JP4895256B2 - 基板の表面処理方法 - Google Patents

基板の表面処理方法 Download PDF

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Publication number
JP4895256B2
JP4895256B2 JP2005278844A JP2005278844A JP4895256B2 JP 4895256 B2 JP4895256 B2 JP 4895256B2 JP 2005278844 A JP2005278844 A JP 2005278844A JP 2005278844 A JP2005278844 A JP 2005278844A JP 4895256 B2 JP4895256 B2 JP 4895256B2
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JP
Japan
Prior art keywords
substrate
cleaning
layer
wafer
treatment method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005278844A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006270032A (ja
JP2006270032A5 (https=
Inventor
栄一 西村
武彦 折居
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2005278844A priority Critical patent/JP4895256B2/ja
Priority to KR1020060017330A priority patent/KR100832164B1/ko
Priority to TW095105956A priority patent/TWI398920B/zh
Priority to US11/359,378 priority patent/US20060196527A1/en
Priority to EP06003683.7A priority patent/EP1696476B1/en
Publication of JP2006270032A publication Critical patent/JP2006270032A/ja
Publication of JP2006270032A5 publication Critical patent/JP2006270032A5/ja
Application granted granted Critical
Publication of JP4895256B2 publication Critical patent/JP4895256B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/234—Cleaning during device manufacture during, before or after processing of insulating materials the processing being the formation of vias or contact holes
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F17/00—Coin-freed apparatus for hiring articles; Coin-freed facilities or services
    • G07F17/32—Coin-freed apparatus for hiring articles; Coin-freed facilities or services for games, toys, sports, or amusements
    • G07F17/3202—Hardware aspects of a gaming system, e.g. components, construction, architecture thereof
    • G07F17/3204—Player-machine interfaces
    • G07F17/3211—Display means
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63F—CARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
    • A63F13/00—Video games, i.e. games using an electronically generated display having two or more dimensions
    • A63F13/90—Constructional details or arrangements of video game devices not provided for in groups A63F13/20 or A63F13/25, e.g. housing, wiring, connections or cabinets
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F17/00—Coin-freed apparatus for hiring articles; Coin-freed facilities or services
    • G07F17/32—Coin-freed apparatus for hiring articles; Coin-freed facilities or services for games, toys, sports, or amusements
    • G07F17/34—Coin-freed apparatus for hiring articles; Coin-freed facilities or services for games, toys, sports, or amusements depending on the stopping of moving members in a mechanical slot machine, e.g. "fruit" machines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/18—Cleaning before device manufacture, i.e. Begin-Of-Line process by combined dry cleaning and wet cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63F—CARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
    • A63F9/00—Games not otherwise provided for
    • A63F9/24—Games using electronic circuits not otherwise provided for
    • A63F2009/2448—Output devices
    • A63F2009/245—Output devices visual
    • A63F2009/2457—Display screens, e.g. monitors, video displays
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63F—CARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
    • A63F2250/00—Miscellaneous game characteristics
    • A63F2250/14—Coin operated
    • A63F2250/142—Coin operated with pay-out or rewarding with a prize
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2005278844A 2005-02-23 2005-09-26 基板の表面処理方法 Expired - Fee Related JP4895256B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005278844A JP4895256B2 (ja) 2005-02-23 2005-09-26 基板の表面処理方法
KR1020060017330A KR100832164B1 (ko) 2005-02-23 2006-02-22 기판 표면 처리 방법, 기판 세정 방법 및 프로그램을기록한 기록 매체
TW095105956A TWI398920B (zh) 2005-02-23 2006-02-22 Surface treatment of substrates
US11/359,378 US20060196527A1 (en) 2005-02-23 2006-02-23 Method of surface processing substrate, method of cleaning substrate, and programs for implementing the methods
EP06003683.7A EP1696476B1 (en) 2005-02-23 2006-02-23 Method of surface processing substrate, method of cleaning substrate, and programs for implementing the methods

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005047361 2005-02-23
JP2005047361 2005-02-23
JP2005278844A JP4895256B2 (ja) 2005-02-23 2005-09-26 基板の表面処理方法

Publications (3)

Publication Number Publication Date
JP2006270032A JP2006270032A (ja) 2006-10-05
JP2006270032A5 JP2006270032A5 (https=) 2008-11-06
JP4895256B2 true JP4895256B2 (ja) 2012-03-14

