JP4873578B2 - レーザ加工装置及び加工条件の決定方法 - Google Patents

レーザ加工装置及び加工条件の決定方法 Download PDF

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JP4873578B2
JP4873578B2 JP2009206229A JP2009206229A JP4873578B2 JP 4873578 B2 JP4873578 B2 JP 4873578B2 JP 2009206229 A JP2009206229 A JP 2009206229A JP 2009206229 A JP2009206229 A JP 2009206229A JP 4873578 B2 JP4873578 B2 JP 4873578B2
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deflector
laser beam
incident
switching element
light source
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JP2011056521A (ja
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研太 田中
裕 石原
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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Priority to JP2009206229A priority Critical patent/JP4873578B2/ja
Priority to TW099128638A priority patent/TW201111083A/zh
Priority to CN2010102761102A priority patent/CN102009269B/zh
Publication of JP2011056521A publication Critical patent/JP2011056521A/ja
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JP2009206229A 2009-09-07 2009-09-07 レーザ加工装置及び加工条件の決定方法 Active JP4873578B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009206229A JP4873578B2 (ja) 2009-09-07 2009-09-07 レーザ加工装置及び加工条件の決定方法
TW099128638A TW201111083A (en) 2009-09-07 2010-08-26 Laser machining device and machining condition determination method
CN2010102761102A CN102009269B (zh) 2009-09-07 2010-09-07 激光加工装置及加工条件的决定方法

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JP2009206229A JP4873578B2 (ja) 2009-09-07 2009-09-07 レーザ加工装置及び加工条件の決定方法

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JP2011056521A JP2011056521A (ja) 2011-03-24
JP4873578B2 true JP4873578B2 (ja) 2012-02-08

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JP (1) JP4873578B2 (cg-RX-API-DMAC7.html)
CN (1) CN102009269B (cg-RX-API-DMAC7.html)
TW (1) TW201111083A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210114874A (ko) 2020-03-11 2021-09-24 스미도모쥬기가이고교 가부시키가이샤 가공순서결정장치, 레이저가공장치, 및 레이저가공방법

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150088296A (ko) * 2012-11-26 2015-07-31 비아 메카닉스 가부시키가이샤 레이저 가공 장치 및 레이저 가공 방법
CN105102174B (zh) * 2013-03-15 2017-05-31 伊雷克托科学工业股份有限公司 基于激光放射所控制的射束定位器
JP6415357B2 (ja) * 2015-03-06 2018-10-31 住友重機械工業株式会社 レーザ加工装置
CN104977814B (zh) * 2015-06-26 2017-07-21 吉林大学 用于激光加工的曝光开关和曝光强度的控制装置、激光加工设备、激光加工控制方法
CN106853558A (zh) * 2015-12-08 2017-06-16 彭翔 冷激光精细加工方法及系统
JP6682146B2 (ja) * 2016-12-12 2020-04-15 住友重機械工業株式会社 レーザパルス切出装置及びレーザ加工方法
JP6782653B2 (ja) * 2017-03-23 2020-11-11 住友重機械工業株式会社 レーザ加工装置
JP7066368B2 (ja) * 2017-10-24 2022-05-13 住友重機械工業株式会社 レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機
CN117389200A (zh) * 2023-12-08 2024-01-12 迈为技术(珠海)有限公司 基于声光偏转器的激光控制系统、方法和计算机设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1133765A (ja) * 1997-07-22 1999-02-09 Nikon Corp レーザ加工装置
US7238913B2 (en) * 2003-10-17 2007-07-03 Gsi Group Corporation Flexible scan field
CN101011777A (zh) * 2006-12-11 2007-08-08 江苏大学 一种中厚板料激光预应力复合喷丸成形的方法和装置
JP5025391B2 (ja) * 2007-08-30 2012-09-12 住友重機械工業株式会社 レーザ加工装置及び加工方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210114874A (ko) 2020-03-11 2021-09-24 스미도모쥬기가이고교 가부시키가이샤 가공순서결정장치, 레이저가공장치, 및 레이저가공방법

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Publication number Publication date
CN102009269A (zh) 2011-04-13
CN102009269B (zh) 2013-03-27
TW201111083A (en) 2011-04-01
TWI379723B (cg-RX-API-DMAC7.html) 2012-12-21
JP2011056521A (ja) 2011-03-24

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