JP2014041873A - Board support device and method thereof, mounting apparatus and method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board support device capable of appropriately supporting a board according to a warpage of the board.SOLUTION: The board support device comprises a control section that executes: a first processing in which a lifter unit lifts a holding member with plural support pins from a waiting position to a lift position to come into contact with the lower face of a board; a second processing in which position detection means detects support pins which has reached a predetermined projection length smaller than an initial projection length while lifting the holding member; and a third processing in which the support pins which have reached a predetermined projection length are fixed individually by an electromagnetic fixing unit, and other support pins are fixed by the electromagnetic fixing unit after the holding member has reached to the lift height position. The control section sets the support pins to an initial projection length so that the height of the support pins is higher than that of the lower face of the board at the upper limit value in the allowable height range of the board when the holding member has positioned at a height position in a state not-supporting the board based on a piece of information on an allowable height range of the board with respect to a reference supporting height of the lower face of the board supported by the support pins.

Description

  The present invention relates to a board support apparatus and method for supporting a board, and a mounting apparatus and method for mounting components on a board.

  2. Description of the Related Art Conventionally, a manufacturing process of an industrial product such as an electronic device often includes a process of mounting a component, applying a liquid agent, or the like on a printed circuit board (hereinafter, simply referred to as “substrate”) constituting the industrial product. Such a substrate often has irregularities on the surface supported when these steps are performed. Therefore, in order to perform these steps accurately and reliably, it is necessary to stably support the work target substrate in a form corresponding to the unevenness on the support side.

  Therefore, a substrate support device that supports the substrate while restricting the movement of the substrate by fixing the support pin in a state where the support pin is in contact with the substrate has also been proposed (see, for example, Patent Document 1).

  FIGS. 9A and 9B show a method of supporting a substrate by the substrate support device of Patent Document 1. FIG. FIG. 9A shows a case where no component is attached to the lower surface of the substrate, and FIG. 9B shows a case where the component is attached to the lower surface of the substrate. As shown in FIGS. 9A and 9B, the substrate support device 100 of Patent Document 1 is a plate-like shape arranged on a horizontal plane that holds a plurality of support pins 102 protruding upward and a plurality of support pins 102. The holding body 101 is provided.

  The operation of the substrate support apparatus 100 when no component is attached to the lower surface of the substrate shown in FIG. First, the plurality of support pins 102 slidably held by the holding body 101 are raised together with the holding body 101 using the lifting device 103. The plurality of support pins 102 lifted integrally are in contact with the substrate 104. If the lifting by the lifting device 103 continues even after contact, the plurality of support pins 102 slide downward with respect to the holding body 101. Thereafter, the lifting by the lifting device 103 is stopped. After the stop, the support pin 102 in contact with the substrate 104 is fixed to the holding body 101 using a fixing portion (not shown) provided between the holding body 101 and the support pin 102. Thereby, the position of the support pin 102 is fixed as shown in FIG. By fixing the positions of the support pins 102 in this way, the movement of the support pins 102 in the support direction (vertical direction in FIG. 9A) by the substrate 104 is limited.

  9A, the operation of supporting the substrate 104 by the substrate support apparatus 100 when no component is attached to the lower surface of the substrate 104 has been described. However, as shown in FIG. 9B, the component is attached to the lower surface of the substrate 104. Even if it is, the same operation is performed.

  After the substrate 104 is supported by the support pins 102 as shown in FIGS. 9A and 9B, the components are mounted on the upper surface of the substrate 104 using a mounting unit (not shown) positioned above the substrate 104. Implementation is done.

JP 2008-4856 A

  However, according to the substrate support apparatus of Patent Document 1, components are mounted in a state where the substrate is held as it is in accordance with the warp of the substrate. On the other hand, there is a desire to mount components with high accuracy while holding a warped board in a more appropriate state.

  Accordingly, an object of the present invention is to solve the above-described problem, and to support a substrate supporting apparatus and method capable of holding a substrate in which warpage or the like has occurred in a more appropriate state, and mounting components with high accuracy. An object of the present invention is to provide a mounting apparatus and method that can be performed.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, a plurality of support pins for supporting the substrate from the lower surface;
A holding body that holds a plurality of support pins so as to be slidable in the vertical direction and projecting upward at an initial protruding length;
An elevating unit that raises the holding body from the standby height position to the raised height position and abuts the upper end of the support pin on the lower surface of the substrate;
A plurality of electromagnetic fixing portions for fixing the support pins in the vertical direction relative to the holding body;
Position detecting means for individually detecting the vertical position of the support pin relative to the holding body in a non-contact state;
A first process in which the holding body is raised by the elevating unit from the standby height position to the raised height position so that the plurality of support pins are in contact with the lower surface of the substrate; and an initial protrusion length by the position detection means during the raising of the holding body The second process of detecting a support pin that has reached a predetermined projection length smaller than the above, and the support pins that have reached a predetermined projection length are individually fixed by an electromagnetic fixing unit, and the other support pins are A control unit that performs a third process of fixing by the electromagnetic fixing unit after the holding body reaches the raised height position,
In the control unit, based on the information on the allowable height range of the substrate relative to the reference support height of the lower surface of the substrate supported by the support pins, the support pins are in a state of not supporting the substrate, and the holding body The initial protrusion length of the support pin is set so that the height of the upper end of the support pin is equal to or higher than the height of the lower surface of the substrate at the upper limit of the allowable height range of the substrate when A substrate support apparatus is provided.

