JP3024951B2 - Semiconductor package lead bending device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead bending apparatus used in a process of manufacturing a semiconductor package (a semiconductor device in which a semiconductor chip is resin-sealed) such as an LSI (large-scale integrated circuit). More particularly, the present invention relates to a semiconductor package lead bending apparatus formed so that the height of the lower end of the lead can be bent to the same state without applying external pressure to the semiconductor chip and by a relatively simple mechanism.

[0002]

2. Description of the Related Art Conventionally, as an apparatus of this type, for example, an upper die which can be moved up and down, a lower die which is disposed below the upper die and has a semiconductor package mounted on an upper surface, and There is a semiconductor package provided with a bending die capable of moving up and down to bend a lead of a mounted semiconductor package (see, for example, Japanese Patent Application Laid-Open No. Sho 59-119859).

[0003]

By the way, as for the semiconductor package, the chip becomes larger and the package size becomes larger with the enhancement of the functions of electronic equipment such as a cellular phone and a portable computer in which this kind of package is incorporated. It is desired that the thickness be as small as possible so that the device can be reduced in size and thickness.

[0004] For this reason, a package of this type is conventionally used in FIG.
As shown in A, warpage (distortion) was unavoidable in the resin sealing portion a of the package.

Therefore, it is desirable that the lead bending device of this type of package is formed so that the height of the lower end of the lead can be uniformly bent in consideration of such package warpage. Otherwise, when the resin sealing portion is restored and warped after the lead is bent, FIG.
This is because, as shown in FIG. 2B, a package in which the lower end (connection terminal portion) of the lead b rises and cannot be accurately soldered to the printed circuit board (printed circuit board) c is manufactured.

However, as described above, this type of conventional device is usually formed of an upper die, a lower die, and a bending die, and only the leads are fixed by the upper die and the lower die, and the bending is performed in that state. The mold descends to bend the lead into, for example, a crank shape (Z shape).

Accordingly, in the case of the conventional device, when the leads are fixed, as shown in FIG. 12C, the resin sealing portion a of the package is corrected into a flat plate shape, and the leads b are bent in this state. there were.

As a result, when the conventional device is used, when the package is restored after being bent, as shown in FIG. 1B, the lead b is lifted, and a package in which the height of the lower end of the lead b is uneven is manufactured. Was.

In this case, since the semiconductor chip is a delicate electronic component that is weak against external pressure and the like, this kind of bending device is formed so that the pressure when the lead is bent is not directly applied to the chip. Is desirable. Also, it is desirable that this type of device can reduce the manufacturing cost, reduce the number of parts and attached devices so that the device can be reduced in size and space, and can efficiently bend the lead with a simple structure. .

The present invention has been proposed in view of such problems of the conventional apparatus. Therefore, a technical problem of the present invention is to fold a lead of a semiconductor package formed so that the height of the lower end of the lead can be bent to the same state efficiently with a simple structure without adversely affecting the semiconductor chip. It is to provide a bending device.

[0011]

The present invention employs the following technical means to solve the above-mentioned problems. That is, in the present invention, the upper die 1 which can be moved up and down, the lower die 2 which is disposed below the upper die 1 and on which the semiconductor package 3 is mounted on the upper surface, and which is mounted on the lower die 2 Semiconductor package 3
And a bending die 4 capable of raising and lowering the lead 3a for bending the lead 3a.
The pressing member 5 for pressing the upper surface of the package 3 is provided so as to avoid the location of the semiconductor package 3.
A support mechanism 7 for supporting the package 3 is provided in accordance with the degree of warpage of the upper mold 1. The pressing member 5 is provided with a spring 6 in a state in which the lower end 5a protrudes downward from the mold surface 1b of the upper mold 1.
And the above-mentioned support mechanism 7 is
b, a large number of pins 8 for supporting the semiconductor package, which are resiliently spring-loaded by the spring 10 with the upper end 8a protruding upward from the b.
A fixing mechanism 9 for fixing the pin 8 by utilizing the downward pressure of the upper mold 1 when closing the mold is formed (claim 1).

Here, the chip 3b of the semiconductor package 3
"Pressing the upper surface of the package 3 avoiding the above-mentioned position" means that the upper surface of the package 3 is pressed without pressing the position of the chip 3b so that the pressure of the upper die 1 is not directly applied to the chip 3b when the die is closed. , That means. Also, depending on the degree of warpage of the semiconductor package 3, this package 3
Supporting the package means that the package 3 is supported in its natural state without forcibly correcting the warp according to the respective deformed state of the semiconductor package 3.

