KR20210130328A - Bonding device and manufacturing method of display device using same - Google Patents

Abstract

The present invention relates to a bonding device which comprises: a fixing member disposed on the upper part of a target panel, which includes a first part, a second part bent from an edge of a first part, and a third part extending from the second part and to which at least one of a driving module and a circuit board is coupled, to fix the target panel; a support member disposed on the lower part of the target panel and supporting the target panel while the driving module and the circuit board are coupled to the target panel; and a heat insulation member disposed on the third part and blocking heat generated while coupling the driving module and the circuit board from being transferred to the first part and the second part. The third part includes a first area adjacent to the second part and a second area in which the driving module and the circuit board are coupled and the heat insulation is disposed on the first area. Accordingly, reliability of a bonding process can be increased.

Description

BONDING DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE USING SAME}

The present invention relates to a bonding device and a method of manufacturing a display device using the same, and more particularly, to a bonding device with reduced defects and improved reliability, and a method for manufacturing a display device using the same.

Recently, a liquid crystal display (LCD) or an organic light emitting diode (OLED) has been used as a display device, such as a mobile phone, a navigation device, a digital camera, an electronic book, a portable game machine, or various terminals. Various applied electronic devices are being used.

Recently, as electronic devices having a curved surface have been developed, the necessity of securing durability and reliability while also having a curved surface of each component of a display device included in the electronic devices is increasing.

SUMMARY OF THE INVENTION An object of the present invention is to provide a bonding device and a method of manufacturing a display device capable of preventing defects in a display panel and improving process reliability.

Among the embodiments, the bonding device comprises: a target panel including a first portion, a second portion bent from an edge of the first portion, and a third portion extending from the second portion, to which a driving module and a circuit board are coupled; a fixing member disposed on the target panel to fix the target panel, a support disposed below the target panel, and supporting the target panel while the driving module and the circuit board are coupled to the target panel a member and a heat insulating member disposed on the third part and blocking heat generated during a coupling process between the driving module and the circuit board from being transferred to the first part and the second part; The portion includes a first area adjacent to the second portion and a second area in which the driving module and the circuit board are coupled, and the heat insulating member is disposed on the first area.

The target panel may include a display panel and a window disposed on the display panel, and the driving module and the circuit board may be disposed on the display panel.

The support member may include a metal.

The support member includes a first surface in contact with the first portion of the target panel, a second surface in contact with the second portion, and a third surface in contact with the third portion, and a plurality of surfaces on the third surface holes can be defined.

The plurality of holes may overlap the second area.

Each of the plurality of holes may be in a vacuum state, and a contact force between the third portion and the third surface may be strengthened.

A curvature of the second surface of the support member may be substantially the same as a curvature of the second portion of the target panel.

It may further include a pressing member for bonding the driving module and the circuit board by pressing on the third part.

The heat insulating member may be in the form of a film, and an adhesive member may be disposed between the heat insulating member and the third portion.

The heat insulating member may be attached to the support member, and the third portion of the target panel may be disposed between the heat insulating member and the support member.

The heat insulating member includes a first heat insulating member disposed on the support member and a second heat insulating member disposed on the first heat insulating member, and the target panel is disposed between the first heat insulating member and the second heat insulating member. can be placed.

The heat insulating member may be attached to the support member in the form of a magnet.

A width of the heat insulating member may be substantially the same as a width of the first region.

In example embodiments, a method of manufacturing a display device includes providing a display panel including a first portion, a second portion bent from an edge of the first portion, and a third portion extending from the second portion, the display a lamination step of coupling a panel to a window overlapping the first portion and the second portion of the display panel; and a bonding step of coupling a driving module and a circuit board to the display panel after the lamination step, wherein the bonding step includes: The method may include disposing a supporting member on which the display panel is mounted under the display panel, and disposing the driving module and the circuit board on a third portion of the display panel in contact with one surface of the supporting member. and compressing and coupling the driving module and the circuit board on a portion of the display panel supported by the support member.