  According to the second aspect of the present invention, in the control unit, when the holding body is positioned at the raised height position, the upper end of the support pin fixed while the holding body is raised is at the reference support height of the lower surface of the substrate. The substrate support apparatus according to the first aspect, in which a predetermined protrusion length is set so as to be positioned.

  According to the third aspect of the present invention, the control unit electromagnetically fixes the portion of the substrate that is displaced below the reference support height on the lower surface of the substrate by performing the first to third processes. The substrate according to the second aspect, wherein the substrate is lifted by a support pin fixed by the portion, and the posture of the substrate is corrected so as to be positioned at the reference support height on the lower surface of the substrate when reaching the raised height position. A support device is provided.

According to a fourth aspect of the present invention, the substrate support apparatus according to any one of the first to third aspects;
A mounting unit that lowers the nozzle holding the component and mounts the component on the upper surface of the board,
The control unit individually detects height information of a plurality of support pins that are individually fixed by the respective electromagnetic fixing units with respect to the holding body positioned at the raised height position, and the detected support pin Based on the height information, a fourth process for calculating and outputting the height information of the substrate corresponding to the support position of each support pin with respect to the substrate, and the descending amount of the nozzle holding the component based on the height information of the substrate Provided is a mounting apparatus that executes a fifth process of mounting a component on a substrate supported by a plurality of support pins while being controlled.

  According to the fifth aspect of the present invention, the control unit extracts a substrate having a shape exceeding the allowable height range of the substrate based on the substrate height information output by the fourth process, and the extracted substrate Provides the mounting apparatus according to the fourth aspect, which does not selectively perform the fifth processing.

According to the sixth aspect of the present invention, the holding body in which the plurality of support pins are slidable in the vertical direction and protruded upward by the initial protrusion length so that the plurality of support pins contact the lower surface of the substrate. A first step of raising from a standby height position to a raised height position;
A second step of detecting a support pin that has reached a predetermined protrusion length that is smaller than the initial protrusion length during raising of the holding body;
Support pins that have reached the specified protruding length are individually fixed in the vertical direction by electromagnetic external force, and the other support pins are fixed in the vertical direction by electromagnetic external force after the holding body reaches the raised height position. And a third step of fixing to
Based on information on the allowable height range of the substrate relative to the reference support height of the lower surface of the substrate supported by the support pins, the support pins are in a state of not supporting the substrate, and the holding body is raised. The initial protrusion length of the support pin is set so that the height of the upper end of the support pin is equal to or higher than the height of the lower surface of the substrate at the upper limit value of the allowable height range of the substrate when positioned at the position. A substrate support method is provided.

  According to the seventh aspect of the present invention, when the holding body is positioned at the rising height position (P2), the upper end of the support pin fixed while the holding body is rising is positioned at the reference support height of the lower surface of the substrate. Thus, the substrate supporting method according to the sixth aspect is provided, wherein a predetermined protruding length is set.

  According to the eighth aspect of the present invention, by performing the first to third steps, the portion of the substrate that is displaced below the reference support height on the lower surface of the substrate is fixed by the fixed support pin. The substrate support method according to the seventh aspect, wherein the substrate posture is corrected so that the substrate is positioned so as to be positioned at the reference support height on the lower surface of the substrate when the lifted height position is reached.

According to a ninth aspect of the present invention, the substrate supporting method according to any one of the seventh to ninth aspects;
The height information of a plurality of support pins that are individually fixed to the holding body located at the raised height position by electromagnetic external force is detected individually, and based on the detected height information of the support pins A fourth step of calculating and outputting the height information of the substrate corresponding to the support position of each support pin with respect to the substrate;
And a fifth step of mounting the component on the substrate supported by the plurality of support pins while controlling the descending amount of the nozzle holding the component based on the height information of the substrate. Provide a method.

  According to the tenth aspect of the present invention, a substrate having a shape exceeding the allowable height range of the substrate is extracted based on the substrate height information output in the fourth step, and the extracted substrate is selectively selected. The mounting method according to the ninth aspect is provided, in which the fifth step is not performed.

  According to the present invention, it is possible to provide a substrate support device and method for holding a warped substrate or the like in a more appropriate state, and a mounting device and method for mounting components with high accuracy. be able to.

The perspective view of the mounting device concerning an embodiment of the invention Sectional drawing of the mounting apparatus concerning an embodiment The top view of the holding body of the mounting apparatus concerning an embodiment The expanded sectional view of the mounting device concerning an embodiment Operational diagram of mounting apparatus according to embodiment The flowchart of the mounting apparatus concerning embodiment of this invention Operational diagram of the mounting apparatus according to the flowchart of FIG. Operational diagram of the mounting apparatus according to the flowchart of FIG. Sectional view of a conventional mounting device

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

(Embodiment)
FIG. 1 is a perspective view showing a schematic configuration of a mounting apparatus 1 including a substrate support apparatus 13 according to an embodiment of the present invention. As shown in FIG. 1, the mounting apparatus 1 includes a substrate support device 13 that supports the substrate 2, a transport rail 14, and a mounting unit 8.

  The substrate 2 is carried into the mounting apparatus 1 by the transport rail 14. The substrate 2 in the mounting apparatus 1 is transported along the direction in which the transport rail 14 extends. As shown in FIG. 1, the transport direction of the substrate 2 is the X-axis direction, the vertical direction is the Z-axis direction, and the X-axis direction and the direction perpendicular to the Z-axis direction are the Y-axis direction. As shown in FIG. 1, when the substrate 2 is moved to a predetermined position along the transport rail 14, the end of the substrate 2 in the transport direction (the end in the X-axis direction) is fixed by a stopper (not shown) of the transport rail 14. Is done. Thereby, the board | substrate 2 is fixed in the predetermined position along a conveyance direction.

