JP4908330B2 - 液晶表示装置用アレイ基板の製造方法 - Google Patents
液晶表示装置用アレイ基板の製造方法 Download PDFInfo
- Publication number
- JP4908330B2 JP4908330B2 JP2007172231A JP2007172231A JP4908330B2 JP 4908330 B2 JP4908330 B2 JP 4908330B2 JP 2007172231 A JP2007172231 A JP 2007172231A JP 2007172231 A JP2007172231 A JP 2007172231A JP 4908330 B2 JP4908330 B2 JP 4908330B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electrode
- gate
- pixel
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 107
- 238000004519 manufacturing process Methods 0.000 title claims description 78
- 239000000758 substrate Substances 0.000 title claims description 69
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 50
- 229910052751 metal Inorganic materials 0.000 claims description 145
- 239000002184 metal Substances 0.000 claims description 145
- 229920002120 photoresistant polymer Polymers 0.000 claims description 101
- 230000008569 process Effects 0.000 claims description 100
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 57
- 239000007769 metal material Substances 0.000 claims description 38
- 230000000903 blocking effect Effects 0.000 claims description 28
- 239000012535 impurity Substances 0.000 claims description 23
- 238000005530 etching Methods 0.000 claims description 18
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000000059 patterning Methods 0.000 claims description 7
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 7
- 230000000873 masking effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 314
- 239000010408 film Substances 0.000 description 41
- 238000003860 storage Methods 0.000 description 40
- 239000004065 semiconductor Substances 0.000 description 39
- 239000010409 thin film Substances 0.000 description 21
- 239000011159 matrix material Substances 0.000 description 15
- 239000011651 chromium Substances 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000002834 transmittance Methods 0.000 description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 239000011733 molybdenum Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- -1 aluminum alloy AlNd Chemical class 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/13629—Multilayer wirings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Description
図1は、液晶表示装置を拡大して概略的に示した斜視図である。
図1に示したように、液晶パネル51は、液晶層(図示せず)を間に相互に離隔された第1基板5と第2基板10で構成されて、第2基板10と向かい合う第1基板5の一面には、ブラックマトリックス6と赤色R、緑色G、青色Bのカラーフィルターパターン7a、7b、7cと、カラーフィルターパターン7a、7b、7c上に透明な共通電極9が構成される。
後述する工程は、5マスク工程の一例を説明している。
このような問題を解決するための方法として、4マスク工程が提案された。
