JP4821481B2 - Electro-optical device manufacturing method and manufacturing apparatus - Google Patents

Description

  The present invention relates to a method and apparatus for manufacturing an electro-optical device for thermocompression bonding an external substrate to a display panel.

  In general, this type of electro-optical device includes a display panel, a driving IC that drives the display panel, and necessary electronic components. As the display panel, a liquid crystal panel, an organic EL (Electro Luminescence) panel, and the like are known, and an electro-optical material such as a liquid crystal and an organic EL material is filled between substrates of each display panel.

  In addition, a flexible substrate (FPC: Flexible Printed Circuit) is connected to the display panel, and a power source, a pixel signal, and the like are input to the display panel via the FPC. The connection between the display panel and the FPC is performed by thermocompression bonding the FPC through a conductive adhesive film such as an anisotropic conductive film (ACF) to a connection portion provided in the display panel. .

  A technique for thermocompression bonding an FPC to a connection portion of a display panel is disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-347359. In the technique disclosed in this document, first, the liquid crystal panel is transported to the ACF attaching stage, ACF is attached to the connection portion of the liquid crystal panel, and then the liquid crystal panel is transported to the pressure bonding stage. The FPC adsorbed by the thermocompression bonding head is brought close to the crimping stage from above, the FPC is brought into contact with the connection portion of the liquid crystal panel, and then the FPC is placed on the connection portion by the ACF via the ACF. Pressurize and heat. Then, the ACF is thermally cured, and the FPC and the connection portion are crimped and electrically connected.

A TAB (Tape Automated Bonding) tape is known as one having a configuration similar to that of an FPC. This TAB tape is also used as a substrate for mounting a driving IC and necessary electronic components. Hereinafter, substrates such as FPC and TAB that are thermocompression bonded to the display panel are collectively referred to as external substrates.
JP 2003-347359 A

  In the crimping stage described in the above-mentioned literature, after the external substrate is thermocompression bonded to the connection portion of the liquid crystal panel, the liquid crystal panel is removed from the crimping stage and supplied to the next process. The removal and supply of the liquid crystal panel is generally performed by a transfer arm. This transfer arm is provided with a transfer head at the tip, and the upper surface of the liquid crystal panel is vacuum-sucked by this transfer head, and is transferred by lifting.

  By the way, the heating temperature of the thermocompression bonding head is as high as about 300 to 350 [° C.], and when the external substrate is thermocompression bonded to the liquid crystal panel, the heat from the thermocompression bonding head is transmitted to the display panel and the liquid crystal (electro-optical material) ) Is heated. When the liquid crystal is heated, its arrangement changes. When the transport head comes into contact with the liquid crystal panel in this state, the transport head is made of metal and the surface temperature is normal (room temperature). The liquid crystal is rapidly cooled by the temperature difference between the surface of the liquid crystal and the liquid crystal panel in contact therewith. When the liquid crystal is rapidly cooled, the change in the alignment of the liquid crystal does not return to the original state, causing display unevenness (color unevenness).

  As a countermeasure, it may be possible to wait until the liquid crystal alignment returns to a normal state by natural heat dissipation, and then remove the material by adsorbing the liquid crystal panel with the transport head. It will decline. In addition, it is conceivable to form the thermocompression bonding head with a material having high heat insulation properties such as rubber, but it is not preferable when the influence of static electricity on the liquid crystal panel is taken into consideration.

  Such a phenomenon appears as a phenomenon such as a change in light emission characteristics even in an EL panel using an organic EL material as an electro-optical material.

  In view of the above circumstances, the present invention can remove a material using a transport head without setting a long standby time after thermocompression bonding of an external substrate, and suppresses a decrease in production efficiency. It is an object of the present invention to provide an electro-optical device manufacturing method and a manufacturing apparatus capable of obtaining a good display state.

  In order to achieve the above object, a first electro-optical device manufacturing method according to the present invention includes a thermocompression bonding process in which an external substrate is thermocompression bonded to a display panel including an electrooptic material, and the external substrate is thermocompression bonded. The display panel is sucked and transported by a metal transport head, and after the thermocompression bonding of the external substrate is completed in the thermocompression bonding process, the display panel is cooled by blowing cooling air. It is characterized by.

