JP2850749B2 - Thermocompression bonding equipment for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component thermocompression bonding apparatus for thermocompression bonding an electronic component lead formed by mounting a chip on a film carrier to an electrode of a substrate. .

[0002]

2. Description of the Related Art A liquid crystal panel, which is frequently used as a display panel of various electronic devices such as a personal computer and a word processor, is formed by bonding two glass plates having a transparent circuit pattern formed thereon. As an electronic component for driving a liquid crystal panel, a component in which a chip is mounted on a film carrier is frequently used. Many fine leads are attached to the film carrier at a narrow pitch. One of the leads is bonded to the electrode formed on the edge of the liquid crystal panel, and the other lead is driven by the liquid crystal panel. Is bonded to an electrode formed on a substrate for use.

A lead bonded to an electrode on a substrate tends to peel off from the electrode when the film carrier is warped. Therefore, a plated portion is formed on the lower surface of the film carrier near the lead, a solder portion is formed on the upper surface of the substrate with respect to the plated portion, and the plated portion is bonded to the solder portion so that stress is not directly applied to the lead. Reinforcement has been made. Bonding the plating part to the solder part in this way
It is called anchor bonding.

As described above, the leads and plated portions of an electronic component are bonded to a substrate. Conventionally, the bonding has been performed as follows. That is,
First, the lead of the film carrier is bonded to the electrode of the substrate by thermocompression bonding using a thermocompression bonding device provided in the first thermocompression bonding apparatus. Next, the liquid crystal panel is sent to a second thermocompression bonding device, and the plated portion is thermocompressed to the solder portion by the thermocompression bonding device of the second thermocompression bonding device to perform anchor bonding.

[0005]

However, in the above-mentioned conventional method, the first thermocompression bonding apparatus and the second thermocompression bonding apparatus have the same structure.
Since two devices are provided and bonding is performed by the first thermocompression bonding apparatus, the liquid crystal panel must be sent to the second thermocompression bonding apparatus to perform anchor bonding. Since a thermocompression bonding apparatus is required, the equipment cost is high, and a large installation area for the apparatus is required.

Accordingly, the present invention provides a thermocompression bonding apparatus for electronic components which can perform bonding of a lead to an electrode and anchor bonding of a film carrier in a short time with good workability using a single thermocompression bonding apparatus. With the goal.

[0007]

For this purpose, the present invention provides a liquid crystal panel in which one lead of an electronic component comprising a chip mounted on a film carrier is bonded along an edge and outward from the edge. A table device for mounting a substrate to which the other lead of the extending electronic component is bonded, and bonding the other lead above the table device by thermocompression bonding to an electrode formed on the upper surface of the substrate A first thermocompressor and a second thermocompressor for performing anchor bonding by thermocompression bonding a plated portion formed on the lower surface of the film carrier to a solder portion formed on the upper surface of the substrate; and the first thermocompressor. And a moving means for moving the second thermocompression bonding element in a horizontal direction relative to the substrate to constitute a thermocompression bonding apparatus for electronic components.

[0008]

According to the above construction, the bonding of the lead of the electronic component to the electrode of the substrate and the anchor bonding of the plating part of the film carrier to the solder part of the substrate can be performed as a series of operations with good workability. .

[0009]

Next, embodiments of the present invention will be described. FIG. 1 is a perspective view of a thermocompression bonding apparatus for electronic components according to a first embodiment of the present invention.
3 is a perspective view of the liquid crystal panel and the substrate, FIG. 3 is a partially enlarged perspective view of a portion A in FIG. 2, and FIGS. 4 and 5 are cross-sectional views of essential parts during bonding of the electronic component in a thermocompression bonding apparatus. 7 is an enlarged sectional view of the main part.

In FIG. 1, the thermocompression bonding apparatus for electronic components comprises a table device 1 and a head device 10.
The table device 1 is configured by stacking an X table 2, a Y table 3, a rotary table 4, and a substrate holding table 5, and a sub table 6 is integrated with the substrate holding table 5 beside the substrate holding table 5. Is provided. Further, the head device 10 includes a first head unit 11 and a second head unit 12.

The first head section 11 includes a slider 13A,
Bracket 14A disposed on the front of slider 13A
And a plurality of first thermocompression bonding elements 15 held at the lower front part of the bracket 14A. Reference numeral 16A denotes a cylinder mounted on the front surface of the slider 13 and its rod 1
A bracket 14A is connected to 7A. Therefore, when the cylinder 16A operates and the rod 17A projects,
The bracket 14A is lowered, and when the rod 17A is retracted, the bracket 14A is raised.

