JPH09193342A - Apparatus for screen printing of cream solder and bond and method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently apply a cream solder for soldering electronic parts and a bond for temporarily fix the electronic parts on a substrate. SOLUTION: A screen mask 1 is divided into the first area A for applying a cream solder 8 and the second area B for applying a bond 9 and the first squeegee 7A and the second squeegee 7B are respectively provided. In addition, a movable table 15 for the substrate 14 is provided below the screen mask 1 to move the substrate 14 below the first area A and the second area B. The substrate 14 is positioned below the first area A and the first squeegee 7A is slid to apply a cream solder 8 on the substrate 14. Then, the substrate 14 is moved below the second area B and the second squeegee 7B is slid to apply a bond 9 thereon.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder and bond screen printing apparatus and a screen printing method for applying cream solder and bond for mounting electronic parts to a substrate.

[0002]

2. Description of the Related Art As a method of mounting electronic parts on a board,
Apply the cream solder to the electrode of the board with the screen printing device, then land the electrode of the electronic component on the cream solder with the chip mounter and mount it, then send the board to the heating furnace and heat it to apply the cream solder. A method of soldering an electronic component to a substrate by melting and solidifying is widely practiced.

Further, in order to prevent the electronic components on the substrate from being displaced, after the electronic components are mounted on the substrate by the chip mounter as described above and before the soldering by the heating furnace is completed. It has been practiced to apply a temporary bonding bond to a substrate with a dispenser and bond the electronic component to the substrate with this bond.

[0004]

Conventionally, the above-mentioned bond has been applied one by one at predetermined coordinate positions on the substrate while the dispenser is horizontally moved in the X and Y directions with respect to the substrate. Therefore, it takes a long time to apply the bond to all the points of the substrate, and there is a problem that work efficiency is not improved.

In view of the above, the present invention provides a screen printing apparatus and a screen printing device for cream solder and bond, which can efficiently apply cream solder for soldering electronic components and a bond for temporarily fixing electronic components to a substrate. The purpose is to provide a method.

[0006]

To this end, the present invention divides a screen mask disposed above a substrate into at least a first area and a second area, and cream solder is applied to the substrate in the first area. A pattern hole for applying a bond is formed on the second area, and a pattern hole for applying a bond is formed on the second area.
Provided with a moving means for selectively moving below the area, and provided with a first squeegee sliding on the first area and a second squeegee sliding on the second area. Is.

Further, according to the present invention, the substrate is positioned below the first area of the screen mask, and a first squeegee is slid on the first area to open a hole in the first area. Applying cream solder to the electrodes of the substrate through the pattern holes, and then moving the substrate below the second area of the screen mask by moving means, where a second squeegee is placed over the second area. A screen printing method of the cream solder and the bond was constituted by the step of applying the bond to the substrate through the pattern hole opened in the second area by sliding.

[0008]

According to the present invention, after applying cream solder on the electrodes of the substrate in the first area of the screen mask, the substrate is moved below the second area, where the second area is Thus, the bond can be applied to all points at once, so that the tact time required for applying the bond can be shortened and the mounting efficiency of electronic parts can be improved.

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a screen printing device for cream solder and a bond according to an embodiment of the present invention, FIG. 2 is a plan view of the screen mask, FIG. 3 is a side view of the same during application of the bond, and FIG. FIG. 5 is a partially enlarged cross-sectional view of the screen mask, FIG. 5 is a cross-sectional view of the board coated with the cream solder, and FIG. 6 is a cross-sectional view of the board on which the electronic component is mounted.

In FIG. 1, reference numeral 1 is a screen mask, and frames 2 are provided on both sides thereof. A guide rail 3 is provided on the frame 2. A first slide table 5A and a second slide table 5B are slidably mounted on the guide rail 3 via a slider 4. A first drive unit 6A is installed on the first slide table 5A, and a second drive unit 6B is installed on the second slide table 5B. The first slide table 5A and the second slide table 5B slide on the guide rails 3 by being driven by a driving unit (not shown).

In FIG. 3, a pair of left and right first squeegees 7A are coupled to the first drive portion 6A. Also the second
A pair of left and right second squeegees 7B are coupled to the drive unit 6B. The first drive unit 6A selectively moves the pair of left and right first squeegees 7A up and down. The second drive unit 6B also selectively moves the pair of left and right second squeegees 7B up and down. The cream solder 8 is put on the screen mask 1 between the first squeegees 7A. A bond 9 is put on the screen mask 1 between the second squeegees 7B.

In FIG. 2, the screen mask 1 is divided into a first area A and a second area B on the left and right, as shown by a chain line. In the first area A, pattern holes 11 for applying the cream solder 8 on the electrodes of the circuit pattern of the substrate are opened. Further, in the second area B, pattern holes 12 for applying the bond 9 to the substrate are opened. In FIG. 3, the left half of the screen mask 1 is the first area A, and the right half B is the second area B.

