JP2839534B2 - Printing machine and printing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to a printing material having a predetermined pattern on a printed board,
For example, the present invention relates to a printing machine and a printing method for printing a solder paste.

(Prior Art) Generally, for example, a flat pack IC shown in FIG.
The main body a is formed in a substantially rectangular shape.
A number of leads b are protruded from each side. As shown in FIG. 12, a printed circuit board c on which the IC body a is mounted is formed with a predetermined pattern of conductive portions d corresponding to a number of leads b on the IC body a. The respective leads b on the IC body a are soldered to the conductive parts d. In this case, since the width dimension of each lead b... Of the IC body a and the interval (lead pitch) between each lead b, b are small (for example, about 0.65 mm), such a narrow-pitch electronic component is shown in FIG. As shown in FIG. 13, when soldering to the printed board c, as shown in FIG. 13, a conductive part d having a predetermined pattern corresponding to a large number of leads b. Are printed by a printing machine, and the leads b... Of the IC body a are soldered to the pattern of the conductive portions b... Of the solder paste printed on the printed board c by means such as heat melting.

14 and 15
As shown in the figure, a substantially flat metal mask e and a squeegee f movable along the plate surface of the metal mask e are provided. In this case, openings g are formed on the surface of the metal mask e in a shape corresponding to the printing pattern (the pattern shape of the conductive portions d on the printed board c). Then, at the time of printing, as shown in FIG. 15, a printed board c is set below the metal mask e, and a squeegee f and a solder paste h are set on the metal mask e. The solder paste h is a paste in which solder particles are bound by a flux (binder), and the size of the solder particles in the solder paste h is, for example, about 50 to 100 μm.

Further, after setting the printing press, the squeegee f is moved in one direction from one end side to the other end side of the metal mask e, as shown by arrows in FIGS. Along with the movement operation, the solder paste h on the metal mask e is pressed from behind and moved along the metal mask e. And solder paste h
During the movement, the solder paste h is passed from the upper surface side of the metal mask e onto the printed circuit board c through the openings g when passing over the openings g. The pattern shape of the conductive portions d... By the solder paste h as shown is printed. Further, after one printing operation is completed, the squeegee f is directed from the other end to the one end of the metal mask e in a state where the printed board c for which printing has been completed is replaced with the next new printed board c. One direction (No.
14 (in the direction opposite to the arrows in FIGS. 14 and 15) to perform the next printing operation.

By the way, in a flat pack IC or the like, an IC body a is formed in a substantially rectangular shape, and a large number of leads b are projected from four sides of the IC body a. In the pattern of the conductive parts b ... and the pattern of the openings g ... of the metal mask e, the parts A, A and the squeegee f which are arranged in parallel to the moving direction of the squeegee f (indicated by arrows in FIG. 16) Are formed at right angles to the direction of movement of. Therefore, in the portions B, B arranged at right angles to the moving direction of the squeegee f, the time during which the solder paste h passes over the openings g. In the middle, there is a problem in that it is difficult for the solder paste h to pass through the openings g in the portions B, B arranged at right angles to the moving direction of the squeegee f. Therefore, the conductive part d by the solder paste h on the printed board c
There is a possibility that printing unevenness may occur in the pattern of..., For example, a portion that is not printed locally may occur, and there is a problem that the printing accuracy is likely to decrease.

(Problem to be Solved by the Invention) In the conventional configuration, the opening g of the metal mask e
In the pattern B, there is a problem in that it is difficult for the solder paste h to pass through each of the openings g during the printing operation in the portions B, B arranged at right angles to the moving direction of the squeegee f. Conductive part d by solder paste h on e
There is a possibility that printing unevenness may occur in the pattern of..., For example, a portion that is not printed locally may occur, and there is a problem that the printing accuracy is likely to decrease.

The present invention has been made in view of the above circumstances, and it is possible to lengthen the passage time of the printing material passing over the opening of the mask at the time of printing, prevent printing unevenness of the printing material on the printed board, and improve printing accuracy. It is an object of the present invention to provide a printing machine and a printing method capable of improving the printing quality.