図2に示したように、アレイ基板は、基板60上に一方向に延長されたゲート配線62と、これと交差して画素領域Pを定義するデータ配線98を含む。
これにより、液晶パネルの画面には、波状の細い線が示される波状ノイズが発生する。
図4Aと図5Aと図6Aに示したように、基板60上にスイッチング領域Sを含む画素領域Pと、基板60の端側に配置されるゲートパッド領域GPとデータパッド領域DPと、ストレージ領域Cとを定義する。
この時、ストレージ領域Cは、ゲート配線領域GLの一部に定義される。
図7に示したように、基板100上に一方向に延長されて、一端にゲートパッド106が構成されたゲート配線104と、ゲート配線104と交差して画素領域Pを定義し、一端にデータパッド148を含むデータ配線146を構成する。
102:ゲート電極
104:ゲート配線
106:ゲートパッド
122:アクティブ層
126:バッファ金属層
136:ソース電極
138:ドレイン電極
140:画素電極
142:ゲートパッド電極
146:データ配線
148:データパッド
Claims (7)
- 第1マスク工程において、画素領域を含む基板上にゲート電極と前記ゲート電極に連結されるゲート配線を形成する段階と、
第2マスク工程において、前記ゲート電極及びゲート配線の上部に第1絶縁膜と、前記第1絶縁膜の上部に、前記ゲート電極に対応してアクティブ層とオーミックコンタクト層、そして前記オーミックコンタクト層上にバッファ金属層を形成する段階と、
第3マスク工程において、前記オーミックコンタクト層の上部に、透明導電性金属物質の第1ソース層と不透明金属物質層の第2ソース層とを含むソース電極及び前記透明導電性金属物質の第1ドレイン層と前記不透明金属物質層の第2ドレイン層とを含むドレイン電極を、前記ドレイン電極に連結させ、前記透明金属物質の第1画素層と前記不透明金属物質の第2画素層とを含む画素パターンを、前記ソース電極に連結させ、前記ゲート配線と交差して前記画素領域を定義するデータ配線を形成する段階と、
第4マスク工程において、前記第2画素層を一部除去することによって前記第1画素層で構成される画素電極と、前記画素電極の一端部に第2画素層で構成される不透明金属パターンとを形成する段階とを含み、
前記第1ソース層および前記第1ドレイン層は、それぞれ前記バッファ金属層上に配置されかつ前記バッファ金属層に接触し、
前記透明導電性金属物質は、インジウムースズーオキサイドITOまたはインジウムージンクーオキサイドIZOを含み、
前記第1マスク工程は、前記ゲート配線の一端に位置するゲートパッドを形成する段階を含み、
前記第2マスク工程は、第1絶縁膜をパターニングして前記ゲートパッドを露出させる段階を含み、
前記第3マスク工程は、前記透明導電性金属物質の第1ゲートパッド電極層と前記不透明金属物質の第2ゲートパッド電極層とを含むゲートパッド電極パターンを形成する段階を含み、
前記第4マスク工程は、前記第2ゲートパッド電極層を除去して前記第1ゲートパッド電極層で構成されるゲートパッド電極を形成する段階を含み、
前記第2マスク工程は、前記ゲート電極、ゲート配線及びゲートパッドの上部に前記第1絶縁膜、純粋非晶質シリコン層、不純物非晶質シリコン層及びフォトレジスト層を形成する段階と、
透過部、遮断部及び半透過部を有するマスクを利用して前記フォトレジスト層を露光する段階と、
前記フォトレジスト層を現像して前記ゲートパッドに対応する前記不純物非晶質シリコン層を露出させて、前記アクティブ層に対応する部分は、第1高さを有して、他の部分は、前記第1高さより低い第2高さを有する第1フォトレジストパターンを形成する段階と、
前記第1フォトレジストパターンをエッチングマスクとして利用して、前記不純物非晶質シリコン、前記純粋非晶質シリコン層及び第1絶縁膜をエッチングして前記ゲートパッドを露出させる段階と、
前記第2高さを有する第1フォトレジストパターンを除去して前記アクティブ層に対応する第2フォトレジストパターンを形成する段階と、
前記第2フォトレジストパターンをエッチングマスクとして利用して、前記不純物非晶質シリコン層と前記純粋非晶質シリコン層を形成する段階とを含むことを特徴とする液晶表示装置用アレイ基板の製造方法。
- 前記画素電極は、前記一端部において、前記データ配線に近接されることを特徴とする請求項1に記載の液晶表示装置用アレイ基板の製造方法。
- 前記マスクの透過部及び遮断部は、各々前記ゲートパッド及び前記アクティブ層に対応する位置に配置されることを特徴とする請求項1に記載の液晶表示装置用アレイ基板の製造方法。
- 前記第2フォトレジストパターンは、前記ゲート電極の幅より狭い幅であることを特徴とする請求項1に記載の液晶表示装置用アレイ基板の製造方法。
- 前記第3マスク工程は、前記データ配線の一端に位置して、前記透明導電性金属物質の第1データパッド層と前記不透明金属物質の第2データパッド層を含むデータパッドパターンを形成する段階を含み、前記第4マスク工程は、前記第2データパッド層を除去して、前記第1データパッド層で構成されるデータパッドを形成する段階を含むことを特徴とする請求項1に記載の液晶表示装置用アレイ基板の製造方法。
- 前記第3マスク工程は、前記オーミックコンタクト層の上部に、透明導電性層、不透明導電性層及びフォトレジスト層を形成する段階と、
透過部と遮断部を有する第2マスクを利用して前記フォトレジスト層を露光する段階と、
前記フォトレジスト層を現像して、前記ソース電極及びドレイン電極に対応する第1フォトレジストパターンと、前記画素パターンに対応する第2フォトレジストパターンと、前記データ配線に対応する第3フォトレジストパターンを形成する段階と、
前記第1ないし第3フォトレジストパターンをエッチングマスクとして利用して、前記不透明導電性層と前記透明導電性層をエッチングする段階と、
