JP4876975B2 - 電子機器用の冷却装置および受熱部材 - Google Patents

電子機器用の冷却装置および受熱部材 Download PDF

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Publication number
JP4876975B2
JP4876975B2 JP2007052169A JP2007052169A JP4876975B2 JP 4876975 B2 JP4876975 B2 JP 4876975B2 JP 2007052169 A JP2007052169 A JP 2007052169A JP 2007052169 A JP2007052169 A JP 2007052169A JP 4876975 B2 JP4876975 B2 JP 4876975B2
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Japan
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fin
refrigerant
heat
base
fins
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JP2007052169A
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Japanese (ja)
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JP2008218589A5 (enExample
JP2008218589A (ja
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及川洋典
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Hitachi Ltd
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Hitachi Ltd
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Priority to JP2007052169A priority Critical patent/JP4876975B2/ja
Priority to US12/039,962 priority patent/US20080216991A1/en
Priority to CN200810080940.0A priority patent/CN101257784B/zh
Publication of JP2008218589A publication Critical patent/JP2008218589A/ja
Publication of JP2008218589A5 publication Critical patent/JP2008218589A5/ja
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2007052169A 2007-03-02 2007-03-02 電子機器用の冷却装置および受熱部材 Expired - Fee Related JP4876975B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007052169A JP4876975B2 (ja) 2007-03-02 2007-03-02 電子機器用の冷却装置および受熱部材
US12/039,962 US20080216991A1 (en) 2007-03-02 2008-02-29 Cooling device for information equipment
CN200810080940.0A CN101257784B (zh) 2007-03-02 2008-02-29 电子设备用的冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007052169A JP4876975B2 (ja) 2007-03-02 2007-03-02 電子機器用の冷却装置および受熱部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011131804A Division JP2011223019A (ja) 2011-06-14 2011-06-14 電子機器用の冷却装置および冷却デバイス

Publications (3)

Publication Number Publication Date
JP2008218589A JP2008218589A (ja) 2008-09-18
JP2008218589A5 JP2008218589A5 (enExample) 2009-04-23
JP4876975B2 true JP4876975B2 (ja) 2012-02-15

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Family Applications (1)

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JP2007052169A Expired - Fee Related JP4876975B2 (ja) 2007-03-02 2007-03-02 電子機器用の冷却装置および受熱部材

Country Status (3)

Country Link
US (1) US20080216991A1 (enExample)
JP (1) JP4876975B2 (enExample)
CN (1) CN101257784B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5117287B2 (ja) * 2008-06-06 2013-01-16 株式会社日立製作所 電子機器の冷却装置
JP5994103B2 (ja) * 2011-09-22 2016-09-21 パナソニックＩｐマネジメント株式会社 冷却装置およびこれを搭載した電気自動車および電子機器
JP5957686B2 (ja) * 2012-01-13 2016-07-27 パナソニックＩｐマネジメント株式会社 冷却装置およびこれを搭載した電子機器および電気自動車
US20150096722A1 (en) * 2012-03-02 2015-04-09 Logos Technologies, Llc Systems and methods for cooling disk lasers
JP6124742B2 (ja) 2013-09-05 2017-05-10 三菱電機株式会社 半導体装置
JP6238800B2 (ja) * 2014-03-17 2017-11-29 株式会社フジクラ 冷却構造
JP6394289B2 (ja) 2014-11-04 2018-09-26 富士通株式会社 蒸発器、冷却装置、及び電子機器
CN105025691B (zh) * 2015-08-10 2018-03-06 苏州大景能源科技有限公司 一种利用液冷散热的电子装置、散热装置及其冷却方法
TWM511640U (zh) * 2015-08-11 2015-11-01 訊凱國際股份有限公司 具有分流設計之液冷式水冷頭及其散熱結構
US10171778B2 (en) * 2015-11-24 2019-01-01 Cooler Master Co., Ltd. Liquid cooling apparatus
US12423158B2 (en) 2016-03-31 2025-09-23 SolidRun Ltd. System and method for provisioning of artificial intelligence accelerator (AIA) resources
JP6939481B2 (ja) 2017-11-30 2021-09-22 富士通株式会社 冷却ジャケット及び電子機器
DE102018101453A1 (de) * 2018-01-23 2019-07-25 Borgwarner Ludwigsburg Gmbh Heizvorrichtung und Verfahren zum Herstellung eines Heizstabes
US10962299B2 (en) * 2018-11-09 2021-03-30 Ldc Precision Engineering Co., Ltd. Evaporator structure with improved layout of cooling fluid channels
TWI689698B (zh) 2019-05-10 2020-04-01 訊凱國際股份有限公司 流量調整件與液冷式散熱裝置
US11744044B2 (en) * 2020-11-05 2023-08-29 Deeia, Inc. Loop thermosyphon devices and systems, and related methods
US20220316817A1 (en) * 2021-03-30 2022-10-06 Asia Vital Components Co., Ltd. Liquid-cooling heat dissipation structure
JP2023166889A (ja) * 2022-05-10 2023-11-22 パナソニックＩｐマネジメント株式会社 冷却装置
US12453042B2 (en) 2022-06-21 2025-10-21 Deeia Inc. Metallic thermal interface materials and associated devices, systems, and methods