The second head section 12 is provided with a first head section 11.
Slider 13B, bracket 14
B, a plurality of second thermocompressors 18 held at the lower part of the front surface of the cylinder 16B and the bracket 14B,
When the rod 17B of the cylinder 16B projects, the bracket 14B moves up and down. The brackets 13A and 13B are slidably mounted on the guide rail 19 in the X direction (lateral direction), and the first head unit 11 and the second head unit 12 are arranged side by side. Therefore, when the driving means (not shown) is driven, the first head 11 and the second head 12
Moves in the X direction along the guide rail 19.

A liquid crystal panel 31 is mounted on the table device 1, and a substrate 32 is mounted on the sub-table 6. Therefore, when the X table 2, the Y table 3, and the rotary table 4 are respectively driven, the liquid crystal panel 31 and the substrate 32 move in the X direction, the Y direction, and the θ direction (horizontal rotation direction), and their positions are adjusted. In FIG. 2, electronic components 40 as drivers are bonded in advance to the edges of the three sides of the liquid crystal panel 31. In the present embodiment, four electronic components 40 are bonded to the long side, and two electronic components 40 are bonded to the short side. The substrate 32 has a long plate shape along one long side of the liquid crystal panel 31, and a large number of electrodes 33 are arranged on the upper surface thereof at a pitch.

In FIG. 3, an electronic component 40 is connected to leads 43 and 44 formed on the lower surface of a film carrier 41.
The chip 42 is formed by inner lead bonding, and the lead 43 on one side is bonded to an electrode formed in advance at a narrow pitch along the edge of the liquid crystal panel 31 by an outer lead bonding device (not shown). I have. Note that the liquid crystal panel 31 is formed by bonding an upper plate 31a and a lower plate 31b made of glass plates as shown in FIGS. 4 and 5, but since the drawing becomes complicated, FIGS. 31a is omitted. A plating portion 45 is provided on the lower surface on both sides of the lead 44 on the other side of the film carrier 41.
Are formed thinly. The plating portion 45 is, for example, tin plating or solder plating. Further, a solder portion 46 is formed at a position corresponding to the plating portion 45 on the upper surface of the substrate 32. As described later, the lead 44 is bonded to the electrode 33, and the plated portion 45 is anchor-bonded to the solder portion 46.

The thermocompression bonding apparatus for the electronic component 40 is constructed as described above. Next, the overall operation will be described. In FIG. 1, the table apparatus 1 is driven to adjust the positions of the liquid crystal panel 31 and the substrate 32 in advance. Next, the first head unit 11 moves above the substrate 32. This first
The head section 11 includes four first electronic components 40 corresponding to the four electronic components 40 bonded to the long sides of the liquid crystal panel 31.
, And each first thermocompression contact 15 is stopped immediately above the lead 44 of each electronic component 40.

Next, when the rod 17A of the cylinder 16A protrudes, the first thermocompression contact 15 descends and is protruded from the lower surface of the first thermocompression contact 15 as shown in FIGS. The thermocompression bonding part 15a is connected to the lead 44
3 and bonded by thermocompression bonding. Reference numeral 15b denotes a heater built in the first thermocompression bonding element 15;
The thermocompression bonding portion 15 a is heated to about 200 ° C. by the heat generated by b, and the heat causes the lead 44 to be bonded to the electrode 33.

If the leads 44 of the four electronic components 40 are simultaneously bonded to the electrodes 33 of the substrate 32 in this manner, the rod 17A of the cylinder 16A retracts,
Each first thermocompression bonding element 15 rises to release the thermocompression bonding state. Next, the second head unit 12 shown in FIG. Next, when the rod 17B of the cylinder 16B protrudes, the second thermocompression bonding element 18 is lowered, and the thermocompression bonding portion 18a on the lower surface thereof is pressed against the upper surface of the film carrier 41 as shown in FIGS. Part 45
Is spot-bonded to the solder portion 46 by thermocompression bonding to perform anchor bonding. The second thermocompression bonding element 18 also has a built-in heater 18b, and the heat causes the plated portion 45 to be thermocompression bonded to the solder portion 46. When the four electronic components 40 are simultaneously anchor-bonded in this manner, the rod 17B of the cylinder 16B is retracted, and the second thermocompression bonding element 1
8 rises to release the thermocompression bonding state. LCD panel 3
The bonding of the lead 44 to the electrode 33 and the anchor bonding are also performed for the electronic component 40 bonded to the other side of the same as described above.

