201111083 六、發明說明： 【發明所屬之技術領域】 本申請主張基於2009年9月7曰申請之日本專利申請第 2009-206229號之優先權。該申請之全部內容通過參照援 用於本說明書中。 本發明係有關一種於加工對象物中使脈衝雷射束之入 射位置移動以進行多個加工點之雷射加工之雷射加工裝置 及加工條件之決定方法。 【先前技術】 對使雷射束從脈衝雷射振盪器經由傳送光學系統、電 流掃描器及f β透鏡而射入加工對象物來進行雷射加工之 加工裝置之一般動作進行說明。使脈衝雷射束射入1個加 工點之後，使電流掃描器動作而使雷射束之入射位置移動 至下一個加工點。待電流掃描器之動作結束，使脈衝雷射 振盪器振盪而使脈衝雷射束射入加工點。 專利文獻1 :日本特開2004-663 00號公報 . 從加工對象物上之1個加工點至下一個加工點之距離 _ 並非一定。故，從電流掃描器之動作開始至結束爲止之時 間不一致。藉此，脈衝雷射振盪器之振盪周期亦變得不一 致。若振盪周期不一致，則脈衝能量、雷射脈衝之時間波 形、光強度分布等發生變動，故難以進行高品質加工。 【發明內容】 -5- 201111083 基於本發明之一種觀點，提供如下雷射加工裝置，具 有： 雷射光源’藉由接收觸發信號而射出脈衝雷射束； 載台，保持加工對象物； 偏轉器’配置於從前述雷射光源射出的脈衝雷射束之 路徑內，若收到於保持在前述載物台的加工對象物之表面 使脈衝雷射束之入射位置移動之移動指令信號，則使脈衝 雷射束之入射位置移動至所指令之移動目的地，若入射位 置之移動結束，則發送移動結束信號； 開關元件，可切換成使從前述雷射光源射出之脈衝雷 射束射入前述偏轉器之開狀態和不射入前述偏轉器之閉狀 態；以及 控制裝置， 係控制前述雷射光源、前述偏轉器及前述開關元件， 前述控制裝置包含：儲存應使雷射束入射的多個加工 點之位置資訊、入射順序及發送前述觸發信號之頻率資訊 之記憶部， 根據儲存於前述記憶部之頻率資訊以一定的重複頻率 向前述雷射光源發送觸發信號， 向前述偏轉器發送使脈衝雷射束之入射位置移動至下 一個加工點之移動指令信號， 向前述偏轉器發送移動指令信號之後，直到從前述偏 轉器接收移動結束信號爲止，不使前述開關元件成爲開狀 態，從前述偏轉器接收移動結束信號之後，同步於前述觸 -6- 201111083 發信號將前述開關元件切換成開狀態。 基於本發明之其他觀點，提供如下加工條件之決定方 法，其爲用來決定使用上述之雷射加工裝置進行雷射加工 時的加工條件之方法，具有： 使用前述觸發信號之頻率資訊不同而加工點之位置資 訊及入射順序共通之多個加工條件各個控制前述偏轉器及 開關元件，使脈衝雷射束之入射位置移動，並測量掃描所 有加工點的掃描時間之步驟；以及 根據前述掃描時間決定前述觸發信號之適宜頻率之步 驟。 因以一定的頻率射出脈衝雷射束，故能夠抑制脈衝能 量、雷射脈衝之時間波形、光強度分布等之不一致，並能 提高加工品質。 【實施方式】 於第1圖顯示實施例的雷射加工裝置之槪略圖。若雷 射光源10從控制裝置20接收觸發信號sigl，則射出脈衝雷 射束L1。觸發信號sigl爲脈衝信號，對觸發信號sigl之1個 脈衝射出1個雷射脈衝。雷射光源1 0例如使用Nd : YAG雷 射等固體雷射，但即使爲氣體雷射也無妨。 從雷射光源1 〇射出的脈衝雷射束經由開關元件11、反 射鏡12、偏轉器13、f0透鏡14射入保持於XY載台15之加 工對象物30。開關元件1 1藉由從控制裝置20接收控制信號 si g2來切換開狀態和閉狀態。開狀態時，使入射之脈衝雷 201111083 射束射入反射鏡1 2。亦即，開狀態時，脈衝雷射束射入加 工對象物3 0。閉狀態時，使入射之脈衝雷射束射入射束擋 板1 6。亦即，閉狀態時，脈衝雷射束不射入加工對象物。 開關元件1 1可使用音響光學元件（AOM)、音響光學偏轉元 件（AOD)等。 代替開關元件亦可爲具有開閉能力之機構。亦即，只 要是不依賴偏轉器之位置穩定定時而以一定的頻率輸出雷 射，能切換成向加工對象物3 0照射輸出的脈衝雷射束之照 射狀態，或者不向加工對象物30照射輸出的脈衝雷射束之 非照射狀態之照射切換機構即可。 f 0透鏡1 4使脈衝雷射束聚光於加工對象物3 0之表面 。可採用於脈衝雷射束之路徑上配置遮罩而使遮罩成像於 加工對象物30之表面來進行加工之遮罩成像法，亦可採用 於光束腰之位置進行加工之方法。 偏轉器13若從控制裝置20接收移動指令信號Sig3，則 於加工對象物30之表面使脈衝雷射束之行進方向變化，以 使脈衝雷射束之入射位置移動。脈衝雷射束之入射位置資 訊藉由移動指令信號sig3供給。若脈衝雷射束的入射位置 之移動結束，則從偏轉器1 3向控制裝置20發送移動結束信 號 sig4。 偏轉器1 3例如可使用包含一對可動鏡之電流掃描器。 XY載台15從控制裝置20收到移動指令信號Sig5使加工 對象物30移動。若移動結束，則從χγ載台15向控制裝置 20發送移動結束信號sig6。雷射加工時，於使加工對象物 -8- 201111083 3 〇靜止之狀態下，藉由使偏轉器13動作來進行偏轉器13能 夠掃描的範圍內之加工。交替重複藉由χγ載台15所進行 的加工對象物3 0之移動和藉由偏轉器1 3之動作所進行的可 掃描範圍內之加工，藉此能夠對加工對象物3 0表面之整個 區域進行加工。 控制裝置20包含儲存各種加工條件之記憶部20Α °記 憶部2 Ο Α儲存劃定於加工對象物3 〇之表面的加工點之位置 資訊（例如，座標等）及加工點之加工順序。進一步儲存發 送觸發信號sigl之頻率資訊（例如觸發信號sigl之重複頻率 或周期等）。並且，記憶部20 A儲存使開關元件1 1成爲開狀 態之時間寬度。 於第2圖顯示雷射加工之時序圖。從上依序表示，從 雷射光源10射出之脈衝雷射束L〗、觸發信號sigl、控制信 號sig2、來自偏轉器1 3之移動結束信號sig4、向偏轉器1 3 之移動指令信號si g3、比開關元件1 1更靠後方之脈衝雷射 束L2、向XY載台15之移動指令信號sig5及來自XY載台15 之移動結束信號sig6。 控制信號s i g 2上升之狀態對應於開關元件丨丨之開狀態 。移動結束信號s i g4上升之狀態對應於脈衝雷射束的入射 位置之移動中，下降之狀態對應於入射位置穩定之狀態（ 幾乎S?止之狀態）。亦即’藉由移動結束信號sig4之下降 來通知入射位置之移動結束。於本說明書中，將使移動結 束is號sig4下降之控制稱爲「移動結束信號以目#之發送」 201111083 XY載台15之移動結束信號sig6也同樣地，上升之狀態 對應於XY載台15之移動中，下降之狀態對應於穩定之狀 態。亦即，藉由移動結束信號sig6之下降來通知XY載台15 之移動結束。 若起動雷射加工裝置且由操作員指示加工之開始，則 控制裝置20以一定的頻率向雷射光源10發送觸發信號si gl 。操作員的加工開始之指示例如藉由按壓加工開始按鈕等 來進行。雷射光源10同步於觸發信號sigl之接收，射出脈 衝雷射束L1。 於時刻tl，從控制裝置20向XY載台15發送移動指令 信號sig5。XY載物台15使加工對象物30移動至藉由移動指 令信號s i g 5指令之位置。 於時刻12，若加工對象物3 0之移動結束，則X γ載台 15藉由使移動結束信號sig6下降來向控制裝置20通知移動 結束。控制裝置20若從XY載台15收到移動結束之通知， 則向偏轉器1 3發送使脈衝雷射束之入射位置移動至最初加 工點之移動指令信號sig3。 於時刻t3，若脈衝雷射束的入射位置之移動結束，則 偏轉器1 3向控制裝置2 0發送移動結束信號s丨g 4。直到接收 來自偏轉器13之移動結束信號sig4爲止，控制裝置20將開 關元件1 1維持閉狀態。故’從雷射光源1 〇射出之脈衝雷射 束射入射束擋板1 6。 於時刻t4 ’控制裝置20發送觸發信號sigl。於該時點 ’由於從偏轉器13接收移動結束信號si g4，故同步於觸發 -10- 201111083 信號sigl向開關元件1 1發送控制信號Sig2，並使開關元件 1 1成爲開狀態。故，於比開關元件1 1更靠後方的雷射束之 路徑出現脈衝雷射束L2，並射入加工對象物3 0之加工點。 控制裝置2 0，從使開關元件1 1成爲開狀態時起算，於 經過儲存在記憶部20A的開狀態之時間寬度之時點，使控 制信號si g2之發送停止。藉此，開關元件丨1成爲閉狀態。 使開關元件1 1成爲閉狀態之後，控制裝置20向偏轉器 1 3發送使入射位置移動至下一個加工點之移動指令信號 si g3。偏轉器13使脈衝雷射束之入射位置移動至所指令之 加工點。 於時刻t5 ’若脈衝雷射束之入射位置之移動結束，則 向控制裝置2 〇發送移動結束信號s i g4。於該時點，於時刻 t4所發送的觸發信號sigi之觸發脈衝之下一個觸發脈衝尙 未被發送。 於時刻t6，發送觸發信號sigl之下一個觸發脈衝。此 時’由於已經接收來自偏轉器1 3之移動結束信號si g4，故 同步於觸發信號si g 1向開關元件丨1發送控制信號si g2。藉 此，向加工對象物3 0之加工點射入脈衝雷射束。 於時刻t7，向偏轉器丨3發送移動指令信號sig3，於時 刻19 ’從偏轉器1 3發送移動結束信號s i g 4。