  In such a configuration, first, an external substrate is thermocompression bonded to a display panel including an electro-optical material. When an external substrate is thermocompression bonded to the display panel, the heat is transferred to the display panel side, and the electro-optic material is heated. When the display panel in which the electro-optical material is heated is sucked and transported by the metal transport head, the electro-optical material is rapidly cooled due to a temperature difference between the metal transport head and the display panel. Therefore, cooling air is blown onto the display panel after the external substrate is thermocompression bonded to cool the display panel, and the arrangement of the electro-optical material that has changed due to the temperature rise is restored. Then, after the temperature of the electro-optical material is lowered to a predetermined level, the display panel is sucked and transported by a metal transport head. As a result, even when the metal transport head is adsorbed to the liquid crystal panel, the temperature difference between the metal transport head and the liquid crystal panel in contact with the metal transport head is small. The occurrence of color unevenness can be suppressed.

  The second electro-optical device manufacturing method is characterized in that, in the first electro-optical device manufacturing method, the cooling air is blown onto at least a region of the display panel close to a side to which the external substrate is connected. To do.

  In such a configuration, the cooling air cools at least the area of the display panel close to the side where the external substrate is connected, and almost no cooling air is blown to the area away from the external substrate where the temperature rise of the display panel is small. Therefore, it is possible to efficiently cool the portion where the temperature rise is large.

  The third electro-optical device manufacturing method is the first electro-optical device manufacturing method or the second electro-optical device manufacturing method, wherein the cooling air has a normal temperature or a temperature slightly higher than the normal temperature. It is characterized by that.

  In such a configuration, since the cooling air has a normal temperature or a slightly higher temperature than the normal temperature, the electro-optical material of the display panel to which the cooling air is blown is not rapidly cooled, and is shorter than natural heat dissipation. With this, the arrangement of the electro-optic material can be restored.

  The first electro-optical device manufacturing apparatus according to the present invention includes a thermocompression bonding head for thermocompression bonding of an external substrate to a display panel including an electrooptic material, and a display panel for thermocompression bonding of the external substrate. A nozzle that blows cooling air and a metal transport head that sucks and transports the display panel cooled by the cooling air from the nozzle are provided.

  In such a configuration, the external substrate is thermocompression bonded to the display panel including the electro-optic material by the thermocompression bonding head. When an external substrate is thermocompression bonded to the display panel, the heat is transferred to the display panel side, and the electro-optic material is heated. When the display panel in which the electro-optical material is heated is sucked and transported by the metal transport head, the electro-optical material is rapidly cooled due to a temperature difference between the metal transport head and the display panel. Therefore, cooling air blown from the nozzles is blown against the display panel after the external substrate is thermocompression bonded to cool the display panel, and the arrangement of the electro-optic material changed by raising the temperature is restored. Then, after the temperature of the electro-optical material is lowered to a predetermined level, the display panel is sucked and transported by a metal transport head. As a result, even when the metal transport head is adsorbed to the liquid crystal panel, the temperature difference between the metal transport head and the liquid crystal panel in contact with the metal transport head is small. The occurrence of color unevenness can be suppressed.

  The second electro-optical device manufacturing apparatus is the first electro-optical device manufacturing apparatus, wherein the cooling air blown from the nozzle is in a region near at least the side of the display panel to which the external substrate is connected. It is characterized by being sprayed.

  In such a configuration, at least the area near the side where the external substrate is connected to the display panel is cooled by the cooling air blown from the nozzle, and the area away from the external substrate where the temperature rise of the display panel is small. Since almost no cooling air is blown, it is possible to efficiently cool the portion where the temperature rise is large.

  The third electro-optical device manufacturing apparatus is the first electro-optical device manufacturing apparatus or the second electro-optical device manufacturing apparatus, wherein the cooling air blown from the nozzle is at room temperature or slightly higher than room temperature. It is characterized by having.

  In such a configuration, since the cooling air blown from the nozzle has a normal temperature or a slightly higher temperature than the normal temperature, the electro-optical material of the display panel to which the cooling air is blown is not rapidly cooled, and is naturally The arrangement of the electro-optic material can be restored in a shorter time than heat dissipation.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of the liquid crystal panel device, and FIG. 2 is a sectional view taken along line II-II in FIG. In the present embodiment, a liquid crystal panel device is shown as an example of an electro-optical device. Note that the liquid crystal panel device shown in the present embodiment may be either a passive type such as STN or an active type such as TFD, TFT, or LTPS.

  The liquid crystal panel device 1 is used as, for example, a light valve of a projection display device that is an example of an electronic device, and includes a liquid crystal panel 2 and an FPC 3 as an external substrate connected to the liquid crystal panel 2.

