JP4880701B2 - 多光子硬化反応性組成物を処理するための方法及び装置 - Google Patents
多光子硬化反応性組成物を処理するための方法及び装置 Download PDFInfo
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G—PHYSICS
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70375—Multiphoton lithography or multiphoton photopolymerization; Imaging systems comprising means for converting one type of radiation into another type of radiation
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- G—PHYSICS
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- G03F7/70605—Workpiece metrology
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- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
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| CN101448632B (zh) | 2006-05-18 | 2012-12-12 | 3M创新有限公司 | 用于制备具有提取结构的光导的方法以及由此方法生产的光导 |
| JP2010537843A (ja) * | 2007-09-06 | 2010-12-09 | スリーエム イノベイティブ プロパティズ カンパニー | 微細構造物品を作製するための工具 |
| US9102083B2 (en) | 2007-09-06 | 2015-08-11 | 3M Innovative Properties Company | Methods of forming molds and methods of forming articles using said molds |
| KR20100080785A (ko) | 2007-09-06 | 2010-07-12 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 광 출력의 영역 제어를 제공하는 광 추출 구조물을 갖는 도광체 |
| WO2009048808A1 (en) * | 2007-10-11 | 2009-04-16 | 3M Innovative Properties Company | Chromatic confocal sensor |
| JP5524856B2 (ja) | 2007-12-12 | 2014-06-18 | スリーエム イノベイティブ プロパティズ カンパニー | エッジ明瞭性が向上した構造の製造方法 |
| JP5801558B2 (ja) * | 2008-02-26 | 2015-10-28 | スリーエム イノベイティブ プロパティズ カンパニー | 多光子露光システム |
| GB2489722B (en) | 2011-04-06 | 2017-01-18 | Precitec Optronik Gmbh | Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer |
| DE102011051146B3 (de) * | 2011-06-17 | 2012-10-04 | Precitec Optronik Gmbh | Prüfverfahren zum Prüfen einer Verbindungsschicht zwischen waferförmigen Proben |
| WO2013130297A1 (en) * | 2012-02-28 | 2013-09-06 | 3M Innovative Properties Company | Multiphoton curing methods using negative contrast compositions |
| US9040921B2 (en) * | 2012-07-28 | 2015-05-26 | Harvard Apparatus Regenerative Technology, Inc. | Analytical methods |
| DE102012111008B4 (de) | 2012-11-15 | 2014-05-22 | Precitec Optronik Gmbh | Optisches Messverfahren und optische Messvorrichtung zum Erfassen einer Oberflächentopographie |
| US9005878B2 (en) | 2013-03-19 | 2015-04-14 | Eastman Kodak Company | Forming patterns using thiosulfate polymer compositions |
| US9499650B2 (en) | 2013-03-19 | 2016-11-22 | Eastman Kodak Company | Thiosulfate polymers |
| US8916336B2 (en) | 2013-03-19 | 2014-12-23 | Eastman Kodak Company | Patterning method using thiosulfate polymer and metal nanoparticles |
| US8986924B2 (en) | 2013-03-19 | 2015-03-24 | Eastman Kodak Company | Method of sequestering metals using thiosulfate polymers |
| US9772552B2 (en) * | 2013-03-19 | 2017-09-26 | Eastman Kodak Company | Thiosulfate polymer compositions and articles |
| CN105324629B (zh) | 2013-06-17 | 2018-08-24 | 普雷茨特激光技术有限公司 | 用于获取距离差的光学测量装置以及光学测量方法 |
| EP3077421B1 (en) | 2013-12-06 | 2018-01-31 | 3M Innovative Properties Company | Liquid photoreactive composition and method of fabricating structures |
| TWI583916B (zh) * | 2015-10-08 | 2017-05-21 | 財團法人工業技術研究院 | 雷射共焦量測方法及應用此方法之雷射共焦量測裝置 |
| US10234265B2 (en) | 2016-12-12 | 2019-03-19 | Precitec Optronik Gmbh | Distance measuring device and method for measuring distances |
| DE102017126310A1 (de) | 2017-11-09 | 2019-05-09 | Precitec Optronik Gmbh | Abstandsmessvorrichtung |
| US11150484B2 (en) | 2018-05-18 | 2021-10-19 | Lawrence Livermore National Security, Llc | System and method for curved light sheet projection during two-photon polymerization |
| DE102018130901A1 (de) | 2018-12-04 | 2020-06-04 | Precitec Optronik Gmbh | Optische Messeinrichtung |
| EP4168734B1 (de) | 2020-06-19 | 2025-09-24 | Precitec Optronik GmbH | Chromatisch konfokale messvorrichtung |
| DE102021113189A1 (de) | 2021-05-20 | 2022-11-24 | Nanoscribe Holding Gmbh | Verfahren zum Erzeugen einer dreidimensionalen Zielstruktur in einem Lithographiematerial mittels einer Laserlithographie-Vorrichtung |
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| JPH04263923A (ja) * | 1991-02-19 | 1992-09-18 | Nippon Telegr & Teleph Corp <Ntt> | 三次元物体の形成方法 |
| JP2001287273A (ja) * | 2001-03-12 | 2001-10-16 | Three D Syst Inc | 立体造形方法及び装置 |
| JP2004518154A (ja) * | 2000-06-15 | 2004-06-17 | スリーエム イノベイティブ プロパティズ カンパニー | 構造を製作するか又は物品に構造を付加するための方法 |
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- 2006-12-20 JP JP2008547458A patent/JP4880701B2/ja not_active Expired - Fee Related
- 2006-12-20 US US12/158,143 patent/US7893410B2/en not_active Expired - Fee Related
- 2006-12-20 WO PCT/US2006/048498 patent/WO2007073482A2/en not_active Ceased
- 2006-12-20 DE DE112006003494T patent/DE112006003494T5/de not_active Withdrawn
- 2006-12-20 CN CN2006800482953A patent/CN101341578B/zh not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| US7893410B2 (en) | 2011-02-22 |
| JP2009521315A (ja) | 2009-06-04 |
| DE112006003494T5 (de) | 2008-10-30 |
| CN101341578B (zh) | 2010-12-08 |
| CN101341578A (zh) | 2009-01-07 |
| US20090250635A1 (en) | 2009-10-08 |
| WO2007073482A3 (en) | 2007-09-27 |
| WO2007073482A2 (en) | 2007-06-28 |
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