To fix the pin 8 using the downward pressure of the upper mold 1 when closing the mold means to convert the force when the upper mold 1 descends into a force for fixing the pin 8, 1 means that the pin 8 is fixed in cooperation with 1. More specifically, the upper die 1 is advanced toward the pin 8 by the lowering action of the pin 8.
This is achieved by providing the fixing mechanism 9 with a member that presses and a member that tightens and fixes the pin 8.

As a member for pressing the pin 8, there is a member according to an embodiment described later shown in FIG. As a member for tightening and fixing the pin 8, there is a chuck 17 having a slit 17a as shown in FIG. The upper part of the chuck 17 is fixed to the inner wall of the storage hole 2 e of the pin 8. The chuck 17 is squeezed when the outer cylinder 18 moves down, and tightens and fixes the pin 8. The outer cylinder 18 is fixed to an operating rod 20 that is pushed down against the resilience of a spring 19 by the downward pressure of the upper die 1.

The cross-sectional shape of the pin 8 is arbitrary, such as circular or polygonal. However, the pin 8 is preferably formed to have a circular cross-sectional shape so that the coefficient of friction during sliding can be reduced and the vertical movement can be made smoothly.
The holding member 5 is preferably formed in a rectangular frame shape so as to uniformly press the package 3 by surrounding the chip 3b in a square shape.
However, the present invention is not limited to this, as long as the upper surface of the device can be pressed.

Further, according to the present invention, the suction hole 11 is opened at the center of the mold surface 2b of the lower mold 2, and the pins 8 are fixed to support the peripheral portion of the package 3 according to the outer shape of the semiconductor package 3. It is preferable that they are arranged in a rectangular shape in plan view with an interval (claim 2).

In this case, the package 3 can be sucked to the mold surface 2b of the lower mold 2 through the suction hole 11, so that the package 3 can be set accurately and easily.
Also, since the pins 8 are arranged in accordance with the outer shape of the package 3, the package 3 can be efficiently supported with a small number of pins 8. In the present invention, the suction hole 11 may be omitted, the pin 8 may be provided at the center of the package 3, and the entire lower surface of the package 3 may be supported by the pin 8.

In the case of the present invention, as shown in FIG. 6 and the like, the fixing mechanism 9 comprises a movable body 13 which is capable of being restored by a pressing rod 12 having an open lower end of the upper mold 1 when the mold is closed. It is preferable that the movable body 13 is formed by a pressing body 14 which is pushed out laterally toward the pin 8 by the downward pressure of the movable body 13 and which is capable of restoring operation in which the tip end portion 14a presses and fixes the pin 8 (claim 3). In this case, since the pins 8 can be fixed with a relatively small number of components, the device can be provided at low cost, and assembly and manufacturing can be facilitated.

Further, according to the present invention, the distal end portion 14a of the pressing body 14 is disposed so as to be freely inserted between the pins 8, and the pressing body 14 is formed so that the pin 8 can be pressed and fixed on both sides of the distal end portion 14a. Is preferable (claim 4). In this case, since two pins 8 can be fixed simultaneously by one pressing body 14, the number of parts can be reduced and the pins 8 can be efficiently fixed compared to the case where the pressing bodies 14 are arranged together with the pins 8. .

In the present invention, it is preferable that the pressing body 14 is formed with a cushion material 14c.
In this case, the pressing body 14 can have a pressure adjusting function and a buffering function.

[0021]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. Reference numeral 1 denotes an upper die capable of vertically moving, and reference numeral 2 denotes a lower die which is disposed below the upper die 1 and on which the semiconductor package 3 is mounted. 4
Is a bending mold that bends the leads 3a of the semiconductor package 3 placed on the lower mold 2 and that can move up and down freely.

The lower die 2 is formed with a protruding frame 2a in contact with the leads 3a of the semiconductor package 3 in a rectangular shape in plan view. The upper mold 1 is formed with a projecting frame 1a for pre-bending the lead 3a when the mold is closed, facing the projecting frame 2a of the lower mold 2. The lead 3a before bending is slightly different in height according to the warpage of the package 3. Therefore, in this embodiment, such a lead 3 a is
Before being bent into a crank shape (Z shape), it is formed so as to be able to be slightly bent and corrected to the same state in advance by the protruding frame 1a of the upper die 1.

Reference numeral 5 denotes a pressing member provided on the upper die 1 for pressing the upper surface of the package 3 while avoiding the location of the chip 3b of the semiconductor package 3. This holding member 5
Is spring-repelled by a spring 6 with the lower end 5a protruding downward from the mold surface 1b of the upper mold 1.

Reference numeral 7 denotes a support mechanism provided on the lower die 2 for supporting the semiconductor package 3 in accordance with the degree of warpage of the package. The support mechanism 7 includes a number of pins 8 for supporting the semiconductor package, and a fixing mechanism 9 for fixing the pins 8 by using the downward pressure of the upper mold 1 when closing the mold. The pin 8 is attached to the mold surface 2b of the lower mold 2.
The upper end 8a is repelled by the spring 10 so as to protrude upward.