  The liquid crystal panel 2 includes a pair of opposing substrates 4, 5, and the gap between the opposing surfaces of both the substrates 4, 5 is bonded via a sealing material 6, and is surrounded by the substrates 4, 5 and the sealing material 6. A liquid crystal (not shown) as an electro-optical material is sealed in the container. Both substrates 4 and 5 are formed in a plate shape using a light-transmitting material such as glass or synthetic resin.

  Further, one substrate 4 has a larger area than the other substrate 5, and in a state where the two substrates 4 and 5 are bonded together, the one substrate 4 is stretched outward from the outer peripheral edge of the other substrate 5. A protruding area is formed, and an FPC mounting area 4a is provided on the surface of the protruding area. A connection portion composed of a plurality of connection terminals is provided on the substrate edge side of the FPC mounting area 4a, and each connection terminal is formed on the opposing surface of both the boards 4 and 5 via the wiring pattern 4b formed in the FPC mounting area 4a. Connected to the wiring.

  In addition, an anisotropic conductive film (ACF) 7 which is an example of a conductive adhesive film is attached to the FPC mounting region 4a, and a connecting portion 3a formed at the tip of the FPC 3 is connected via the ACF 7. It is mounted on the connecting portion of the FPC mounting area 4a by thermocompression bonding. Further, a driving IC 8 is mounted on a predetermined area on the surface of the FPC mounting area 4a via the ACF 7. The driving IC 8 may be mounted on the FPC 3, and the ACF 7 may be attached in advance to the surface of the connecting portion 3a of the FPC 3 that faces the FPC mounting area 4a.

  FIG. 3 shows a process diagram of an FPC mounting apparatus 11 which is an example of a manufacturing apparatus for mounting the FPC 3 on the liquid crystal panel 2.

  This FPC mounting apparatus 11 is relatively connected between the ACF application station 12 (FIG. 3A), the FPC application station 13 (FIG. 3C), and between the ACF application station 12 and the FPC application station 13. A first transport head 14 (FIG. 3B) that reciprocates, and a second transport head 15 (FIG. 3D) that reciprocates relatively between the FPC crimping station 13 and the next process. Is provided. As described above, when the ACF 7 is pasted to the connecting portion 3a of the FPC 3, the ACF pasting station 12 is not necessary. However, in the following, a case where the ACF 7 is pasted at the ACF pasting station 12 will be described as an example.

  In the ACF pasting station 12 shown in FIG. 3A, a step of pasting the ACF 7 on the terminal portion of the FPC mounting area 4a provided on one substrate 4 constituting the liquid crystal panel 2 is executed. That is, the ACF attaching station 12 has an ACF attaching stage 12a, and the liquid crystal panel 2 is set in a predetermined alignment state on the ACF attaching stage 12a. Next, the ACF 7 is attached to the FPC mounting area 4a provided on one substrate 4 of the liquid crystal panel 2 set on the ACF attaching stage 12a from above. The configuration of the ACF pasting station 12 and the pasting operation of the ACF 7 at the ACF pasting station 12 are the same as those in the prior art, and thus the description thereof is omitted.

  The first transfer head 14 shown in FIG. 3B is held at the tip of a transfer arm (not shown), and the transfer head 14 has an ACF application station 12 (the ACF application station 12 is omitted by the operation of the transfer arm). In this case, the liquid crystal panel 2 set on the ACF adhering stage 12a is removed, and the FPC pressure bonding station 13 described later is provided. The material is fed to the existing FPC pressure bonding stage 13a.

  The first transport head 14 has a suction surface 14a at its lower end, and a recess 14b is opened at the center of the suction surface 14a. A negative pressure generator (not shown) such as a vacuum pump is communicated with the recess 14b, and the upper surface of the other substrate 5 of the liquid crystal panel 2 is sucked and lifted by the negative pressure generated on the suction surface 14a.

  In the FPC crimping station 13 shown in FIG. 3C, a process of thermocompression bonding the FPC 3 onto the surface of the FPC mounting area 4a of the liquid crystal panel 2 is performed. The FPC pressure bonding station 13 has an FPC pressure bonding stage 13a, and the liquid crystal panel 2 fed by the first transport head 14 is set on the FPC pressure bonding stage 13a in a predetermined alignment state.

