JP4880820B2 - レーザ支援加工方法 - Google Patents

レーザ支援加工方法 Download PDF

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Publication number
JP4880820B2
JP4880820B2 JP2001012372A JP2001012372A JP4880820B2 JP 4880820 B2 JP4880820 B2 JP 4880820B2 JP 2001012372 A JP2001012372 A JP 2001012372A JP 2001012372 A JP2001012372 A JP 2001012372A JP 4880820 B2 JP4880820 B2 JP 4880820B2
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Japan
Prior art keywords
laser
processing method
laser beam
processed
assisted processing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2001012372A
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English (en)
Japanese (ja)
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JP2002210730A (ja
JP2002210730A5 (enExample
Inventor
弘明 三澤
マルティンキャビティス アンドリウス
ヨードカシス サウリウス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laser Systems Inc Japan
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Laser Systems Inc Japan
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Priority to JP2001012372A priority Critical patent/JP4880820B2/ja
Publication of JP2002210730A publication Critical patent/JP2002210730A/ja
Publication of JP2002210730A5 publication Critical patent/JP2002210730A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
JP2001012372A 2001-01-19 2001-01-19 レーザ支援加工方法 Expired - Lifetime JP4880820B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001012372A JP4880820B2 (ja) 2001-01-19 2001-01-19 レーザ支援加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001012372A JP4880820B2 (ja) 2001-01-19 2001-01-19 レーザ支援加工方法

Publications (3)

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JP2002210730A JP2002210730A (ja) 2002-07-30
JP2002210730A5 JP2002210730A5 (enExample) 2008-04-10
JP4880820B2 true JP4880820B2 (ja) 2012-02-22

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JP (1) JP4880820B2 (enExample)

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CN103111762A (zh) * 2013-01-29 2013-05-22 无锡鼎晶光电科技有限公司 一种将激光打孔应用于蓝宝石片打孔的方法
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9850159B2 (en) 2012-11-20 2017-12-26 Corning Incorporated High speed laser processing of transparent materials
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US10144093B2 (en) 2013-12-17 2018-12-04 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10173916B2 (en) 2013-12-17 2019-01-08 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
US10233112B2 (en) 2013-12-17 2019-03-19 Corning Incorporated Laser processing of slots and holes
US10252931B2 (en) 2015-01-12 2019-04-09 Corning Incorporated Laser cutting of thermally tempered substrates
US10280108B2 (en) 2013-03-21 2019-05-07 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
US10377658B2 (en) 2016-07-29 2019-08-13 Corning Incorporated Apparatuses and methods for laser processing
US10421683B2 (en) 2013-01-15 2019-09-24 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US10525657B2 (en) 2015-03-27 2020-01-07 Corning Incorporated Gas permeable window and method of fabricating the same
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11111170B2 (en) 2016-05-06 2021-09-07 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US11478874B2 (en) 2019-04-05 2022-10-25 Tdk Corporation Method of processing inorganic material substrate, device, and method of manufacturing device
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules

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JP2006142335A (ja) * 2004-11-19 2006-06-08 National Institute Of Advanced Industrial & Technology レーザー加工装置
JP4630971B2 (ja) * 2004-12-21 2011-02-09 並木精密宝石株式会社 パルスレーザによる微小構造の形成方法
JP2006303360A (ja) * 2005-04-25 2006-11-02 Fujikura Ltd 貫通配線基板、複合基板及び電子装置
WO2007061018A1 (ja) * 2005-11-22 2007-05-31 Olympus Corporation ガラス基材の加工方法およびガラス部品
JP4402708B2 (ja) * 2007-08-03 2010-01-20 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
JP5478009B2 (ja) 2007-11-09 2014-04-23 株式会社フジクラ 半導体パッケージの製造方法
JP5702556B2 (ja) 2010-07-26 2015-04-15 浜松ホトニクス株式会社 レーザ加工方法
EP2599580A4 (en) 2010-07-26 2016-12-28 Hamamatsu Photonics Kk LASER PROCESSING PROCESS
EP2599583B1 (en) 2010-07-26 2020-04-01 Hamamatsu Photonics K.K. Substrate processing method
JP5574866B2 (ja) 2010-07-26 2014-08-20 浜松ホトニクス株式会社 レーザ加工方法
JP5693074B2 (ja) 2010-07-26 2015-04-01 浜松ホトニクス株式会社 レーザ加工方法
CN103026486B (zh) 2010-07-26 2016-08-03 浜松光子学株式会社 中介物的制造方法
EP2599582B1 (en) 2010-07-26 2020-03-25 Hamamatsu Photonics K.K. Substrate processing method
WO2012014710A1 (ja) 2010-07-26 2012-02-02 浜松ホトニクス株式会社 レーザ加工方法
US9108269B2 (en) 2010-07-26 2015-08-18 Hamamatsu Photonics K. K. Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same
KR101940334B1 (ko) 2010-07-26 2019-01-18 하마마츠 포토닉스 가부시키가이샤 레이저 가공 방법
JP5530522B2 (ja) 2010-07-26 2014-06-25 浜松ホトニクス株式会社 半導体デバイスの製造方法
JP5653110B2 (ja) 2010-07-26 2015-01-14 浜松ホトニクス株式会社 チップの製造方法
JP2011066449A (ja) * 2010-12-20 2011-03-31 Fujikura Ltd 貫通配線基板の製造方法、複合基板の製造方法、及びこれらの製造方法により形成された貫通配線基板や複合基板を用いた電子装置の製造方法
WO2012160880A1 (ja) * 2011-05-23 2012-11-29 並木精密宝石株式会社 発光素子の製造方法および発光素子
CN103212822B (zh) * 2012-01-19 2016-07-06 昆山思拓机器有限公司 全自动smt模板切割及检测一体化系统切割及检测方法
JP6157245B2 (ja) * 2013-07-01 2017-07-05 三菱電機株式会社 レーザ加工装置およびレーザ光軸調整方法
JP2015150609A (ja) 2014-02-18 2015-08-24 アイシン精機株式会社 レーザ加工方法
KR20210022773A (ko) 2014-09-16 2021-03-03 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
LT3311947T (lt) * 2016-09-30 2019-12-27 Corning Incorporated Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas
NL2017998B1 (en) * 2016-12-14 2018-06-26 Corning Inc Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
CN111830695B (zh) * 2020-07-31 2025-03-11 北京兆维电子(集团)有限责任公司 一种oled显示面板亮点缺陷修正系统

