JP4892425B2 - 半導体パッケージの実装構造および半導体パッケージ - Google Patents

半導体パッケージの実装構造および半導体パッケージ Download PDF

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Publication number
JP4892425B2
JP4892425B2 JP2007177958A JP2007177958A JP4892425B2 JP 4892425 B2 JP4892425 B2 JP 4892425B2 JP 2007177958 A JP2007177958 A JP 2007177958A JP 2007177958 A JP2007177958 A JP 2007177958A JP 4892425 B2 JP4892425 B2 JP 4892425B2
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Prior art keywords
substrate
semiconductor package
pin
pins
wiring
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JP2007177958A
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Japanese (ja)
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JP2009016634A (ja
JP2009016634A5 (enrdf_load_stackoverflow
Inventor
茂生 中島
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2007177958A priority Critical patent/JP4892425B2/ja
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JP2007177958A 2007-07-06 2007-07-06 半導体パッケージの実装構造および半導体パッケージ Expired - Fee Related JP4892425B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007177958A JP4892425B2 (ja) 2007-07-06 2007-07-06 半導体パッケージの実装構造および半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007177958A JP4892425B2 (ja) 2007-07-06 2007-07-06 半導体パッケージの実装構造および半導体パッケージ

Related Child Applications (1)

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JP2011108068A Division JP5242736B2 (ja) 2011-05-13 2011-05-13 半導体パッケージの実装構造

Publications (3)

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JP2009016634A JP2009016634A (ja) 2009-01-22
JP2009016634A5 JP2009016634A5 (enrdf_load_stackoverflow) 2010-05-13
JP4892425B2 true JP4892425B2 (ja) 2012-03-07

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ID=40357169

Family Applications (1)

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JP2007177958A Expired - Fee Related JP4892425B2 (ja) 2007-07-06 2007-07-06 半導体パッケージの実装構造および半導体パッケージ

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JP (1) JP4892425B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5383225B2 (ja) 2008-02-06 2014-01-08 富士フイルム株式会社 インク組成物、インクジェット記録方法、および印刷物
JP6064440B2 (ja) * 2012-08-27 2017-01-25 富士通株式会社 電子装置、電子装置の製造方法、および電子部品の単体試験方法
CN109148421B (zh) * 2018-08-31 2020-04-28 成都天箭科技股份有限公司 一种微波单片集成电路接地结构及其安装工艺
US10510713B1 (en) * 2018-10-28 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Semicondcutor package and method of manufacturing the same
CN116364660B (zh) * 2023-05-24 2023-11-28 浙江常淳科技有限公司 一种集成电路封装定位装置及定位方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317548A (ja) * 1986-07-09 1988-01-25 Fujitsu Ltd 半導体パツケ−ジ及びその製造方法
JP2646331B2 (ja) * 1993-09-24 1997-08-27 オーガット インコーポレイテッド リードピンキャリア
JPH08271578A (ja) * 1995-03-30 1996-10-18 Toshiba Corp 半導体装置のテストソケット
JPH11185915A (ja) * 1997-12-22 1999-07-09 Toyo Commun Equip Co Ltd エリアアレイパッケージ用ソケット
JP4384316B2 (ja) * 1999-12-06 2009-12-16 イビデン株式会社 電子部品モジュール
JP2003123922A (ja) * 2001-10-11 2003-04-25 Sony Corp 半導体装置とソケットまたは実装基板との接続構造

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