JP4912080B2 - 電子部品ハンドリング装置およびその運用方法、ならびに試験用トレイおよびプッシャ - Google Patents

電子部品ハンドリング装置およびその運用方法、ならびに試験用トレイおよびプッシャ Download PDF

Info

Publication number
JP4912080B2
JP4912080B2 JP2006221876A JP2006221876A JP4912080B2 JP 4912080 B2 JP4912080 B2 JP 4912080B2 JP 2006221876 A JP2006221876 A JP 2006221876A JP 2006221876 A JP2006221876 A JP 2006221876A JP 4912080 B2 JP4912080 B2 JP 4912080B2
Authority
JP
Japan
Prior art keywords
electronic component
test
tray
handling apparatus
storage member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006221876A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008045996A (ja
JP2008045996A5 (ko
Inventor
明彦 伊藤
和之 山下
義仁 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP2006221876A priority Critical patent/JP4912080B2/ja
Priority to TW096125981A priority patent/TW200812890A/zh
Priority to KR1020097004250A priority patent/KR101075139B1/ko
Priority to PCT/JP2007/064170 priority patent/WO2008020523A1/ja
Publication of JP2008045996A publication Critical patent/JP2008045996A/ja
Publication of JP2008045996A5 publication Critical patent/JP2008045996A5/ja
Application granted granted Critical
Publication of JP4912080B2 publication Critical patent/JP4912080B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2006221876A 2006-08-16 2006-08-16 電子部品ハンドリング装置およびその運用方法、ならびに試験用トレイおよびプッシャ Expired - Fee Related JP4912080B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006221876A JP4912080B2 (ja) 2006-08-16 2006-08-16 電子部品ハンドリング装置およびその運用方法、ならびに試験用トレイおよびプッシャ
TW096125981A TW200812890A (en) 2006-08-16 2007-07-17 Electronic component handling apparatus, method for operating the electronic component handling apparatus, test tray and pusher
KR1020097004250A KR101075139B1 (ko) 2006-08-16 2007-07-18 전자 부품 핸들링 장치 및 그 운용 방법, 및 시험용 트레이및 푸셔
PCT/JP2007/064170 WO2008020523A1 (fr) 2006-08-16 2007-07-18 Appareil de manipulation de composants électroniques, procédé de fonctionnement de l'appareil de manipulation de composants électroniques, plateau de contrôle et poussoir

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006221876A JP4912080B2 (ja) 2006-08-16 2006-08-16 電子部品ハンドリング装置およびその運用方法、ならびに試験用トレイおよびプッシャ

Publications (3)

Publication Number Publication Date
JP2008045996A JP2008045996A (ja) 2008-02-28
JP2008045996A5 JP2008045996A5 (ko) 2009-09-10
JP4912080B2 true JP4912080B2 (ja) 2012-04-04

Family

ID=39082050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006221876A Expired - Fee Related JP4912080B2 (ja) 2006-08-16 2006-08-16 電子部品ハンドリング装置およびその運用方法、ならびに試験用トレイおよびプッシャ

Country Status (4)

Country Link
JP (1) JP4912080B2 (ko)
KR (1) KR101075139B1 (ko)
TW (1) TW200812890A (ko)
WO (1) WO2008020523A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6190264B2 (ja) * 2013-12-13 2017-08-30 東芝メモリ株式会社 半導体製造装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998007041A1 (fr) * 1996-08-09 1998-02-19 Advantest Corporation Appareil d'essai de dispositifs a semi-conducteur
JP4222442B2 (ja) * 1999-07-16 2009-02-12 株式会社アドバンテスト 電子部品試験装置用インサート
JP2002071755A (ja) * 2000-08-28 2002-03-12 Advantest Corp 半導体試験装置
JP3971214B2 (ja) * 2002-03-11 2007-09-05 ヤマハ発動機株式会社 電子部品検査装置
KR100946482B1 (ko) * 2004-11-22 2010-03-10 가부시키가이샤 어드밴티스트 전자 부품 핸들링 장치용 인서트, 푸셔, 테스트 헤드용소켓 가이드 및 전자 부품 핸들링 장치

Also Published As

Publication number Publication date
KR20090046900A (ko) 2009-05-11
TWI359102B (ko) 2012-03-01
KR101075139B1 (ko) 2011-10-20
JP2008045996A (ja) 2008-02-28
TW200812890A (en) 2008-03-16
WO2008020523A1 (fr) 2008-02-21

Similar Documents

Publication Publication Date Title
US7156680B2 (en) Insert and electronic component handling apparatus provided with the same
US4940935A (en) Automatic SMD tester
KR100301750B1 (ko) 반도체디바이스용트레이꺼내기장치및반도체디바이스용트레이수납장치
US20060208721A1 (en) Semiconductor carrier tray, and burn-in board, burn-in test method, and semiconductor manufacturing method using the semiconductor carrier tray
US9671452B2 (en) Substrate inspection apparatus and probe card transferring method
JP2008076308A (ja) 電子部品試験装置用のインタフェース装置
JPWO2008041334A1 (ja) 電子部品試験装置
WO2004011952A1 (ja) 電子部品試験装置
WO2006054765A1 (ja) 電子部品ハンドリング装置用のインサート、プッシャ、テストヘッド用のソケットガイドおよび電子部品ハンドリング装置
US7371078B2 (en) Insert attachable to an insert magazine of a tray for holding an area array type electronic component to be tested
JP3940979B2 (ja) ソケットタイプのモジュールテスト装置
KR19990006956A (ko) 반도체 집적회로 시험장치
JP2018189392A (ja) 電子部品試験装置用のキャリア
JP4912080B2 (ja) 電子部品ハンドリング装置およびその運用方法、ならびに試験用トレイおよびプッシャ
US7589521B2 (en) Universal cover for a burn-in socket
KR100798104B1 (ko) 전자부품 시험장치
KR100824128B1 (ko) 전자 부품 핸들링 장치용 인서트 및 전자 부품 핸들링 장치
JPH1098083A (ja) 検査ソケットおよび電気特性検査装置
WO2009116165A1 (ja) トレイ搬送装置およびそれを備えた電子部品試験装置
JP4884977B2 (ja) 電子部品ハンドリング装置用のインサート、プッシャ、テストヘッド用のソケットガイドおよび電子部品ハンドリング装置
US11802905B2 (en) System level test device for memory
KR20050009066A (ko) 반도체 소자 테스트 핸들러용 캐리어 모듈
JP2008045996A5 (ko)
WO2010052780A1 (ja) 着脱装置、コンタクトアーム、電子部品ハンドリング装置および保持ユニット
KR100326640B1 (ko) 모듈아이씨핸들러용캐리어

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090729

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090729

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110706

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110901

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120104

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120117

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150127

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150127

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees