JP4885331B2 - 太陽電池素子の接続方法および矯正方法並びにこれらの装置 - Google Patents
太陽電池素子の接続方法および矯正方法並びにこれらの装置 Download PDFInfo
- Publication number
- JP4885331B2 JP4885331B2 JP2011509363A JP2011509363A JP4885331B2 JP 4885331 B2 JP4885331 B2 JP 4885331B2 JP 2011509363 A JP2011509363 A JP 2011509363A JP 2011509363 A JP2011509363 A JP 2011509363A JP 4885331 B2 JP4885331 B2 JP 4885331B2
- Authority
- JP
- Japan
- Prior art keywords
- solar cell
- cell element
- lead wire
- tab lead
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 89
- 238000012937 correction Methods 0.000 title claims description 19
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 165
- 229910000679 solder Inorganic materials 0.000 claims description 121
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 63
- 239000011889 copper foil Substances 0.000 claims description 51
- 238000003825 pressing Methods 0.000 claims description 51
- 238000002844 melting Methods 0.000 claims description 47
- 230000008018 melting Effects 0.000 claims description 47
- 238000010438 heat treatment Methods 0.000 claims description 43
- 230000007704 transition Effects 0.000 claims description 34
- 238000003466 welding Methods 0.000 claims description 34
- 230000006698 induction Effects 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 10
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- 238000001816 cooling Methods 0.000 description 8
- 239000004033 plastic Substances 0.000 description 8
- 230000035882 stress Effects 0.000 description 7
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- 239000000758 substrate Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
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- 239000013078 crystal Substances 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- 230000009466 transformation Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011509363A JP4885331B2 (ja) | 2009-04-16 | 2010-04-16 | 太陽電池素子の接続方法および矯正方法並びにこれらの装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009099778 | 2009-04-16 | ||
JP2009099778 | 2009-04-16 | ||
JP2011509363A JP4885331B2 (ja) | 2009-04-16 | 2010-04-16 | 太陽電池素子の接続方法および矯正方法並びにこれらの装置 |
PCT/JP2010/056841 WO2010119950A1 (ja) | 2009-04-16 | 2010-04-16 | 太陽電池素子の接続方法および矯正方法並びにこれらの装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4885331B2 true JP4885331B2 (ja) | 2012-02-29 |
JPWO2010119950A1 JPWO2010119950A1 (ja) | 2012-10-22 |
Family
ID=42982607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011509363A Expired - Fee Related JP4885331B2 (ja) | 2009-04-16 | 2010-04-16 | 太陽電池素子の接続方法および矯正方法並びにこれらの装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4885331B2 (ko) |
KR (1) | KR20120022863A (ko) |
WO (1) | WO2010119950A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013237059A (ja) * | 2012-05-14 | 2013-11-28 | Eco & Engineering Co Ltd | インターコネクタと太陽電池素子の接合装置及び接合方法 |
EP2911206A3 (en) * | 2014-02-24 | 2015-11-25 | LG Electronics Inc. | Solar cell module and method for manufacturing the same |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5471097B2 (ja) * | 2009-07-10 | 2014-04-16 | 東洋製罐株式会社 | 金属基板とガラス基板との接合方法 |
