control unit 11 has a function of controlling the decompression device 12 based on the gas pressure detected by the position sensor and the pressure sensor 75. Specifically, when the head 7 is lowered to a predetermined position, that is, the position where the IC chip 3 attracted by the head 7 comes into contact with the glass substrate 2a, the decompression device 12 is driven, and the pressure sensor 75 is set to a predetermined pressure. When the value is detected, the driving of the decompression device 12 is stopped.

Next, the flow of processing by the control unit 11, the operation of the mounter 100, and the manufacturing method of the display unit 1 will be described.
First, the atmosphere in the mounter 100 is set to atmospheric pressure. The control unit 11 operates the robot 22 to move the suction unit 25 above the liquid crystal display panel 2 arranged on the pallet 21. When the suction unit 25 moves to a predetermined position, the suction unit 25 is lowered to cause the suction unit 25 to suck the liquid crystal display panel 2. And the adsorption | suction part 25 is raised and the liquid crystal display panel 2 is lifted. The lifted liquid crystal display panel 2 is moved by the robot 22 from the liquid crystal display panel supply unit 20 to above the crimping stage 61. When the liquid crystal display panel 2 comes above a predetermined position of the pressure bonding stage 61, the control unit 11 lowers the suction unit 25 and places the liquid crystal display panel 2 on the upper surface of the pressure bonding stage 61. Thereafter, the suction unit 25 is returned to the pallet 21.

  Next, the control unit 11 operates the robot 32 to move the head 7 above the IC chips 3 arranged on the pallet 31. When the head 7 moves to a predetermined position, the elevating part 36 is lowered by the motor. Along with this, the body 37 and the head 7 are lowered, and the bonding tool 72 comes into contact with the upper surface of the chip body 3a. Then, the chip body 3 a is sucked to the bonding tool 72 by suction through the suction hole 72 a. Subsequently, the elevating unit 36, the machine body 37, and the head 7 are raised by the motor, and the IC chip 3 is lifted. The head 7 is moved onto the crimping stage 61 by the robot 32. At this time, the alignment marks of the glass substrate 2a and the IC chip 3 are detected by the camera 63, and the crimping stage 61 is moved and rotated, so that the alignment marks are exactly overlapped.

  Thereafter, the elevating part 36 is lowered by the motor. Accordingly, the airframe 37 and the head 7 are lowered. Then, with the lower surface of the chip body 3a facing the upper surface of the glass substrate 2a, the chip body 3a approaches the glass substrate 2a, and the bumps 3b and 3c directly contact the electrode terminals 2b and 2e, respectively. The partition wall 74 also descends, and the sealing material 74a of the partition wall 74 comes into contact with the upper surface of the glass substrate 2a and is surrounded by the lower surface of the head body 71, the inner surface of the partition wall 74, and the upper surface of the glass substrate 2a as shown in FIG. A space S2 is created.

  When the position sensor detects that the head 7 has been lowered to a predetermined position, the air cylinder 39 is actuated by the control unit 11, and the head 7 is pressed downward by the air cylinder 39. By doing so, even if there are variations in the height of the bumps 3b and 3c, the bumps 3b and 3c are compressed, and all the bumps 3b and 3c are surely in contact with the electrode terminals 2b and 2e. Moreover, the sealing material 74a is press-contacted to the upper surface of the glass substrate 2a, and the airtightness in the partition 74 increases. The amount of pressurization is set in advance according to the hardness and area of the bump.

  In a state where the head 7 is pressed downward by the air cylinder 39, the control unit 11 drives the decompression device 12. The gas in the space S2 is sucked by the decompression device 12 through the suction port 71a, and the atmospheric pressure in the space S2 gradually decreases. The suction of the gas is performed until the atmospheric pressure in the space S2 becomes a predetermined value (for example, −100 kPa or less in gauge pressure).

