JP4902950B2 - Ｌｅｄ照明光源 - Google Patents

Ｌｅｄ照明光源 Download PDF

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Publication number
JP4902950B2
JP4902950B2 JP2004259304A JP2004259304A JP4902950B2 JP 4902950 B2 JP4902950 B2 JP 4902950B2 JP 2004259304 A JP2004259304 A JP 2004259304A JP 2004259304 A JP2004259304 A JP 2004259304A JP 4902950 B2 JP4902950 B2 JP 4902950B2
Authority
JP
Japan
Prior art keywords
led
light source
led element
outer peripheral
illumination light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004259304A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005117028A (ja
JP2005117028A5 (enExample
Inventor
正 矢野
正則 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2004259304A priority Critical patent/JP4902950B2/ja
Publication of JP2005117028A publication Critical patent/JP2005117028A/ja
Publication of JP2005117028A5 publication Critical patent/JP2005117028A5/ja
Application granted granted Critical
Publication of JP4902950B2 publication Critical patent/JP4902950B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02—Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • F21L4/022—Pocket lamps
    • F21L4/027—Pocket lamps the light sources being a LED
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body

Landscapes

  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
JP2004259304A 2003-09-16 2004-09-07 Ｌｅｄ照明光源 Expired - Fee Related JP4902950B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004259304A JP4902950B2 (ja) 2003-09-16 2004-09-07 Ｌｅｄ照明光源

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003322645 2003-09-16
JP2003322645 2003-09-16
JP2004259304A JP4902950B2 (ja) 2003-09-16 2004-09-07 Ｌｅｄ照明光源

Publications (3)

Publication Number Publication Date
JP2005117028A JP2005117028A (ja) 2005-04-28
JP2005117028A5 JP2005117028A5 (enExample) 2007-08-02
JP4902950B2 true JP4902950B2 (ja) 2012-03-21

Family

ID=34554437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004259304A Expired - Fee Related JP4902950B2 (ja) 2003-09-16 2004-09-07 Ｌｅｄ照明光源

Country Status (1)

Country Link
JP (1) JP4902950B2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007018878A (ja) * 2005-07-07 2007-01-25 Matsushita Electric Works Ltd 照明器具
KR100691191B1 (ko) * 2005-07-15 2007-03-09 삼성전기주식회사 Ｌｅｄ를 이용한 면광원 및 이를 구비하는 ｌｃｄ 백라이트유닛
JP4548668B2 (ja) * 2005-10-21 2010-09-22 タイテック株式会社 照明シート
JP4989936B2 (ja) * 2006-07-27 2012-08-01 株式会社朝日ラバー 照明装置
EP3848970A1 (en) 2007-01-22 2021-07-14 Cree, Inc. Multiple light emitting diode emitter
JP4995120B2 (ja) * 2008-02-28 2012-08-08 シャープ株式会社 照明装置およびこれを備えた表示装置
JP5180739B2 (ja) * 2008-08-27 2013-04-10 パナソニック株式会社 バックライト装置
JP5574976B2 (ja) * 2008-11-27 2014-08-20 京セラ株式会社 照明器具
JP5327601B2 (ja) * 2008-12-12 2013-10-30 東芝ライテック株式会社 発光モジュールおよび照明装置
JP2010153044A (ja) * 2008-12-23 2010-07-08 Toshiba Lighting & Technology Corp 光源ユニット及び照明器具
KR101646256B1 (ko) * 2009-12-29 2016-08-05 엘지이노텍 주식회사 발광장치
WO2011108664A1 (ja) * 2010-03-03 2011-09-09 有限会社Ｍｔｅｃ 光半導体装置
JP2012028412A (ja) * 2010-07-20 2012-02-09 Furukawa Electric Co Ltd:The ２次元面発光レーザアレイ素子、面発光レーザ装置および光源
JP5341154B2 (ja) * 2011-08-31 2013-11-13 株式会社フジクラ 高演色性発光ダイオードランプユニット
JP5992674B2 (ja) 2011-10-05 2016-09-14 シチズン電子株式会社 発光モジュール
TWI446599B (zh) * 2012-02-15 2014-07-21 太極光光電股份有限公司 無邊框的ｌｅｄ晶片封裝方法及以該方法製成的發光裝置
JP5946311B2 (ja) * 2012-04-11 2016-07-06 シチズンホールディングス株式会社 Ｌｅｄモジュール
JP7339581B2 (ja) * 2018-12-20 2023-09-06 日亜化学工業株式会社 発光装置及び発光回路
US11739910B2 (en) 2019-12-16 2023-08-29 Lumileds Llc LED arrays with self-stabilizing torch functions

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6332972A (ja) * 1986-07-26 1988-02-12 Mitsubishi Cable Ind Ltd ランプ
JPH01146248U (enExample) * 1988-03-29 1989-10-09
JPH0744029Y2 (ja) * 1990-12-28 1995-10-09 株式会社小糸製作所 Ｌｅｄモジュール
JPH11162234A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd 発光ダイオードを用いた光源
JP3989794B2 (ja) * 2001-08-09 2007-10-10 松下電器産業株式会社 Ｌｅｄ照明装置およびｌｅｄ照明光源

Also Published As

Publication number Publication date
JP2005117028A (ja) 2005-04-28

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