JP2012146895A (ja) * | 2011-01-14 | 2012-08-02 | Eco & Engineering Co Ltd | 太陽電池素子ストリングとバスバーの接続方法及び接続装置 |
KR101224123B1 (ko) | 2011-01-28 | 2013-01-21 | 주식회사 에스에프에이 | 후면전극 태양전지용 스트링 제조장치 |
JP2013069963A (ja) * | 2011-09-26 | 2013-04-18 | Alonics Ltd | 裏面接点型太陽電池素子の接続装置、及び加熱ヘッド |
JP2013149919A (ja) * | 2012-01-23 | 2013-08-01 | Three M Innovative Properties Co | 部材剥離方法及び部材剥離装置並びに半導体チップ製造方法 |
EP2804224A1 (de) | 2013-05-13 | 2014-11-19 | Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung eines Photovoltaikmoduls |
WO2015071992A1 (ja) * | 2013-11-14 | 2015-05-21 | 有限会社エコ&エンジニアリング | インターコネクタと太陽電池素子の接合装置及び接合方法 |
DE102016115355A1 (de) * | 2016-08-18 | 2018-02-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Anheften einer metallischen Folie an eine Oberfläche eines Halbleitersubstrats und Halbleiterbauelement mit einer metallischen Folie |
CN106862690A (zh) * | 2017-02-09 | 2017-06-20 | 常州天合光能有限公司 | Ibc电池单焊台、串联用焊接台及其串联焊接方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004273914A (ja) * | 2003-03-11 | 2004-09-30 | Mekku:Kk | 太陽電池セル製造装置 |
JP2005191491A (ja) * | 2003-12-26 | 2005-07-14 | Sharp Corp | 太陽電池モジュールの製造方法と太陽電池モジュールの製造装置 |
JP2005191259A (ja) * | 2003-12-25 | 2005-07-14 | Sharp Corp | 太陽電池モジュールの製造方法と太陽電池モジュールの製造装置 |
JP2005235971A (ja) * | 2004-02-19 | 2005-09-02 | Nisshinbo Ind Inc | フラックス塗布機能を具備した太陽電池用タブリードのハンダ付け装置 |
JP2006278695A (ja) * | 2005-03-29 | 2006-10-12 | Kyocera Corp | 太陽電池モジュール |
JP2006332264A (ja) * | 2005-05-25 | 2006-12-07 | Kyocera Corp | 太陽電池モジュールの製造方法 |
-
2010
- 2010-04-16 WO PCT/JP2010/056841 patent/WO2010119950A1/ja active Application Filing
- 2010-04-16 KR KR1020117026113A patent/KR20120022863A/ko not_active Application Discontinuation
- 2010-04-16 JP JP2011509363A patent/JP4885331B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004273914A (ja) * | 2003-03-11 | 2004-09-30 | Mekku:Kk | 太陽電池セル製造装置 |
JP2005191259A (ja) * | 2003-12-25 | 2005-07-14 | Sharp Corp | 太陽電池モジュールの製造方法と太陽電池モジュールの製造装置 |
JP2005191491A (ja) * | 2003-12-26 | 2005-07-14 | Sharp Corp | 太陽電池モジュールの製造方法と太陽電池モジュールの製造装置 |
JP2005235971A (ja) * | 2004-02-19 | 2005-09-02 | Nisshinbo Ind Inc | フラックス塗布機能を具備した太陽電池用タブリードのハンダ付け装置 |
JP2006278695A (ja) * | 2005-03-29 | 2006-10-12 | Kyocera Corp | 太陽電池モジュール |
JP2006332264A (ja) * | 2005-05-25 | 2006-12-07 | Kyocera Corp | 太陽電池モジュールの製造方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013237059A (ja) * | 2012-05-14 | 2013-11-28 | Eco & Engineering Co Ltd | インターコネクタと太陽電池素子の接合装置及び接合方法 |
EP2911206A3 (en) * | 2014-02-24 | 2015-11-25 | LG Electronics Inc. | Solar cell module and method for manufacturing the same |
US9553226B2 (en) | 2014-02-24 | 2017-01-24 | Lg Electronics Inc. | Solar cell module and method for manufacturing the same |
US10475944B2 (en) | 2014-02-24 | 2019-11-12 | Lg Electronics Inc. | Solar cell module and method for manufacturing the same |
US11538952B2 (en) | 2014-02-24 | 2022-12-27 | Shangrao Jinko Solar Technology Development Co., Ltd. | Solar cell module and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
WO2010119950A1 (ja) | 2010-10-21 |
KR20120022863A (ko) | 2012-03-12 |
JPWO2010119950A1 (ja) | 2012-10-22 |
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