JP4899409B2 - 多層プリント配線基板及びその製造方法 - Google Patents

多層プリント配線基板及びその製造方法 Download PDF

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Publication number
JP4899409B2
JP4899409B2 JP2005306929A JP2005306929A JP4899409B2 JP 4899409 B2 JP4899409 B2 JP 4899409B2 JP 2005306929 A JP2005306929 A JP 2005306929A JP 2005306929 A JP2005306929 A JP 2005306929A JP 4899409 B2 JP4899409 B2 JP 4899409B2
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Japan
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layer
film
prepreg
skip
hole
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Japanese (ja)
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JP2007115954A5 (enExample
JP2007115954A (ja
Inventor
文雄 越後
禎志 中村
昌吾 平井
俊夫 須川
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2005306929A priority Critical patent/JP4899409B2/ja
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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2005306929A 2005-10-21 2005-10-21 多層プリント配線基板及びその製造方法 Expired - Fee Related JP4899409B2 (ja)

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JP2005306929A JP4899409B2 (ja) 2005-10-21 2005-10-21 多層プリント配線基板及びその製造方法

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JP2005306929A JP4899409B2 (ja) 2005-10-21 2005-10-21 多層プリント配線基板及びその製造方法

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JP2007115954A JP2007115954A (ja) 2007-05-10
JP2007115954A5 JP2007115954A5 (enExample) 2008-11-27
JP4899409B2 true JP4899409B2 (ja) 2012-03-21

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110028951A (ko) * 2009-09-14 2011-03-22 삼성전기주식회사 인쇄회로기판 및 그의 제조방법
KR101148385B1 (ko) 2010-12-08 2012-05-21 삼성전기주식회사 비아 구조물 및 그 형성 방법, 그리고 상기 비아 구조물을 갖는 회로 기판 및 상기 회로 기판의 제조 방법
JP2017123376A (ja) 2016-01-05 2017-07-13 イビデン株式会社 プリント配線板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2587596B2 (ja) * 1993-09-21 1997-03-05 松下電器産業株式会社 回路基板接続材とそれを用いた多層回路基板の製造方法
JP3311899B2 (ja) * 1995-01-20 2002-08-05 松下電器産業株式会社 回路基板及びその製造方法
JPH09148739A (ja) * 1995-11-24 1997-06-06 Toray Ind Inc 多層回路板およびその製造方法
JPH09246724A (ja) * 1996-03-04 1997-09-19 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP3395621B2 (ja) * 1997-02-03 2003-04-14 イビデン株式会社 プリント配線板及びその製造方法
JP3053790B2 (ja) * 1997-09-30 2000-06-19 松下電器産業株式会社 回路基板接続用部材、回路基板の製造方法および回路基板
JP3431523B2 (ja) * 1998-12-09 2003-07-28 松下電器産業株式会社 回路基板接続材とその製造方法及び回路基板接続材を用いた多層回路基板の製造方法
JP3760101B2 (ja) * 2001-02-13 2006-03-29 富士通株式会社 多層プリント配線板およびその製造方法
JP4705261B2 (ja) * 2001-04-02 2011-06-22 日本シイエムケイ株式会社 ビルドアップ多層プリント配線板
JP2003168861A (ja) * 2001-11-30 2003-06-13 Cmk Corp ビルドアップ多層配線基板の回路形成方法

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