於時刻17至19 間之時刻t8 ’雖發送觸發信號sigl，但於該時點控制裝置 20未接收移動結束信號sig4，故不會發送使開關元件1 1成 爲開狀態之控制信號sig2。 於時刻t9之後的時刻tl〇，若發送觸發信號sigl，則控 -11 - 201111083 制裝置20同步於觸發信號sigi發送使開關元件1 1成爲開狀 態之控制信號sig2。 藉由重複脈衝雷射束的入射位置之移動和使開關元件 1 1成爲開狀態之控制，能夠使脈衝雷射束射入加工對象物 30的可掃描範圍內之所有加工點。若可掃描範圍內的所有 加工點之處理結束，則於時刻tl 1，藉由向XY載台15發送 移動指令信號si g5，使未加工之區域移動至可掃描範圍內 〇 於上述實施例中，即使驅動偏轉器1 3而使脈衝雷射束 之入射位置移動至下一個加工點爲止之時間不一致，雷射 光源1 〇仍能以一定的頻率射出脈衝雷射束。故，能夠抑制 脈衝能量、雷射脈衝之時間波形、光強度分布等之不一致 。其結果，能夠提高加工品質。 於上述實施例中，例如於時刻t4，同步於觸發信號 sigl而發送控制信號sig2時，從觸發信號sigl設定一定的 遲延時間而發送控制信號si g2亦可。若使控制信號sig2之 發送遲延，則於脈衝波形中，可不使剛上升後的過渡期之 成分射入加工對象物30，而僅使光強度穩定後之成分射入 加工對象物30。同樣地，於1個雷射脈衝的射出結束之前 ，使開關元件1 1恢復至閉狀態亦可。藉此，能夠僅使脈衝 波形當中適於加工的部分射入加工對象物3 0。 接著，參照第3A圖及第3B圖對脈衝雷射束的重複頻 率之適宜値進行說明。假設從第η-1個加工點至第η個加工 點的入射位置之移動時間爲Μ 1，從第η個加工點至第η+ 1 -12- 201111083 個加工點的入射位置之移動時間爲M 2 ’從第n+1個加工點 至第n + 2個加工點的入射位置之移動時間爲M3。 第3A圖及第3B圖表示移動結束信號sig4、觸發信號 sigl及控制信號sig2之時序圖。第3B圖表示觸發信號sigl 之振盪頻率低於第3 A圖之例子。 於第3A圖及第3B圖所示之任一個例子中’皆於加工 第η-1個加工點之後馬上發送觸發信號sig 1之觸發脈衝P 1 。於第3 A圖所示之例子中，移動結束信號s i g 4之下降時和 第2個觸發脈衝P2幾乎於相同時刻發生。故，用於加工第η 個加工點的控制信號si g2之脈衝Qn之發送必須等到第3個 觸發脈衝P 3。 相對於此，於第3 B圖所示之例子中，移動結束信號 sig4下降時之後，馬上發送第2個觸發脈衝P2。故，同步 於第2個觸發脈衝P2，發送用於加工第η個加工點的控制信 號sig2之脈衝Q„。 並且，於第3 A圖所示之例子中，於剛發送第5個觸發 脈衝P 5之後，向第n+ 1個加工點的入射位置之移動就結束 。故，用於加工第n + 1個加工點的控制信號sig2之脈衝 Qn+i之發送必須等到第6個觸發脈衝P6。如此’第n+1個加 工點的加工與從進行第η個加工點的加工之觸發脈衝P 3起 算第3個觸發脈衝Ρ6同步。 相對於此，於第3Β圖所示之例子中，於即將發送第4 個觸發脈衝Ρ4時，移動結束信號sig4下降。故，同步於觸 發脈衝P4，發送用於進行第n+l個加工點的加工之控制信 -13- 201111083 號Qn+i。亦即，第n+l個加工點之加工’與從進行第η個加 工點的加工之觸發脈衝Ρ2起算第2個觸發脈衝Ρ4同步》 第η + 2個加工點之加工，於第3Α圖及第3Β圖中之任一 個例子中，皆與進行第n+l個加工的觸發脈衝之下一個觸 發脈衝同步。 如第3A圖及第3B圖所示般’用於加工多個加工點所 需時間，並不一定觸發信號sigl之頻率越高就越短。而是 根據脈衝雷射束的入射位置之移動時間之分布存在觸發信 號sigl之最佳頻率。 於第4圖顯示實際進行劃定有約1 20,000個加工點之加 工對象物的加工時之觸發信號sigl之頻率與加工所需時間 的關係。橫軸以單位「Hz」表示觸發信號sigl之振盪頻率 ，縱軸以單位「秒」表示加工所需時間。可知於觸發信號 sigl之振盪頻率爲1 000Hz〜2000Hz之範圍內，當振盪頻率 爲1 5 00Hz時加工時間變最短。於加工該加工對象物時，將 觸發信號sigl之振盪頻率設爲150 0Hz比設爲2000Hz更能縮 短所需時間。 加工所需時間變最短的振盪頻率，根據加工對象物的 加工點之分布而有不同。以下，對決定適宜的振盪頻率之 方法進行說明。 使用儲存於控制裝置20之記憶部20A的觸發信號sigl 之頻率資訊不同而加工點之位置資訊及入射順序共通的多 個加工條件各個，來控制偏轉器1 3及開關元件1 1。藉此， 使脈衝雷射束之入射位置依序向多個加工點移動。此時， •14- 201111083 測量掃描所有加工點之掃描時間。 根據實際測量之掃描時間決定觸發信號sig 1之適宜的 振盪頻率。例如’將掃描時間最短的振盪頻率設爲適宜的 振盪頻率。 爲了決定振盪頻率之適宜値，於控制偏轉器1 3及開關 元件1 1時，無需從雷射光源1 〇實際射出脈衝雷射束。例如 ，可於關掉雷射光源1 〇之電源而不從雷射光源1 〇射出脈衝 雷射束之狀態下進行上述評價。 於上述實施例顯示使用1個雷射束進行加工之情況， 但於使從雷射光源射出的雷射束分支爲多個並使用多個雷 射束進行加工之情況時，亦可應用上述實施例。例如，第 1圖所示之開關元件Π可使雷射束選擇性地傳送至除射入 射束擋板1 6的路徑以外之兩條路徑。此時，開關元件1 1可 切換成：使脈衝雷射束傳送至第1路徑之第1開狀態，使脈 衝雷射束傳送至第2路徑之第2開狀態及使脈衝雷射束射入 射束擋板的閉狀態當中之任一個。 於兩條路徑分別配置第1圖所示之偏轉器1 3及f β透鏡 14。於兩條雷射束之路徑分別配置加工對象物30。χγ載 台15可於兩條路徑中共用，亦可在每個路徑配置χγ載台 〇 只要分別於兩條路徑中加工的加工對象物的加工點之 分布及加工順序相同，則移動結束信號sig4從兩個偏轉器 13幾乎同時發送至控制裝置20。 控制裝置20從兩個偏轉器1 3雙方接收移動結束信號 -15- 201111083 sig4之後，使開關元件Π同步於觸發脈衝而成爲第1開狀 態，並同步於下一個觸發脈衝而成爲第2開狀態即可。 當分別於兩條路徑中加工的加工對象物的加工點之分 布不同時，從兩個偏轉器13發送移動結束信號sig4之時期 相互偏離。在此情況，可將開關元件1 1控制成：於僅從一 方之偏轉器1 3接收移動結束信號si g4之狀態下’使脈衝雷 射束傳送至接收移動結束信號si g4—方之路徑。 以上按照實施例說明了本發明，但本發明不限於這些 〇 例如可進行各種變更、改良、組合等，這對本領域技 術人員來說是顯而易見的。 【圖式簡單說明】 第1圖係實施例的雷射加工裝置之槪略圖。 第2圖係使用實施例的雷射加工裝置進行加工時之各 種信號之時序圖。 第3A、3B圖係觸發信號之頻率不同的兩種情況之時 序圖。 第4圖係顯示觸發信號之頻率與加工所需時間之關係 的測定結果。 【主要元件符號說明】 1 〇 :雷射光源 1 1 :開關元件 -16- 201111083 1 2 :反射鏡 1 3 :偏轉器 1 4 : f 0透鏡 15 : XY載台 1 6 :射束擋板 20 :控制裝置 20A :儲存器 s i g 1 :觸發信號 sig2 :控制信號 sig3 :移動指令信號 sig4 :移動結束信號 sig5 :移動指令信號 s i g 6 :移動結束信號 -17[Technical Field] The present application claims priority based on Japanese Patent Application No. 2009-206229, filed on Sep. 7, 2009. The entire contents of this application are incorporated herein by reference. The present invention relates to a laser processing apparatus and a method for determining processing conditions for moving a laser beam at an incident position in a processing object to perform laser processing at a plurality of processing points. [Prior Art] A general operation of a processing apparatus that performs laser processing by projecting a laser beam from a pulsed laser oscillator through a transmission optical system, a current scanner, and an fβ lens into an object to be processed will be described. After the pulsed laser beam is incident on one of the processing points, the current scanner is actuated to move the incident position of the laser beam to the next processing point. When the action of the current scanner is completed, the pulsed laser oscillator is oscillated to cause the pulsed laser beam to enter the processing point. Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-663 00. The distance _ from one processing point to the next processing point on the object to be processed is not constant. Therefore, the time from the start to the end of the operation of the current scanner does not match. Thereby, the oscillation period of the pulsed laser oscillator also becomes inconsistent. If the oscillation periods do not match, the pulse energy, the time waveform of the laser pulse, the light intensity distribution, and the like fluctuate, so that it is difficult to perform high-quality processing. SUMMARY OF THE INVENTION -5-201111083 In accordance with one aspect of the present invention, a laser processing apparatus is provided having: a laser source 'emits a pulsed laser beam by receiving a trigger signal; a stage to hold the object to be processed; and a deflector a movement command signal that is disposed in a path of a pulsed laser beam emitted from the laser light source and that is moved to an incident position of the pulsed laser beam while being held on the surface of the object to be processed by the stage The incident position of the pulsed laser beam is moved to the commanded movement destination, and if the movement of the incident position is completed, the movement end signal is transmitted; and the switching element is switchable to cause the pulsed laser beam emitted from the laser source to be injected into the foregoing a state in which the deflector is open and a closed state in which the deflector is not incident; and a control device that controls the laser light source, the deflector, and the switching element, wherein the control device includes: storing a plurality of laser beam incident The position information of the processing point, the incident sequence, and the memory portion for transmitting the frequency information of the trigger signal are stored in the memory unit according to the The frequency information sends a trigger signal to the laser light source at a certain repetition frequency, and sends a movement command signal for moving the incident position of the pulsed laser beam to the next processing point to the deflector, and after transmitting the movement command signal to the deflector, Until the movement end signal is received from the deflector, the switching element is not turned on, and after receiving the movement end signal from the deflector, the switching element is switched to the ON state in synchronization with the above-mentioned touch-6-201111083 signal. According to another aspect of the present invention, there is provided a method for determining a processing condition, which is a method for determining a processing condition for performing laser processing using the above-described laser processing apparatus, comprising: processing using a frequency information of the trigger signal differently The position information of the point and the plurality of processing conditions common to the incident sequence respectively control the deflector and the switching element to move the incident position of the pulsed laser beam, and measure the scanning time of scanning all the processing points; and determine according to the scanning time The step of the appropriate frequency of the aforementioned trigger signal. Since the pulsed laser beam is emitted at a constant frequency, the inconsistency of the pulse energy, the time waveform of the laser pulse, the light intensity distribution, and the like can be