Next, a second embodiment of the present invention will be described. FIG. 8 is a perspective view of a thermocompression bonding apparatus for electronic components according to a second embodiment of the present invention, FIG. 9 is a perspective view of a thermocompression bonding tool provided in the thermocompression bonding apparatus for electronic components, and FIGS. It is principal part sectional drawing during bonding of the thermocompression bonding apparatus of components. 9 and 10, in the thermocompression bonding tool 50, a first thermocompression bonding element 53 is housed in a recessed portion 52 formed in a lower part on the rear side of a main body 51. A pin 57 projects from the back surface of the first thermocompression bonding element 53, and the pin 57 fits into a vertical long hole 56 formed in the main body 51. As shown in FIG. 10, a spring member 54 is interposed on the upper surface of the first thermocompression contactor 53.
The thermocompressor 53 is elastically held up and down.

In FIG. 9, the lower part on the front side of the main body 51 is a second thermocompression bonding element 51a, and two thermocompression bonding sections 51b are provided on the lower surface thereof. Normally, the lower surface of the first thermocompression bonding element 53 is located below the lower surface of the thermocompression bonding portion 51b. 55 is a heater built in the main body 51. This thermocompression bonding tool 50 is held under the bracket 14A in FIG. The other configuration shown in FIG. 8 is the same as that of FIG. 1, and the description thereof will be omitted by retaining the same reference numerals.

Next, the operation will be described. By driving the table device 1, the substrate 32 on the sub-table 6 is positioned below the thermocompression bonding tool 50. Next, cylinder 16A
Is projected, and the thermocompression bonding tool 50 is lowered.

Then, as shown in FIG. 10, first, the first thermocompression bonding element 53 lands on the lead 44 attached to the film carrier 41, and the lead 44 is bonded to the electrode 33 of the substrate 32. At this time, the thermocompression bonding portion 51b is floating in the air, and has not landed on the film carrier 41. Next, when the rod 17A further projects and the thermocompression bonding tool 50 descends, the spring material 54 is compressed, and the thermocompression bonding portion 51b of the second thermocompression bonding element 51a lands on the film carrier 41 as shown in FIG. The part 45 is anchor-bonded to the solder part 46. Next, the rod 17A of the cylinder 16A
Is pulled in, the thermocompression bonding tool 50 is raised, and the bonding is completed. As described above, in the second embodiment, since the first thermocompression bonding element 53 and the second thermocompression bonding element 51a are integrated, the bonding of the lead 44 and the anchor bonding can be substantially performed by one vertical movement. Can be done simultaneously. In addition, the first thermocompression element 53 and the second thermocompression element 51
By integrating a, only one head unit is required, and the apparatus can be reduced in size and size.

FIG. 12 is a perspective view of a thermocompression bonding tool provided in a thermocompression bonding apparatus for electronic components according to a third embodiment of the present invention.
3 and FIG. 14 are cross-sectional views of main parts during bonding of the thermocompression bonding apparatus for the electronic component. In FIG. 12, a thermocompression bonding tool 60 is provided with a first thermocompression bonding element 62 protruding from a lower portion on the rear side of a box-shaped main body 61 and a second thermocompression bonding element 63 on a lower front side thereof.
Are formed to protrude. A large distance D is secured between the first thermocompression bonding element 62 and the second thermocompression bonding element 63. Other configurations are the same as those of the second embodiment.

Next, the operation will be described. By driving the table device 1, the substrate 32 on the sub-table 6 is positioned below the thermocompression bonding tool 60. Next, cylinder 16A
, And the thermocompression bonding tool 60 is lowered.

Then, as shown in FIG. 13, first, the first thermocompression bonding element 62 lands on the lead 44, and the lead 44 is bonded to the electrode 33 of the substrate 32. As shown
The lower surface of the first thermocompressor 62 protrudes below the lower surface of the second thermocompressor 63. Therefore, even if the first thermocompressor 62 lands on the lead 44, the second thermocompressor is 63 floats in the air and does not land on the film carrier 41.