In this embodiment, the pins 8 are all formed of a ceramic material having the same length and diameter and a circular cross section. In this embodiment, as shown in FIG. 4, the pins 8 are arranged in a rectangular shape in a plan view at regular intervals so as to support the periphery of the semiconductor package 3 in accordance with the outer shape of the semiconductor package 3. I have.

Reference numeral 11 denotes a suction hole opened at the center of the mold surface 2b of the lower mold 2. A projection 2c of a rectangular frame is formed on the mold surface 2b of the lower mold 2 so as to surround the suction hole 11 and to face the lower end 5a of the pressing member 5 in a facing manner. The height of the protrusion 2c is selected to be lower than the upper end 8a of the pin 8.

The fixing mechanism 9 is, as shown in FIG.
A movable body 13 which can be restored by a pressing rod 12 having an open lower end of the upper mold 1 when the mold is closed, and a downward movement of the movable body 13 causes the pin 8 to be pushed laterally toward the pin 8 so that the pin 8 is moved forward. 14a is pressed and fixed, and the restoring operation is possible.
And formed.

The movable body 13 includes a shaft 13a disposed at a position facing the pressing rod 12, and an operating pin 13b having a lower end connected to the shaft 13a. The lower operation pin 13b, the tapered portion 13b ₁ which diameter is reduced downward is formed. 15 is the movable body 1
Reference numeral 3 denotes a spring that constantly springs upward.

The upper part of the pressing member 14 is formed on the inclined surface shaped to engage the tapered portion 13b ₁ of the operation pin 13b. The base end 14b of the pressing body 14 is
6 is repelled so as to face the storage hole 2d of the operation pin 13b.

In this embodiment, the pressing member 14 is
In this embodiment, the front end 14a of the pressing body 14 is provided with pins 8a at both sides of the front end 14a.
Is formed so as to be pressed and fixed.

The position of the pin 8 which engages with both sides of the distal end portion 14a of the pressing body 14 is formed in an inverted conical engaging portion 8b whose diameter is reduced downward. Both sides of the pressing body 14 are formed in an inclined surface shape so as to engage with the engaging portion 8b of the pin 8. In this case, the pressing body 14 is
As shown in (1), a curved surface portion 14d gradually narrowing toward the distal end may be provided, and the pin 8 may be pressed and fixed by the curved surface portion 14d. in this case,
Since it is not necessary to form the engaging portion 8b on the pin 8,
Accordingly, the shape of the pin 8 can be simplified, and the cost can be reduced.

The pressing member 14 is provided with a cushion member 14c. The cushion 14c is made of a urethane rubber plate or the like, and is formed by bonding the tip 14a and the base 14b together with the cushion 14c.

Next, the operation of the present invention will be described. First, the semiconductor package 3 is set on the lower mold 2. At this time, since the upper end 8a of the pin 8 protrudes slightly higher than the protrusion 2c, the package 3 is first supported by the upper end 8a of the pin 8.

Next, the upper die 1 descends in this state. In this case, the lower end 5a of the pressing member 5 is in a state of being protruded downward from the mold surface 1b of the upper mold 1 by the elastic force of the spring 6, as shown in FIG. Therefore, when the upper die 1 descends, first, the lower end 5 a of the pressing member 5 presses the upper surface of the package 3. In this case, since the pressing force of the upper mold 1 is larger than the elastic force of the spring 6, as the upper mold 1 descends against the elastic force of the spring 6, the pressing member 5 presses the package 3 while pressing the package 3. It is pushed into the upper mold 1 gradually.

Since the pins 8 are resiliently pushed upward by the springs 10, the pins 8 are supported by the pressing members 5 so as to follow the lower surface of the package 3. In this case, in this embodiment, since the protrusion 2c is formed on the mold surface 2b of the lower mold 2, the package 3 is pressed against the upper end of the protrusion 2c when the mold is closed, and the height of the protrusion 2c is increased. Is supported by the pin 8.

When the upper die 1 moves down, the pressing rod 12 moves down together with the upper die 1 and presses the shaft rod 13a of the movable body 13 downward. Therefore, the operating pin 13b integrated with the shaft 13a
Is lowered, and the pressing body 14 advances toward the pin 8. When the mold is closed, in this embodiment, both side surfaces of the distal end portion 14a of the pressing body 14 are engaged with the engaging portions 8b of the pins 8, and the pins 8 are pressed and fixed.