suppressed, and the processing quality can be improved. [Embodiment] A schematic view of a laser processing apparatus of an embodiment is shown in Fig. 1. If the laser light source 10 receives the trigger signal sigl from the control device 20, the pulsed laser beam L1 is emitted. The trigger signal sigl is a pulse signal, and one laser pulse is emitted for one pulse of the trigger signal sigl. The laser light source 10 uses, for example, a solid laser such as a Nd:YAG laser, but it may be a gas laser. The pulsed laser beam emitted from the laser light source 1 射 is incident on the processing object 30 held by the XY stage 15 via the switching element 11, the mirror 12, the deflector 13, and the f0 lens 14. The switching element 1 1 switches the on state and the off state by receiving the control signal si g2 from the control device 20. In the on state, the incident pulse Ray 201111083 beam is incident on the mirror 12. That is, in the on state, the pulsed laser beam is incident on the processing object 30. In the closed state, the incident pulsed laser beam is incident on the beam baffle 116. That is, in the closed state, the pulsed laser beam does not enter the object to be processed. As the switching element 1, an acoustic optical element (AOM), an acoustic optical deflecting element (AOD), or the like can be used. Instead of the switching element, it is also possible to have a mechanism for opening and closing. In other words, if the laser beam is output at a constant frequency without depending on the position stabilization timing of the deflector, the laser beam can be switched to the irradiation state of the pulsed laser beam that is output to the object to be processed 30, or the object to be processed 30 is not irradiated. The irradiation switching mechanism of the non-irradiated state of the output pulsed laser beam may be used. The f 0 lens 14 condenses the pulsed laser beam on the surface of the object 30. A mask imaging method in which a mask is disposed on a path of the pulsed laser beam to form a mask on the surface of the object 30 for processing, or a method of processing at a position of the beam waist may be employed. When the deflector 13 receives the movement command signal Sig3 from the control device 20, the deflector 13 changes the traveling direction of the pulsed laser beam on the surface of the object 30 to move the incident position of the pulsed laser beam. The incident position information of the pulsed laser beam is supplied by the movement command signal sig3. When the movement of the incident position of the pulsed laser beam is completed, the movement end signal sig4 is transmitted from the deflector 13 to the control device 20. The deflector 13 can use, for example, a current scanner including a pair of movable mirrors. The XY stage 15 receives the movement command signal Sig5 from the control device 20 to move the object 30. When the movement is completed, the movement end signal sig6 is transmitted from the χγ stage 15 to the control device 20. In the laser processing, the processing of the object 13 - 201111083 3 is stopped, and the deflection of the deflector 13 is performed to perform processing in a range in which the deflector 13 can scan. The movement of the object 30 by the χγ stage 15 and the processing within the scannable range by the operation of the deflector 13 are alternately repeated, whereby the entire area of the surface of the object 30 can be processed. Processing. The control unit 20 includes a memory unit 20 that stores various processing conditions, and a memory unit 2 Ο Α stores position information (for example, coordinates, etc.) of the processing points delineated on the surface of the object 3 及 and the processing order of the processing points. Further, the frequency information of the transmission trigger signal sigl (for example, the repetition frequency or period of the trigger signal sigl, etc.) is stored. Further, the memory unit 20 A stores the time width at which the switching element 11 is turned on. Figure 2 shows the timing diagram for laser processing. The pulsed laser beam L emitted from the laser light source 10, the trigger signal sigl, the control signal sig2, the movement end signal sig4 from the deflector 13, and the movement command signal si g3 to the deflector 13 are sequentially indicated from above. The pulsed laser beam L2 rearward of the switching element 1 1 , the movement command signal sig5 to the XY stage 15 , and the movement end signal sig6 from the XY stage 15 . The state in which the control signal s i g 2 rises corresponds to the on state of the switching element 丨丨. The state in which the movement end signal s i g4 rises corresponds to the movement of the incident position of the pulsed laser beam, and the state of the fall corresponds to the state in which the incident position is stable (the state of almost S?). That is, the end of the movement of the incident position is notified by the fall of the movement end signal sig4. In the present specification, the control for lowering the movement end is number sig4 is referred to as "transmission completion signal transmission by destination #" 201111083. Similarly, the movement completion signal sig6 of the XY stage 15 corresponds to the XY stage 15 In the movement, the falling state corresponds to a stable state. That is, the end of the movement of the XY stage 15 is notified by the fall of the movement end signal sig6. If the laser processing apparatus is activated and the operator instructs the start of processing, the control unit 20 transmits a trigger signal si gl to the laser source 10 at a certain frequency. The operator's instruction to start machining is performed, for example, by pressing a machining start button or the like. The laser source 10 is synchronized with the reception of the trigger signal sigl to emit the pulsed laser beam L1. At time t1, the movement command signal sig5 is transmitted from the control device 20 to the XY stage 15. The XY stage 15 moves the object 30 to a position commanded by the movement command signal s i g 5 . At time 12, when the movement of the object 30 is completed, the X γ stage 15 notifies the control device 20 of the end of the movement by lowering the movement end signal sig6. Upon receiving the notification of the end of the movement from the XY stage 15, the control unit 20 transmits a movement command signal sig3 for moving the incident position of the pulsed laser beam to the initial machining point to the deflector 13. At time t3, if the movement of the incident position of the pulsed laser beam is completed, the deflector 13 transmits a movement end signal s丨g4 to the control device 20. The control device 20 maintains the switching element 1 1 in a closed state until receiving the movement end signal sig4 from the deflector 13. Therefore, the pulsed laser beam emitted from the laser light source 1 入射 is incident on the beam baffle 16. The control device 20 transmits a trigger signal sigl at time t4'. At this point in time, since the movement end signal si g4 is received from the deflector 13, the control signal Sig2 is transmitted to the switching element 1 1 in synchronization with the trigger -10- 201111083 signal sigl, and the switching element 1 1 is turned on. Therefore, the pulsed laser beam L2 appears on the path of the laser beam rearward of the switching element 1 1 and enters the processing point of the object 30. The control device 20 starts from the time when the switching element 1 1 is turned on, and stops the transmission of the control signal si g2 when the time width of the open state of the memory unit 20A has elapsed. Thereby, the switching element 丨1 is in a closed state. After the