The laminating may include fixing the window through a fixing member disposed above the window, disposing the display panel under the fixed window, disposing a pressure pad under the display panel; and compressing and bonding the display panel to the lower surface of the window by expanding the pressure pad.

The support member includes a first surface in contact with the first portion, a second surface in contact with the second portion, and a third surface in contact with the third portion, wherein one surface of the support member is the third surface can

The third portion of the display panel may include a first area adjacent to the second portion and a second area in which the driving module and the circuit board are disposed, and the bonding step may include forming the second area of the display panel on the second area. The method may further include arranging a heat insulating member for blocking heat generated during the compression process in the first region before the step of compressing and bonding the driving module and the circuit board.

The support member may include a plurality of holes overlapping the second region.

The heat insulating member may be provided in the form of a film and may be attached to the first region of the display panel through an adhesive member.

The method may further include removing the heat insulating member from the first area of the display panel after the bonding step.

In a method of manufacturing a display device, a process of thermally bonding a driving module and/or a circuit board on the display panel may be performed after the lamination process of bonding the window and the display panel. Accordingly, according to the present invention, it is possible to eliminate the possibility of defects in the driving module and/or the circuit board occurring during the lamination process of the window and the display panel. Also, according to the present invention, a support member is disposed under the display panel for a thermal bonding process of a driving module and/or a circuit board, and a heat insulating member is disposed on the display panel to prevent a defect in the display panel due to heat generation and to improve the reliability of the process. can improve

1 is a perspective view of a bonding apparatus according to an embodiment of the present invention.
2 is a cross-sectional view of a bonding apparatus according to an embodiment of the present invention.
3 is a cross-sectional view of a bonding apparatus according to an embodiment of the present invention.
4 is a cross-sectional view of a bonding apparatus according to an embodiment of the present invention.
5 is a perspective view of a support member according to an embodiment of the present invention.
6A is a cross-sectional view of a support member according to an embodiment of the present invention.
6B is a cross-sectional view of a bonding apparatus according to an embodiment of the present invention.
7A and 7B are flowcharts of a method of manufacturing a display device according to an exemplary embodiment.
8A to 8D are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.
9A and 9B are cross-sectional views of a bonding apparatus according to an embodiment of the present invention.
10 is a cross-sectional view of a bonding apparatus according to an embodiment of the present invention.

In this specification, when a component (or region, layer, part, etc.) is referred to as “on,” “connected to,” or “coupled with” another component, it is directly disposed/on the other component. It means that it can be connected/coupled or a third component can be placed between them.

Like reference numerals refer to like elements. In addition, in the drawings, thicknesses, ratios, and dimensions of components are exaggerated for effective description of technical content. “And/or” includes any combination of one or more that the associated elements may define.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The singular expression includes the plural expression unless the context clearly dictates otherwise.

Also, terms such as “below”, “lower side”, “above”, “upper side” and the like are used to describe the relationship between the components shown in the drawings. The above terms are relative concepts, and are described based on directions indicated in the drawings.

Terms such as “comprise” or “have” are intended to designate that a feature, number, step, action, component, part, or combination thereof described in the specification is present, and includes one or more other features, numbers, or steps. , it should be understood that it does not preclude the possibility of the existence or addition of , operation, components, parts, or combinations thereof.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Also, terms such as terms defined in commonly used dictionaries should be construed as having a meaning consistent with their meaning in the context of the relevant art, and unless they are interpreted in an ideal or overly formal sense, they are explicitly defined herein do.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a perspective view of a bonding apparatus according to an embodiment of the present invention. 2 is a cross-sectional view of a bonding apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a cross-section taken along lines I to I' of FIG. 1 .

1 and 2 , the bonding device BD includes a fixing member WJ, a support member SM, and a heat insulating member HM.

The bonding device BD may be a facility for bonding various electronic components on the target panel SB. For example, the bonding device BD may be a device for bonding at least one of the driving module 10 and the circuit board 20 to the target panel SB.