In FIG. 4, the thickness Db of the second area B
Is considerably thicker than the thickness Da of the first area A, and a step d is formed on the upper surfaces of the first area A and the second area B.
There is. Further, spacers 13 are provided at appropriate places in the second area B. The spacer 13 is grounded to the substrate 14 and secures a space S for escaping the cream solder 8 applied on the upper surface of the substrate 14. In addition, this spacer 13
Defines the height of the upper surface of the screen mask 1 in the second area B so that the thickness of the bond 9 applied to the substrate 14 does not vary.

In FIG. 3, the substrate 14 is placed on a movable table 15 as moving means. The movable table 15 is placed on a guide rail 16. The movable table 15 moves laterally on the guide rails 16 to selectively position the substrate 14 below the first area A or the second area B. The movable table 15 also includes a vertical movement mechanism that causes the substrate 14 to move up and down.

The screen printing apparatus for cream solder and bond is constructed as described above, and its operation will be described below. In FIG. 3, the substrate 14 is located below the first area A of the screen mask 1. So the first on the left
The squeegee 7A of No. 1 is landed on the screen mask 1, the first squeegee 7A on the right side is lifted from the screen mask 1, and in that state, the first slide table 5A is slid to the right. As a result, the cream solder 8 is applied onto the electrodes 17 of the substrate 14 through the pattern holes 11.
In FIG. 3, when the first squeegee 7A is slid to the left, the left first squeegee 7A is lifted from the screen mask 1 and the right first squeegee 7A is landed on the screen mask. FIG. 5 shows the substrate 14 in which the cream solder 8 is applied on the electrodes 17 of the circuit pattern as described above.

After the cream solder 8 is applied as described above, the movable table 15 is driven to move the substrate 14 to the position shown in FIG.
In, it is moved below the second area B. Then, the second squeegee 7B on the left side is landed on the screen mask 1, the second squeegee 7B on the right side is raised from the screen mask 1, and in that state, the second slide table 5B is slid rightward, The bond 9 is applied to the substrate 14 through the pattern hole 12. In FIG. 5, a bond 9 indicated by a chain line shows the bond thus applied. As shown in FIG. 5, the bond 9 is the cream solder 8
Is applied much thicker than In FIG. 3, the second
When sliding the squeegee 7B to the left,
The squeegee 7B is raised from the screen mask 1 and the second squeegee 7B on the right side is landed on the screen mask 1.

After the cream solder 8 and the bond 9 are applied to the substrate 14 as described above, the electronic component 20 is mounted on the cream solder 8 by the chip mounter as shown in FIG. Then, the electronic component 20 is adhered by the bond 9 and temporarily fixed onto the substrate 14. Next, this board 1
4 is sent to a heating furnace where it is reflowed to melt and solidify the cream solder 8 and bond 9
Is cured, and the soldering of the electronic component 20 is completed.

[0018]

According to the present invention, the cream solder and the bond can be applied to the substrate by the screen printing device. In particular, since it is possible to apply bonds at a large number of points on the substrate at one time, the tact time can be greatly shortened compared to the conventional method of applying bonds using a dispenser, and electronic components can be mounted efficiently. it can.

[Brief description of the drawings]

FIG. 1 is a perspective view of a cream solder and bond screen printing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a screen mask of a cream solder and bond screen printing apparatus according to an embodiment of the present invention.

FIG. 3 is a side view of the cream solder and bond screen printing apparatus according to an embodiment of the present invention during application of a bond.

FIG. 4 is a partially enlarged sectional view of a screen mask of a screen printing apparatus for cream solder and bond according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view of a cream solder-coated substrate of a cream solder and bond screen printing apparatus according to an embodiment of the present invention.

FIG. 6 is a cross-sectional view of a board on which electronic components of a screen printing apparatus for cream solder and bond according to an embodiment of the present invention are mounted.

[Explanation of symbols]

 1 Screen Mask 7A First Squeegee 7B Second Squeegee 8 Cream Solder 9 Bond 11, 12 Pattern Hole 13 Spacer 14 Substrate 15 Movable Table A First Area B Second Area

Continuation of front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location // H05K 3/12 7511-4E H05K 3/12 C

Claims (2)

[Claims] 1. A screen mask arranged above a substrate is divided into at least a first area and a second area, and a pattern hole for applying cream solder to the substrate is opened in the first area. , A pattern hole for applying a bond is formed in the second area, and a moving means for selectively moving the substrate below the first area and below the second area is provided. A screen printing device for cream solder and bond, comprising: a first squeegee that slides on a first area; and a second squeegee that slides on the second area. 2. A substrate is positioned below a first area of a screen mask, and a first squeegee is slid on the first area to pass through a pattern hole formed in the first area. Step of applying cream solder on the electrodes of the substrate, and then moving the substrate below the second area of the screen mask by the moving means, where the second squeegee slides on the second area. A step of applying a bond to the substrate through the pattern hole opened in the second area.