switching element 1 1 is turned off, the control device 20 transmits a movement command signal si g3 for moving the incident position to the next machining point to the deflector 13. The deflector 13 moves the incident position of the pulsed laser beam to the commanded processing point. At the time t5', when the movement of the incident position of the pulsed laser beam is completed, the movement end signal s i g4 is transmitted to the control device 2A. At this point in time, a trigger pulse 尙 below the trigger pulse of the trigger signal sigi transmitted at time t4 is not transmitted. At time t6, a trigger pulse is sent below the trigger signal sigl. At this time, since the movement end signal si g4 from the deflector 13 has been received, the control signal si g2 is sent to the switching element 同步1 in synchronization with the trigger signal si g 1 . Thereby, the pulsed laser beam is incident on the processing point of the object 30. At time t7, the movement command signal sig3 is sent to the deflector 丨3, and the movement end signal s i g 4 is transmitted from the deflector 13 at time 19'. Although the trigger signal sigl is transmitted at time t8' between time 17 and 19, but control device 20 does not receive the end of movement signal sig4 at this time, control signal sig2 for turning on switching element 1 1 is not transmitted. At the time tl 之后 after the time t9, when the trigger signal sigl is transmitted, the control device 11 - 201111083 device 20 transmits the control signal sig2 for turning the switching element 1 1 to the ON state in synchronization with the trigger signal sigi. By repeating the movement of the incident position of the pulsed laser beam and the control of turning on the switching element 1 1 , the pulsed laser beam can be incident on all the processing points in the scannable range of the object 30 to be processed. If the processing of all the processing points in the scanable range is completed, at time t11, the unprocessed area is moved to the scannable range by transmitting the movement command signal sig5 to the XY stage 15, as in the above embodiment. Even if the deflector 13 is driven to shift the incident position of the pulsed laser beam to the next processing point, the laser light source 1 射 can still emit the pulsed laser beam at a certain frequency. Therefore, it is possible to suppress the inconsistency between the pulse energy, the time waveform of the laser pulse, and the light intensity distribution. As a result, the processing quality can be improved. In the above embodiment, for example, at time t4, when the control signal sig2 is transmitted in synchronization with the trigger signal sigl, the control signal si g2 may be transmitted by setting a certain delay time from the trigger signal sigl. When the transmission of the control signal sig2 is delayed, the component of the transition period immediately after the rise is not incident on the object 30, and only the component whose light intensity has stabilized is incident on the object 30. Similarly, the switching element 1 1 may be returned to the closed state before the end of the emission of one laser pulse. Thereby, only a portion of the pulse waveform suitable for processing can be incident on the object 30. Next, the appropriateness of the repetition frequency of the pulsed laser beam will be described with reference to Figs. 3A and 3B. It is assumed that the moving time of the incident position from the n-1th processing point to the nth processing point is Μ 1, and the moving time of the incident position from the nth processing point to the η+ 1 -12-201111083 processing points is The movement time of the incident position of M 2 ' from the n+1th processing point to the n + 2th processing point is M3. 