  When the pressure sensor 75 detects that the atmospheric pressure in the space S2 is a predetermined value, the control unit 11 stops the decompression device 12, and the atmospheric pressure in the space S2 is maintained at the predetermined value. At this time, since the space S2 has a negative pressure compared with the surrounding area, the liquid crystal display panel 2 and the IC chip 3 are attracted to each other. When the bonding tool 72 is heated, the heat propagates to the bumps 3b and 3c via the IC chip 3 and is bonded to the electrode terminals 2b and 2e. The bonding tool 72 may be thermocompression bonded while the decompression device 12 performs a decompression operation. As described above, stress is generated so as to reduce the space between the liquid crystal display panel 2 and the IC chip 3, so that no gap is generated between the bumps 3 b and 3 c and the electrode terminals 2 b and 2 e when thermobonding with the bonding tool 72. And can be joined well. Also, since the ACF is not previously disposed between the bumps 3b and 3c and the electrode terminals 2b and 2e, the contact area between the bumps 3b and 3c and the electrode terminals 2b and 2e is increased to reduce the contact resistance and improve the reliability. it can. Next, the controller 11 drives the resin supply device 13, and the resin is sent from the resin supply device 13 to each nozzle 73. Then, an ultraviolet curable resin or a thermosetting resin is discharged from the lower end of each nozzle 73. As shown in FIG. 11, the discharged resin is stored on the upper surface of the glass substrate 2a so as to surround the periphery of the chip body 3a, and then comes into close contact with the side peripheral surface of the chip body 3a. The space S1 between the lower surface of the chip body 3a is enclosed. The space S1 is in a reduced-pressure atmosphere like the space S2. When the space S1 and the outer space are reliably separated, the control unit 11 stops the resin supply device 13, and then the resin curing device 62 irradiates the ultraviolet curable resin with ultraviolet rays or the thermosetting resin. By applying heat to the resin, the resin is cured and the sealing material R is obtained. When the resin curing device 62 is an ultraviolet irradiation device, it is disposed below the pressure-bonding stage 61, and the ultraviolet curable resin is cured through the glass substrate 2a to form the sealing material R. When the resin curing device 62 is a heat source, the bonding tool 72 can also be used as the resin curing device 62.

  When a predetermined time has elapsed after the start of ultraviolet irradiation or heating and the sealing material R is cured, the mounting of the IC chip 3 on the liquid crystal display panel 2 is completed. The control unit 11 causes the gas to flow backward in the decompression device 12 so that the space in the partition wall 74 returns to atmospheric pressure. Since the space S1 is surrounded by the sealing material R, even if the space in the partition wall 74 returns to atmospheric pressure, the space S1 is kept in a reduced pressure state. Thereafter, the elevating part 36 is raised by the motor, and the head 7 is returned onto the pallet 31 by the robot 32.

  Next, the ACF for connecting to the FPC board 4 is conveyed to the liquid crystal display panel 2 by roll-to-roll, transferred to the liquid crystal display panel 2 by a thermocompression tool and a crimping stage (not shown), and the ACF is transferred to the liquid crystal display panel by a cutter. Cut every two. Then, the control unit 11 operates the robot 52 to move the bonding tool 55 above a predetermined position of the FPC board 4 arranged on the pallet 41. When the bonding tool 55 moves to a predetermined position, the bonding tool 55 is lowered and the FPC board 4 is attracted to the bonding tool 55. And the adsorption | suction part 25 is raised and the FPC board | substrate 4 is lifted. The lifted FPC board 4 is moved by the robot 52 from the FPC supply unit 40 to above the ACF on the electrode of the liquid crystal display panel 2 placed on the crimping stage (not shown). When the electrodes of the liquid crystal display panel 2 and the electrodes of the FPC board 4 are aligned, the control unit 11 lowers the bonding tool 55 and performs thermocompression bonding like the bonding tool 72 to connect the FPC board 4 to the liquid crystal display panel 2. Let Thus, the display unit 1 is completed.

  When the display unit 1 is completed, the control unit 11 controls the arms 81 and 82 of the display unit carry-out unit 80 to suck the display unit 1 and move it from the crimping stage to the pallet 51. When the display unit 1 reaches a predetermined position above the pallet 51, the control unit 11 lowers the display unit 1 by the arms 81 and 82 and places the display unit 1 on the pallet 51. The arms 81 and 82 that have placed the display unit 1 return to their original positions. When the necessary number of display units 1 are arranged on the pallet 51, the pallet 51 is transported to the next process.

  In the next process, if a backlight is attached to the back of the display unit 1 and a member such as a case is attached, a liquid crystal display device is completed.

In the present embodiment, the IC chip 3 is pressure-bonded at a high temperature, and when the sealing material R is cured, the temperature of the space S1 is cooled to room temperature, thereby causing the gas in the space S1 to contract the volume. And the pressure can be reduced. Further, in the present embodiment, natural cooling by stopping application of voltage, forced cooling using a cooling device, and the like are included.
Alternatively, a thermoplastic resin liquefied by heat may be used and cured by cooling.
Further, the FPC supply unit may be removed from the mounter and the FPC board may be crimped to the next process.