  Next, the lower surface of the substrate 2 fixed at a predetermined position in the transport direction by the transport rail 14 is regulated and supported from below by the substrate support device 13. Thereafter, components are mounted on the upper surface of the substrate 2 supported by the substrate support device 13 by using the mounting unit 8 positioned above the substrate 2.

  The substrate 2 on which components are mounted by the mounting unit 8 is movable by being supported from below by the substrate support device 13 and fixed in the transport direction of the substrate 2 by a stopper (not shown) of the transport rail 14. Thereafter, the substrate 2 moves along the transport rail 14 and is carried out of the mounting apparatus 1.

  Next, the configuration of the substrate support device 13 of the mounting apparatus 1 will be described with reference to FIG. The substrate support device 13 includes a support pin 3 that supports the substrate 2, a holding body 4, an electromagnetic fixing unit 5, an elevating unit 6, a position detection unit 7, and a control unit 9. FIG. 2 shows a state where the lower surface of the substrate 2 is supported by the plurality of support pins 3 of the substrate support device 13.

  The plurality of support pins 3 of the substrate support device 13 are held by a plate-like holding body 4 so as to be slidable in the vertical direction (Z direction). The plurality of support pins 3 held by the holding body 4 are usually arranged below the substrate 2 in a state where the holding body 4 is lowered integrally so that the upper end does not contact the lower surface of the substrate 2. Waiting.

  FIG. 3 shows a plan view of the support pin 3 and the holding body 4. As shown in FIG. 3, the holding body 4 is a substantially rectangular plate arranged in the XY plane. The holding body 4 is formed with a plurality of circular through holes 16 having substantially the same diameter penetrating in the vertical direction (Z direction). For example, when viewed from above, the plurality of through holes 16 are arranged in a plurality of rows in the X direction and in a plurality of rows in the Y direction, and are regularly arranged so that the intervals in each direction are equal. The support pin 3 is inserted into the through hole 16 of the holding body 4.

  As shown in FIG. 2, an elevating part 6 is attached to the holding body 4. The elevating unit 6 raises (and descends) the holding body 4 and the plurality of support pins 3 held by the holding body 4 by raising the holding body 4. When the holding body 4 is raised by the elevating unit 6, the upper end of the support pin 3 comes into contact with the lower surface of the substrate 2 disposed above.

  As shown in FIGS. 2 and 3, an electromagnetic fixing portion 5 is provided between the inner periphery of each through hole 16 of the holding body 4 and the outer periphery of each support pin 3. The electromagnetic fixing part 5 can fix the support pin 3 releasably using an electromagnetic external force. The electromagnetic fixing unit 5 normally holds the support pin 3 so as to be slidable, but selectively fixes the support pin 3 by generating an electromagnetic external force. The support pin 3 fixed by the electromagnetic fixing unit 5 is in a state of being fixed relatively to the holding body 4. In the present embodiment, a voltage is used as an example of an electromagnetic external force, and an ER gel 15 (electrorheological fluid) whose viscosity is changed by application of a voltage is used as an example of the electromagnetic fixing unit 5.

  The electromagnetic fixing part 5 will be described with reference to FIG. As shown in FIG. 4, the electromagnetic fixing portion 5 includes a packing 10, an electrode 11, and an ER gel 15. The ER gel 15 is enclosed inside by packings 10 provided at the upper and lower ends of the through hole 16. In the space in which the ER gel 15 is enclosed, two electrodes 11 connected to the power source 12 are provided. When a voltage is applied between the electrodes 11, the viscosity of the ER gel 15 changes, whereby the frictional force between the ER gel 15 and the support pin 3 is increased and the support pin 3 is fixed.

  On the other hand, the friction force with respect to the support pin 3 by the electromagnetic fixing part 5 when no voltage is applied to the electromagnetic fixing part 5 is set to such an extent that the support pin 3 does not fall off due to its own weight.

  Next, as shown in FIGS. 1 and 2, position detection means 7 for individually detecting the relative positions of the support pins 3 with respect to the holding body 4 is provided below the holding body 4. The position detection means 7 is attached to the lower part of the holding body 1 so as to surround the periphery of the support pin 3 in a non-contact state with respect to the support pin 3. 1 and 2, one position detecting means 7 is provided for one support pin 3.

  In the present embodiment, an optical or magnetic linear scale is used as the position detection means 7 which is a non-contact position detection means in the vertical direction of each support pin 3. For example, the magnetic linear scale has a coil, and the magnetic field of the coil changes depending on the height position of the support pin 3 surrounded by the magnetic linear scale. By calculating the relationship between the magnetic field of the coil and the height position of the support pin 3 in advance, the height position of the support pin 3 is detected based on the detected magnetic field of the coil. That is, by using a magnetic linear scale or the like, the relative height position of the support pin 3 with respect to the holding body 4 can be detected in a non-contact state.

  As shown in FIGS. 1 and 2, a mounting unit 8 is provided above the substrate 2. The mounting unit 8 is moved in the X, Y, and Z directions by a drive unit (not shown).

  At the tip of the mounting unit 8, a suction mechanism (for example, a vacuum suction nozzle) that sucks components to be mounted on the substrate 2 is provided. When the nozzle sucks the component, the mounting unit 8 can move while sucking and holding the component.