3A and 3B are timing charts showing the movement end signal sig4, the trigger signal sigl, and the control signal sig2. Fig. 3B shows an example in which the oscillation frequency of the trigger signal sigl is lower than that of Fig. 3A. In either of the examples shown in Figs. 3A and 3B, the trigger pulse P 1 of the trigger signal sig 1 is transmitted immediately after processing the n-1th processing point. In the example shown in Fig. 3A, the falling of the movement end signal s i g 4 and the second trigger pulse P2 occur almost at the same timing. Therefore, the transmission of the pulse Qn of the control signal si g2 for processing the nth processing point must wait until the third trigger pulse P 3 . On the other hand, in the example shown in Fig. 3B, the second trigger pulse P2 is transmitted immediately after the movement completion signal sig4 falls. Therefore, the pulse Q of the control signal sig2 for processing the nth processing point is transmitted in synchronization with the second trigger pulse P2. Further, in the example shown in FIG. 3A, the fifth trigger pulse is just transmitted. After P 5 , the movement to the incident position of the n+1th machining point ends. Therefore, the transmission of the pulse Qn+i of the control signal sig2 for processing the n+1th machining point must wait until the sixth trigger pulse P6. Thus, the processing of the 'n+1th processing point is synchronized with the third triggering pulse Ρ6 from the trigger pulse P3 for processing the nth processing point. In contrast, in the example shown in the third drawing, When the fourth trigger pulse Ρ4 is about to be transmitted, the movement end signal sig4 is lowered. Therefore, in accordance with the trigger pulse P4, Qn+i of control letter-13-201111083 for processing the n+1th machining point is transmitted. That is, the processing of the n+1th machining point is synchronized with the second trigger pulse Ρ4 from the trigger pulse Ρ2 of the processing of the nth machining point. The processing of the η + 2 machining points is performed in the third drawing. And in any of the examples in the third figure, the triggering of the n+1th processing is performed. The next trigger pulse synchronization. As shown in Figures 3A and 3B, the time required to process multiple machining points is not necessarily shorter as the frequency of the trigger signal sigl is higher. The distribution of the movement time of the incident position of the beam has the optimum frequency of the trigger signal sigl. Figure 4 shows the frequency and processing of the trigger signal sigl when processing the object to be processed with approximately 1 20,000 machining points. The relationship between the required time. The horizontal axis represents the oscillation frequency of the trigger signal sigl in units of "Hz", and the vertical axis represents the time required for processing in units of "seconds". It can be seen that the oscillation frequency of the trigger signal sigl is in the range of 1 000 Hz to 2000 Hz, and the processing time becomes the shortest when the oscillation frequency is 1 500 Hz. When the object to be processed is processed, the oscillation frequency of the trigger signal sigl is set to 150 0 Hz, and the time required to be shortened is set to 2000 Hz. The oscillation frequency at which the processing time is the shortest varies depending on the distribution of the processing points of the object to be processed. Hereinafter, a method of determining an appropriate oscillation frequency will be described. The deflector 13 and the switching element 11 are controlled by using different frequency information of the trigger signal sigl stored in the memory unit 20A of the control device 20, and the position information of the machining point and the plurality of machining conditions common to the incident sequence. Thereby, the incident position of the pulsed laser beam is sequentially moved to a plurality of processing