Next, in this state, the root of the lead 3a is preliminarily bent by the projecting frame 1a of the upper die 1, and then the bending die 4
Is lowered, and the lead 3a is bent into a crank shape.

When the bending is completed and the mold is opened, the movable body 13 is raised by the elastic action of the spring 15 in conjunction with the rise of the upper mold 1. Accordingly, the pressing body 14 is opened, and the pressing body 1
4 is restored by the resilient action of the spring 16, and at the same time, the pin 8 is raised by the resilient force of the spring 10 and is restored.

[0039]

As described above, in the device of the present invention, the holding member for pressing the upper surface of the semiconductor package while avoiding the location of the chip is provided on the upper die, and the support mechanism for supporting the package according to the degree of warpage of the package is provided. Provided in the lower mold,
This support mechanism is formed by a large number of pins for supporting the semiconductor package and a fixing mechanism for fixing the pins by using the downward pressure of the upper mold when closing the mold.

Therefore, according to the device of the present invention, the lead can be bent without applying external pressure to the chip by the pressing member, and the package can be supported by the support mechanism in accordance with the warpage of the semiconductor package. Can be folded in the same state.

Further, since the apparatus of the present invention fixes the pins using the downward pressure of the upper die, there is no need to provide a dedicated device for fixing the pins. Therefore, according to this, the device of the present invention can be provided inexpensively, the size and space of the device can be reduced, and the pins can be fixed efficiently.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a preferred embodiment of the device of the present invention.

FIG. 2 is a longitudinal sectional view of a main part of the above device when a mold is closed.

FIG. 3 is a bottom view of a main part of the upper die.

FIG. 4 is a plan view of a main part of a lower die.

FIG. 5 is an enlarged sectional view of a main part taken along line VV of FIG. 4;

FIG. 6 is a longitudinal sectional view of a main part showing the operation of the above device.

FIG. 7 is a vertical sectional view of a main part showing the operation of the above device.

8A and 8B show another embodiment of the pressing body, wherein A is a plan view of a main part, and B is a side view as viewed from line BB of A.

FIG. 9 is a vertical sectional view of a main part showing another embodiment of the fixing mechanism.

FIG. 10 is a plan view of a semiconductor package manufactured by the same device.

FIG. 11 is a side view of a semiconductor package manufactured by the same device.

12A is a side view showing a state of a semiconductor package before processing, FIG. 12B is a side view showing a state of a package in which leads are bent by a conventional device, and FIG. 12C is a package when the leads are fixed by the conventional device. It is a side view which shows the state of.

[Explanation of symbols]

 Reference Signs List 1 upper mold 1b mold surface 2 lower mold 2b mold surface 3 semiconductor package 3a lead 3b chip 4 bending mold 5 holding member 5a lower end 6 spring 7 support mechanism 8 pin 8a upper end 9 fixing mechanism 10 spring

Continuation of the front page (56) References JP-A-7-321273 (JP, A) JP-A-10-92994 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 23 / 50 B21D 5/01

Claims (5)

(57) [Claims] An upper die capable of vertically moving, a lower die disposed below the upper die and having a semiconductor package mounted on an upper surface, and a lead of the semiconductor package mounted on the lower die. In a device for bending a lead of a semiconductor package having a bending die capable of freely moving up and down, a holding member that presses an upper surface of the package while avoiding a chip portion of the semiconductor package is provided on the upper die,
The lower mold has a support mechanism for supporting the semiconductor package in accordance with the degree of warpage of the semiconductor package. The pressing member is spring-loaded with a lower end protruding downward from the upper mold surface. The support mechanism described above uses a number of pins for supporting the semiconductor package, which are resiliently spring-loaded with the upper end protruding upward from the lower mold surface, and the lower pressure of the upper mold when closing the mold. A lead bending device for a semiconductor package, wherein the bending device is formed by a fixing mechanism for utilizing and fixing. 2. A suction hole is opened in the center of the lower mold surface, and pins are formed in a rectangular shape in a plan view at regular intervals so as to support the peripheral portion of the package in accordance with the outer shape of the semiconductor package. The device for bending a lead of a semiconductor package according to claim 1, wherein the device is disposed. 3. A movable body which can be restored by a fixing mechanism which is depressed by a pressing rod having an open lower end when the mold is closed, and a pin which is laterally pushed out toward the pin by the downward pressure of the movable body. The lead bending device for a semiconductor package according to claim 1, wherein the bending device is formed by a restoring-operable pressing body whose front end is pressed and fixed. 4. The semiconductor package according to claim 3, wherein the pressing body is disposed between the pins so that the distal end thereof can enter freely, and the pins are pressed and fixed on both sides of the distal end of the pressing body. Lead bending equipment. 5. The device according to claim 3, wherein the pressing body is formed with a cushion material.