[Structure of the Invention] (Means for Solving the Problems) According to the invention of claim 1, a printed board is provided below one surface of a mask in which an opening having a shape corresponding to a print pattern is formed, and the other of the mask is provided. A squeegee for moving the printing material along the other surface of the mask is provided above the surface, and the printing material is moved along the mask along with the movement of the squeegee to move the other side of the mask. A printing machine that passes the printing material onto the printed board from the surface side through the opening and prints the printing material on the printed board, wherein the squeegee is at least a front surface in the moving direction of the squeegee and the opening is A printing machine characterized in that an inclined surface inclined at a predetermined angle with respect to the moving direction of the squeegee is formed in a region passing over the part.

The invention according to claim 2 provides a printing plate below one surface of a mask in which an opening having a shape corresponding to a printing pattern is formed, and a printing material on the other surface of the mask above the other surface of the mask. Along with each squeegee to be moved along the squeegee, the printing material is moved along the mask along with the movement of the squeegee so that the printing material is moved from the other surface side of the mask to the printed board via the opening. A printing machine that passes the printing material and prints the printing material on the printed board, wherein the squeegee has a bent portion in a region passing over the opening. is there.

According to a third aspect of the present invention, a printed board is disposed below one surface of a mask in which an opening having a shape corresponding to a printing pattern is formed, and a printing material is applied above the other surface of the mask. A squeegee for moving along the other surface is provided, and the printing material is moved along the mask along with the movement of the squeegee, so that the printing material is moved from the other surface side of the mask to the printed board via the opening. In the printing method, the printing material is passed through the printing plate, and the printing material is printed on the printed board. A printing method characterized by printing a material.

According to a fourth aspect of the present invention, a printed board is disposed below one surface of a mask in which an opening having a shape corresponding to a print pattern is formed, and a printing material is applied to the mask over the other surface of the mask. A squeegee for moving along the other surface is provided, and the printing material is moved along the mask along with the movement of the squeegee, so that the printing material is moved from the other surface side of the mask to the printed board via the opening. The printing material is passed through the printing plate and the printing material is printed on the printed board, wherein a region passing over the opening of the squeegee is inclined at a predetermined angle with respect to a moving direction thereof, and the first moving is performed. A printing method for printing the printing material by moving the printing material in a direction and a second direction of movement that intersects the first direction of movement.

According to a fifth aspect of the present invention, a printed board is disposed below one surface of a mask in which an opening having a shape corresponding to a printing pattern is formed, and a printing material is applied to the mask over the other surface of the mask. A plurality of squeegees to be moved along the other surface are arranged in parallel, and the printing material is moved along the mask along with the movement of the squeegee, and the printing material is moved from the other surface side of the mask through the opening. In the printing method of passing the printing material on the printed board and printing the printing material on the printed board, the printing material is printed using two squeegees selected from the plurality of squeegees. This is a printing method characterized by the following.

In the invention according to claim 6, a printed board is disposed below one surface of the mask in which an opening having a shape corresponding to a printing pattern is formed, and a printing material is applied to the mask above the other surface of the mask. A plurality of squeegees to be moved along the other surface are arranged in parallel, and the printing material is moved along the mask along with the movement of the squeegee, and the printing material is moved from the other surface side of the mask through the opening. In the printing method of passing the printing material on the printed board and printing the printing material on the printed board, two squeegees selected from the plurality of squeegees are used, and these squeegees are moved in the moving direction. The printing method is characterized in that the printing material is printed while being inclined at a predetermined angle and moved.

According to a seventh aspect of the present invention, a printed board is disposed below one surface of a mask in which an opening having a shape corresponding to a printing pattern is formed, and a printing material is applied to the mask over the other surface of the mask. A plurality of squeegees to be moved along the other surface are arranged in parallel, and the printing material is moved along the mask along with the movement of the squeegee, and the printing material is moved from the other surface side of the mask through the opening. In the printing method of passing the printing material on the printed board and printing the printing material on the printed board, two squeegees selected from the plurality of squeegees are used, and The printing method is characterized in that the printing material is printed while being moved in a movement direction and a second movement direction intersecting the first movement direction.