points. At this time, •14- 201111083 measures the scan time of all machining points. The appropriate oscillation frequency of the trigger signal sig 1 is determined based on the actually measured scan time. For example, 'the oscillation frequency with the shortest scanning time is set to a suitable oscillation frequency. In order to determine the appropriate frequency of the oscillation frequency, it is not necessary to actually emit the pulsed laser beam from the laser light source 1 when controlling the deflector 13 and the switching element 11. For example, the above evaluation can be performed in a state where the power of the laser light source 1 关 is turned off without emitting the pulsed laser beam from the laser light source 1 。. In the above embodiment, the case of processing using one laser beam is shown. However, when the laser beam emitted from the laser light source is branched into a plurality of pieces and processed using a plurality of laser beams, the above-described implementation can also be applied. example. For example, the switching element 第 shown in Fig. 1 can selectively transmit the laser beam to two paths other than the path of the incident beam baffle 16. At this time, the switching element 1 1 can be switched to transmit the pulsed laser beam to the first open state of the first path, to transmit the pulsed laser beam to the second open state of the second path, and to cause the pulsed laser beam to be incident. Any of the closed states of the bundle baffle. The deflector 13 and the fβ lens 14 shown in Fig. 1 are disposed on the two paths. The object 30 is placed on each of the paths of the two laser beams. The χγ stage 15 can be shared between the two paths, or the χγ stage can be disposed in each path. As long as the distribution and processing order of the processing points of the processed objects respectively processed in the two paths are the same, the movement end signal sig4 It is transmitted from the two deflectors 13 to the control device 20 almost simultaneously. After receiving the movement end signal -15-201111083 sig4 from both of the two deflectors 1, the control device 20 turns the switching element Π into the first ON state in synchronization with the trigger pulse, and becomes the second ON state in synchronization with the next trigger pulse. Just fine. When the distribution of the machining points of the objects to be processed in the two paths is different, the periods in which the movement end signal sig4 is transmitted from the two deflectors 13 deviate from each other. In this case, the switching element 11 can be controlled to transmit the pulsed laser beam to the path of the reception end signal si g4 in a state where the movement end signal si g4 is received only from the one side deflector 13. The present invention has been described above by way of examples, but the invention is not limited thereto, and various modifications, improvements, combinations and the like can be made, for example, as will be apparent to those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram of a laser processing apparatus of an embodiment. Fig. 2 is a timing chart of various signals when processing is performed using the laser processing apparatus of the embodiment. The 3A and 3B pictures are timing charts of two cases in which the frequency of the trigger signal is different. Figure 4 shows the measurement results of the relationship between the frequency of the trigger signal and the time required for processing. [Main component symbol description] 1 〇: laser light source 1 1 : switching element-16- 201111083 1 2 : mirror 1 3 : deflector 1 4 : f 0 lens 15 : XY stage 1 6 : beam baffle 20 : Control device 20A : Memory sig 1 : Trigger signal sig2 : Control signal sig3 : Move command signal sig4 : Move end signal sig5 : Move command signal sig 6 : Move end signal -17