Family

ID=36636246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005278844A Expired - Fee Related JP4895256B2 (ja) 2005-02-23 2005-09-26 基板の表面処理方法

Country Status (4)

Country Link
EP (1) EP1696476B1 (https=)
JP (1) JP4895256B2 (https=)
KR (1) KR100832164B1 (https=)
TW (1) TWI398920B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100854455B1 (ko) * 2006-06-30 2008-08-27 주식회사 하이닉스반도체 반도체 소자의 워터마크 제거방법
JP5143808B2 (ja) 2009-10-08 2013-02-13 本田技研工業株式会社 撮像装置、撮像システム及び演算方法
JP5424848B2 (ja) 2009-12-15 2014-02-26 株式会社東芝 半導体基板の表面処理装置及び方法
KR101271248B1 (ko) * 2011-08-02 2013-06-07 주식회사 유진테크 에피택셜 공정을 위한 반도체 제조설비
US9461144B2 (en) * 2014-06-13 2016-10-04 Taiwan Semiconductor Manufacturing Company, Ltd. Method for semiconductor device fabrication
JP6934376B2 (ja) * 2017-09-20 2021-09-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102434297B1 (ko) * 2018-01-09 2022-08-18 가부시키가이샤 스크린 홀딩스 기판 처리 방법 및 기판 처리 장치
CN108447774B (zh) * 2018-03-29 2023-05-26 长鑫存储技术有限公司 同时去除热氧化膜和去除沉积氧化膜的方法及设备
TWI911263B (zh) * 2020-08-25 2026-01-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 清潔基板的方法、選擇性沉積的方法、及反應器系統
KR102796895B1 (ko) * 2022-03-30 2025-04-17 야마하 로보틱스 홀딩스 가부시키가이샤 전자 부품 세정 장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6345822A (ja) * 1986-08-13 1988-02-26 Hitachi Ltd クリ−ニング方法および装置
US5171393A (en) * 1991-07-29 1992-12-15 Moffat William A Wafer processing apparatus
US5282925A (en) * 1992-11-09 1994-02-01 International Business Machines Corporation Device and method for accurate etching and removal of thin film
JPH06163508A (ja) * 1992-11-27 1994-06-10 Fuji Electric Co Ltd 基板の乾燥方法および装置
JPH06314679A (ja) * 1993-04-30 1994-11-08 Sony Corp 半導体基板の洗浄方法
JPH06337193A (ja) * 1993-05-27 1994-12-06 Tokyo Hightech Kk 真空乾燥装置
JPH0969509A (ja) * 1995-09-01 1997-03-11 Matsushita Electron Corp 半導体ウェーハの洗浄・エッチング・乾燥装置及びその使用方法
JP2927768B1 (ja) 1998-03-26 1999-07-28 技術研究組合オングストロームテクノロジ研究機構 半導体装置およびその製造方法
US5932022A (en) * 1998-04-21 1999-08-03 Harris Corporation SC-2 based pre-thermal treatment wafer cleaning process
US6486072B1 (en) * 2000-10-23 2002-11-26 Advanced Micro Devices, Inc. System and method to facilitate removal of defects from a substrate
KR100416592B1 (ko) * 2001-02-10 2004-02-05 삼성전자주식회사 매엽식 웨이퍼 세정 장치 및 이를 이용한 웨이퍼 세정 방법
JP3421329B2 (ja) * 2001-06-08 2003-06-30 東京エレクトロン株式会社 薄膜形成装置の洗浄方法
JP2003077839A (ja) * 2001-08-30 2003-03-14 Toshiba Corp 半導体製造装置のパージ方法及び半導体装置の製造方法
US6858532B2 (en) * 2002-12-10 2005-02-22 International Business Machines Corporation Low defect pre-emitter and pre-base oxide etch for bipolar transistors and related tooling
JP4187540B2 (ja) * 2003-01-31 2008-11-26 大日本スクリーン製造株式会社 基板処理方法
JP4039385B2 (ja) * 2003-04-22 2008-01-30 東京エレクトロン株式会社 ケミカル酸化膜の除去方法

Also Published As

Publication number Publication date
EP1696476B1 (en) 2015-02-18
JP2006270032A (ja) 2006-10-05
TWI398920B (zh) 2013-06-11
KR100832164B1 (ko) 2008-05-23
EP1696476A3 (en) 2009-12-09
TW200723391A (en) 2007-06-16
KR20060024832A (ko) 2006-03-17
EP1696476A2 (en) 2006-08-30

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