The target panel SB may include a window WD and a display panel DP. The target panel SB may correspond to a display module (not shown) of a display device (not shown). Electronic components driving the display panel DP may be bonded on the target panel SB. In this embodiment, the electronic component may include the driving module 10 and the circuit board 20 . Electronic components coupled to the display panel DP are not limited thereto.

In the present exemplary embodiment, the driving module 10 and the circuit board 20 may be bonded on the display panel DP. The target panel SB may include a first part DP-1P, a second part DP-2P, and a third part DP-3P. The target panel SB includes a display panel DP, and the display panel DP includes a first portion DP-1P and a second portion DP that is bent from an edge EZ of the first portion DP-1P. -2P) and a third part DP-3P extending from the second part DP-2P. Accordingly, in the present specification, the first part DP-1P, the second part DP-2P, and the third part DP-3P of the target panel SB are the first part ( DP-1P) of the display panel DP. DP-1P), the second part DP-2P, and the third part DP-3P.

The target panel SB may include a flat portion and a curved portion. In an embodiment, the first part DP-1P of the target panel SB may correspond to a flat part, and the second part DP-2P may correspond to a curved part. The target panel SB may include one or more and four or less second portions DP-2P. For example, the display panel DP of the target panel SB may be a four-sided bending display panel (or a four-sided edge display panel) including four second portions DP-2P. The third portion DP-3P may be a portion extending from one of up to four second portions DP-2P.

In an embodiment, the target panel SB may include an anti-reflection panel (not shown) between the window WD and the display panel DP.

Here, the driving module 10 may include a driving IC, and the circuit board 20 may include a flexible circuit board (FPCB).

The driving module 10 may generate a driving signal necessary for the operation of the display panel DP based on a control signal transmitted from the outside. The driving module 10 may be disposed in a pad area (not shown) of the non-display area (not shown) at the edge of the display panel DP. In the present exemplary embodiment, the driving module 10 may be disposed on the third portion DP - 3P of the display panel DP. In an embodiment, the driving module 10 may provide signals for controlling pixels of the display panel DP.

The driving module 10 may be electrically connected to the display panel DP through an ultrasonic bonding method. The driving module 10 may be electrically connected to the display panel DP through an adhesive film. Here, the adhesive film may be an anisotropic conductive film (ACF).

The driving module 10 may be mounted on the display panel DP in various ways. The COG (Chip On Glass) method that attaches directly to the rigid glass substrate of the display panel (DP), the COF (Chip On Film) method that attaches another flexible film to the display panel (DP), and the direct attachment to the flexible display panel There is a COP (Chip On Plastic) method. In the present embodiment, the driving module 10 may be directly attached to the display panel DP through a COP method. In the present exemplary embodiment, the display panel DP may include flexible polyimide PI.

The circuit board 20 may be disposed on the display panel DP. The circuit board 20 may correspond to an electronic component that connects a main circuit board (not shown) that drives the display panel DP to the display panel DP. The circuit board 20 may be disposed on the display panel DP by an ultrasonic bonding method or an anisotropic conductive film (ACF).

The driving module 10 and the circuit board 20 may be attached to the display panel DP through a thermocompression process. In the present embodiment, the driving module 10 and the circuit board 20 may be respectively disposed on the target panel SB. In another embodiment, the driving module 10 may be disposed on the circuit board 20 . Although not shown, in this case, the circuit board 20 may be thermocompressed onto the display panel DP of the target panel SB, and the driving module 10 may be thermocompressed onto the circuit board 20 .

The fixing member WJ may fix the window WD. The fixing member WJ may fix the target panel SB to which the window WD and the display panel DP are coupled. The fixing member WJ may contact the upper surface of the window WD to fix the target panel SB. Although the shape of the fixing member WJ is shown to be the same as that of the window WD, the shape of the fixing member WJ is not necessarily limited thereto, and the shape of the fixing member WJ may be various shapes covering the window WD. For example, the fixing member WJ may correspond to a window jig. Here, the window jig may include molds or stages having various shapes for fixing the window WD coupled to the display panel DP.