  As shown in FIGS. 1 and 2, the mounting unit 8 is retracted above the substrate 2 when no components are mounted. On the other hand, when mounting components, the mounting unit 8 is moved downward by the drive unit in a state where the mounting unit 8 is positioned in the X and Y directions with respect to the mounting position of the substrate 2.

  Here, in the board | substrate support apparatus 13 of this Embodiment, FIG. 5 (a), (b) is used about the positional relationship of each support pin 3 and the holding body 4, such as the protrusion length of each support pin 3. FIG. I will explain. FIG. 5A shows a state (standby state) before the raising of the holding body 4 by the elevating unit 6 is started. FIG. 5B shows a state where the holding body 4 is raised to the maximum height position. 5A and 5B, the case where the substrate 2 is not disposed above the support pins 3 will be described.

As shown in FIG. 5A, in the standby state, the height position of the holding body 4 is at the standby height position P1 as the lower limit height position. At this time, the plurality of support pins 3, and the state of not supporting a substrate 2, is held in a state where the holder 4 projecting only the initial projection length L _1. In addition, the protrusion length in this specification means the length of the part which protruded upwards from the holding body 4 on the basis of the holding body 4. FIG.

Thereafter, the holding body 4 and the plurality of support pins 3 are raised by the elevating unit 6. As shown in FIG.5 (b), the holding body 4 is raised to the raising height position P2 as an upper limit height position. As shown in FIG. 5 (b), even if the holding body 4 reaches the raised height position P2, the plurality of support pins 3 are located on the holding body 4 similarly to the standby state shown in FIG. 5 (a). It is shown in a state protruding upward at an initial projection length L ₁ Te. This is because the support pin 3 does not come into contact with the substrate 2 until the holding body 4 reaches the rising height position P2 under the condition that the substrate 2 is not disposed above the support pin 3, and is below the holding body 4. This is because they are not slid.

  In the present embodiment, as shown in FIG. 5A, a reference support height P3 is set as a reference support height when the lower surface of the substrate 2 is supported flat. The reference support height P3 is a desired height position of the lower surface of the substrate 2 supported by each support pin 3, and can be arbitrarily set.

  Further, in the present embodiment, as shown in FIG. 5A, the allowable height range R of the lower surface of the substrate 2 is set with reference to the reference support height P3. The allowable height range R is the height range of the lower surface of the substrate 2 with the amount of warpage allowed for the quality of the substrate 2, and can be arbitrarily set.

Further, in the present embodiment, as shown in FIG. 5B, when the support pins 3 do not support the substrate 2 and the holding body 4 is located at the raised height position P2, the holding body 4 The initial protruding length of the support pin 3 is such that the height of the upper end of the support pin 3 held so as to be slidable in the vertical direction is not less than the upper limit height P4 of the allowable height range R of the lower surface of the substrate 2. L ₁ has been set. By thus setting the initial protruding length L _1, when the amount of warpage of the substrate 2 supported is within the amount warpage allowed, when the holder 4 is located at the raised height position P2 All the support pins 3 come into contact with the lower surface of the substrate 2. By utilizing this fact, it is possible to determine whether or not the warpage amount of the substrate 2 is an allowable warpage amount. A specific determination method will be described later.

  The operations of the constituent members of the mounting device 1 and the substrate support device 13 described above are controlled by the control unit 9 provided in the substrate support device 13. As shown in FIG. 2, the control unit 9 is connected to the support pin 3, the holding body 4, the electromagnetic fixing unit 5, the elevating unit 6, and the position detection unit 7, and individually controls the operation of these components. .

  The height information of the support pin 3 detected by the position detection unit 7 is transmitted from the position detection unit 7 to the control unit 9 and processed by the control unit 9. The control unit 9 controls the ascending / descending operation of the mounting unit 8, and the descending amount of the nozzle tip of the mounting unit 8 is also controlled by the control unit 9.

  Next, operations of the mounting apparatus 1 and the substrate support apparatus 13 according to the present embodiment will be described.

  The mounting apparatus 1 and the board | substrate support apparatus 13 of this Embodiment operate | move along the flowchart shown in FIG. The operation of the mounting apparatus 1 according to the flowchart shown in FIG. 6 is described with reference to FIGS. 7A to 8C and FIGS. 8A to 8C for the case where the substrate 2 warps and warps, respectively. explain. The case where the substrate 2 is warped means a case where the substrate 2 is upwardly convex at the center of the substrate 2, and the case where the substrate 2 is warped is downwardly convex. Refers to the case.

FIG. 7A shows a standby state before the lift by the elevating unit 6 starts when the substrate 2 is warped downward. As shown in FIG. 7 (a), the holding member 4 is in a state in which the support pins 3 projecting relative to the holding member 4 at an initial projection length L _1, standby height position of the lower limit height position P1 Are arranged in a standby state (step S1). Initial protruding length L ₁ is as described above, the support pin 3 substrate 2 and the state of the unsupported, when holder 4 is located at the raised height position P2, the height of the support pin 3 upper end board 2 is set by the control unit 9 of the substrate support device 13 so as to be equal to or higher than the upper limit height P4 of the allowable height range R of the lower surface. This setting can also be performed by an initial protrusion amount setting operation in which the support pins 3 held so as to be slidable in the vertical direction with respect to the holding body 4 are relatively collectively set by a protrusion reference member (not shown). (For example, the initial protrusion length L1 may be set all at _once by pressing the lower end of the support pin 3 penetrating vertically with respect to the holding body 4 against a protrusion reference member (not shown)).