(Function) After printing the printing material, the squeegee is moved in the first movement direction to push out the printing material on the mask, and then the squeegee is moved in the second movement direction intersecting the first movement direction. By extruding the printing material on the mask, the amount of the printing material passing from the upper surface of the mask to the printed board through each opening is prevented from being uneven between the openings.

(Embodiment) Hereinafter, a first embodiment of the present invention will be described with reference to FIG. 1 and FIG. FIG. 1 corresponds to a large number of leads b on the IC body a side by a solder paste (printing material) h on a printed board c on which an IC body a such as a flat pack IC shown in FIG. 11 is mounted, for example. 1 shows a schematic configuration of a main part of a printing machine for printing conductive portions d in a predetermined pattern as shown in FIG.
Denotes a print head unit. In this case, the metal mask 1 is formed of a substantially flat metal plate such as a stainless steel plate mounted on the mask frame 3. On the surface of the metal mask 1, openings 4 having a printed pattern shape corresponding to the pattern shape of the conductive portions d on the printed board c are formed as shown in FIG. Further, the mask frame 3 of the metal mask 1 is supported so as to be adjustable in height by a height adjustment mechanism (not shown).

Further, the print head unit 2 is provided with a squeegee 5, a squeegee support member 6, and a squeegee moving mechanism (squeegee position moving mechanism) 7 for pushing out the solder paste h on the metal mask 1. In this case, the squeegee 5 is formed at the lower end with a tapered sword tip 8 that contacts the plate surface of the metal mask 1. Further, the upper end of the squeegee 5 is connected to a drive cylinder 9 so that the drive cylinder 9 drives the squeegee 5 up and down. The drive cylinder 9 is attached to the lower surface of the squeegee support member 6.

Further, the squeegee moving operation mechanism 7 is provided with an X direction moving mechanism 10 and a Y direction moving mechanism 11 for moving the squeegee support member 6 in the left and right directions and the front and rear directions in FIG. 1, respectively. With the squeegee support member 6
A rotation operation mechanism 13 for rotating the squeegee about a rotation shaft 12 and an elevation drive mechanism (not shown) for vertically driving the squeegee support member 6 are provided.

Further, a printed board c is disposed below the metal mask 1. The printed board c is placed on the board table 14. The substrate table 14 is supported by a table driving mechanism (not shown) so as to be movable in a rotation operation direction about rotation axes in the X, Y, and vertical directions.

 Next, the operation of the above configuration will be described.

First, at the time of printing, as shown in FIG.
Printed board c below the squeegee 5 on the metal mask 1
Are arranged respectively. Then, the squeegee 5 is moved from left to right as shown by the solid arrow in FIG. 2 to perform the first printing. At the time of this first printing, the squeegee support member 6 is moved to the left end position in FIG.
And the solder paste h is set on the metal mask 1.

Further, after setting the printing press, the squeegee 5 is moved from the left end to the right end of the metal mask 1 as shown by a solid arrow in FIG. With the movement of the squeegee 5, the solder paste h on the metal mask 1 is pressed from behind to move along the metal mask 1, and during the movement of the solder paste h, the solder paste h passes over the openings 4. Then, the solder paste h is passed from the upper surface side of the metal mask 1 to the printed board c through the openings 4.
The second printing operation is performed.

After completion of the first printing, the squeegee 5 is moved perpendicularly (intersecting) with the moving direction of the squeegee 5 at the time of the first printing operation as indicated by a virtual arrow in FIG. To perform the second printing. This 2
At the time of the second printing, the squeegee support member 6 is rotated by 90 ° about the rotation shaft 12 by the rotation operation mechanism 13 of the squeegee movement operation mechanism 7 as indicated by a virtual line in FIG. The squeegee support member 6 is moved to the upper end position in FIG. 2 by the X direction moving mechanism 10 and the Y direction moving mechanism 11 of the mechanism 7. Then, in this state, the lower end of the squeegee 5 is brought into contact with the metal mask 1, and the squeegee 5 is brought into contact with the metal mask 1 as shown by a virtual arrow in FIG.
From the upper end to the lower end. And
With the movement of the squeegee 5, the solder paste h on the metal mask 1 is pressed from the rear and the metal mask 1 is pressed.
During the movement of the solder paste h, when passing over the openings 4, the solder paste h is placed on the printed board c from the upper surface side of the metal mask 1 through the openings 4.
And the second printing operation is performed.