  Further, as shown in FIG. 4, a thermocompression bonding head 16 is provided above the FPC crimping stage 13a. The thermocompression bonding head 16 has a head main body 16a and a pressure surface 16b provided on the lower surface of the head main body 16a. The pressure surface 16b is provided on the liquid crystal panel 2 set on the FPC pressure bonding stage 13a. The portion of the FPC mounting area 4a to which the connecting portion 3a provided at the tip of the FPC 3 is crimped can be raised and lowered via an actuator such as an air cylinder (not shown). The pressing surface 16b is heated to a preset thermocompression bonding temperature (300 to 350 [° C.]).

  In the FPC pressure bonding station 13, the connecting portion 3a of the FPC 3 is made to face the surface of the FPC mounting area 4a provided on one substrate 4 constituting the liquid crystal panel 2 set on the FPC pressure bonding stage 13a. And the upper surface of this connection part 3a is pressurized and heated with the pressurization surface 16b of the thermocompression-bonding head 16. FIG. Then, the FPC 3 is thermocompression bonded to the FPC mounting area 4a via the ACF 7, and the connecting portions provided in the FPC mounting area 4a and the FPC 3 are electrically connected.

  Further, as shown in FIG. 7, the FPC crimping station 13 has a nozzle 22. A blower (not shown) such as an air blower or an air compressor communicates with the upstream side of the nozzle 22. The nozzle 22 is held by a robot arm (not shown) so as to be movable, and after the thermocompression bonding by the thermocompression bonding head 16 is completed, the outlet 22a is directed near the end of the other substrate 5 on the FPC3 side. Is done.

  The second transport head 15 shown in FIG. 3 (d) is held at the tip of a transport arm (not shown), and reciprocates between the FPC crimping station 13 and the next process by the movement of the transport arm. The material of the liquid crystal panel 2 set on the FPC pressure bonding stage 13a is removed, and the material is supplied to the next process. As shown in FIG. 7, the second transport head 15 has a suction surface 15a formed at the lower end thereof, and a recess 15b is opened at the center of the suction surface 15a. A negative pressure generator (not shown) such as a vacuum pump is communicated with the recess 15b, and the upper surface of the other substrate 5 of the liquid crystal panel 2 is sucked and lifted by the negative pressure generated on the suction surface 15a. The panel 2 (at this time, since the FPC 3 is connected to the liquid crystal panel 2, to be precise, the liquid crystal panel device 1) is transported to the next process. The second transport head 15 is made of metal and is grounded (grounded) in a predetermined manner to prevent the liquid crystal panel device 1 from being affected by static electricity or the like.

  Incidentally, as described above, the temperature of the pressure surface 16b of the thermocompression bonding head 16 is as high as 300 to 350 [° C.]. Therefore, as shown in FIG. 5, the connecting portion 3a of the FPC 3 is connected to the pressure surface 16b. When pressing on the FPC mounting area 4a of the other substrate 5 via the ACF 7, the heat from the pressing surface 16b at that time is sealed between the substrates 4 and 5 via the one substrate 4 and the wiring pattern 4b. Is transmitted to the liquid crystal, and the liquid crystal is heated. When the liquid crystal is heated, the other substrate 5 is heated by the heat, so that the surface temperature of the other substrate 5 also rises.

  As described above, the second transport head 15 is made of metal, and the surface temperature thereof is normal temperature (room temperature). Therefore, immediately after the FPC 3 is thermocompression bonded to the FPC mounting area 4 a, if the suction surface 15 a of the second transport head 15 is brought into contact with the upper surface of the other substrate 5, the suction surface 15 a and the surface of the other substrate 5 are Due to the temperature difference, the liquid crystal is rapidly cooled via the other substrate 5. The alignment of the heated liquid crystal has changed. If the liquid crystal is rapidly cooled in this state, the change in the alignment does not return to the original state, causing display unevenness (color unevenness).

  The surface temperature distribution of the other substrate 5 raised in temperature by the heat from the thermocompression bonding head 16 is highest near the end portion (hereinafter referred to as “front end portion”) close to the side to which the FPC 3 is connected. It gets lower as you move away from. According to the experiment, the alignment of the liquid crystal corresponding to the hatched area (hereinafter referred to as “temperature rising area”) F in FIG. 6 from the front end side of the other substrate 5 is influenced by the heat from the thermocompression bonding head 16. It turns out that it is changing.

  However, in this embodiment, before the second transport head 15 sucks the liquid crystal panel 2, the temperature rising region F is air-cooled by air blow as cooling air from the nozzle 22 in the FPC pressure bonding station 13, and the liquid crystal Since the liquid crystal panel 2 is transported by the second transport head 15 until the arrangement is restored, the liquid crystal is rapidly cooled even if the liquid crystal panel 2 is adsorbed by the second transport head 15. There is nothing.

  Next, the operation of the FPC mounting apparatus 11 having such a configuration will be described. When the liquid crystal panel 2 is set in a predetermined alignment state on the ACF application stage 12a of the ACF application station 12 shown in FIG. 3A, it is formed on one substrate 4 constituting the liquid crystal panel 2. The ACF 7 is attached to the FPC mounting area 4a (see FIGS. 1 and 2) from above.

  Thereafter, the suction surface 14a of the first transport head 14 comes into contact with the upper surface of the other substrate 5 of the liquid crystal panel 2, and the upper surface of the other substrate 5 is sucked by a negative pressure. Next, the liquid crystal panel 2 is lifted by the first transport head 14, and the liquid crystal panel 2 is fed to the FPC pressure bonding station 13. The liquid crystal panel 2 is set in a state in which the liquid crystal panel 2 is aligned in a predetermined manner on the FPC pressure bonding stage 13a provided in the FPC pressure bonding station 13 by the movement of the transport arm. When the liquid crystal panel 2 is set on the FPC pressure bonding stage 13a, first, the driving IC 8 is mounted at a predetermined position on the surface of the FPC mounting area 4a. If the driving IC 8 is mounted on the FPC 3, this step is omitted.

  Next, as shown in FIG. 4, the connecting portion 3a of the FPC 3 is made to face the edge on the surface of the FPC mounting area 4a. Then, the thermocompression bonding head 16 waiting upward is lowered, and the pressing surface 16b provided on the lower surface of the head main body 16a presses the connecting portion 3a of the FPC 3 as shown in FIGS. The pressurizing surface 16b is heated to a preset thermocompression bonding temperature (300 to 350 [° C.]), and the pressurizing and heating of the pressurizing surface 16b causes the connecting portion 3a of the FPC 3 on the FPC mounting region 4a via the ACF7. It is thermocompression bonded to.

  When the FPC 3 is thermocompression bonded to the FPC mounting area 4a by the thermocompression bonding head 16, the heat of the pressing surface 16b is transferred to the liquid crystal via the wiring pattern of the FPC mounting area 4a or one of the substrates 4, and the liquid crystal is raised. Be warmed. Furthermore, the temperature of the other substrate 5 is also raised by the heat of the liquid crystal. As described above, the surface temperature distribution of the other substrate 5 whose temperature has been raised is highest near the front end portion and becomes lower as the distance from the front end portion increases, and the liquid crystal corresponding to the temperature rise region F shown by hatching in FIG. Is changed by the influence of heat from the thermocompression bonding head 16.

  When the thermocompression bonding of the FPC 3 to the FPC mounting area 4a by the thermocompression bonding head 16 is completed, the thermocompression bonding head 16 is returned to the standby position. Further, by replacing this, the nozzle 22 held by the robot arm (not shown) is exposed to the liquid crystal panel 2, and as shown in FIG. 7, the outlet 22 a is obliquely above the front end of the other substrate 5. It is set in a state where it is oriented to. Air from a blower (not shown) is blown out from the blowout port 22a of the nozzle 22, and this air blow is blown to the temperature rising region F (see FIG. 6) of the other substrate 5 to raise the temperature rising region F ( (See FIG. 6) and its surroundings are cooled.

  The air blown out from the nozzle 22 has a temperature at which the temperature raising region F is not rapidly cooled, that is, normal temperature or a slightly higher temperature. Therefore, the other substrate 5 is not rapidly cooled by the air blow from the nozzle 22, and can be gradually cooled in a shorter time than natural heat dissipation. In addition, since the cooling air is blown only on the temperature rising region F that has been heated by thermocompression bonding and its periphery, the liquid crystal can be cooled efficiently.

  Then, after the temperature rising region F of the other substrate 5 has been cooled to a predetermined level, that is, after the temperature of the portion corresponding to the temperature rising region F has been lowered to the temperature at which the change in the liquid crystal alignment returns to its original state, Return to position. Thereafter, the second transport head 15 provided at the front end of the transport arm (not shown) is made to face above the liquid crystal panel 2 set on the FPC crimping stage 13a as shown in FIG.

