JP3421713B2 - Thin plate positioning device with holding function - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning mechanism for an assembly device for products using a thin plate made of a resinous material, and more particularly, it accurately adheres to a positioning portion while pressing a thin plate which tends to warp from above. The present invention relates to a thin plate positioning device with a pressing function.

[0002]

2. Description of the Related Art FIG. 4 is a cross-sectional view showing an example of a conventional thin plate positioning device of this type, and shows a schematic structure of a positioning unit for temporarily positioning the thin plate 1 and a holding unit for holding the thin plate 1 from above. It is shown.

The positioning unit includes a reference plate (fixed end plate) 2 serving as an end face reference for positioning the thin plate 1, and the thin plate 1.
Is driven in a direction parallel to the plate 4 by a pin (moving end plate) 3 for pressing and positioning the reference plate 2 on the reference plate, a plate 4 having a suction pad on the surface, and a drive shaft 7 extending from an NC actuator (not shown). Slider 5, a guide rail 6 for guiding the drive of the slider 5, and a pin 3 that are integrally formed with each other, and have their own spring mounting seat 1
0a and a slide table 8 elastically connected by a spring 9 engaged with a spring seat 10b of the slider 5, and a stopper plate 11 for restricting the movement of the slide table 8 in the compression direction. Are arranged orthogonally to each other. The reference plate 2 is fixed to each end of the plate 4.

On the other hand, the pressing unit includes a pressing plate 22 for pressing the thin plate 1 positioned on the positioning unit from its upper portion, a plurality of shafts 23 for fixedly supporting the pressing plate 22, and the thin plate 1 adsorbed on the plate 4. It is composed of a first slider 15 which moves up and down to be brought into close contact with the pad, and a second slider 16 which moves up and down to form a constant gap between the pressing plate 22 and the plate 4 while supporting the first slider 15. It

The operation of the thin plate positioning device with a pressing function having the above-described structure is as follows. First, the second slider 16 is lowered from above the thin plate 1 on the plate 4 so that the gap between the pressing plate 22 and the plate 4 becomes A millimeter (<twice the plate thickness of the thin plate 1) (two-dot chain line in the figure). Position of). Next, with the thin plate 1 mounted on the plate 4, the slider 5 is driven in the direction of the reference plate 2 to move the pin 3 to the outer end portion of the thin plate 1 and elastically grip the thin plate 1 for temporary positioning. To do. After that, the pressing plate 22 is moved down by the first slider 15 so that the plate 4 and the thin plate 1 come into close contact with each other. In this way, after fixing the back surface of the thin plate 1 to the suction pad on the plate 4, the positioning is completed.

[0006]

By the way, the thin plates 1 to be mass-produced are apt to be warped due to the material and structure thereof, for example, a shape as shown in FIG. 4 or an inverted shape thereof. Therefore, in the conventional thin plate positioning device with a pressing function, when the first slider 15 is lowered in parallel with the plate 4 and the thin plate 1 is pushed from above, displacement due to this warpage occurs or the warped portion becomes stable. In some cases, it did not come into close contact with the suction pad on the plate 4. Therefore, there is a problem that the positioning accuracy cannot be improved, and improvement has been desired.

Therefore, an object of the present invention is to provide a thin plate positioning device with a pressing function, which is capable of accurately positioning even a thin plate which is liable to warp and which stabilizes suction to a suction pad. It is in.

[0008]

In order to solve the above problems, according to the present invention, a positioning unit elastically gripping an end surface of a thin plate on a flat surface of the plate, and a back surface of the thin plate elastically gripped by the positioning unit. A pressing unit for closely contacting the flat surface with the flat surface, the pressing unit lifting and lowering vertically with respect to the flat surface, a shaft that is displaced in conjunction with the lifting mechanism, and supported by the shaft. In the thin plate positioning device with a pressing function, which comprises a pressing plate that presses the thin plate from above the surface of the thin plate, the shaft is a fixed length shaft, and the expanded and contracted length is longer than the fixed length shaft. Variable length shaft, and the pressing plate is supported so as to be tiltable with respect to the flat surface.