Therefore, in the above configuration, after the first printing operation of moving the squeegee 5 in one direction, the squeegee 5 is moved in a direction orthogonal to the moving direction of the squeegee 5 during the first printing operation.
Is moved to perform the second printing,
The portions B, B arranged at right angles to the moving direction of the squeegee 5 during the first printing operation can be arranged parallel to the moving direction of the squeegee 5 during the second printing operation. Therefore, even if the printing failure of the solder paste h occurs in the portions B, B arranged at right angles to the moving direction of the squeegee 5 during the first printing operation, this portion B, B
Since the solder paste h can be reliably printed on B by the second printing operation, one of the portions arranged at right angles in the pattern of the opening 4 of the metal mask 1 (at the time of the first printing operation) The parts B, B arranged at right angles to the direction of movement of the squeegee 5 are more soldered than the other side (parts A, A arranged parallel to the direction of movement of the squeegee 5 during the first printing operation). It is possible to reliably prevent the paste h from being difficult to be printed, and the printed board c
Printing unevenness of the pattern of the conductive portion d due to the upper solder paste h can be prevented, and the printing accuracy can be improved.

FIG. 3 to FIG. 7 show a second embodiment of the present invention. This is provided with three squeegees 22a, 22b, 22c for extruding the solder paste h on the metal mask 1 in the print head unit 21 of the printing machine. In this case, the print head unit 12 has three squeegees 22a, 22b, 22c.
In addition, a squeegee support member 23 and a squeegee moving operation mechanism 24 are provided. In this case, tapered sword tips 25a, 25b, and 25c are formed at the lower ends of the squeegees 22a, 22b, and 22c, respectively, in contact with the plate surface of the metal mask 1. Further, the upper end of each squeegee 22a, 22b, 22c is connected to the drive cylinder 26a, 26b, 26c, respectively.
Each squeegee 2 is driven by these drive cylinders 26a, 26b, 26c.
2a, 22b, and 22c are independently driven to move up and down. Further, these drive cylinders 26a, 26b, 26c are mounted on the lower surface of the squeegee support member 23.

Further, the squeegee moving operation mechanism 24 is provided with an X direction moving mechanism 27 and a Y direction moving mechanism 28 for moving the squeegee support member 23 in the left and right directions and the front and rear directions in FIG. 3, respectively. With the squeegee support member 24
A rotating operation mechanism 30 for rotating the rotating shaft 29 about a rotating shaft 29 and an elevating drive mechanism (not shown) for driving the squeegee support member 23 up and down are provided.

 Next, the operation of the above configuration will be described.

First, at the time of printing, as shown in FIG.
Below the printed board c and the squeegee 22 on the metal mask 1.
a, 22b, and 22c are respectively arranged. And squeegee 22
First printing is performed in which a, 22b, and 22c are moved from left to right as shown by solid arrows in FIGS. At the time of the first printing operation, the squeegee support member 16 is moved to the left end position in FIGS. 2 and 3 by the squeegee moving operation mechanism 24. Further, in this state, the squeegees 22a, 22b, 22c
Along the moving direction of each of the squeegees 22a, 22b, 22c (the direction of the solid arrows in FIGS. 4 and 5),
The solder paste h is set on the metal mask 1.

Next, in this state, as shown in FIG. 5 and FIG.
Squeegee 2 at the right end of the squeegees 22a, 22b, 22c
Lift 2a so that it does not touch metal mask 1, and
The squeegees 22b and 22c (at the center position and the left end position) are brought into contact with the metal mask 1.