By setting the initial protrusion length L ₁ in this way, the plurality of support pins 3 are arranged at positions protruding from the initial protrusion length L ₁ with respect to the holding body 4 as shown in FIG. 7A. Is done. On the other hand, the holding body 4 is arranged at a standby height position P1 as a lower limit height position.

  Thus, in the standby state in which the support pins 3 and the holding body 4 are arranged, the substrate 2 and the support pins 3 do not interfere with each other when the substrate 2 is carried in.

In the present embodiment, in addition to the initial protrusion length L ₁ , the upper end of the support pin 3 is the lower surface of the substrate 2 when the holder 4 is positioned at the upper limit height position P ₂ in addition to the initial protrusion length L _1. A predetermined projection length L _F is set in advance such that the projection length is positioned at the reference support height P3. At the projecting length L _F is set state, the support pin 3 and holder 4 is placed in a standby state at the standby height position P1 (step S1). Specific setting of the predetermined protrusion length L _F will be described later.

Next, under the control of the control unit 9, the elevating unit 6 integrally raises the holding body 4 and the plurality of support pins 3 (step S2 (first process, first step)). Accordingly, when supporting the downwardly warped substrate 2 as shown in FIG. 7, among the plurality of support pins 3, the upper end is the lower surface of the substrate 2 before the support pin 3 located at the center of the substrate 2. Will come into contact. The support pin 3 whose upper end is in contact with the lower surface of the substrate 2 slides relatively downward with respect to the holding body 4 while the upper end is positioned on the lower surface of the substrate 2 as the lift by the elevating unit 6 continues. . As the support pin 3 slides downward with respect to the holding member 4, the projecting length of the support pin 3 becomes smaller from an initial projection length L _1.

Then, among the plurality of support pins 3 which slides downward with respect to the holding member 4, the support pin 3 sequentially reaching an initial protrusion amount L ₁ which is defined in the step S1 to a predetermined projecting length L _F It is fixed (step S3). Specifically, the height information of the support pins 3 is detected at any time by the position detection means 7 provided in each support pin 3 (second processing, second step), and the detected height information of the support pins 3 is detected. Based on the above, the support pin 3 that has reached the predetermined protrusion length L _F is determined. The determined support pin 3 is fixed by the electromagnetic fixing portion 5 (third process, third step). Specifically, a voltage is applied from the electrode 11 to the electromagnetic fixing unit 5 under the control of the control unit 9. By applying voltage, the viscosity of the electromagnetic fixing portion 5 changes, and the frictional force between the electromagnetic fixing portion 5 and the support pin 3 increases. The support pin 3 is fixed by the increase of the frictional force. When the support pins 3 are fixed, the substrate 2 supported by the support pins 3 is prevented from being deformed downward.

FIG.7 (b) is a figure which shows an ascending process. As shown in FIG. 7 (b), 1 supporting pins located in the middle part 3, since the protrusion length reaches L _F, and is fixed by the electromagnetic fixing unit 5. Thereafter, the support pin 3 is raised integrally with the holding body 4 in a fixed state. On the other hand, other support pin 3, the projecting length has not reached the L _F, is not fixed by the electromagnetic fixing unit 5. Thereafter, the support pins 3 slide downward with respect to the holding body 4 as the holding body 4 rises.

As shown in FIG. 7B, the single support pin 3 located in the center portion reaches the protruding length L _F, and the vertical direction with respect to the holding body 4 in a state where the upper end is in contact with the lower surface of the substrate 2. Are fixed and lifted together with the holding body 4. As a result, the central portion of the substrate 2 is pushed upward by the upper ends of the support pins 3. When the central portion of the substrate 2 is pushed upward, the shape of the substrate 2 that has been warped gradually approaches horizontal, and the posture is corrected.

Also in the subsequent rising of the support 4, sequentially fixing the support pin 3 reaches a predetermined projection length L _F. Finally, when the holding body 4 is positioned at the rising height position P2, the raising of the holding body 4 by the elevating part 6 is stopped (step S4).

  In the present embodiment, the reference support height P3 is set to be horizontal.

FIG.7 (c) is a figure which shows the state in which the holding body 4 was stopped in the raising height position P2. By setting the predetermined protrusion length _LF to the above-described length, as shown in FIG. 7 (c), the support pin 3 has the upper end positioned at the reference support height P3. The lower surface of 2 is supported. By being supported in this way, the substrate 2 is disposed horizontally along the reference support height P3. By supporting the substrate 2 horizontally, the posture of the substrate 2 is corrected.

In FIG. 7 (c), the although all the support pins 3 that describes when it reaches the projecting length L _F at elevated process, by setting the warp direction and standards support height P3 of the substrate 2, protruding length of some of the support pin 3 may not reach the L _F. Support pin 3 such projection length does not reach L _F is not fixed by the electromagnetic fixing portion 5 until raised by the lifting unit 6 is stopped, even in the holding body 4 after rising stop by lifting part 6 On the other hand, it is held in a slidable state. As described above, when there is a support pin 3 that is not fixed even after the holding body 4 is positioned at the raised height position P2, the support pin 3 is fixed by the electromagnetic fixing portion 5 (step S5). When step S5 is completed, all the support pins 3 are fixed. When the support pin 3 is fixed, the position detection means 7 detects the height position of the support pin 3 with respect to the holding body 4 under the control of the control unit 9. In the present embodiment, since one position detecting means 7 is provided for one support pin 3, the height positions of all the support pins 3 are individually detected. Information on the detected height positions of the respective support pins 3 is sent from the position detection means 7 to the control unit 9.

