JP3303646B2 - Screen printing device and screen printing method for cream solder and bond - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a screen printing apparatus and a screen printing method for applying cream solder and a bond for mounting electronic components on a substrate.

[0002]

2. Description of the Related Art As a method for mounting an electronic component on a substrate,
The cream solder is applied on the electrodes of the substrate by a screen printing device, and then the electrodes of the electronic component are landed and mounted on the cream solder by a chip mounter, and then the substrate is sent to a heating furnace and heated to remove the cream solder. 2. Description of the Related Art A method of soldering an electronic component to a substrate by melting and solidifying the electronic component has been widely practiced.

Further, in order to prevent the electronic components on the substrate from being displaced from each other after the electronic components are mounted on the substrate by the chip mounter and before the soldering by the heating furnace is completed as described above, A temporary bonding bond is applied by a dispenser, and the electronic component is bonded to a substrate by the bond.

[0004]

Conventionally, the bond is applied one point at a time to a predetermined coordinate position on the substrate while moving the dispenser horizontally with respect to the substrate in the X direction or the Y direction. Therefore, it takes a long time to apply the bond to all points on the substrate, and there is a problem that the working efficiency is not improved.

Accordingly, the present invention provides a screen printing apparatus and screen printing apparatus for a cream solder and a bond capable of efficiently applying a cream solder for soldering an electronic component and a bond for temporarily fixing the electronic component to a substrate. The aim is to provide a method.

[0006]

According to the present invention, a screen mask disposed above a substrate is divided into at least a first area and a second area, and cream solder is applied to the first area. A pattern hole for applying a bond is formed in the second area, and a pattern hole for applying a bond is formed in the second area.
Moving means for selectively moving below the area, a first squeegee sliding on the first area, and a second squeegee sliding on the second area , and The thickness of the second area is the first area
The first area and the second area are thicker than
There is a step on the upper surface of the
A spacer that protrudes from the board is protruded from the board.
This secures a space for escaping solder .

Further, according to the present invention, a substrate is positioned below a first area of a screen mask, and a first squeegee is slid over the first area to form a hole in the first area. Applying cream solder onto the electrodes of the substrate through the pattern holes, and then moving the substrate below the second area of the screen mask by the moving means.
Applying a bond to the substrate through a pattern hole opened in the second area by sliding a second squeegee over the second area where the spacer is grounded to the substrate. A solder and bond screen printing method was configured.

[0008]

According to the present invention, after applying cream solder on the electrodes of the substrate in the first area of the screen mask, the substrate is moved below the second area, where the second area is placed. Accordingly, the bond can be applied to all the points at once, so that the tact time required for applying the bond can be reduced, and the mounting efficiency of the electronic component can be improved.

An embodiment of the present invention will be described below with reference to the drawings. 1 is a perspective view of a screen printing apparatus for cream solder and a bond according to an embodiment of the present invention, FIG. 2 is a plan view of the screen mask, FIG. 3 is a side view of the screen mask while the bond is being applied, and FIG. FIG. 5 is a cross-sectional view of a substrate to which the cream solder is applied, and FIG. 6 is a cross-sectional view of a substrate on which the electronic component is mounted.

In FIG. 1, reference numeral 1 denotes a screen mask, on both sides of which a frame 2 is provided. A guide rail 3 is provided on the frame 2. On the guide rail 3, a first slide table 5A and a second slide table 5B are slidably mounted via a slider 4. A first drive unit 6A is provided on the first slide table 5A, and a second drive unit 6B is provided on the second slide table 5B. The first slide table 5A and the second slide table 5B are driven by driving means (not shown) to slide on the guide rail 3.

In FIG. 3, a pair of left and right first squeegees 7A are connected to the first drive section 6A. Also the second
A pair of left and right second squeegees 7B are coupled to the driving unit 6B. The first driving unit 6A selectively moves the pair of left and right first squeegees 7A up and down. The second drive unit 6B also selectively moves the pair of left and right second squeegees 7B up and down. A cream solder 8 is put on the screen mask 1 between the first squeegees 7A. A bond 9 is put on the screen mask 1 between the second squeegees 7B.

In FIG. 2, the screen mask 1 is divided into a first area A and a second area B as shown by a chain line. In the first area A, a pattern hole 11 for applying the cream solder 8 on the electrode of the circuit pattern of the substrate is formed. In the second area B, a pattern hole 12 for applying the bond 9 to the substrate is formed. In FIG. 3, the left half of the screen mask 1 is a first area A, and the right half B is a second area B.

In FIG. 4, the thickness Db of the second area B
Is considerably thicker than the thickness Da of the first area A, and a step d is formed on the upper surfaces of the first area A and the second area B.
There is. Further, a spacer 13 is protruded at an appropriate position in the second area B. The spacer 13 is grounded to the substrate 14 to secure a space S for the cream solder 8 applied on the upper surface of the substrate 14 to escape. The spacer 13
Defines the height of the upper surface of the screen mask 1 in the second area B so that the thickness of the bond 9 applied to the substrate 14 does not vary.