The support member SM may support the target panel SB. The support member SM may support the target panel SB fixed to the fixing member WJ from a lower portion. The support member SM may support the first part DP-1P, the second part DP-2P, and the third part DP-3P of the target panel SB. The support member SM may support the first part DP-1P in the third direction DR3 and support the third part DP-3P in the first direction DR1 . The support member SM may include a metal. The support member SM may have a fixed shape.

In an embodiment, the support member SM may support the target panel SB while the driving module 10 and/or the circuit board 20 are coupled to the target panel SB. For example, the support member SM may be formed during a process in which the driving module 10 and/or the circuit board 20 are thermocompression-bonded on the third portion DP-3P of the display panel DP. ) may support the lower surface of the third part DP-3P.

In an embodiment, the support member SM may include a first surface SM-1S, a second surface SM-2S, and a third surface SM-3S. The first surface SM-1S contacts the first part DP-1P of the target panel SB, the second surface SM-2S contacts the second part DP-2P, and the third The surface SM-3S may contact the third part DP-3P. In an embodiment, the third surface SM-3S may support the third part DP-3P of the target panel SB during the compression bonding process of the driving module 10 and/or the circuit board 20 . have.

In FIG. 2 , a first area 1A and a second area 2A may be defined in the third part DP - 3P. The first area 1A is an area adjacent to the second portion DP-2P, and the second area 2A is an area non-adjacent to the second portion DP-2P. The driving module 10 and/or the circuit board 20 may be coupled on the second region 2A.

In an embodiment, the curvature CR of the second surface SM-2S of the support member SM may be substantially the same as the curvature CR of the second portion DP-P2 of the target panel SB. have.

The heat insulating member HM may be disposed on the third portion DP-P3 of the target panel SB. The heat insulating member HM may include a heat insulating material that blocks heat. The heat insulating member HM may be disposed in the first area A1 of the target panel SB. The heat insulating member HM may be disposed closer to the first portion DP-P1 of the display panel DP than the second area A2 to which the driving module 10 and/or the circuit board 20 are attached. . Accordingly, the heat insulating member HM generates heat generated when the driving module 10 and/or the circuit board 20 is thermally compressed to the second area A2 in the first portion DP- of the display panel DP. Transmission to the pixel area defined in P1) can be prevented.

In an embodiment, the bonding device BD may include a compression member PM. The compression member PM may thermocompress the driving module 10 and/or the circuit board 20 on the third portion DP-P3 of the target panel SB.

3 is a cross-sectional view of a bonding apparatus according to an embodiment of the present invention. 3 is a cross-sectional view illustrating a cross section taken along II to II′ of FIG. 1 .

Referring to FIG. 3 , the third part DP-3P of the display panel DP is disposed on the third surface SM-3S of the support member SM, and the heat insulation is disposed on the third part DP-3P. A member HM may be disposed. In an embodiment, the heat insulating member HM may be provided in the form of a film. The heat insulating member HM may be adhered to the display panel DP through the adhesive member AD. For example, the adhesive member AD may include a pressure-sensitive adhesive (PSA) or a transparent adhesive (OCA). The heat insulating member HM may be removed from the display panel DP after the driving module 10 and/or the circuit board 20 are thermally compressed on the display panel DP.

In an embodiment, the width WT1 of the heat insulating member HM may be the same as the width WT1 of the third portion DP - 3P of the display panel DP. Here, the width may be the length in the second direction DR2 .

4 is a cross-sectional view of a bonding apparatus according to an embodiment of the present invention. 4 is a cross-sectional view illustrating a cross section taken along lines III to III' of FIG. 1 .

Referring to FIG. 4 , the third portion DP - 3P may include a first area 1A and a second area 2A. The first region 1A may be adjacent to the second part DP-2P, and the second region 2A may be spaced apart from the second part DP-2P. The heat insulating member HM may be attached to the first area 1A, and the driving module 10 and the circuit board 20 may be attached to the second area 2A. As mentioned above, in FIG. 4 , the driving module 10 and the circuit board 20 are respectively illustrated as being disposed in the second region 2A, but the present invention is not limited thereto, and the circuit board is located in the second region 2A. Only 20 is attached, and the driving module 10 may be disposed on the circuit board 20 .

5 is a perspective view of a support member according to an embodiment of the present invention. 6A is a cross-sectional view of a support member according to an embodiment of the present invention. 6B is a cross-sectional view of a bonding apparatus according to an embodiment of the present invention.

5 to 6B , the support member SM may include a plurality of holes VH on the third surface SM-3S. In the drawing, six holes VH are illustrated in the second direction DR2 and three holes VH are illustrated in the third direction DR3, but the present invention is not limited thereto. The plurality of holes VH may be vacuum holes. In an embodiment, the plurality of holes VH may overlap the second area 2A of the third portion of the display panel DP. The plurality of holes VH are disposed on the third surface SM-3S to overlap the second area 2A. The third surface SM-3S may be in close contact with the third portion DP-3P of the display panel DP.

The plurality of holes VH may be provided in a vacuum state to enhance a contact force between the third portion DP-3 and the third surface SM-S3 . Here, the contact force may mean a force that can be maintained in a contact state. That is, the plurality of holes VH in a vacuum state may maintain the third surface SM-3S and the second area 2A of the third part DP-3 in a contact state.

In FIG. 6B , the width WT2 of the plurality of holes VH in the second direction DR2 is equal to the width WT2 of the third portion DP-3P of the display panel DP in the second direction DR2 . may be substantially the same. The plurality of holes VH may be disposed on one surface contacting the third portion DP-3P of the display panel DP among the third surfaces SM-3S of the support member SM.

7A and 7B are flowcharts of a method of manufacturing a display device according to an exemplary embodiment. 7A is a flowchart illustrating a method of manufacturing a display device, and FIG. 7B is a flowchart illustrating the bonding step of FIG. 7A .

Referring to FIG. 7A , the method of manufacturing the display device may include a lamination step ( S710 ) for coupling the display panel and a window and a bonding step ( S720 ) for coupling a driving module and/or a circuit board to the display panel. Here, the display device is a concept including the target panel SB shown in FIGS. 1 and 2 , the driving module 10 coupled to the target panel SB, and the circuit board 20 .

In an embodiment, in the lamination step, the window disposed on the display panel may overlap the first portion and the second portion of the display panel. An adhesive may be disposed between the window and the display panel. The adhesive may correspond to a pressure sensitive adhesive or a clear adhesive. The lamination step may include fixing the window through the fixing member. The lamination step may include disposing an adhesive on the lower surface of the window fixed to the fixing member and disposing the display panel on the adhesive. The lamination step may include disposing a pressure pad under the display panel and compressing and bonding the display panel to the lower surface of the window through expansion of the pressure pad.

In FIG. 7B , the bonding step ( S720 ) includes seating the display panel including a first portion, a second portion bent from an edge of the first portion, and a third portion extending from the second portion on a support member ( S722 ). may include. The bonding step ( S720 ) may include disposing the driving module and/or the circuit board on the third portion of the display panel supported on one surface of the support member ( S724 ). The bonding step ( S720 ) may include a step ( S726 ) of disposing a heat insulating member in the first area adjacent to the second part of the third part. The bonding step ( S720 ) may include a step ( S728 ) of bonding the driving module and/or the circuit board disposed in the second area other than the first area of the third portion to the display panel by pressing the bonding step ( S728 ). 8A to 8D will be described in detail.

8A to 8D are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment.

In FIG. 8A , the method of manufacturing the display device may include a method of bonding the driving module 10 and/or the circuit board 20 to the display panel DP through a bonding device. The supporting member SM may correspond to a stage supporting the target panel SB. The support member SM may be in contact with the lower surface to support the target panel SB fixed by the fixing member WJ. The support member SM has a metal fixed shape and includes the first part DP-1P, the second part DP-2P, and the third part DP-3P of the display panel DP of the target panel SB. can support

A plurality of holes VH may be provided on the third surface SM-3S of the support member SM in contact with the third portion DP-3P of the display panel DP. The support member SM may firmly support the third portion DP - 3P of the display panel DP through the plurality of holes VH.

In FIG. 8B , the bonding device BD may include a heat insulating member HM. The heat insulating member HM may be disposed on the first area 1A of the third portion DP - 3P of the display panel DP. The heat insulating member HM may block heat from being transferred from the second area 2A to the first portion DP - 1P of the display panel DP.

8C and 8D , the bonding device BD may effectively attach the driving module 10 and/or the circuit board 20 to the display panel DP. In an embodiment, the support member SM of the bonding device BD is formed during a process in which the driving module 10 and/or the circuit board 20 are thermally compressed on the second area 2A of the display panel DP. , the third portion DP - 3P may be supported so that the pressing force of the pressing member PM may be sufficiently transmitted to the display panel DP. The heat insulating member HM of the bonding device BD may prevent a pixel (not shown) from being defective because heat generated during thermal compression is transferred to the first portion DP-1P of the display panel DP. have.

9A and 9B are cross-sectional views of a bonding apparatus according to an embodiment of the present invention. 9A and 9B show a heat insulating member HM according to another embodiment of the present invention.

In FIG. 9A , the heat insulating member HM is disposed on the third portion DP - 3P. The heat insulating member HM may cover the third portion DP - 3 . The heat insulating member HM may be provided in the form of a jig. The heat insulating member HM may be attached to the support member SM. The heat insulating member HM may be bonded to the third surface of the support member SM including a metal including a magnet. That is, the heat insulating member HM may be disposed on the third surface SM-3S of the support member in a manner that surrounds the third portion DP-3P of the display panel disposed on the support member SM.

In FIG. 9B , the heat insulating member HM may include a first heat insulating member HM-1 and a second heat insulating member HM-2. The first heat insulating member HM-1 may be disposed on the support member SM. The first heat insulating member HM - 1 may be disposed between the support member SM and the third portion DP - 3P of the display panel. The second heat insulating member HM - 2 may be disposed on the third portion DP - 3P of the display panel. The first heat insulating member HM-1 and the second heat insulating member HM-2 may be coupled to each other. The first heat insulating member HM-1 and the second heat insulating member HM-2 may surround the third portion DP-3P of the display panel in the second direction DR2.

In an embodiment, the jig-shaped heat insulating member HM may be removed from the display panel DP after a thermal compression process.

10 is a cross-sectional view of a bonding apparatus according to an embodiment of the present invention.

In FIG. 10 , the curvature CR of the second surface SM-2S of the support member SM is variably determined according to the curvature CR of the second portion DP-2P of the target panel SB. In the present embodiment, the curvature CR of the second surface SM-2S of the support member SM may be designed to be the same as the curvature CR of the second part SM-2S of the target panel SB. have. Accordingly, the third surface SM-3S of the support member SM may effectively support the third portion DP-3P of the target panel SB. If the curvature CR of the second part DP-2P of the target panel SB is greater than or less than 90 degrees, the curvature CR of the second surface SM-2S of the support member SM is also corresponding thereto. It can be designed to be larger or smaller than 90 degrees depending on the design.

As described above, embodiments have been disclosed in the drawings and the specification. Although specific terms are used herein, they are only used for the purpose of describing the present invention, and are not used to limit the meaning or the scope of the present invention described in the claims. Therefore, it will be understood by those of ordinary skill in the art that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the true technical protection scope of the present invention should be defined by the technical spirit of the appended claims.