  The control unit 9 calculates the height information of the substrate 2 at the support position from the information about the height position of each support pin 3 sent from the position detection means 7 and the information about the thickness of the substrate 2 inputted in advance. (Step S6 (fourth process, fourth process)).

  Next, components are mounted by the mounting unit 8 on the substrate 2 supported by the plurality of support pins 3 (step S7 (fifth process, fifth process)). Specifically, the nozzle of the mounting unit 8 is lowered, and the component adsorbed on the tip of the nozzle of the mounting unit 8 is pressed against the upper surface of the substrate 2. When the mounting unit 8 moves downward, the lower surface of the component (the surface on which the component is mounted) held at the tip of the mounting unit 8 reaches the upper surface of the substrate 2 and is attached to the upper surface of the substrate 2. Thereafter, after the suction of the component by the nozzle is released, the mounting unit 8 is retreated upward again. In this way, components are mounted by the mounting unit 8.

  The amount of lowering of the nozzle of the mounting unit 8 at this time is controlled by the control unit 9 based on the information on the height position of the substrate 2 output in step S6. By controlling the lowering amount of the nozzle of the mounting unit 8 in this way, the component can be mounted along the shape of the substrate 2 without applying extra stress to the substrate 2 or the component, and the high-quality substrate 2 can be mounted. Can be created. Note that the position of the upper surface of the substrate 2 is determined by the control unit 9 based on the information on the height position of the substrate 2 output in step S6 in advance before controlling the lowering amount of the nozzle of the mounting unit 8 in step S7. Have been identified.

  Further, by mounting the components in a state where the posture of the substrate 2 is corrected, the quality of the substrate 2 can be improved and the mounting accuracy of the components can be improved.

  Next, the case where the board | substrate 2 warps is demonstrated using Fig.8 (a)-(c). FIGS. 8A to 8C are diagrams illustrating operations of the mounting apparatus 1 and the substrate support apparatus 13 when the substrate 2 is warped. In the mounting apparatus 1 according to the present embodiment, the operation of the mounting apparatus 1 is performed according to the flowchart shown in FIG. 6 to mount components regardless of the warpage of the board 2 to be mounted. That is, even when the board 2 is warped, components are mounted according to the flowchart shown in FIG. 6 in the same manner as when the board 2 is warped.

FIG. 8A shows a standby state before the lift by the elevating unit 6 starts when the substrate 2 is warped. As shown in FIG. 8A, the plurality of support pins 3 are held in a state of protruding upward with an initial protruding length L ₁ with respect to the holding body 4. Setting of the initial projection length L ₁ is omitted because it is similar to the case of anhedral.

In addition to the initial protrusion length L ₁ , the upper end of the support pin 3 is the reference support height of the lower surface of the substrate 2 when the holding body 4 is positioned at the raised height position P ₂ in addition to the initial protrusion length L _1. is in terms of a preset predetermined projection length L _F of the projection length as positioned in P3, the support pins 3 and holder 4 is placed in a standby state at the standby height position P1 (step S1). Setting a predetermined projection length L _F is also omitted because it is similar to the case of anhedral.

  Next, the holding body 4 and the plurality of support pins 3 are raised integrally (step S2). Thereby, as shown in FIG. 8B, the upper end of the plurality of support pins 3 comes into contact with the lower surface of the substrate 2 first from the support pin 3 close to the end of the substrate 2. The support pin 3 whose upper end is in contact with the lower surface of the substrate 2 slides relatively downward with respect to the holding body 4 while the upper end is positioned on the lower surface of the substrate 2 when the lifting by the elevating unit 6 continues.

Then, a plurality of support pins 3 which slides downward with respect to the holding member 4, the projecting length are sequentially fixed to the support pin 3 reaches a predetermined projecting length L _F that defines in step S1 (Step S3). Specifically, the height information of the support pins 3 is detected at any time by the position detection means 7 provided on each support pin 3, and a predetermined protrusion length L _F based on the detected height information of the support pins 3. The support pin 3 that has reached is determined.

  Finally, when the holding body 4 is positioned at the rising height position P2, the raising of the holding body 4 by the elevating part 6 is stopped (step S4).

FIG. 8C is a diagram illustrating a state in which the holding body 4 is stopped at the raised height position P2. As shown in FIG. 8 (c), the plurality of support pins 3 that support the center side of the warped substrate 2 do not reach the predetermined protrusion length L _F and are fixed to the holding body 4. Absent. This is because none of the support pins 3 has reached the predetermined protruding length L _F until the holding body 4 is positioned at the raised height position P2.

As shown in FIG. 8C, the upper ends of all the support pins 3 are in contact with the lower surface of the substrate 2. Meanwhile, in step S1, the initial projection length L ₁ of the support pin 3, when the holder 4 is located at the raised height position P2, the allowable height range height of the lower surface substrate 2 of the support pin 3 upper It is set to be equal to or greater than the upper limit height P4 of R. Accordingly, as shown in FIG. 8C, since the upper ends of all the support pins 3 are in contact with the lower surface of the substrate 2, the height position of the lower surface of the substrate 2 used in FIG. It can be seen that it is within R. That is, it can be seen that the warpage amount of the substrate 2 is an allowable warpage amount. As described above, according to the mounting device 1 and the substrate support device 13 of the present embodiment, the height of the support pin 3 when the holding body 4 is positioned at the raised height position P2 is determined. It is possible to determine whether or not the warp amount is an allowable warp amount.