According to the present embodiment, not only the electrode and the bump are in direct contact, but atmospheric pressure is applied to the electronic component and the substrate, and the state where the electrode and the bump are pressed against each other is maintained. Therefore, since there is no need to bond using ACF or the like as in the prior art, the electronic component can be reliably pressure-bonded to the substrate, no matter how fine the electrodes and bumps are.
The higher the degree of vacuum in the space, the more reliable the contact between the electrode and the bump.
Further, by covering the surface of the sealing material with a liquid gasket material, the space S1 and the space S2 can be in a higher vacuum state.
In the above embodiment, there is one IC chip 3, but a plurality of IC chips 3 may be arranged on the glass substrate 2a.
For example, in the above embodiment, the IC chip 3 also serves as a gate driver connected to the scanning line and a source driver connected to the signal line. However, the IC chip 3 may be composed of a plurality of IC chips 3 separated from each other. In this case, the glass substrate 2a protrudes from one end face of the glass substrate 2c, a non-display area where the IC chip 3 as a gate driver is disposed, and a source driver protrudes from the other end face of the glass substrate 2c. And a non-display area in which another IC chip 3 is arranged, and each IC chip 3 is connected to the FPC board 4 via a plurality of wirings 2f.
In the above embodiment, the display unit 1 has the liquid crystal display panel 2, but other display panels such as an EL panel and a field emission display panel may be used.

1 Display unit 2 Liquid crystal display panel 2a Glass substrate (substrate)
2b Electrode terminal 3 IC chip (electronic component)
3a Chip body (electronic component body)
3b Bump 4 FPC board 100 Mounter 10 Mounter body 20 Liquid crystal display panel supply unit 30 IC chip supply unit 35 Crimping device 40 FPC supply unit 50 Display unit unloading unit 60 Crimping unit 7 Head 71 Head body 71a Suction port 71b Hole 72 Bonding tool 73 Nozzle 74 Partition 74a Sealing material S1, S2 Space R Sealing material

Claims (7)

A substrate,
An electrode provided on the substrate;
An electronic component provided on the substrate, having a bump connected to the electrode;
An electronic component mounting structure comprising: a sealing material surrounding a decompressed space between the substrate and the electronic component.   2. The electronic component mounting structure according to claim 1, wherein the space has a gauge pressure of −100 kPa or less. The substrate is provided with a TFT, a signal line connected to the source of the TFT, a scanning line connected to the gate of the TFT,
The electronic component mounting structure according to claim 1, wherein the IC chip is connected to at least one of the signal line and the scanning line. A bonding tool for crimping the held electronic components to the substrate;
A partition wall surrounding the electronic component held by the bonding tool and a first space around the electronic component;
A suction port for sucking the gas in the first space in a state where the partition wall is in contact with the substrate;
A mounter head, comprising: a nozzle for applying a sealing material that blocks a second space between the substrate and the electronic component from the surroundings. A stage on which the substrate is placed;
A head body that moves up and down on the stage;
A bonding tool attached to the head body and crimping an electronic component to the substrate;
A partition wall surrounding the electronic component held by the bonding tool and a first space around the electronic component;
A decompression device that decompresses the gas in the first space in a state where the partition wall is in contact with the substrate;
A mounter comprising: a nozzle that applies a sealing material that blocks a second space between the substrate and the electronic component from the surroundings in a state where the partition wall is in contact with the substrate.   An electronic component main body is made to face the surface of the substrate, bumps provided on the surface of the electronic component main body facing the substrate are brought into contact with electrodes formed on the surface of the substrate, and the electronic component main body and the substrate The space between the substrate and the electrode is surrounded by the sealing material, and the sealing material is interposed between the surface of the substrate and the electronic component body, and the applied sealing material is surrounded by the sealing material. A method for manufacturing an electronic component mounting structure, wherein a stop material is cured.   The electronic component main body is opposed to the surface of the substrate, bumps provided on the surface of the electronic component main body facing the substrate are brought into contact with the electrodes formed on the surface of the substrate, and the electronic component main body is heated. In the state where the gas around the electronic component body is expanded, the bump and the electrode are surrounded by a sealing material, and the sealing material is interposed between the surface of the substrate and the electronic component body. Manufacturing the electronic component mounting structure, wherein the applied sealing material is cured, and then the electronic component main body is cooled to reduce the space between the electronic component main body and the substrate. Method.

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