Next, when the rod 17A of the cylinder 16A is retracted, the thermocompression bonding tool 60 is raised, and the first thermocompression bonding element 62 is separated from the lead 44 (see the thermocompression bonding tool 60 shown by a chain line in FIG. 13). So Y table 3
, The liquid crystal panel 31 and the substrate 32 are slightly moved in the arrow Y1 direction, and the second thermocompression bonding element 63 is positioned above the plating part 45. Next, cylinder 16A again
By projecting the rod 17A, the thermocompression bonding tool 60 is lowered, and as shown in FIG.
In step 3, anchor bonding is performed. At this time, the first thermocompression bonding element 62 has retreated backward, and the leads 44 and the substrate 3
2 does not land. That is, the distance D is set to prevent the first thermocompression contactor 62 from contacting the lead 44 or the substrate 32 and causing an obstacle in the anchor bonding when the second thermocompression bonding device 63 performs the anchor bonding. I'm running away. When the anchor bonding is completed as described above, the rod 17A of the cylinder 16A is retracted, and the thermocompression bonding tool 60 rises and returns to the original position.
Also in the third embodiment, by integrating the first thermocompression bonding element 62 and the second thermocompression bonding element 63, only one head is required, and the apparatus can be reduced in size and size.

[0026]

As described above, according to the present invention, there is provided a liquid crystal panel in which one lead of an electronic component comprising a chip mounted on a film carrier is bonded along an edge and extends outward from the edge. A table device on which a substrate to which the other lead of the electronic component is to be bonded is placed; and a first device which is above the table device and which is bonded by thermocompression bonding to the electrode formed on the upper surface of the substrate. A second thermocompressor for performing thermocompression bonding of a plated portion formed on the lower surface of the film carrier and a solder portion formed on the upper surface of the substrate and anchor-bonding the first and second thermocompressors; And a moving means for moving the thermocompressor relative to the substrate in the horizontal direction to form an electronic component thermocompression device. The anchor bonding of key portions can be performed with good workability as a series of operations. In addition, since this bonding and anchor bonding can be performed by one thermocompression bonding apparatus, equipment costs can be reduced and the installation area of the apparatus can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a thermocompression bonding apparatus for electronic components according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a liquid crystal panel and a substrate according to the first embodiment of the present invention.

FIG. 3 is a partially enlarged perspective view of a liquid crystal panel and a substrate according to the first embodiment of the present invention.

FIG. 4 is a sectional view of a main part during bonding of the thermocompression bonding apparatus for electronic components according to the first embodiment of the present invention.

FIG. 5 is a sectional view of a main part during bonding of the thermocompression bonding apparatus for electronic components according to the first embodiment of the present invention.

FIG. 6 is an enlarged sectional view of a main part during bonding of the thermocompression bonding apparatus for electronic components according to the first embodiment of the present invention.

FIG. 7 is an enlarged sectional view of a main part during bonding of the thermocompression bonding apparatus for electronic components according to the first embodiment of the present invention.

FIG. 8 is a perspective view of a thermocompression bonding apparatus for electronic components according to a second embodiment of the present invention.

FIG. 9 is a perspective view of a thermocompression bonding tool provided in an electronic component thermocompression bonding apparatus according to a second embodiment of the present invention.

FIG. 10 is a sectional view of a main part during bonding of a thermocompression bonding apparatus for electronic components according to a second embodiment of the present invention.

FIG. 11 is a sectional view of a main part during bonding of a thermocompression bonding apparatus for electronic components according to a second embodiment of the present invention.

FIG. 12 is a perspective view of a thermocompression bonding tool provided in an electronic component thermocompression bonding apparatus according to a third embodiment of the present invention.

FIG. 13 is a sectional view of a main part during bonding of a thermocompression bonding apparatus for electronic components according to a third embodiment of the present invention.

FIG. 14 is a sectional view of a main part during bonding of a thermocompression bonding apparatus for electronic components according to a third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Table apparatus (moving means) 15, 53, 62 First thermocompression bonder 18, 51a, 63 Second thermocompression bonder 31 Liquid crystal panel 32 Substrate 33 Electrode 40 Electronic component 41 Film carrier 42 Chip 44 Lead 45 Plating section 46 Solder part

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 3/32-3/34

Claims (1)

(57) [Claims] 1. A liquid crystal panel in which one lead of an electronic component comprising a chip mounted on a film carrier is bonded along an edge and the other lead of the electronic component extending outward from the edge is formed by a liquid crystal panel. A table device on which a substrate to be bonded is placed, a first thermocompressor for bonding the other lead by thermocompression bonding to an electrode formed on the upper surface of the substrate above the table device, and the film A second thermocompressor for thermocompression-bonding a plated portion formed on the lower surface of the carrier to a solder portion formed on the upper surface of the substrate for anchor bonding; a first thermocompressor and a second thermocompressor; Moving means for relatively moving the substrate in the horizontal direction with respect to the substrate.