As a preferred form of the positioning unit, a fixed end plate for determining the position of one end of the thin plate to be placed on the plate, and the thin plate in the direction from the other end to the fixed end plate. A sliding end is provided for temporary positioning, and a moving end plate for elastically gripping the temporarily positioned thin plate is provided. Then, the pressing unit causes the lowermost end portion of the pressing plate to abut on the fixed end plate side of the temporarily positioned thin plate, and then sequentially abuts on the moving end plate side. In this case, the moving end plate retreats in accordance with the deformation force generated in the thin plate, but the elastic gripping force of the thin plate by the moving end plate due to the retreat is smaller than the minimum force for making a dent on the thin plate. To set.

[0010]

DETAILED DESCRIPTION OF THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of a thin plate positioning device with a holding function of the present invention. In the device of this embodiment, the configuration of the positioning unit is the same as that of the conventional device shown in FIG. 4, so the same reference numerals are given and detailed description thereof is omitted. Explained.

The pressing unit according to the present embodiment replaces the pressing plate 22 and the plurality of shafts 23 of the same length in the conventional apparatus shown in FIG. A fixed-length first shaft 13 fixed to one cylinder and the other end joined to one hinge part of the pressing plate 12, and one end fixed to the first cylinder 15 and the other end of the pressing plate to the other hinge part. And a second shaft 14 of variable length joined to.

The second shaft 14 is provided with a cylinder, which can be expanded and contracted by, for example, a spring material, between the joint portion to the hinge portion and the fixed portion to the first slider 15, and the pressing plate 12 has a cushion function. It is designed to have. The length in the extended state is set to be longer than that of the first shaft 13, and the shape of the pressing plate 12 supported together with the first shaft 13 is set to the pin 3 before contacting the thin plate 1.
The reference plate 2 side is relatively low with respect to the side, and after contacting the thin plate 1, the reference plate 2 side is gradually parallel to the plate 4. The cushioning function may be provided by hydraulic pressure or pneumatic pressure instead of the spring material, and a member other than the combination of the spring material and the cylinder may be used as long as the member has elasticity.

Next, the operation of the thin plate positioning device with the holding function of this embodiment will be described with reference to FIGS. First, the pressing plate 1 from above the thin plate 1 on the plate 4
The second slider 16 is lowered so that the gap between the lowermost end of 2 and the plate 4 is A millimeter (<twice the plate thickness of the thin plate 1) (the position indicated by the chain double-dashed line in FIG. 1). Next, the slider 5 is driven to move the pin 3 toward the reference plate 2 to temporarily position the thin plate 1 on the plate 4. Pin 3 at this time
The (slider 5) moves until the end face of the thin plate 1 contacts the reference plate 2.

FIG. 2 shows a sectional view in this temporary positioning state. Even if the thin plate 1 has a warp as shown in the figure, the force generated when correcting the warp has a cushioning function. Since it is gently absorbed by the pressing plate 12, the position on the plate 4 is not largely displaced. In this state, the first slider 15 is gradually lowered. Then, the pressing plate 12 sequentially presses the surface of the thin plate 1 from the side close to the reference plate 2 toward the pin 3 side. As a result, the back surface of the thin plate 1 is brought into close contact with the suction pad on the plate 4 in order from the part temporarily positioned by the reference plate 2 to the part close to the pin 3.

The thin plate 1 is pushed by the pressing plate 12.
A deforming force having a component in the moving direction of the pin 3 is generated. Then, the pin 3 retracts and the spring 9 extends in accordance with this deforming force. If the force generated by the spring 9 at this time, that is, the elastic gripping force P of the thin plate 1 is too large, a dent is made on the thin plate 1, so the following formula is set to be satisfied. Maximum propulsion force <P (= α / spring constant) <Minimum force to make a dent on thin plate 1

Here, the propulsive force is a force required to move the thin plate 1 backward, and the denting force is a force that deforms the outer shape of the thin plate 1. Further, α is the backward movement amount of the pin 3 (slide table 8).