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JPH09258012A (ja) * 1996-03-26 1997-10-03 Sharp Corp レーザビーム発生用光学素子及びレーザビーム発生装置
JP3433110B2 (ja) * 1998-08-03 2003-08-04 科学技術振興事業団 ３次元的回折光学素子及びその製造方法
JP2000343714A (ja) * 1999-04-02 2000-12-12 Seiko Epson Corp 水晶穴加工方法およびインクジェット式記録ヘッドの製造方法
JP2000288766A (ja) * 1999-04-07 2000-10-17 Kubota Corp レーザ加工装置

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US9850159B2 (en) 2012-11-20 2017-12-26 Corning Incorporated High speed laser processing of transparent materials
US11345625B2 (en) 2013-01-15 2022-05-31 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
US11028003B2 (en) 2013-01-15 2021-06-08 Corning Laser Technologies GmbH Method and device for laser-based machining of flat substrates
US10421683B2 (en) 2013-01-15 2019-09-24 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
CN103111762B (zh) * 2013-01-29 2015-12-09 无锡鼎晶光电科技有限公司 一种将激光打孔应用于蓝宝石片打孔的方法
CN103111762A (zh) * 2013-01-29 2013-05-22 无锡鼎晶光电科技有限公司 一种将激光打孔应用于蓝宝石片打孔的方法
US10280108B2 (en) 2013-03-21 2019-05-07 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US11713271B2 (en) 2013-03-21 2023-08-01 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US10611668B2 (en) 2013-12-17 2020-04-07 Corning Incorporated Laser cut composite glass article and method of cutting
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10173916B2 (en) 2013-12-17 2019-01-08 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
US10179748B2 (en) 2013-12-17 2019-01-15 Corning Incorporated Laser processing of sapphire substrate and related applications
US10183885B2 (en) 2013-12-17 2019-01-22 Corning Incorporated Laser cut composite glass article and method of cutting
US10233112B2 (en) 2013-12-17 2019-03-19 Corning Incorporated Laser processing of slots and holes
US10144093B2 (en) 2013-12-17 2018-12-04 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10597321B2 (en) 2013-12-17 2020-03-24 Corning Incorporated Edge chamfering methods
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US10392290B2 (en) 2013-12-17 2019-08-27 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US11148225B2 (en) 2013-12-17 2021-10-19 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
US11697178B2 (en) 2014-07-08 2023-07-11 Corning Incorporated Methods and apparatuses for laser processing materials
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
US11014845B2 (en) 2014-12-04 2021-05-25 Corning Incorporated Method of laser cutting glass using non-diffracting laser beams
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US10252931B2 (en) 2015-01-12 2019-04-09 Corning Incorporated Laser cutting of thermally tempered substrates
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
US10525657B2 (en) 2015-03-27 2020-01-07 Corning Incorporated Gas permeable window and method of fabricating the same
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US11111170B2 (en) 2016-05-06 2021-09-07 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes
US10377658B2 (en) 2016-07-29 2019-08-13 Corning Incorporated Apparatuses and methods for laser processing
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US11130701B2 (en) 2016-09-30 2021-09-28 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11972993B2 (en) 2017-05-25 2024-04-30 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11478874B2 (en) 2019-04-05 2022-10-25 Tdk Corporation Method of processing inorganic material substrate, device, and method of manufacturing device

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