|
JP2006142335A
(ja)
*
|
2004-11-19 |
2006-06-08 |
National Institute Of Advanced Industrial & Technology |
レーザー加工装置
|
|
JP4630971B2
(ja)
*
|
2004-12-21 |
2011-02-09 |
並木精密宝石株式会社 |
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|
|
JP2006303360A
(ja)
*
|
2005-04-25 |
2006-11-02 |
Fujikura Ltd |
貫通配線基板、複合基板及び電子装置
|
|
US8307672B2
(en)
|
2005-11-22 |
2012-11-13 |
Olympus Corporation |
Glass substrate processing method and glass component
|
|
JP4402708B2
(ja)
*
|
2007-08-03 |
2010-01-20 |
浜松ホトニクス株式会社 |
レーザ加工方法、レーザ加工装置及びその製造方法
|
|
JP5478009B2
(ja)
*
|
2007-11-09 |
2014-04-23 |
株式会社フジクラ |
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|
|
WO2012014722A1
(ja)
|
2010-07-26 |
2012-02-02 |
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|
|
JP5653110B2
(ja)
|
2010-07-26 |
2015-01-14 |
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チップの製造方法
|
|
JP5702556B2
(ja)
|
2010-07-26 |
2015-04-15 |
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|
|
KR102035619B1
(ko)
|
2010-07-26 |
2019-12-16 |
하마마츠 포토닉스 가부시키가이샤 |
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|
|
KR101825238B1
(ko)
|
2010-07-26 |
2018-02-02 |
하마마츠 포토닉스 가부시키가이샤 |
광 흡수 기판의 제조 방법, 및 그것을 제조하기 위한 성형형의 제조 방법
|
|
US8961806B2
(en)
|
2010-07-26 |
2015-02-24 |
Hamamatsu Photonics K.K. |
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|
|
JP5574866B2
(ja)
|
2010-07-26 |
2014-08-20 |
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|
|
JP5693074B2
(ja)
|
2010-07-26 |
2015-04-01 |
浜松ホトニクス株式会社 |
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|
|
US8828873B2
(en)
|
2010-07-26 |
2014-09-09 |
Hamamatsu Photonics K.K. |
Method for manufacturing semiconductor device
|
|
CN103025478B
(zh)
|
2010-07-26 |
2015-09-30 |
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|
|
WO2012014718A1
(ja)
|
2010-07-26 |
2012-02-02 |
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|
|
EP2599576B1
(en)
|
2010-07-26 |
2019-12-11 |
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|
|
JP2011066449A
(ja)
*
|
2010-12-20 |
2011-03-31 |
Fujikura Ltd |
貫通配線基板の製造方法、複合基板の製造方法、及びこれらの製造方法により形成された貫通配線基板や複合基板を用いた電子装置の製造方法
|
|
KR101516609B1
(ko)
|
2011-05-23 |
2015-05-04 |
나미키 세이미쓰 하우세키 가부시키가이샤 |
발광소자의 제조 방법 및 발광소자
|
|
CN103212822B
(zh)
*
|
2012-01-19 |
2016-07-06 |
昆山思拓机器有限公司 |
全自动smt模板切割及检测一体化系统切割及检测方法
|
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
|
CN103111762B
(zh)
*
|
2013-01-29 |
2015-12-09 |
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|
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
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Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
|
JP6157245B2
(ja)
*
|
2013-07-01 |
2017-07-05 |
三菱電機株式会社 |
レーザ加工装置およびレーザ光軸調整方法
|
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
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|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
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|
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
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Laser processing of sapphire substrate and related applications
|
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
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Edge chamfering methods
|
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
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|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
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|
|
JP2015150609A
(ja)
|
2014-02-18 |
2015-08-24 |
アイシン精機株式会社 |
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|
|
KR102445217B1
(ko)
|
2014-07-08 |
2022-09-20 |
코닝 인코포레이티드 |
재료를 레이저 가공하는 방법 및 장치
|
|
WO2016010991A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
|
WO2016010943A2
(en)
|
2014-07-14 |
2016-01-21 |
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|
|
US10611667B2
(en)
|
2014-07-14 |
2020-04-07 |
Corning Incorporated |
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|
|
TWI659793B
(zh)
|
2014-07-14 |
2019-05-21 |
美商康寧公司 |
用於使用可調整雷射束焦線來處理透明材料的系統及方法
|
|
EP3195706B2
(de)
|
2014-09-16 |
2025-05-14 |
LPKF Laser & Electronics SE |
Verfahren zum einbringen mindestens einer ausnehmung oder einer durchbrechung in ein plattenförmiges werkstück
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
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|
|
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(en)
|
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|
|
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(en)
|
2015-03-24 |
2021-07-14 |
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|
|
WO2016160391A1
(en)
|
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2016-10-06 |
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|
|
US11186060B2
(en)
|
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|
|
MY194570A
(en)
|
2016-05-06 |
2022-12-02 |
Corning Inc |
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|
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
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|
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
|
CN109803934A
(zh)
|
2016-07-29 |
2019-05-24 |
康宁股份有限公司 |
用于激光处理的装置和方法
|
|
WO2018044843A1
(en)
|
2016-08-30 |
2018-03-08 |
Corning Incorporated |
Laser processing of transparent materials
|
|
CN109803786B
(zh)
*
|
2016-09-30 |
2021-05-07 |
康宁股份有限公司 |
使用非轴对称束斑对透明工件进行激光加工的设备和方法
|
|
NL2017998B1
(en)
*
|
2016-12-14 |
2018-06-26 |
Corning Inc |
Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
|
|
LT3311947T
(lt)
*
|
2016-09-30 |
2019-12-27 |
Corning Incorporated |
Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas
|
|
JP7066701B2
(ja)
|
2016-10-24 |
2022-05-13 |
コーニング インコーポレイテッド |
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|
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
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|
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
|
US12180108B2
(en)
|
2017-12-19 |
2024-12-31 |
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Methods for etching vias in glass-based articles employing positive charge organic molecules
|
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|
|
JP7230650B2
(ja)
|
2019-04-05 |
2023-03-01 |
Tdk株式会社 |
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|
|
CN111830695B
(zh)
*
|
2020-07-31 |
2025-03-11 |
北京兆维电子(集团)有限责任公司 |
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|