In FIG. 3, a substrate 14 is placed on a movable table 15 as moving means. The movable table 15 is mounted on a guide rail 16. The movable table 15 moves on the guide rail 16 in the horizontal direction, and selectively positions the substrate 14 below the first area A and the second area B. Further, the movable table 15 is provided with a vertical movement mechanism for causing the substrate 14 to perform a vertical movement.

This cream solder and bond screen printing apparatus is configured as described above, and the operation will be described next. In FIG. 3, the substrate 14 is located below the first area A of the screen mask 1. So the first on the left
Squeegee 7A lands on the screen mask 1, the first squeegee 7A on the right is lifted from the screen mask 1, and in this state, the first slide table 5A is slid to the right. As a result, the cream solder 8 is applied onto the electrodes 17 of the substrate 14 through the pattern holes 11.
In FIG. 3, when the first squeegee 7A is slid to the left, the first squeegee 7A on the left is lifted from the screen mask 1 and the first squeegee 7A on the right is landed on the screen mask. FIG. 5 shows the substrate 14 on which the cream solder 8 is applied on the electrodes 17 of the circuit pattern as described above.

After the cream solder 8 is applied as described above, the movable table 15 is driven to move the substrate 14 to the position shown in FIG.
Is moved below the second area B. Then, the second squeegee 7B on the left is landed on the screen mask 1, the second squeegee 7B on the right is raised from the screen mask 1, and the second slide table 5B is slid rightward in that state. The bond 9 is applied to the substrate 14 through the pattern hole 12. In FIG. 5, a bond 9 indicated by a dashed line indicates the bond applied in this manner. As shown in FIG. 5, the bond 9 is a cream solder 8
Is applied much thicker than In FIG. 3, the second
When sliding the squeegee 7B to the left, the second squeegee 7B
The squeegee 7B is lifted from the screen mask 1 and the right second squeegee 7B lands on the screen mask 1.

After the cream solder 8 and the bond 9 are applied to the substrate 14 as described above, the electronic component 20 is mounted on the cream solder 8 by a chip mounter as shown in FIG. Then, the electronic component 20 is bonded by the bond 9 and temporarily fixed on the substrate 14. Next, this substrate 1
4 is sent to a heating furnace, where the solder paste is melted and solidified by reflow treatment, and the bond 9
Is cured, and the soldering of the electronic component 20 ends.

[0018]

According to the present invention, cream solder and a bond can be applied to a substrate by a screen printing apparatus. In particular, the bond can be applied to a large number of points on the board at once, so the takt time can be greatly reduced compared to the conventional method of applying a bond with a dispenser, and electronic components can be mounted efficiently. it can.

[Brief description of the drawings]

FIG. 1 is a perspective view of a cream solder and bond screen printing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a screen mask of a cream solder and bond screen printing apparatus according to an embodiment of the present invention.

FIG. 3 is a side view of a cream solder and bond screen printing apparatus during application of a bond according to an embodiment of the present invention;

FIG. 4 is a partially enlarged cross-sectional view of a screen mask of a cream solder and bond screen printing apparatus according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view of a substrate coated with cream solder in a screen printing apparatus for cream solder and bonds according to an embodiment of the present invention.

FIG. 6 is a cross-sectional view of a substrate on which electronic components of a cream solder and bond screen printing apparatus according to an embodiment of the present invention are mounted.

[Explanation of symbols]

 Reference Signs List 1 screen mask 7A first squeegee 7B second squeegee 8 cream solder 9 bond 11, 12 pattern hole 13 spacer 14 substrate 15 movable table A first area B second area

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B41F 15/00-15/44 H05K 3/12-3/34

Claims (2)

(57) [Claims] A screen mask disposed above a substrate is divided into at least a first area and a second area, and a pattern hole for applying cream solder to the substrate is formed in the first area. Moving means for opening a pattern hole for applying a bond in the second area and selectively moving the substrate below the first area and below the second area; A first squeegee sliding on a first area and a second squeegee sliding on the second area are provided , and the thickness of the second area is
The first area is thicker than the first area;
The upper surface of the second area has a step, and the second area has a step.
Spacers are provided in the area of
A screen printing apparatus for cream solder and bond, wherein a space for escape of cream solder on a substrate is secured . 2. A screen printing apparatus according to claim 1,
Screen printing method, wherein a substrate is positioned below a first area of a screen mask, and a first squeegee is slid over the first area to form a hole in the first area. Applying cream solder on the electrodes of the substrate through the pattern holes, and then moving the substrate below the second area of the screen mask by the moving means to ground the spacer to the substrate , where the second area Applying a bond to the substrate through a pattern hole formed in the second area by sliding a second squeegee on the upper surface of the second squeegee.