前記ソース電極及びドレイン電極をエッチングマスクとして利用して、前記オーミックコンタクト層を除去することによって前記アクティブ層を露出させる段階とを含むことを特徴とする請求項1に記載の液晶表示装置用アレイ基板の製造方法。
- 前記第4マスク工程は、前記ソース電極、前記ドレイン電極及び前記画素パターンの上部に、第2絶縁膜とフォトレジスト層を形成する段階と、
透過部と遮断部を有するマスクを利用して、前記フォトレジスト層を露光する段階と、
前記フォトレジスト層を現像し、前記データ配線より広い幅を有して、前記画素電極の一端部を覆って前記画素パターンに対応する前記第2絶縁膜を露出させるフォトレジストパターンを形成する段階と、
前記フォトレジストパターンをエッチングマスクとして利用して、前記第2絶縁膜、前記第2画素層をエッチングすることによって前記画素電極と、前記画素電極の一端部に前記不透明金属パターンとを形成する段階とを含むことを特徴とする請求項1に記載の液晶表示装置用アレイ基板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060060866A KR101235106B1 (ko) | 2006-06-30 | 2006-06-30 | 액정표시장치용 어레이 기판과 그 제조방법 |
KR10-2006-0060866 | 2006-06-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008015525A JP2008015525A (ja) | 2008-01-24 |
JP4908330B2 true JP4908330B2 (ja) | 2012-04-04 |
Family
ID=38875668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007172231A Expired - Fee Related JP4908330B2 (ja) | 2006-06-30 | 2007-06-29 | 液晶表示装置用アレイ基板の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7960735B2 (ja) |
JP (1) | JP4908330B2 (ja) |
KR (1) | KR101235106B1 (ja) |
CN (1) | CN100559250C (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW413844B (en) | 1998-11-26 | 2000-12-01 | Samsung Electronics Co Ltd | Manufacturing methods of thin film transistor array panels for liquid crystal displays and photolithography method of thin films |
JP5371341B2 (ja) * | 2007-09-21 | 2013-12-18 | 株式会社半導体エネルギー研究所 | 電気泳動方式の表示装置 |
KR20100008146A (ko) * | 2008-07-15 | 2010-01-25 | 삼성전자주식회사 | 입체영상 표시 장치 |
CN101881911B (zh) * | 2009-05-07 | 2012-08-22 | 上海天马微电子有限公司 | 液晶显示装置及其驱动方法 |
WO2011016287A1 (ja) * | 2009-08-04 | 2011-02-10 | シャープ株式会社 | アクティブマトリックス基板、液晶表示パネル、液晶表示装置およびアクティブマトリックス基板の製造方法 |
WO2011016286A1 (ja) * | 2009-08-04 | 2011-02-10 | シャープ株式会社 | アクティブマトリックス基板、液晶表示パネル、液晶表示装置およびアクティブマトリックス基板の製造方法 |
KR20110067765A (ko) * | 2009-12-15 | 2011-06-22 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
KR101210146B1 (ko) | 2010-04-05 | 2012-12-07 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 제조 방법 |
TWI420213B (zh) * | 2010-04-28 | 2013-12-21 | Au Optronics Corp | 液晶顯示面板 |
KR101750430B1 (ko) * | 2010-11-29 | 2017-06-26 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판의 제조 방법 |
US8435832B2 (en) * | 2011-05-26 | 2013-05-07 | Cbrite Inc. | Double self-aligned metal oxide TFT |
CN102629575B (zh) * | 2011-08-23 | 2014-09-24 | 京东方科技集团股份有限公司 | 一种阵列基板及其制造方法 |
CN102751240B (zh) * | 2012-05-18 | 2015-03-11 | 京东方科技集团股份有限公司 | 薄膜晶体管阵列基板及其制造方法、显示面板、显示装置 |
CN102749776A (zh) * | 2012-07-02 | 2012-10-24 | 深圳市华星光电技术有限公司 | 一种阵列基板、液晶显示装置及阵列基板的制造方法 |
US8842252B2 (en) * | 2012-07-02 | 2014-09-23 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Array substrate, LCD device, and method for manufacturing array substrate |
CN102983103B (zh) * | 2012-12-10 | 2015-09-16 | 京东方科技集团股份有限公司 | 制作薄膜晶体管阵列基板的方法、阵列基板和显示装置 |
JP6168915B2 (ja) * | 2013-08-22 | 2017-07-26 | キヤノン株式会社 | 半導体装置の製造方法 |
CN103605242B (zh) * | 2013-11-21 | 2016-08-31 | 合肥京东方光电科技有限公司 | 一种阵列基板及其制备方法和显示装置 |
CN103715095B (zh) * | 2013-12-27 | 2016-01-20 | 北京京东方光电科技有限公司 | 掩膜版组、薄膜晶体管及制作方法、阵列基板、显示装置 |
CN103745955B (zh) * | 2014-01-03 | 2017-01-25 | 京东方科技集团股份有限公司 | 显示装置、阵列基板及其制造方法 |
EP3152144A1 (en) * | 2014-06-03 | 2017-04-12 | Otis Elevator Company | Automatic determination of elevator user's current location and next destination with mobile device technology |
KR102550460B1 (ko) | 2016-03-30 | 2023-07-03 | 삼성디스플레이 주식회사 | 표시 장치 |
CN105870202A (zh) | 2016-06-21 | 2016-08-17 | 深圳市华星光电技术有限公司 | 薄膜晶体管及其制造方法、液晶显示面板 |
CN113380896B (zh) * | 2021-05-20 | 2023-04-25 | 惠科股份有限公司 | 薄膜晶体管的制备方法、薄膜晶体管及显示面板 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2870072B2 (ja) | 1989-12-25 | 1999-03-10 | カシオ計算機株式会社 | 液晶表示装置 |
TW413844B (en) | 1998-11-26 | 2000-12-01 | Samsung Electronics Co Ltd | Manufacturing methods of thin film transistor array panels for liquid crystal displays and photolithography method of thin films |
JP3420201B2 (ja) * | 1999-12-22 | 2003-06-23 | 日本電気株式会社 | 液晶表示装置 |
JP2001326360A (ja) | 2000-05-18 | 2001-11-22 | Sharp Corp | アクティブマトリクス基板の製造方法およびアクティブマトリクス基板および薄膜電界効果トランジスタの製造方法 |
US6620655B2 (en) * | 2000-11-01 | 2003-09-16 | Lg.Phillips Lcd Co., Ltd. | Array substrate for transflective LCD device and method of fabricating the same |
KR100750872B1 (ko) | 2001-01-18 | 2007-08-22 | 엘지.필립스 엘시디 주식회사 | 액정표장치용 어레이기판과 그 제조방법 |
US6888586B2 (en) * | 2001-06-05 | 2005-05-03 | Lg. Philips Lcd Co., Ltd. | Array substrate for liquid crystal display and method for fabricating the same |
JP4984369B2 (ja) | 2002-12-10 | 2012-07-25 | 株式会社ジャパンディスプレイイースト | 画像表示装置及びその製造方法 |
KR100602062B1 (ko) * | 2003-04-03 | 2006-07-14 | 엘지.필립스 엘시디 주식회사 | 수평 전계 인가형 액정 표시 장치 및 그 제조 방법 |
KR100532087B1 (ko) * | 2003-06-20 | 2005-11-30 | 엘지.필립스 엘시디 주식회사 | 액정표시장치 |
US7916254B2 (en) * | 2003-10-27 | 2011-03-29 | Hitachi Displays, Ltd. | Liquid crystal display apparatus for performing alignment process by irradiating light |
KR101167661B1 (ko) * | 2005-07-15 | 2012-07-23 | 삼성전자주식회사 | 배선 구조와 배선 형성 방법 및 박막 트랜지스터 기판과 그제조 방법 |
KR101221261B1 (ko) * | 2006-02-15 | 2013-01-11 | 엘지디스플레이 주식회사 | 액정 표시 장치용 어레이 기판 및 그 제조 방법 |
TWI418910B (zh) * | 2009-05-26 | 2013-12-11 | Au Optronics Corp | 陣列基板及其形成方法 |
-
2006
- 2006-06-30 KR KR1020060060866A patent/KR101235106B1/ko active IP Right Grant
-
2007
- 2007-06-20 CN CNB2007101114230A patent/CN100559250C/zh active Active
- 2007-06-26 US US11/823,486 patent/US7960735B2/en not_active Expired - Fee Related
- 2007-06-29 JP JP2007172231A patent/JP4908330B2/ja not_active Expired - Fee Related
-
2011
- 2011-05-11 US US13/105,341 patent/US8258022B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20080001155A1 (en) | 2008-01-03 |
US7960735B2 (en) | 2011-06-14 |
JP2008015525A (ja) | 2008-01-24 |
KR101235106B1 (ko) | 2013-02-20 |
CN100559250C (zh) | 2009-11-11 |
US20110212581A1 (en) | 2011-09-01 |
CN101097375A (zh) | 2008-01-02 |
KR20080002197A (ko) | 2008-01-04 |
US8258022B2 (en) | 2012-09-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4908330B2 (ja) | 液晶表示装置用アレイ基板の製造方法 | |
KR101257811B1 (ko) | 액정표시장치용 어레이 기판과 그 제조방법 | |
JP4668893B2 (ja) | 液晶表示装置及びその製造方法 | |
KR101282893B1 (ko) | 액정표시장치용 어레이 기판과 그 제조방법 | |
JP4885805B2 (ja) | 液晶表示装置用アレイ基板とその製造方法 | |
JP4925057B2 (ja) | 横電界型の液晶表示装置用アレイ基板及びその製造方法 | |
JP4567589B2 (ja) | 液晶表示装置用アレイ基板及びその製造方法 | |
US7847289B2 (en) | Array substrate for liquid crystal display device and method of manufacturing the same | |
KR101284697B1 (ko) | 액정표시장치용 어레이 기판과 그 제조방법 | |
KR100920482B1 (ko) | 액정표시장치용 어레이 기판과 그 제조방법 | |
KR101242032B1 (ko) | 액정표시장치용 어레이 기판과 그 제조방법 | |
KR101396809B1 (ko) | 액정표시장치용 어레이 기판 및 그 제조방법 | |
KR20080001180A (ko) | 액정표시장치용 어레이 기판과 그 제조방법 | |
KR101124398B1 (ko) | 액정표시자치용 어레이 기판과 그 제조방법 | |
KR20090029572A (ko) | 액정표시장치용 어레이 기판 및 그 제조방법 | |
KR20080002271A (ko) | 횡전계 방식 액정표시장치용 어레이 기판과 그 제조방법 | |
KR20050108924A (ko) | 씨오티 구조 액정표시장치 및 그 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100716 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100726 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101026 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110202 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110428 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110509 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110511 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110713 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111012 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111219 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120112 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150120 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4908330 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |