JP4904138B2 - 液晶表示パネル製造システム及びこれを用いて製造された液晶表示パネル - Google Patents
液晶表示パネル製造システム及びこれを用いて製造された液晶表示パネル Download PDFInfo
- Publication number
- JP4904138B2 JP4904138B2 JP2006331502A JP2006331502A JP4904138B2 JP 4904138 B2 JP4904138 B2 JP 4904138B2 JP 2006331502 A JP2006331502 A JP 2006331502A JP 2006331502 A JP2006331502 A JP 2006331502A JP 4904138 B2 JP4904138 B2 JP 4904138B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- loader
- liquid crystal
- crystal display
- display panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N13/00—Exhaust or silencing apparatus characterised by constructional features ; Exhaust or silencing apparatus, or parts thereof, having pertinent characteristics not provided for in, or of interest apart from, groups F01N1/00 - F01N5/00, F01N9/00, F01N11/00
- F01N13/001—Gas flow channels or gas chambers being at least partly formed in the structural parts of the engine or machine
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N2240/00—Combination or association of two or more different exhaust treating devices, or of at least one such device with an auxiliary device, not covered by indexing codes F01N2230/00 or F01N2250/00, one of the devices being
- F01N2240/20—Combination or association of two or more different exhaust treating devices, or of at least one such device with an auxiliary device, not covered by indexing codes F01N2230/00 or F01N2250/00, one of the devices being a flow director or deflector
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N2260/00—Exhaust treating devices having provisions not otherwise provided for
- F01N2260/14—Exhaust treating devices having provisions not otherwise provided for for modifying or adapting flow area or back-pressure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N2290/00—Movable parts or members in exhaust systems for other than for control purposes
- F01N2290/02—Movable parts or members in exhaust systems for other than for control purposes with continuous rotary movement
- F01N2290/04—Movable parts or members in exhaust systems for other than for control purposes with continuous rotary movement driven by exhaust gases
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
Description
120、320 洗浄器
130−1、130−2 コータ
150−1、150−2 露光機
160、260、360 デベロッパー
170、270、370 検査器
180 アンローダ
210、310 第1ローダ
215、315 第2ローダ
220、330 第1コータ
235、355 第2コータ
250、350 第1露光機
255、355 第2露光機
280、285、380、385 移送ライン
340 第1バッファー
345 第2バッファー
Claims (3)
- 2つのポートを備え、各ポートにローディングされた1グループのカセットに対し基板の投入及び排出作業が同時に遂行できる第1ローダと、
2つのポートを備え、各ポートにローディングされた他グループのカセットに対し、基板の投入及び排出作業が同時に遂行できる第2ローダと、
前記第1ローダを介して投入される基板に対し、製造工程を遂行した後、前記第1ローダに移送させる第1工程部と、
前記第2ローダを介して投入される基板に対し、製造工程を遂行した後、前記第2ローダに移送させる第2工程部と、
前記基板の移送のための第1及び第2の移送ラインと、
を含み、
前記第1ローダ及び前記第2ローダは、同一カセットに対し、基板の投入及び排出作業を同時に遂行でき、
前記第1ローダ及び前記第2ローダから投入される基板に対し、共通して製造工程を遂行する共通工程部を更に含み、前記共通工程部は、前記第1及び第2の移送ラインを介して、前記第1ローダ、第2ローダ、第1工程部及び第2工程部に接続され、
前記第1の移送ラインは、前記第1ローダと前記第2ローダと前記共通工程部との間の基板の移送を可能にし、前記第2の移送ラインは、前記第1工程部と前記第2工程部と前記共通工程部との間の基板の移送を可能にし、
前記同一カセットから投入された基板は、前記同一カセットへ排出された基板と異なり、
前記第1工程部及び前記第2工程部は、各々互いに異なる製造工程が同時に進行できることを特徴とする液晶表示パネル製造システム。
- 前記第1工程部は、第1コータ及び第1露光機を含み、前記第2工程部は、第2コータ及び第2露光機を含む請求項1記載の液晶表示パネル製造システム。
- 前記共通工程部は洗浄器及び検査器を含む請求項1記載の液晶表示パネル製造システム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060024751A KR101291794B1 (ko) | 2006-03-17 | 2006-03-17 | 액정표시패널 제조 시스템 및 이에 의해 제조된액정표시패널 |
KR10-2006-0024751 | 2006-03-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007249177A JP2007249177A (ja) | 2007-09-27 |
JP4904138B2 true JP4904138B2 (ja) | 2012-03-28 |
Family
ID=37671554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006331502A Expired - Fee Related JP4904138B2 (ja) | 2006-03-17 | 2006-12-08 | 液晶表示パネル製造システム及びこれを用いて製造された液晶表示パネル |
Country Status (8)
Country | Link |
---|---|
US (1) | US7663731B2 (ja) |
JP (1) | JP4904138B2 (ja) |
KR (1) | KR101291794B1 (ja) |
CN (1) | CN100510880C (ja) |
DE (1) | DE102006055621B4 (ja) |
FR (1) | FR2898691B1 (ja) |
GB (1) | GB2436165B (ja) |
TW (1) | TWI350402B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103135264B (zh) * | 2011-11-30 | 2016-10-26 | 上海中航光电子有限公司 | 遮光元件加工装置 |
US9145271B2 (en) * | 2012-09-18 | 2015-09-29 | Varian Semiconductor Equipment Associates, Inc. | Optimization of conveyor belts used for workpiece processing |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2598721B2 (ja) * | 1991-03-27 | 1997-04-09 | 大日本スクリーン製造株式会社 | 回転式基板処理装置 |
JPH0870033A (ja) * | 1994-08-26 | 1996-03-12 | Kokusai Electric Co Ltd | 半導体製造装置のウェーハ移載機 |
JP3069945B2 (ja) * | 1995-07-28 | 2000-07-24 | 東京エレクトロン株式会社 | 処理装置 |
JPH1022358A (ja) * | 1996-06-28 | 1998-01-23 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
TW444275B (en) * | 1998-01-13 | 2001-07-01 | Toshiba Corp | Processing device, laser annealing device, laser annealing method, manufacturing device and substrate manufacturing device for panel display |
TW442891B (en) * | 1998-11-17 | 2001-06-23 | Tokyo Electron Ltd | Vacuum processing system |
TW469483B (en) * | 1999-04-19 | 2001-12-21 | Applied Materials Inc | Method and apparatus for aligning a cassette |
WO2000072375A1 (fr) * | 1999-05-20 | 2000-11-30 | Nikon Corporation | Contenant pour appareil d'exposition de support, procede de fabrication de dispositif et appareil de fabrication de dispositif |
TWI313489B (en) * | 2002-07-19 | 2009-08-11 | Toppoly Optoelectronics Corp | Post treatment of dry-etched metal film and system performing combined etching and stripping procedures |
JP4475864B2 (ja) * | 2002-09-11 | 2010-06-09 | 大日本印刷株式会社 | 混流型製造ラインシステム |
JP2005277049A (ja) * | 2004-03-24 | 2005-10-06 | Tokyo Electron Ltd | 熱処理システム及び熱処理方法 |
KR20050113350A (ko) * | 2004-05-27 | 2005-12-02 | 엘지.필립스 엘시디 주식회사 | 기판공정시스템 |
KR20060044032A (ko) * | 2004-11-11 | 2006-05-16 | 삼성전자주식회사 | 표시패널용 검사 장치 및 이의 검사 방법 |
JP4476133B2 (ja) * | 2005-02-24 | 2010-06-09 | 東京エレクトロン株式会社 | 処理システム |
-
2006
- 2006-03-17 KR KR1020060024751A patent/KR101291794B1/ko active IP Right Grant
- 2006-11-24 DE DE102006055621.6A patent/DE102006055621B4/de not_active Expired - Fee Related
- 2006-11-29 GB GB0623873A patent/GB2436165B/en not_active Expired - Fee Related
- 2006-11-30 CN CNB2006101629849A patent/CN100510880C/zh not_active Expired - Fee Related
- 2006-11-30 FR FR0610455A patent/FR2898691B1/fr not_active Expired - Fee Related
- 2006-12-08 JP JP2006331502A patent/JP4904138B2/ja not_active Expired - Fee Related
- 2006-12-22 US US11/643,938 patent/US7663731B2/en not_active Expired - Fee Related
- 2006-12-28 TW TW095149506A patent/TWI350402B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2007249177A (ja) | 2007-09-27 |
US20070231477A1 (en) | 2007-10-04 |
DE102006055621A1 (de) | 2007-09-20 |
FR2898691A1 (fr) | 2007-09-21 |
KR20070094281A (ko) | 2007-09-20 |
GB0623873D0 (en) | 2007-01-10 |
US7663731B2 (en) | 2010-02-16 |
FR2898691B1 (fr) | 2011-01-07 |
GB2436165B (en) | 2008-07-02 |
CN101038388A (zh) | 2007-09-19 |
TW200736716A (en) | 2007-10-01 |
CN100510880C (zh) | 2009-07-08 |
TWI350402B (en) | 2011-10-11 |
KR101291794B1 (ko) | 2013-07-31 |
GB2436165A (en) | 2007-09-19 |
DE102006055621B4 (de) | 2018-02-15 |
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