  Next, the support pin 3 that is not fixed to the holding body 4 even after the ascent is stopped is fixed by the electromagnetic fixing portion 5 (step S5). When step S5 is completed, all the support pins 3 are fixed and the substrate 2 is supported.

  After step S5, similar to the case of the warped substrate, the same processes as step S6 (calculate and output the height above the substrate 2 at the support position) and step S7 (mount components) are performed. Description of steps S6 and S7 is omitted.

  In step S7, by mounting the component by controlling the lowering amount of the nozzle of the mounting unit 8, it is possible to mount the component along the shape of the substrate 2 without applying extra stress to the substrate 2 or the component. And a high-quality substrate 2 can be produced.

As described above, according to the mounting device 1 and the substrate support device 13 of the present embodiment, when the holding body 4 is positioned at the raised height position P2, the upper end of the support pin 3 is the reference height of the lower surface of the substrate 2. so as to be positioned P3, for example, after having preset corrective possible predetermined protrusion length L _F so as to be flat orientation of the substrate 2 anhedral, protruding length L _F during the ascent of the holder 4 By fixing the reached support pins 3 sequentially, the posture of the substrate 2 (especially downward warping) can be corrected. By mounting components in a state where the posture of the substrate 2 is corrected, the quality of the substrate 2 can be improved and the mounting accuracy of the components can be improved.

Further, according to the mounting device 1 and the substrate supporting device 13 of the present embodiment, by the initial protruding length L ₁ of the support pin 3 is set to a predetermined length, the substrate 2 (especially cambered) Whether or not the height position of the lower surface is within the allowable height range R can be determined. That is, it is possible to determine whether or not the warpage amount of the substrate 2 is an allowable warpage amount.

  Further, according to the mounting device 1 and the substrate support device 13 of the present embodiment, the position detection means 7 detects the height position of the support pin 3 in a non-contact state with respect to the support pin 3. Therefore, stable position detection can be performed without being affected by the characteristic 3.

  Further, according to the mounting apparatus 1 of the present embodiment, by controlling the amount of lowering of the nozzle of the mounting unit 8, components are mounted along the shape of the substrate 2 without applying excessive stress to the substrate 2. And a high-quality substrate 2 can be produced.

  As described above, according to the substrate support device 13 of the present embodiment, it is possible to hold a substrate in which warpage or the like has occurred in a more appropriate state. Further, according to the mounting apparatus 1 of the present embodiment, it is possible to mount components with high accuracy on a substrate on which warpage or the like has occurred.

  In addition, this invention is not limited to the said embodiment, It can implement in another various aspect. For example, when it is determined that the warpage amount of the substrate 2 is an unacceptable amount (when the substrate 2 having a shape exceeding the allowable height range R on the lower surface of the substrate 2 is extracted), the substrate 2 having the warpage amount is determined. The component mounting (step S6) may not be performed. Thus, the yield can be improved by selectively mounting the components.

Further, in the above embodiment, the predetermined projection length L _F, when the holder 4 is located at the raised height position P2, the holding member 4 fixed support pins 3 upper reference support high during the ascent Although the case where the length is set so as to be positioned at the height P3 has been described, the upper end of the support pin 3 fixed while the holding body 4 is raised is not limited to this case, and the height other than the reference support height P3. For example, in the case of the support pin 3 that supports the substrate 2 via the component mounted on the lower surface of the substrate 2, the length is set so as to be positioned at a reference support height P3 or less. You may do it.

  In addition to the mounting apparatus 1 of the above embodiment, when a plurality of mounting apparatuses are arranged side by side, the height information of the substrate 2 obtained by the mounting apparatus 1 is used as data for the subsequent mounting apparatuses. You may make it transmit. By transmitting data in this way, the data on the board 2 can be used effectively, and efficient mounting can be performed on a mounting line including a plurality of mounting apparatuses.

  Moreover, although the ER gel 15 is used for the electromagnetic fixing portion 5 in the above embodiment, a piezoelectric element or the like may be used.

  In the above embodiment, an optical or magnetic linear scale is used as the position detection means 7, but other means capable of detecting the position of the support pin 3 may be used.

  In the above embodiment, the reference support height P3 and the upper limit height P4 and the lower limit height of the allowable height range R are set horizontally (in the XY plane). It can be set as appropriate according to the properties and specifications required for the completed substrate 2. The reference support height P3, the upper limit height P4 of the allowable height range R, and the lower limit height may be set so as to support the substrate 2 in a state of warping upward or downward.

  In the above embodiment, the position detection means 7 is provided on each support pin 3, but the position detection means 7 may be provided only on a specific support pin 3.

  Further, the number and interval of the through holes 16 formed in the holding body 4 can be set as appropriate in addition to the arrangement of the above embodiment.

  It is to be noted that, by appropriately combining any of the above-described various embodiments, the effects possessed by them can be produced.

  The present invention can be applied to a substrate supporting apparatus and method for supporting a substrate, and a mounting apparatus and method for mounting components on a substrate.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus 2 Board | substrate 3 Support pin 4 Holding body 5 Electromagnetic fixing | fixed part 6 Lifting / lowering part 7 Position detection means 8 Mounting unit 9 Control part 10 Packing 11 Electrode 12 Power supply 13 Board | substrate support apparatus 14 Transport rail 15 ER gel 16 Through-hole R Allowable height Length range P1 Standby height position P2 Lifting height position P3 Reference support height P4 Upper limit value L of allowable height range R ₁ Initial protrusion length L _F Predetermined protrusion length

Claims (10)

A plurality of support pins (3) for supporting the substrate from the lower surface;
A holding body (4) for holding a plurality of support pins slidable in the vertical direction and projecting upward with an initial projecting length (L ₁ );
An elevating part (6) for raising the holding body from the standby height position (P1) to the raised height position (P2) and bringing the upper end of the support pin into contact with the lower surface of the substrate;
A plurality of electromagnetic fixing portions (5) for fixing the support pins in the vertical direction relative to the holder;
Position detection means (7) for individually detecting the vertical position of the support pin relative to the holding body in a non-contact state;
A first process in which the holding body is raised by the elevating unit from the standby height position (P1) to the raised height position (P2) so that the plurality of support pins are in contact with the lower surface of the substrate; A second process of detecting a support pin that has reached a predetermined protrusion length (L _F ) smaller than the initial protrusion length (L ₁ ) by the detection means, and a support that has reached a predetermined protrusion length (L _F ) A control unit that performs the third process of fixing the pins individually by the electromagnetic fixing unit and fixing the other support pins by the electromagnetic fixing unit after the holding body reaches the rising height position (P2). With
In the control unit, based on the information on the allowable height range (R) of the substrate relative to the reference support height (P3) of the lower surface of the substrate supported by the support pins, the support pins do not support the substrate. When the holding body is positioned at the raised height position (P2) in the state, the height of the lower surface of the substrate (P4) when the height of the upper end of the support pin is the upper limit value of the allowable height range (R) of the substrate. as the above, the initial projection length of the support pins (L ₁₎ is set, the substrate supporting device. In the control unit, when the holding body is positioned at the rising height position (P2), the upper end of the support pin fixed while the holding body is rising is positioned at the reference support height (P3) on the lower surface of the substrate. The substrate support apparatus according to claim 1, wherein a predetermined protruding length (L _F ) is set.   The control unit performs the first to third processes, thereby supporting the portion of the substrate displaced below the reference support height (P3) on the lower surface of the substrate by the electromagnetic fixing unit. The substrate according to claim 2, wherein the substrate is lifted by a pin, and the posture of the substrate is corrected so as to be positioned at the reference support height (P3) on the lower surface of the substrate when reaching the raised height position (P2). Support device. A substrate support apparatus according to any one of claims 1 to 3,
A mounting unit (8) for lowering the nozzle holding the component and mounting the component on the upper surface of the board;
The control unit individually detects the height information of the plurality of support pins in a state of being individually fixed by the respective electromagnetic fixing units with respect to the holding body positioned at the rising height position (P2), and is detected. Based on the height information of the support pins, a fourth process for calculating and outputting the height information of the substrate corresponding to the support position of each support pin with respect to the substrate, and the nozzle holding the component based on the height information of the substrate A mounting apparatus that executes a fifth process of mounting a component on a substrate supported by a plurality of support pins while controlling a descending amount.   The control unit extracts a substrate having a shape exceeding the allowable height range (R) of the substrate based on the substrate height information output by the fourth processing, and selectively selects the fifth substrate for the extracted substrate. The mounting apparatus according to claim 4, wherein no processing is performed. The holding body in which the plurality of support pins are slidable in the vertical direction and protruded upward in the initial protruding length (L1) so that the plurality of support pins are in contact with the lower surface of the substrate is set at the standby height position (P1). A first step of raising the lift to a lift height position (P2);
A second step of detecting a support pin that has reached a predetermined protrusion length (L _F ) that is smaller than the initial protrusion length (L ₁ ) during the raising of the holder;
The support pins that have reached a predetermined protruding length (L _F ) are individually fixed in the vertical direction by electromagnetic external force, and the other support pins after the holder has reached the raised height position (P2). A third step of fixing in the vertical direction by electromagnetic external force,
Based on information on the allowable height range (R) of the substrate that is allowed relative to the reference support height (P3) of the lower surface of the substrate supported by the support pins, the support pins are in a state of not supporting the substrate, and When the holding body is positioned at the raised height position (P2), the height of the upper end of the support pin is equal to or higher than the height (P4) of the lower surface of the substrate at the upper limit value of the allowable height range (R) of the substrate. A substrate support method in which the initial protrusion length (L ₁ ) of the support pin is set. When the holding body is positioned at the raised height position (P2), a predetermined protrusion is made so that the upper end of the support pin fixed while the holding body is raised is located at the reference support height (P3) of the lower surface of the substrate. The substrate support method according to claim 6, wherein a length (L _F ) is set.   By performing the first to third steps, the portion of the substrate that is displaced below the reference support height (P3) on the lower surface of the substrate is lifted by a fixed support pin, and the height is increased. The substrate support method according to claim 7, wherein when the position (P2) is reached, the posture of the substrate is corrected so as to be positioned at the reference support height (P3) of the lower surface of the substrate. A substrate support method according to any one of claims 6 to 8,
Height information of a plurality of support pins in a state of being individually fixed by an electromagnetic external force to the holding body positioned at the raised height position (P2) is individually detected, and the detected height of the support pins A fourth step of calculating and outputting the height information of the substrate corresponding to the support position of each support pin with respect to the substrate based on the information;
And a fifth step of mounting the component on the substrate supported by the plurality of support pins while controlling the descending amount of the nozzle holding the component based on the height information of the substrate. Method.   Based on the substrate height information output in the fourth step, a substrate having a shape exceeding the allowable height range (R) of the substrate is extracted, and the fifth step is not selectively performed on the extracted substrate. The mounting method according to claim 9.

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