JP5992674B2 - 発光モジュール - Google Patents
発光モジュール Download PDFInfo
- Publication number
- JP5992674B2 JP5992674B2 JP2011220729A JP2011220729A JP5992674B2 JP 5992674 B2 JP5992674 B2 JP 5992674B2 JP 2011220729 A JP2011220729 A JP 2011220729A JP 2011220729 A JP2011220729 A JP 2011220729A JP 5992674 B2 JP5992674 B2 JP 5992674B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- led
- power supply
- emitting module
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 36
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 230000003247 decreasing effect Effects 0.000 claims 1
- 210000004899 c-terminal region Anatomy 0.000 description 20
- 230000000694 effects Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/10—Controlling the intensity of the light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
Description
11 発光モジュール
12 基板
13 LED
14 給電電極群
14a A端子
14b B端子
14c C端子
14d D端子
15 折り返し電極群
15a 第1折り返し電極
15b 第2折り返し電極
15c 第3折り返し電極
16 枠体
17 樹脂体
19 ボンディングワイヤ
21 第1部分発光部(中心部分発光部)
21a 第1往路列
21b 第1復路列
22 第2部分発光部(周辺部分発光部)
22a 第2往路列
22b 第2復路列
23 第3部分発光部(周辺部分発光部)
23a 第3往路列
23b 第3復路列
Claims (8)
- 基板と、
該基板上に複数並列して配置され、各列が複数個のLEDの縦列集合体からなるLED列と、
前記複数のLED列の一端側に配置される複数の給電電極と、
前記基板を挟んで前記給電電極と対向する側に配置される複数の折り返し電極とを備える発光モジュールであって、
前記LED列は、一の給電電極から一の折り返し電極に向けて電気的に接続される往路列と、前記一の折り返し電極から前記一の給電電極以外の他の給電電極の一つに向けて電気的に接続される復路列とで構成されると共に、
これら往路列と復路列とによって、複数の給電電極、複数の折り返し電極及び複数のLED列の全てが電気的に直列接続される一の経路からなり、前記複数の給電電極のうち、所定の給電電極間に電源電圧を印加することによって、所定の往路列及び復路列からなるLED列を発光させることを特徴とする発光モジュール。 - 前記複数のLED列は、前記基板の中央部に往路列及び復路列が隣接して配置される中心部分発光部と、
該中心部分発光部を中心として左右に配置される往路列及び復路列からなる少なくとも一以上の周辺部分発光部とを備える請求項1に記載の発光モジュール。 - 前記周辺部分発光部を構成する複数のLED列は、各LED列を構成するLEDの数が前記中心部分発光部から外側に向かって漸次減少する請求項2に記載の発光モジュール。
- 前記複数のLED列は、等間隔に配列される請求項1に記載の発光モジュール。
- 前記中心部分発光部及び周辺部分発光部は、対応する往路列と復路列を構成するLEDの数が略同数となるように構成される請求項2に記載の発光モジュール。
- 前記基板は、中央部から外周部に向けてLEDの配置領域が狭くなるように形成される請求項1に記載の発光モジュール。
- 前記基板は、円形状、楕円形状あるいは菱形形状のいずれかによって形成される請求項1に記載の発光モジュール。
- 前記基板は、LEDが配置される表面が光反射部材によって形成される請求項1に記載の発光モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011220729A JP5992674B2 (ja) | 2011-10-05 | 2011-10-05 | 発光モジュール |
US13/646,042 US9220142B2 (en) | 2011-10-05 | 2012-10-05 | Light-emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011220729A JP5992674B2 (ja) | 2011-10-05 | 2011-10-05 | 発光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013080852A JP2013080852A (ja) | 2013-05-02 |
JP5992674B2 true JP5992674B2 (ja) | 2016-09-14 |
Family
ID=48041644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011220729A Active JP5992674B2 (ja) | 2011-10-05 | 2011-10-05 | 発光モジュール |
Country Status (2)
Country | Link |
---|---|
US (1) | US9220142B2 (ja) |
JP (1) | JP5992674B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014225520A (ja) * | 2013-05-15 | 2014-12-04 | 東芝ライテック株式会社 | 発光モジュール及び照明装置 |
JP2015119096A (ja) * | 2013-12-19 | 2015-06-25 | 株式会社タムラ製作所 | 発光装置 |
US10862276B2 (en) | 2017-08-31 | 2020-12-08 | Nichia Corporation | Method of manufacturing light emitting device and light emitting device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4902950B2 (ja) * | 2003-09-16 | 2012-03-21 | パナソニック株式会社 | Led照明光源 |
JP2008244165A (ja) * | 2007-03-27 | 2008-10-09 | Toshiba Lighting & Technology Corp | 照明装置 |
JP2008140921A (ja) * | 2006-11-30 | 2008-06-19 | Toshiba Lighting & Technology Corp | 照明装置 |
JP5408414B2 (ja) | 2009-06-10 | 2014-02-05 | 東芝ライテック株式会社 | 発光モジュール |
JP2011014836A (ja) | 2009-07-06 | 2011-01-20 | Toyoda Gosei Co Ltd | 半導体発光装置の駆動方法及び半導体発光装置 |
JP2013118292A (ja) * | 2011-12-02 | 2013-06-13 | Citizen Electronics Co Ltd | Led発光装置 |
JP6072472B2 (ja) * | 2012-08-27 | 2017-02-01 | シチズン電子株式会社 | Led発光装置 |
-
2011
- 2011-10-05 JP JP2011220729A patent/JP5992674B2/ja active Active
-
2012
- 2012-10-05 US US13/646,042 patent/US9220142B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US9220142B2 (en) | 2015-12-22 |
US20130088159A1 (en) | 2013-04-11 |
JP2013080852A (ja) | 2013-05-02 |
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