Further, after setting the printing press, the squeegees 22a, 22b, and 22c are moved from the left end to the right end of the metal mask 1 as shown by solid arrows in FIGS.
With the movement of the squeegees 22b and 22c at the center position and the left end position, the solder paste h on the metal mask 1 is pressed from the rear as shown in FIG.
Move along. In this case, the solder paste h pressed by the squeegee 22b at the center first passes through the openings 4... Of the metal mask 1, and then the solder paste h pressed by the squeegee 22c at the left end. During the movement of the solder paste h, which is first pressed by the squeegee 22b at the center position, when the solder paste h passes over the openings 4... From the upper surface side of the metal mask 1 through the openings 4. Pass the solder paste h,
Subsequently, when the solder paste h pressed by the squeegee 22c at the left end portion passes over each of the openings 4, the solder paste h is again put on the printed board c from the upper surface side of the metal mask 1 through each of the openings 4. Can be passed through. Therefore, the amount of solder paste h that can pass from the upper surface of the metal mask 1 through the openings 4 to the printed board c can be increased.

After the first printing, the squeegees 22a, 22b, 22
The second printing is performed by moving c in the direction (downward in FIG. 4) orthogonal (intersecting) to the moving direction of the squeegee 5 during the first printing operation as indicated by the imaginary arrow in FIG. Perform At the time of the second printing, the squeegee support member 23 is turned by 90 ° about the turning shaft 29 by the turning operation mechanism 30 of the squeegee moving operation mechanism 24 as shown by a virtual line in FIG. The squeegee support member is moved by the X-direction movement mechanism 27 and the Y-direction movement mechanism 28 of the movement operation mechanism 24.
23 is moved to the upper end position in FIG. In this state, the squeegee 22a at the lower end portion is lifted up so as not to touch the metal mask 1, and the squeegees 22b and 22c
Is brought into contact with the metal mask 1 and the squeegees 22a, 22b, 22c are moved from the upper end side to the lower end side of the metal mask 1 as shown by phantom arrows in FIG. Then, with the movement of the squeegees 22a, 22b, 22c, the solder paste h on the metal mask 1 is pressed from the rear to move along the metal mask 1, and during the movement of the solder paste h, each of the openings 4. Metal mask 1 when passing over
The second printing operation is performed by passing the solder paste h onto the printed board c from the upper surface side of the printed board c through the openings 4.

Therefore, even in the above-described configuration, after the first printing operation in which the squeegees 22a, 22b, and 22c are moved in one direction, similarly to the first embodiment, the squeegees 22a, 22b, and 22 in the first printing operation are completed.
Squeegee 2 in the direction orthogonal (intersecting) to the direction of movement of 22c
Since the second printing is performed by moving 2a, 22b and 22c, the same effect as in the first embodiment can be obtained.

Note that when printing is performed by moving the squeegees 22a, 22b, and 22c from right to left as indicated by the arrow in FIG. 7 (or when printing is performed by moving the squeegees from bottom to top in FIG. 4). The squeegee support member 23 is moved to the right end (lower end) position by the operating mechanism 24, and in this state, the squeegees 22a, 22
b, 22c are arranged along the moving direction of each squeegee 22a, 22b, 22c, and the squeegee 22c at the left end (upper end) position.
Is lifted up so as not to touch the metal mask 1, two predetermined squeegees 22b, 22a are selected, and the squeegees 22b, 22a at the center position and the right end position are set in contact with the metal mask 1, By moving the squeegees 22a, 22b, 22c from right to left (from bottom to top) in this state, the pattern of the conductive portions d... By the solder paste h can be similarly printed on the printed board c.

FIGS. 8 and 9 show a third embodiment. This is accomplished by providing a pair of L-shaped squeegees 31a and 31b bent (having bent portions) in a substantially L-shape as shown in FIG. 8, and applying the solder paste h on the metal mask 11 when printing the solder paste h. L-shaped squeegee 31a to be pushed out,
Inclined surfaces 32a, 32 inclined on the pressing surface of 31b in a direction deviating from the direction perpendicular to the moving direction of the L-shaped squeegees 31a, 31b.
b is provided respectively. In this case, the convex portions of the L-shaped squeegees 31a and 31b are arranged in a rightward state in FIG.

During the first printing operation, the L-shaped squeegees 31a, 31
8 is moved from left to right as shown by solid arrows in FIGS. 8 and 9, and after this first printing, the L-shaped squeegees 31a and 31b are shown by virtual arrows in FIG. As described above, the second printing is performed by moving the L-shaped squeegees 31a and 31b in the direction (intersecting) perpendicular to (downward in FIG. 8) in the first printing operation. Therefore, also in this case, the same effects as those of the above embodiments can be obtained. It goes without saying that, after the first printing, the squeegees 31a and 31b may be moved in a direction opposite to the first moving direction.