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US3746086A (en) * 1971-08-27 1973-07-17 Peerless Of America Heat exchangers
JPH0311759A (ja) * 1989-06-09 1991-01-21 Hitachi Ltd 半導体装置の冷却装置
US4909315A (en) * 1988-09-30 1990-03-20 Microelectronics And Computer Technology Corporation Fluid heat exchanger for an electronic component
JP3260584B2 (ja) * 1995-04-07 2002-02-25 株式会社日立製作所 マルチチップモジュールの冷却機構
JP4493117B2 (ja) * 1999-03-25 2010-06-30 レノボ シンガポール プライヴェート リミテッド ノートブック型パーソナルコンピューターの冷却方法及び冷却装置
US6578626B1 (en) * 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
AU2003247855A1 (en) * 2002-06-28 2004-01-19 Roger Paulman Fin array for heat transfer assemblies and method of making same
US7000684B2 (en) * 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US7017654B2 (en) * 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
JP2005079483A (ja) * 2003-09-03 2005-03-24 Hitachi Ltd 電子機器装置
JP4222171B2 (ja) * 2003-09-24 2009-02-12 株式会社デンソー 対向振動流型熱輸送装置
WO2005043620A1 (ja) * 2003-10-30 2005-05-12 Fujitsu Limited 冷却装置及び電子装置
JP2005229047A (ja) * 2004-02-16 2005-08-25 Hitachi Ltd 電子機器の冷却システム、及び、それを使用した電子機器
WO2005104323A2 (en) * 2004-03-30 2005-11-03 Purdue Research Foundation Improved microchannel heat sink
US7139172B2 (en) * 2004-07-01 2006-11-21 International Business Machines Corporation Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
US20060171801A1 (en) * 2004-12-27 2006-08-03 Matsushita Electric Industrial Co., Ltd. Heatsink apparatus
JP4551261B2 (ja) * 2005-04-01 2010-09-22 株式会社日立製作所 冷却ジャケット
JP4687541B2 (ja) * 2005-04-21 2011-05-25 日本軽金属株式会社 液冷ジャケット
JP2007003164A (ja) * 2005-06-27 2007-01-11 Nakamura Mfg Co Ltd 平板状ヒートパイプまたはベーパーチャンバー、および、その形成方法
US7900692B2 (en) * 2005-10-28 2011-03-08 Nakamura Seisakusho Kabushikigaisha Component package having heat exchanger
JP4962836B2 (ja) * 2006-01-10 2012-06-27 中村製作所株式会社 冷却部を備えた電子部品用パッケージ、およびその形成方法
US7537047B2 (en) * 2006-03-23 2009-05-26 Foxconn Technology Co., Ltd. Liquid-cooling heat sink
US7731079B2 (en) * 2008-06-20 2010-06-08 International Business Machines Corporation Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled

Also Published As

Publication number Publication date
CN101257784A (zh) 2008-09-03
CN101257784B (zh) 2010-12-15
JP2008218589A (ja) 2008-09-18
US20080216991A1 (en) 2008-09-11

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