FIG. 3 is a cross-sectional view showing a state in which the first slider 15 is lowered to bring the entire back surface of the thin plate 1 into close contact with the plate 4, and the thin plate 1 is flattened with its warpage corrected. . As a result, the thin plate 1 is reliably adsorbed by the adsorption pad on the plate 4. Moreover, before the suction, the pressing plate 12 having a cushion function and the force generated when the warp is corrected by the elastic gripping force of the pin 3 are absorbed and the provisional positioning is correctly performed. It will be highly accurate.

[0018]

As is apparent from the above description, according to the thin plate positioning device with a pressing function of the present invention, even if the temporarily positioned thin plate has a warp, it is tiltably supported by the lifting mechanism. Further, since the elastic pressing plate is brought into close contact with the plate while gently correcting the warped portion of the thin plate, the positioning accuracy is significantly increased as compared with the conventional device. Further, since the thin plates are brought into close contact with the reference plate side to the pin side one after another, there is an effect that the thin plates are securely and stably adsorbed to the adsorption site on the plate.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a thin plate positioning device with a holding function of the present invention.

FIG. 2 is a sectional view showing a positioning process according to the present embodiment.

FIG. 3 is a cross-sectional view showing a positioning completed state according to the present embodiment.

FIG. 4 is a cross-sectional view showing a configuration example of a conventional thin plate positioning device with a pressing function.

[Explanation of symbols]

1 Thin plate to be positioned 2 Reference plate (fixed end plate) 3 pins (moving end plate) 4 plates 5 slider 6 Guide rail 7 drive shaft 8 slide table 9 springs 10a, 10b Spring seat 11 Stopper plate 12 Press plate 13 First shaft 14 Second shaft 15 First slider 16 Second slider

Continuation of the front page (56) Reference JP-A-5-21999 (JP, A) JP-A-63-180469 (JP, A) JP-A-3-91998 (JP, A) JP-A-2-311234 (JP , A) JP-A-59-99790 (JP, A) JP-A-58-44791 (JP, A) Jitsukaihei 4-76341 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB) Name) B23Q 3/18 H05K 3/22 H05K 13/04

Claims (3)

(57) [Claims] 1. A positioning unit for elastically gripping an end surface of a thin plate on a flat surface of a plate, and a pressing unit for closely contacting a back surface of the thin plate elastically gripped by the positioning unit on the flat surface, The pressing unit includes an elevating mechanism that elevates and lowers vertically with respect to the flat surface, a shaft that is displaced in conjunction with the elevating mechanism, and a pressing plate that is supported by the shaft and presses the thin plate from above the surface thereof. In the thin plate positioning device with a holding function, the shaft comprises a fixed length shaft and a stretchable variable length shaft whose length in an extended state is longer than the fixed length shaft, and the holding plate comprises A thin plate positioning device with a pressing function, which is supported so as to be tiltable with respect to a flat surface. 2. A fixed end plate for determining the position of one end of the thin plate to be placed on the plate, and a temporary positioning by sliding the thin plate from the other end toward the fixed end plate. And a moving end plate that elastically grips the temporarily positioned thin plate, and the pressing unit contacts the lower end portion of the pressing plate with the fixed end plate side of the temporarily positioned thin plate. The method according to claim 1, wherein
Thin plate positioning device with the described holding function. 3. The moving end plate retreats according to the deformation force generated in the thin plate when pressed by the pressing plate, and the elastic gripping force of the thin plate by the moving end plate accompanying the retreat is The thin plate positioning device with a pressing function according to claim 2, wherein the force is smaller than a minimum force for making a dent on the thin plate.