As is clear from FIG. 8, in this case, the L-shaped squeegees 31a, 31b have a pressing surface in which the L-shaped squeegees 31a, 31b, 31b
The inclined surfaces 32a and 32b which are inclined (inclined at a predetermined angle) in directions deviating from the orthogonal direction to the moving direction of the solder paste h on the metal mask 1 are formed by the inclined surfaces 32a and 32b. By performing the extruding operation, the solder paste h passing over each opening 4 of the metal mask 1.
Can be made longer. Therefore, the amount of the solder paste h that passes from the upper surface side of the metal mask 1 to the printed board c through the openings 4... Can be increased as compared with the conventional case, and the solder paste h on the printed board c can be used. Printing unevenness of the pattern of the conductive portions d can be more reliably prevented, and the printing accuracy can be improved. It is needless to say that the squeegees 22a, 22b, 22c of the second embodiment may be formed in the same shape as the L-shaped squeegees 31a, 31b.

The present invention is not limited to the above embodiment. For example, as in a fourth embodiment shown in FIG. 10, a substantially continuous wave squeegee 41 in which a plurality of L-shaped squeegees 31a and 31b of the third embodiment are connected in the lateral direction (having a plurality of bent portions) May be provided. In this case, since the convex portions 42 and the concave portions 43 can be alternately arranged on the pressing surface of the squeegee 41, the solder paste h is pushed outward by the inclined surface of the squeegee 41 when the squeegee 41 moves, or the squeegee
It can be prevented from being collected in the center direction of 41,
The solder paste h can be pushed out substantially uniformly over the entire pressing surface of the squeegee 41. Further, it goes without saying that the squeegees 22a, 22b and 22c of the second embodiment may be formed in the same shape as the squeegee 41.

In the above embodiments, after the first printing, the squeegee support members 6, 23 are rotated by 90 ° about the rotation shafts 12, 29 by the rotation operation mechanisms 13, 30 of the squeegee movement operation mechanisms 7, 24. Although the configuration in which the operation is performed is shown, a configuration in which the substrate table 14 supporting the printed board c and the metal mask 1 are rotated by 90 ° may be employed. Further, the squeegee driving mechanism in the X direction and the squeegee driving mechanism in the Y direction may be provided independently.

In addition, printing materials other than solder paste,
For example, other materials such as an adhesive for fixing the chip component can be used.

Further, it goes without saying that various modifications can be made without departing from the spirit of the present invention.

[Effects of the Invention] According to the present invention, printing unevenness can be prevented and printing accuracy can be improved.

[Brief description of the drawings]

1 and 2 show a first embodiment of the present invention. FIG. 1 is a side view showing a schematic configuration of a main part of a printing press.
FIG. 2 is a plan view showing a metal mask and a squeegee. FIGS. 3 to 7 show a second embodiment of the present invention. FIG. 3 is a side view showing a schematic configuration of a main part of the printing press. FIG. 4 is a plan view showing a metal mask and a squeegee, and FIG.
FIG. 6 is a cross-sectional view taken along line VV of FIG. 4, FIG. 6 is a vertical cross-sectional view of a main part for explaining a printing operation in one direction, and FIG. 7 is a main part for explaining a printing operation in the opposite direction. 8 and 9 show a third embodiment. FIG. 8 is a plan view showing a metal mask and a squeegee, and FIG. 9 is a sectional view taken along line IX-IX in FIG. FIG. 10 is a perspective view showing a squeegee of the fourth embodiment, FIG. 11 is a perspective view showing a flat pack IC,
FIG. 12 is a longitudinal sectional view showing a state where the flat pack IC is soldered to a printed board, FIG. 13 is a perspective view showing a conductive portion of the printed board, FIGS. 14 and 15 show a conventional example, 14 is a plan view showing a metal mask and a squeegee, FIG. 15 is a sectional view taken along the line XV-XV of FIG. 14, and FIG. 16 is a plan view showing a conductive portion pattern of a printed board. c ... printed board, d ... conductive part, h ... solder paste (printing material), 1 ... metal mask, 4 ... opening,
5, 22a, 22b, 22c: squeegee, 7, 24: squeegee moving operation mechanism (squeegee position moving operation mechanism), 31a, 31b ... L
Shape squeegee, 41 …… Continuous waveform squeegee.