  Next, the second transport head 15 is lowered in the direction of the liquid crystal panel 2, and the suction surface 15a is brought into contact with the surface of the other substrate 5 as shown in FIG. Then, the upper surface of the other substrate 5 of the liquid crystal panel 2 is adsorbed to the adsorption surface 15a by the negative pressure generated in the recess 15b of the adsorption surface 15a. Then, when the transport arm (not shown) is operated to raise the second transport head 15, the liquid crystal panel 2 attracted to the suction surface 15 a is lifted and removed from the FPC pressure bonding stage 13 a as shown in FIG. 10. Is done.

  By the way, since the second transport head 15 is made of metal and has a surface temperature of room temperature (room temperature), when the suction surface 15a of the second transport head 15 contacts the upper surface of the other substrate 5, the suction surface. There is a possibility that the other substrate 5 may be rapidly cooled due to the temperature difference between the surface 15a and the surface of the other substrate 5, but the temperature rising region F of the other substrate 5 has already been cooled by the air blow, Even if 15a contacts the surface of the other substrate 5, a large temperature difference does not occur and the alignment of the liquid crystal is returned to a normal state. As a result, the occurrence of display unevenness (color unevenness) in the liquid crystal is suppressed, and a good display state can be obtained.

  The present invention is not limited to the above-described embodiments. For example, an inert gas such as nitrogen gas is blown out from the nozzle 22 as cooling air in addition to air, and the liquid crystal panel 2 is cooled by this gas blowing. May be. The external substrate is not limited to a flexible substrate such as the FPC 3 or a film substrate typified by a TAB tape, and may be a thin substrate.

  The present invention is not limited to the above-described embodiments, and various modifications can be made as appropriate without departing from the spirit or idea of the invention that can be read from the claims and the entire specification. The manufacturing apparatus and the manufacturing method are also included in the technical scope of the present invention.

Plan view of liquid crystal panel device II-II sectional view of FIG. Schematic process diagram of FPC mounting equipment Side view of liquid crystal panel fed to FPC crimping stage Side view of a state where a flexible substrate is thermocompression bonded to a liquid crystal panel Plan view of FIG. Side view of the liquid crystal panel being cooled by air blow Side view of the second transport head in proximity to the liquid crystal panel Side view of the state in which the second transport head sucks the liquid crystal panel Side view of the state where the liquid crystal panel is removed from the FPC pressure bonding stage by the second transport head

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Liquid crystal panel apparatus, 2 ... Liquid crystal panel, 3 ... Flexible substrate, 3a ... Connection part, 4 ... One board | substrate, 4a ... Mounting area | region, 4b ... Wiring pattern, 5 ... Other board | substrate, 7 ... Anisotropic electrically conductive film 11 ... FPC mounting apparatus, 12 ... ACF sticking station, 12a ... ACF sticking stage, 13 ... FPC pressure bonding station, 13a ... FPC pressure bonding stage, 15 ... second conveying head, 15a ... adsorption surface, 16 ... thermocompression bonding head, 22 ... Nozzle, 22a ... Outlet, F ... Temperature rise area

Claims (6)

A thermocompression bonding process in which an external substrate is thermocompression bonded to a display panel including an electro-optic material;
A conveyance step of adsorbing and conveying the display panel on which the external substrate is thermocompression bonded with a metal conveyance head;
In the thermocompression bonding process, after the thermocompression bonding of the external substrate is completed, cooling is performed by blowing cooling air to the display panel. 2. The method of manufacturing an electro-optical device according to claim 1, wherein the cooling air is blown onto a region near at least the side of the display panel to which the external substrate is connected. 3. The method of manufacturing an electro-optical device according to claim 1, wherein the cooling air has a normal temperature or a temperature slightly higher than the normal temperature. A thermocompression bonding head for thermocompression bonding an external substrate to a display panel including an electro-optic material;
A nozzle that blows cooling air against the display panel that is thermocompression-bonded to the external substrate;
An electro-optical device manufacturing apparatus, comprising: a metal transport head that sucks and transports the display panel cooled by cooling air from the nozzle. 5. The electro-optical device manufacturing apparatus according to claim 4, wherein the cooling air blown from the nozzles is blown to a region near at least the side of the display panel to which the external substrate is connected. 6. The electro-optical device manufacturing apparatus according to claim 4, wherein the cooling air blown from the nozzle has a normal temperature or a temperature slightly higher than the normal temperature.

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