BD: bonding device
SB: target panel
DP: display panel
WD: Windows
SM: support member
HM: insulation member
WJ: Fixing member
10: drive module
20: circuit board

Claims (20)

It is disposed on an upper portion of a target panel including a first portion, a second portion bent from an edge of the first portion, and a third portion extending from the second portion to which at least one of a driving module and a circuit board is coupled. a fixing member for fixing the target panel;
a support member disposed under the target panel and supporting the target panel while the driving module and the circuit board are coupled to the target panel; and
and a heat insulating member disposed on the third part and blocking heat generated during the coupling process of the driving module and the circuit board from being transferred to the first part and the second part,
The third portion includes a first area adjacent to the second portion and a second area in which the driving module and the circuit board are coupled, and the heat insulating member is disposed on the first area. The method of claim 1 , wherein the target panel comprises a display panel and a window disposed on the display panel;
The driving module and the circuit board are disposed on the display panel. The bonding apparatus according to claim 1, wherein the support member comprises a metal. According to claim 1, wherein the support member comprises a first surface in contact with the first portion of the target panel, a second surface in contact with the second portion, and a third surface in contact with the third portion,
A bonding device in which a plurality of holes are defined on the third surface. The bonding apparatus according to claim 4, wherein the plurality of holes overlap the second area. The bonding apparatus according to claim 5, wherein each of the plurality of holes is in a vacuum state, and the contact force between the third part and the third surface is strengthened. 5. The bonding apparatus of claim 4, wherein a curvature of the second surface of the support member is substantially equal to a curvature of the second portion of the target panel. The bonding apparatus of claim 1 , further comprising a compression member configured to press and couple the driving module and the circuit board on the third part. The bonding apparatus of claim 1 , wherein the heat insulating member is in the form of a film, and an adhesive member is disposed between the heat insulating member and the third portion. The bonding apparatus according to claim 1, wherein the heat insulating member is attached to the supporting member, and the third portion of the target panel is disposed between the heat insulating member and the supporting member. According to claim 1, wherein the heat insulating member comprises a first heat insulating member disposed on the support member and a second heat insulating member disposed on the first heat insulating member, wherein the target panel comprises the first heat insulating member and the A bonding device disposed between the second heat insulating members. The bonding apparatus according to claim 10, wherein the heat insulating member is attached to the support member in the form of a magnet. The bonding apparatus according to claim 1, wherein a width of the heat insulating member is substantially equal to a width of the third portion. providing a display panel including a first portion, a second portion bent from an edge of the first portion, and a third portion extending from the second portion;
a lamination step of combining the display panel and a window overlapping the first and second portions of the display panel; and
a bonding step of coupling at least one of a driving module and a circuit board to the display panel after the lamination step;
The bonding step is
disposing a support member under the display panel on which the display panel is mounted;
disposing the driving module and the circuit board on a third portion of the display panel in contact with one surface of the support member; and
and compressing and coupling the driving module and the circuit board on a portion of the display panel supported by the support member. 15. The method of claim 14, wherein the lamination step,
fixing the window through a fixing member disposed on the window;
disposing the display panel under the fixed window;
disposing a pressure pad under the display panel; and
and compressing and bonding the display panel to a lower surface of the window by expanding the pressure pad. 15. The method of claim 14, wherein the support member comprises a first surface in contact with the first portion, a second surface in contact with the second portion, and a third surface in contact with the third portion,
One surface of the support member is the third surface. 15. The method of claim 14, wherein the third portion of the display panel comprises a first area adjacent to the second portion and a second area in which the driving module and the circuit board are disposed;
The bonding step is
Before the step of compressing and bonding the driving module and the circuit board to the second area of the display panel, the method further comprising: disposing a heat insulating member blocking heat generated during the compression process in the first area in the first area; A method of manufacturing a display device. The method of claim 17 , wherein the support member includes a plurality of holes overlapping the second area. The method of claim 17 , wherein the heat insulating member is provided in the form of a film and is attached to the first region of the display panel through an adhesive member. The method of claim 19 , further comprising removing the heat insulating member from the first area of the display panel after the bonding step.

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