Claims (7)

(57) [Claims] 1. A printed board is provided below one surface of a mask having an opening having a shape corresponding to a print pattern, and a printing material is applied along the other surface of the mask above the other surface of the mask. A squeegee to be moved is provided, and the printing material is moved along the mask along with the movement of the squeegee, and the printing is performed on the printed board from the other surface side of the mask through the opening. In a printing machine that passes a material and prints the printing material on the printed board, the squeegee has a predetermined angle with respect to a moving direction of the squeegee at least in a region passing in front of the squeegee moving direction and over the opening. A printing press, characterized in that an inclined surface is formed. 2. A printed board is provided below one surface of a mask having an opening having a shape corresponding to a printing pattern, and a printing material is applied along the other surface of the mask above the other surface of the mask. A squeegee to be moved is provided, and the printing material is moved along the mask along with the movement of the squeegee, and the printing is performed on the printed board from the other surface side of the mask through the opening. A printing machine for passing a material and printing the printing material on the printed board, wherein the squeegee has a bent portion in a region passing over the opening. 3. A printing board is provided below one surface of a mask having an opening having a shape corresponding to a printing pattern, and a printing material is applied above the other surface of the mask. A squeegee for moving along the surface is provided, and the printing material is moved along the mask along with the movement of the squeegee to move the printing material from the other surface side of the mask onto the printed circuit board via the opening. In a printing method of passing a printing material and printing the printing material on the printed board, a region passing over the opening of the squeegee is inclined at a predetermined angle with respect to the moving direction to move the printing material. A printing method characterized by printing. 4. A printed board is provided below one surface of a mask having an opening having a shape corresponding to a printing pattern, and a printing material is applied above the other surface of the mask. A squeegee for moving along the surface is provided, and the printing material is moved along the mask along with the movement of the squeegee to move the printing material from the other surface side of the mask onto the printed circuit board via the opening. In a printing method for passing a printing material and printing the printing material on the printed board, a region passing over the opening of the squeegee is inclined at a predetermined angle with respect to the moving direction, and the first moving direction and A printing method for printing the printing material by moving the printing material in a second movement direction intersecting the first movement direction. 5. A printed board is provided below one surface of a mask in which an opening having a shape corresponding to a printing pattern is formed, and a printing material is applied above the other surface of the mask. A plurality of squeegees to be moved along the surface are arranged in parallel, and the printing material is moved along the mask along with the movement of the squeegee, and the squeegee is moved from the other surface side of the mask through the opening. In a printing method of passing the printing material on a printed board and printing the printing material on the printed board, printing the printing material using two squeegees selected from the plurality of squeegees. Characteristic printing method. 6. A printed board is provided below one surface of a mask having an opening having a shape corresponding to a printing pattern, and a printing material is applied above the other surface of the mask. A plurality of squeegees to be moved along the surface are arranged in parallel, and the printing material is moved along the mask along with the movement of the squeegee, and the squeegee is moved from the other surface side of the mask through the opening. In a printing method of passing the printing material on a printed board and printing the printing material on the printed board, two squeegees selected from the plurality of squeegees are used, and these squeegees are moved in the moving direction. A printing method, wherein the printing material is printed while being inclined at a predetermined angle and moved. 7. A printed board is provided below one surface of a mask in which an opening having a shape corresponding to a print pattern is formed, and a printing material is applied above the other surface of the mask. A plurality of squeegees to be moved along the surface are arranged in parallel, and the printing material is moved along the mask along with the movement of the squeegee, and the squeegee is moved from the other surface side of the mask through the opening. In a printing method of passing the printing material on a printed board and printing the printing material on the printed board, two squeegees selected from the plurality of squeegees are used, and the squeegees are moved in a first movement direction. And printing the printing material by moving the printing material in a second movement direction that intersects the first movement direction.